CN106993395A - A kind of power amplifier - Google Patents
A kind of power amplifier Download PDFInfo
- Publication number
- CN106993395A CN106993395A CN201710286650.0A CN201710286650A CN106993395A CN 106993395 A CN106993395 A CN 106993395A CN 201710286650 A CN201710286650 A CN 201710286650A CN 106993395 A CN106993395 A CN 106993395A
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- China
- Prior art keywords
- fan
- power amplifier
- enclosure body
- deflector
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000012546 transfer Methods 0.000 claims abstract description 5
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 6
- 238000004512 die casting Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of power amplifier.The power amplifier includes enclosure body, side fin, fan and deflector, the inwall of the enclosure body contacts to carry out heat transfer with the high-power components of the power amplifier, the side fin is two, and on the outer surface for being disposed in parallel in the enclosure body, the deflector is oppositely arranged with the outer surface, the side fin, the outer surface and the deflector constitute current path, and the fan is located at one end of the current path.The power amplifier has the characteristics of radiating effect is good.
Description
Technical field
The present invention relates to radiator structure technical field, more particularly, to a kind of power amplifier.
Background technology
Operationally, internal component can produce substantial amounts of heat to power amplifier.When heat can not be distributed in time, meeting
Have a strong impact on the reliability and service life of electronic component.Simultaneously with the continuous improvement of power amplifier properties, chip power
Also constantly lifting therewith, is produced so as to directly results in more heats.
The radiator structure of existing power amplifier generally has two kinds.
For example, the integrally formed radiating shell of die casting constitutes primary structural component, built-in PCBA with bottom.This structure radiating effect
It is really poor, it is adaptable to the power amplifier of low-power.
For example, install radiator additional in chip position, and increase fan and radiated.Although this mode can be by air-cooled
The rapidly temperature on reduction chip, but whole heat is still gathered in enclosure interior, it is necessary to rational device arrangement and air channel
Design can just play radiating effect, and the arrangement requirement to device is high.Enclosure interior entirety heat is higher, to the running environment of device
Unfavorable, while such assembling is complex, volume is big, low production efficiency.
The content of the invention
It is an object of the present invention to provide a kind of new solution of power amplifier.
There is provided a kind of power amplifier according to the first aspect of the invention.The power amplifier includes enclosure body, side
Fin, fan and deflector, the inwall of the enclosure body contact to carry out heat with the high-power components of the power amplifier
Conduction, the side fin is two, and is disposed in parallel on the outer surface of the enclosure body, the deflector with it is described outer
Surface is oppositely arranged, and the side fin, the outer surface and the deflector constitute current path, and the fan is located at the gas
One end of logical circulation road.
Alternatively, heat conduction is provided with the inwall raised, the heat conduction is raised with the side fin or two institutes
The region stated between the fin of side is oppositely arranged, the high-power components and the heat conduction projection contacts.
Alternatively, it is provided with thermal conductive silicon rubber cushion between the high-power components and the heat conduction are raised.
Alternatively, the distance between two described side fins are from one end close to the fan to one away from the fan
End is gradually reduced.
Alternatively, in addition to the central fins that are arranged between two side fins.
Alternatively, the central fins is multiple, the central fins with the fan separately, by submedial described
Between spacing between central fins and the fan is more than between the central fins away from the center line and the fan
Away from.
Alternatively, multiple central fins form the air intake area of approximately " V " font.
Alternatively, the height of the fan is more than the height of the central fins, in the outer surface and the air intake
The relative position in area is provided with by the fan to the excessive first slope of the central fins, and/or in the deflector
The position relative with the air intake area is provided with by the fan to the second excessive slope of the central fins.
Alternatively, the distance between outer surface of the deflector and the enclosure body is by one end close to the fan
It is gradually reduced to one end away from the fan.
Alternatively, in addition to PCBA, the PCBA are arranged in the enclosure body, the high-power components of the PCBA
Contacted with the inwall of the enclosure body.It was found by the inventors of the present invention that in the prior art, the radiating effect of power amplifier
Difference, is not suitable for the radiating of high-power components.Therefore, the technical assignment or technology to be solved that the present invention to be realized are asked
Topic be it is that those skilled in the art never expect or it is not expected that, therefore the present invention is a kind of new technical scheme.
The power amplifier of the embodiment of the present invention passes through side fin, outer surface and deflector formation current path, fan production
Raw wind is limited at flowing in current path.In this way, windage loss can be reduced, flow velocity is added.
In addition, the power amplifier has good radiating effect, it is adaptable to the radiating of high-power components.
In addition, radiator structure is arranged on the outside of enclosure body, inner space is not take up, heat scatters and disappears rapid.
In addition, the power amplifier is simple in construction, demolition, installation are convenient.
In addition, side fin adds area of dissipation, radiating can be made rapider.
By referring to the drawings to the detailed description of the exemplary embodiment of the present invention, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used for the principle for explaining the present invention together with its explanation.
Fig. 1 is the local exploded view of power amplifier according to an embodiment of the invention.
Fig. 2 is the exploded view of power amplifier according to an embodiment of the invention.
Fig. 3 is the structural representation of enclosure body according to an embodiment of the invention.
Fig. 4 is the view of another angle of Fig. 3.
Fig. 5 is fan according to an embodiment of the invention and the installation diagram of enclosure body.
Description of reference numerals：
11：Enclosure body；12：Side fin；13：Central fins；14：Fan；15：Heat conduction is raised；16：Deflector；17：The
Two slopes；18：First slope；19：Air intake area；20：PCBA.
Embodiment
The various exemplary embodiments of the present invention are described in detail now with reference to accompanying drawing.It should be noted that：Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments does not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
Fig. 1 is the local exploded view of power amplifier according to an embodiment of the invention.Fig. 2 is according to of the invention one
The exploded view of the power amplifier of embodiment.
There is provided a kind of power amplifier according to one embodiment of present invention.The power amplifier is particularly suitable for use in respectively
The vehicle-mounted of vehicle is planted to use.The power amplifier includes enclosure body 11, side fin 12, fan 14 and deflector 16.For example, shell
Body body 11 is tabular, and it has inwall and outer surface.
The inwall of enclosure body 11 contacts to carry out heat transfer with the high-power components of power amplifier.For example, housing sheet
Body 11 is fabricated by by copper alloy or aluminium alloy.These thermal conductivity of material are good and are easy to processing.For example, high-power member
Part is directly contacted with inwall.
Side fin 12 is two, and is disposed in parallel on the outer surface of enclosure body 11.For example, side fin 12 perpendicular to
Outer surface.Two side fins 12 be arranged in parallel, therebetween the distance with setting；Either two side fins 12 are not parallel,
But bearing of trend is roughly the same.Deflector 16 and the outer surface of enclosure body 11 are oppositely arranged.Deflector 16 is used to guide air-flow.
Preferably, side fin 12 is integrally formed with enclosure body 11.For example, integral by the way of casting or die casting
Shaping, can so simplify procedure of processing and the bonding strength of the two is high.
For example, as shown in figure 1, being provided perpendicular to the screwed hole of outer surface on side fin 12.User will by screw
Deflector 16 is fixed on side fin 12.In this way, the demolition, installation of deflector 16 become convenient.
Side fin 12, outer surface and deflector 16 constitute current path, and fan 14 is located at one end of current path.Fan 14
The wind of generation is via current path, to take away the heat conducted by internal heating element to outer surface and side fin 12.
The power amplifier of the embodiment of the present invention passes through the outer surface of side fin 12 and the formation current path of deflector 16, fan
14 wind produced are limited at flowing in current path.In this way, windage loss can be reduced, flow velocity is added.
In addition, the power amplifier has good radiating effect, it is adaptable to the radiating of high-power components.
In addition, the radiator structure of the power amplifier is arranged on the outside of enclosure body, inner space is not take up, heat scatters and disappears
Rapidly.
In addition, the power amplifier is simple in construction, demolition, installation are convenient.
In addition, side fin 12 adds area of dissipation, radiating can be made rapider.
In one example, as shown in Fig. 2 the power amplifier includes PCBA20 (Printed Circuit Board
Assembly, pcb component) PCBA20 is arranged in enclosure body 11, PCBA20 high-power components and housing sheet
The inwall contact of body 11, to carry out heat transfer.
In one example, heat conduction projection 15 is provided with inwall.As shown in figure 4, heat conduction projection 15 protrudes from housing
The inwall of body 11, to be contacted with high-power components.High-power components are contacted with heat conduction projection 15.For example, high-power components
For chip, resistive element, capacity cell etc..
Heat conduction projection 15 and the region in fin 12 or two between fin 12 are oppositely arranged, in order to which heat is passed
It is directed on outer surface or side fin 12.Heat conduction projection 15 is using the good material of heat transfer.For example, copper alloy, aluminium alloy etc..
For example, it is preferable that, heat conduction projection 15 and side fin 12 are integrally formed with enclosure body 11.For example, using casting
Or the mode of die casting is integrally formed.In this way, simplify procedure of processing and bonding strength is high.
Preferably, thermal conductive silicon rubber cushion is provided between high-power components and heat conduction projection 15.Thermal conductive silicon rubber cushion can
Effectively improve the efficiency of heat conduction.
In addition, thermal conductive silicon rubber cushion is flexible, buffering vibration can be played a part of.
If two side fins 12 be arranged in parallel, as the wind of fan 14 is gradually distance from fan 14, due to the effect of windage,
Blast can be reduced gradually, and wind speed is gradually reduced, and so be unfavorable for scattering and disappearing for heat.
In one example, the distance between two side fins 12 are from one end close to fan 14 to one away from fan 14
End is gradually reduced.For example, two formation wedge structures of side fin 12.In this way, the cross-sectional area of current path is by entering
Wind area 19 is gradually reduced to air outlet, can effectively be made up the pressure loss that current path comes apart from elongated strap, be increased wind
Pressure, improves air velocity, is conducive to heat to scatter and disappear.
In one example, power amplifier also includes the central fins 13 being arranged between two side fins 12.It is middle
The setting of fin 13 effectively increases area of dissipation, and the heat of high-power components can be made to distribute rapidly.
For example, central fins 13 are perpendicular to outer surface, the bearing of trend of central fins 13 is roughly the same with side fin 12, with
Just multiply runner is formed.Central fins 13 it is highly consistent, in order to which the air-flow of multiply runner is uniform.
Preferably, central fins 13, side fin 12, heat conduction projection 15 are integrally formed with enclosure body 11, for example with
The mode of casting or die casting is integrally formed.In this way, simplify procedure of processing and bonding strength is high.
In addition, the structure of integration is conducive to the quick conduction of heat.
Those skilled in the art can set the quantity of central fins 13 according to actual needs.
In one example, central fins 13 are multiple.Central fins 13 and fan 14 are separately.By submedial centre
Spacing between fin 13 and fan 14 is more than the spacing between the central fins 13 away from center line and fan 14.For example, center line
For to two side fins 12 apart from identical line, as shown in Figure 3.In this way, wind can be reduced in flow process
The pressure loss.
Furthermore it is possible to reduce the generation of turbulent flow phenomenon, the energy loss of wind is reduced, blast is improved.
For example, as shown in figure 3, the distance of center line to two side fins 12 is equal.Central fins 13 are 4, are distributed two-by-two
In the both sides of center line.It is more than two centres away from center line by the distance between submedial two central fins 13 and fan 14
The distance between fin 13 and fan 14.This structure can reduce the pressure loss, reduction turbulent flow.
Preferably, multiple central fins 13 form the air intake area 19 of approximately " V " font.For example, as shown in Figures 3 and 5, by
Distance is different between multiple central fins 13 and fan 14, forms the air intake area 19 of approximate " V " font.For example, approximate " V " word
Shape can form the air intake area 19 of " V " font, U-shaped or arc.This structure can further reduce the pressure loss, reduction
Turbulent flow.
In one example, the height of fan 14 is more than the height of central fins 13.In this way, it can guarantee that fan
14 air supply areas are more than or equal to the sectional area of current path, to ensure that enough wind enters in current path.
It is provided with the position relative with air intake area 19 of outer surface by fan 14 to excessive first oblique of central fins 13
Slope 18, and/or be provided with the position relative with air intake area 19 of deflector 16 by fan 14 to central fins 13 it is excessive the
Two slopes 17.In this way, it can effectively reduce windage, and increase to up to the blast after central fins 13.
For example, as shown in figure 3, the outer surface of enclosure body 11 is gone down in the position depression for installing fan 14, in air intake area
19 are provided with first slope 18.First slope 18 can make the gap that the wind of fan 14 smoothly enters between central fins 13 and
Gap between central fins 13 and side fin 12.
For example, as shown in figure 1, deflector 16 is made at air intake area 19 to the shape of contract to form the second slope
17.Similarly, the second slope 17 can make the wind of fan 14 smoothly into the gap between central fins 13 and central fins
Gap between 13 and side fin 12.
In addition, can so reduce the local height of enclosure body 11, it is easy to be assembled in other equipment, has complied with electronics
Equipment is lightening, miniaturization development trend.
In one example, the distance between outer surface of deflector 16 and enclosure body 11 is by one end close to fan 14
It is gradually reduced to one end away from fan 14.In this way, the cross-sectional area of current path is by air intake area 19 to air outlet
It is gradually reduced, equally can effectively makes up the pressure loss that current path comes apart from elongated strap, increase blast, improve gas
Flow velocity degree, is conducive to heat to scatter and disappear.
Although some specific embodiments of the present invention are described in detail by example, the skill of this area
Art personnel are it should be understood that example above is merely to illustrate, the scope being not intended to be limiting of the invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (10)
1. a kind of power amplifier, it is characterised in that including enclosure body (11), side fin (12), fan (14) and deflector
(16), the inwall of the enclosure body (11) is contacted with the high-power components of the power amplifier to carry out heat transfer, described
Side fin (12) is two, and is disposed in parallel on the outer surface of the enclosure body (11), the deflector (16) and institute
State outer surface to be oppositely arranged, the side fin (12), the outer surface and the deflector (16) constitute current path, the wind
Fan one end that (14) are located at the current path.
2. power amplifier according to claim 1, it is characterised in that heat conduction is provided with the inwall raised
(15), raised (15) are relative with the region when fin (12) or two are described between fin (12) sets for the heat conduction
Put, the high-power components are contacted with the heat conduction raised (15).
3. power amplifier according to claim 2, it is characterised in that raised in the high-power components and the heat conduction
(15) thermal conductive silicon rubber cushion is provided between.
4. power amplifier according to claim 1, it is characterised in that the distance between two described side fins (12) by
It is gradually reduced close to one end of the fan (14) to one end away from the fan (14).
5. power amplifier according to claim 1, it is characterised in that also including being arranged on two side fins (12)
Between central fins (13).
6. power amplifier according to claim 5, it is characterised in that the central fins (13) be it is multiple, it is described in
Between fin (13) and the fan (14) separately, by between the submedial central fins (13) and the fan (14)
Spacing is more than the spacing between the central fins (13) away from the center line and the fan (14).
7. power amplifier according to claim 6, it is characterised in that multiple central fins (13) form approximate
The air intake area (19) of " V " font.
8. power amplifier according to claim 7, it is characterised in that the height of the fan (14) is more than the centre
The height of fin (13), be provided with the position relative with the air intake area (19) of the outer surface by the fan (14) to
The excessive first slope (18) of the central fins (13), and/or in the deflector (16) and air intake area (19) phase
To position be provided with by the fan (14) to excessive the second slope (17) of the central fins (13).
9. power amplifier according to claim 1, it is characterised in that the deflector (16) and the enclosure body
(11) the distance between outer surface gradually subtracts from one end close to the fan (14) to one end away from the fan (14)
It is small.
10. power amplifier according to claim 1, it is characterised in that also including PCBA (20), PCBA (20) quilt
It is arranged in the enclosure body (11), the high-power components and the inwall of the enclosure body (11) of the PCBA (20) connect
Touch.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710286650.0A CN106993395A (en) | 2017-04-27 | 2017-04-27 | A kind of power amplifier |
| PCT/CN2017/089477 WO2018196141A1 (en) | 2017-04-27 | 2017-06-22 | Power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710286650.0A CN106993395A (en) | 2017-04-27 | 2017-04-27 | A kind of power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106993395A true CN106993395A (en) | 2017-07-28 |
Family
ID=59417029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710286650.0A Pending CN106993395A (en) | 2017-04-27 | 2017-04-27 | A kind of power amplifier |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106993395A (en) |
| WO (1) | WO2018196141A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107517579A (en) * | 2017-10-25 | 2017-12-26 | 成都西井科技有限公司 | A kind of radiator of power amplifier |
| CN112243339A (en) * | 2020-12-04 | 2021-01-19 | 北京理工大学深圳汽车研究院(电动车辆国家工程实验室深圳研究院) | Double-circulation heat dissipation system |
| CN112312722A (en) * | 2019-07-25 | 2021-02-02 | 上海擎感智能科技有限公司 | Host shell, integrated host and vehicle-mounted multimedia |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752374A (en) * | 2013-12-26 | 2015-07-01 | 华为技术有限公司 | Radiator and radiator group |
| CN204695202U (en) * | 2015-05-05 | 2015-10-07 | 苏州三星电子电脑有限公司 | Wind-cooling heat dissipating unit and there is the notebook computer of this wind-cooling heat dissipating unit |
| CN105682415A (en) * | 2014-11-20 | 2016-06-15 | 深圳万讯自控股份有限公司 | Radiating apparatus, driver and radiating method for driver |
| CN106028766A (en) * | 2016-08-02 | 2016-10-12 | 成都雷电微力科技有限公司 | Novel cooling fin runner structure |
| CN205830253U (en) * | 2016-08-02 | 2016-12-21 | 成都雷电微力科技有限公司 | A kind of Novel fin flow passage structure |
-
2017
- 2017-04-27 CN CN201710286650.0A patent/CN106993395A/en active Pending
- 2017-06-22 WO PCT/CN2017/089477 patent/WO2018196141A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752374A (en) * | 2013-12-26 | 2015-07-01 | 华为技术有限公司 | Radiator and radiator group |
| CN105682415A (en) * | 2014-11-20 | 2016-06-15 | 深圳万讯自控股份有限公司 | Radiating apparatus, driver and radiating method for driver |
| CN204695202U (en) * | 2015-05-05 | 2015-10-07 | 苏州三星电子电脑有限公司 | Wind-cooling heat dissipating unit and there is the notebook computer of this wind-cooling heat dissipating unit |
| CN106028766A (en) * | 2016-08-02 | 2016-10-12 | 成都雷电微力科技有限公司 | Novel cooling fin runner structure |
| CN205830253U (en) * | 2016-08-02 | 2016-12-21 | 成都雷电微力科技有限公司 | A kind of Novel fin flow passage structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107517579A (en) * | 2017-10-25 | 2017-12-26 | 成都西井科技有限公司 | A kind of radiator of power amplifier |
| CN112312722A (en) * | 2019-07-25 | 2021-02-02 | 上海擎感智能科技有限公司 | Host shell, integrated host and vehicle-mounted multimedia |
| CN112243339A (en) * | 2020-12-04 | 2021-01-19 | 北京理工大学深圳汽车研究院(电动车辆国家工程实验室深圳研究院) | Double-circulation heat dissipation system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018196141A1 (en) | 2018-11-01 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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Application publication date: 20170728 |