CN106206934A - A kind of gear type sensor module based on magnetoresistive chip and method for packing thereof - Google Patents
A kind of gear type sensor module based on magnetoresistive chip and method for packing thereof Download PDFInfo
- Publication number
- CN106206934A CN106206934A CN201610553741.1A CN201610553741A CN106206934A CN 106206934 A CN106206934 A CN 106206934A CN 201610553741 A CN201610553741 A CN 201610553741A CN 106206934 A CN106206934 A CN 106206934A
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- magnetoresistive chip
- main body
- chip
- encapsulation main
- pad
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- 238000000034 method Methods 0.000 title claims 2
- 238000012856 packing Methods 0.000 title claims 2
- 238000005538 encapsulation Methods 0.000 claims abstract 10
- 239000000839 emulsion Substances 0.000 claims abstract 6
- 239000008393 encapsulating agent Substances 0.000 claims abstract 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Hall/Mr Elements (AREA)
Abstract
The present invention relates to a kind of gear type sensor module based on magnetoresistive chip, belong to magnetic induction Detection Techniques field.Magnetoresistive chip is placed on the line direction, NS pole of magnet, magnetoresistive chip is close to surface, N pole, fix internal with encapsulation main body of magnet is connected, magnetoresistive chip signal leading point couples with signal ejector one end, this signal ejector other end is connected with pad and connects, and this pad is connected with the edge of encapsulation main body upper and lower surface and side, porose in the middle of each pad, emulsion sheet covers in encapsulation main body, in the space of the rectangular profile that encapsulant fills encapsulation main body and emulsion sheet formation.Advantage is novel structure, has integrated level high, the advantages such as volume is little, easy for installation, and welding manner is flexible, and contamination resistance is strong, stable output signal.
Description
Technical field
The invention belongs to magnetic induction Detection Techniques field.
Background technology
Magnetic induction detection mainly utilizes magnetoresistance principle, and it is defined as: material resistivity in magnetic field changes
Phenomenon is called magnetoresistance.Owing to magnetoresistance is only by external magnetic fields, magnetic resistance change rate causes output voltage to change, phase
Measuring components and parts compared with contacts such as varistors, measured object just can be detected by magnetic susceptibility sensor without contact.There is sensitivity
Degree height, lossless decomposition, insensitive to oil pollution environment, apply the product manufactured by this technology to be widely used in commercial production
In.Especially in Hyundai Motor, such as velocity measuring, angle detects, and position is detected, current detecting etc.
Different according to the principle that magnetoresistance produces, anisotropic magnetoresistance (Anisotropic Magneto can be divided into
Resistance, AMR), giant magnetoresistance effect (Giant Magneto Resistance, GMR), wear magnetoresistance (Tunnel then
Magneto Resistance, TMR)
AMR sensor chip is made up of the anisotropic magnetoresistance (AMR) of magnetic material, its highly sensitive, low in energy consumption, volume
Little, reliability is high, good temp characteristic, operating frequency are high, adverse environment resistant ability is strong, and the spy easily mated with digital circuit
Property so that it is it is widely used in modern industry.
GMR sensor is the same with AMR sensor, and they broadly fall into mistor sensor chip, but its principle is different
(variation pattern of mistor).Compared with AMR, GMR sensor chip has bigger change rate of magnetic reluctance, and higher is sensitive
Degree, the advantage of the aspect such as the preferable linearity.Through development for many years, GMR sensor chip is in terms of its linearity, sluggish
Etc. the performance of aspect be greatly improved.Now, produce and there is high sensitivity, the preferable magnetic field sensor of the linearity
Chip, can the change of preferable induced field.
TMR(Tunnel MagnetoResistance) it is the Novel magnetic power inhibition effect sensing starting commercial Application in recent years
Device chip, what it utilized is that magnetic field is sensed by the tunneling magnetoresistance of Researches for Magnetic Multilayer Films, and ratio is found also before
AMR chip and the GMR chip of actual application have bigger resistance change rate.Relative to GMR chip, there is more preferable temperature steady
Qualitative, higher sensitivity, the broader range of linearity.
Magnetoresistive chip in existing market is typically employed in chip back and places the mode layout (thing due to AMR of magnet
Reason characteristic, its product is not suitable for carrying on the back magnetic and places), signal leading point is in chip both sides.Owing to this layout type needs at chip
Both sides connect pad, and magnetoresistive chip can only be placed in magnet middle, it is impossible to place near magnet edge, cause the sensor can only
Just putting gear, sensor bulk is big, takes up room many, is unfavorable for that subsequent product is developed.And in magnetoresistive chip and magnet
Between need wiring board and external equipment to transmit signal, magnetic field that chip receives is weakened, and (magnetic field size increases in power with distance
Index reduces), be not suitable in the application being applied to precision instrument and equipment.
Summary of the invention
The present invention provides a kind of gear type sensor module based on magnetoresistive chip and method for packing thereof, to solve to deposit at present
Sensor bulk big, take up room many, be unfavorable for the problem that subsequent product is developed.
The present invention adopts the technical scheme that: magnetoresistive chip is placed on the line direction, N, S pole of magnet, and magnetoresistive chip is tight
Being affixed on surface, N pole, fix internal with encapsulation main body of magnet is connected, and magnetoresistive chip signal leading point joins with signal ejector one end
Connecing, this signal ejector other end is connected with pad and connects, and this pad is connected with the edge of encapsulation main body upper and lower surface and side,
Each pad is middle porose, and emulsion sheet covers in encapsulation main body, and encapsulant fills encapsulation main body and the square of emulsion sheet formation
In the space of shape profile.
Chamfering is had in pad side outside encapsulation main body of the present invention.
Magnet of the present invention has gap with the front end of encapsulation main body.
Magnetoresistive chip of the present invention takes TMR magnetoresistive chip.
Method for packing of the present invention, comprises the following steps:
First magnetoresistive chip is close to magnet surface, re-uses signal ejector and connect pad and the magnetoresistive chip of encapsulation main body
Side, afterwards emulsion sheet is affixed on signal ejector, finally uses encapsulant to fill encapsulation main body and emulsion sheet shape
In the space of the rectangular profile become.
It is an advantage of the invention that novel structure, place magnet inside encapsulation main body, magnet surface posts magnetoresistive chip, and
Keeping the relative position of chip and encapsulation main body, pad is at the ipsilateral penumbra of upper and lower surface and runs through, convenient encapsulation vertically or
Level is welded, and the encapsulant of the space within encapsulation main body is filled, and has integrated level high, and volume is little, easy for installation, welding side
The advantages such as formula is flexible, and contamination resistance is strong, stable output signal.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation that the present invention removes encapsulant；
Fig. 3 is the structural representation that the present invention encapsulates the back side
Fig. 4 is the structure sectional view of the present invention；
Fig. 5 is the structure sectional view of encapsulation main body 3 of the present invention.
Detailed description of the invention
Magnetoresistive chip 1 is placed on the line direction, N, S pole of magnet 2, and magnetoresistive chip 1 is close to surface, N pole, magnet 2 with
The internal fixing connection of encapsulation main body 3, magnetoresistive chip signal leading point couples with signal ejector 4 one end, and this signal draws dress
Putting 4 other ends to be connected with pad 5 and connect, this pad 5 is connected with the edge of encapsulation main body upper and lower surface and side, in the middle of each pad
Porose, emulsion sheet 6 covers in encapsulation main body 3, and the sky of the rectangular profile of encapsulation main body and emulsion sheet formation filled by encapsulant 7
In gap.
Chamfering 301 is had in pad side outside encapsulation main body of the present invention.
Magnet of the present invention has gap with the front end of encapsulation main body, and encapsulant is used for protecting magnet and magnetic resistance after filling
Chip, is not destroyed by external force.
Magnetoresistive chip 1 takes TMR magnetoresistive chip.
Method for packing of the present invention, comprises the following steps:
First magnetoresistive chip 1 is close to magnet 2 surface, re-uses signal ejector 4 and connect pad 5 and the magnetic resistance of encapsulation main body
The side of chip, is affixed on emulsion sheet 6 on signal ejector 4 afterwards, finally uses encapsulant 7 fill encapsulation main body and cover
In the space of the rectangular profile that cover plate is formed.
Claims (5)
1. a gear type sensor module based on magnetoresistive chip, it is characterised in that: magnetoresistive chip is placed on N, S pole of magnet
On line direction, magnetoresistive chip is close to surface, N pole, and fix internal with encapsulation main body of magnet is connected, and magnetoresistive chip signal is drawn
Point couples with signal ejector one end, and this signal ejector other end is connected with pad and connects, on this pad and encapsulation main body
The edge of lower surface and side connects, porose in the middle of each pad, and emulsion sheet covers in encapsulation main body, and envelope filled by encapsulant
In the space of the rectangular profile that dress body and emulsion sheet are formed.
A kind of gear type sensor module based on magnetoresistive chip the most according to claim 1, it is characterised in that: described envelope
Dress body exterior has chamfering in pad side.
A kind of gear type sensor module based on magnetoresistive chip the most according to claim 1, it is characterised in that: described magnetic
Body has gap with the front end of encapsulation main body.
A kind of gear type sensor module based on magnetoresistive chip the most according to claim 1, it is characterised in that: described magnetic
Resistance chip takes TMR magnetoresistive chip.
A kind of gear type sensor module method for packing based on magnetoresistive chip, it is characterised in that
Comprise the following steps:
First magnetoresistive chip is close to magnet surface, re-uses signal ejector and connect pad and the magnetoresistive chip of encapsulation main body
Side, afterwards emulsion sheet is affixed on signal ejector, finally uses encapsulant to fill encapsulation main body and emulsion sheet shape
In the space of the rectangular profile become.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553741.1A CN106206934A (en) | 2016-07-14 | 2016-07-14 | A kind of gear type sensor module based on magnetoresistive chip and method for packing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610553741.1A CN106206934A (en) | 2016-07-14 | 2016-07-14 | A kind of gear type sensor module based on magnetoresistive chip and method for packing thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106206934A true CN106206934A (en) | 2016-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610553741.1A Pending CN106206934A (en) | 2016-07-14 | 2016-07-14 | A kind of gear type sensor module based on magnetoresistive chip and method for packing thereof |
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| CN (1) | CN106206934A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997031A (en) * | 2017-05-18 | 2017-08-01 | 长春禹衡光学有限公司 | A kind of sensor module and its method for packing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040100832A1 (en) * | 2002-09-05 | 2004-05-27 | Kentaro Nakajima | Magnetic memory device |
| CN102809665A (en) * | 2012-06-04 | 2012-12-05 | 江苏多维科技有限公司 | Magnetic resistance gear sensor |
| CN202916902U (en) * | 2012-10-31 | 2013-05-01 | 江苏多维科技有限公司 | Currency detection magnetic head with magnetic bias processing-based sensitive direction parallel to detection surface |
| CN104167043A (en) * | 2013-05-17 | 2014-11-26 | 北京嘉岳同乐极电子有限公司 | Chip-type weak magnetic detection sensor |
| CN104767080A (en) * | 2014-01-07 | 2015-07-08 | 英飞凌科技股份有限公司 | Magnet assembly package and method for manufacturing magnet assembly package |
| CN105301530A (en) * | 2014-07-22 | 2016-02-03 | 英飞凌科技股份有限公司 | Apparatus and a system for detecting a physical variable |
-
2016
- 2016-07-14 CN CN201610553741.1A patent/CN106206934A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040100832A1 (en) * | 2002-09-05 | 2004-05-27 | Kentaro Nakajima | Magnetic memory device |
| CN102809665A (en) * | 2012-06-04 | 2012-12-05 | 江苏多维科技有限公司 | Magnetic resistance gear sensor |
| CN202916902U (en) * | 2012-10-31 | 2013-05-01 | 江苏多维科技有限公司 | Currency detection magnetic head with magnetic bias processing-based sensitive direction parallel to detection surface |
| CN104167043A (en) * | 2013-05-17 | 2014-11-26 | 北京嘉岳同乐极电子有限公司 | Chip-type weak magnetic detection sensor |
| CN104767080A (en) * | 2014-01-07 | 2015-07-08 | 英飞凌科技股份有限公司 | Magnet assembly package and method for manufacturing magnet assembly package |
| CN105301530A (en) * | 2014-07-22 | 2016-02-03 | 英飞凌科技股份有限公司 | Apparatus and a system for detecting a physical variable |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997031A (en) * | 2017-05-18 | 2017-08-01 | 长春禹衡光学有限公司 | A kind of sensor module and its method for packing |
| CN106997031B (en) * | 2017-05-18 | 2024-05-10 | 长春禹衡光学有限公司 | Sensor module and packaging method thereof |
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Application publication date: 20161207 |
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