CN211653594U - Server of special integrated circuit chip - Google Patents
Server of special integrated circuit chip Download PDFInfo
- Publication number
- CN211653594U CN211653594U CN202020572029.8U CN202020572029U CN211653594U CN 211653594 U CN211653594 U CN 211653594U CN 202020572029 U CN202020572029 U CN 202020572029U CN 211653594 U CN211653594 U CN 211653594U
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- circuit board
- server according
- power supply
- containing cavity
- server
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 230000005855 radiation Effects 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 238000009423 ventilation Methods 0.000 claims description 15
- 238000010248 power generation Methods 0.000 claims description 13
- 239000000428 dust Substances 0.000 claims description 7
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
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Abstract
The utility model discloses a special integrated circuit chip's server, this server includes: the device comprises a case, a base and a power supply, wherein a containing cavity is formed in the case; the circuit board is arranged in the containing cavity, and an integrated circuit chip and a power supply are arranged on the circuit board at intervals; the heat radiation fan is arranged on the side wall of the containing cavity and is arranged opposite to the circuit board, and the heat radiation fan is electrically connected with the power supply; the thermoelectric generation assembly is arranged in the containing cavity and is abutted against one side of the heat dissipation fan, and the thermoelectric generation assembly is electrically connected with the circuit board. The utility model discloses technical scheme aims at avoiding the waste of resource when improving the radiating effect with heat conversion into electric energy.
Description
Technical Field
The utility model relates to a server technical field, in particular to application specific integrated circuit chip's server.
Background
With the development of science and technology, the operation function of the server is more and more powerful, and the working power consumption of the integrated circuit chip is higher and higher, but the integrated circuit chip can generate a large amount of heat during working so that the temperature of the integrated circuit chip is sharply increased, so that the performance of the server is reduced due to the operation speed, and potential safety hazards exist. Usually, the heat dissipation is performed by a heat dissipation fan, which is not ideal in heat dissipation effect and causes a lot of waste of resources.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a server aims at avoiding the waste of resource when improving the radiating effect with heat conversion into the electric energy.
To achieve the above object, the present invention provides a server including:
the device comprises a case, a base and a power supply, wherein a containing cavity is formed in the case;
the circuit board is arranged in the containing cavity and is provided with an integrated chip and a power supply at intervals;
the heat radiation fan is arranged on the side wall of the containing cavity and is arranged opposite to the circuit board, and the heat radiation fan is electrically connected with the power supply;
the thermoelectric generation assembly is arranged in the containing cavity and is abutted against one side of the heat dissipation fan, and the thermoelectric generation assembly is electrically connected with the circuit board.
Furthermore, the circuit board is provided with a voltage stabilizing circuit, and the thermoelectric generation assembly is electrically connected with the power supply through the voltage stabilizing circuit.
Further, the thermoelectric generation component comprises a power generation piece and a metal cooling fin which are mutually abutted, and the power generation piece is arranged between the metal cooling fin and the power generation piece.
Furthermore, an insulating layer is arranged between the power generation sheet and the circuit board.
Furthermore, a temperature sensor is arranged in the containing cavity and electrically connected with the circuit board.
Furthermore, a ventilation hole communicated with the outside is formed in the position, adjacent to the metal cooling fin, of the chassis.
Further, the ventilation hole is opposite to the metal cooling fin.
Further, the ventilation hole is equipped with a plurality ofly, and is a plurality of the even interval in ventilation hole sets up.
Furthermore, a dust screen is arranged at the orifice of the vent hole.
The utility model discloses among the technical scheme, utilize radiator fan to form the air convection, make the air current through heating element such as integrated circuit chip and power, the thermoelectric generation subassembly in low reaches will be blown from the heat source in upper reaches, adopt the heat in the higher incoming flow air of thermoelectric generation subassembly absorbed temperature, and then turn into the electric current in order to charge for the power, the power is the radiator fan power supply again, thereby form the reuse of resource, not only improved the utilization ratio of resource, and the radiating efficiency has been improved, and the operational property of extension integrated circuit chip prolongs its life.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a server according to the present invention;
FIG. 2 is a schematic cross-sectional view of the server in FIG. 1;
fig. 3 is a partially enlarged view of a portion a in fig. 2.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a server 100 of application specific integrated circuit chip.
Referring to fig. 1 to 3, the server 100 for asic chip includes:
the device comprises a case 10, wherein a containing cavity 11 is formed in the case 10;
the circuit board 20 is arranged in the cavity 11, and the circuit board 20 is provided with integrated chips and a power supply 22 at intervals;
the heat radiation fan 30 is arranged on the side wall of the accommodating cavity 11 and is opposite to the circuit board 20, and the heat radiation fan 30 is electrically connected with the power supply 22;
the thermoelectric generation assembly 40 is arranged in the cavity 11 and is abutted against one side of the circuit board 20 departing from the heat dissipation fan 30, and the thermoelectric generation assembly 40 is electrically connected with the circuit board 20.
Note that, when the server 100 is operating, both the integrated circuit chip 21 and the power supply 22 generate heat, and the operation speed of the server 100 is affected. The cooling fan 30 blows air with a high temperature to the thermoelectric generation assembly 40, and a temperature difference is generated at both sides of the thermoelectric generation assembly 40, thereby forming a potential difference. The thermoelectric generation element 40 may contact the circuit board 20 to convert more heat into electric energy, and of course, the thermoelectric generation element 40 may not contact the circuit board 20 as long as a temperature difference is formed between both sides thereof. In addition, when the server 100 is suddenly powered off, the electric energy generated by the thermoelectric generation assembly 40 can satisfy the electric energy required by the server 100 in a short time, so that the server 100 can save data in time, the loss of the data is avoided, and the economic loss is reduced.
The utility model discloses among the technical scheme, utilize radiator fan 30 to form the air convection, make the air current through heating element such as integrated circuit chip 21 and power 22, the thermoelectric generation subassembly 40 in low reaches will be blown from the heat source in upper reaches, adopt the heat in the higher incoming flow air of thermoelectric generation subassembly 40 absorbed temperature, and then turn into the electric current in order to charge for power 22, power 22 is radiator fan 30 power supply again, thereby form the reuse of resource, not only the utilization ratio of resource has been improved, and the radiating efficiency has been improved, and prolong integrated circuit chip 21's operational performance and prolong its life.
Preferably, the circuit board 20 is provided with a regulator circuit, and the thermoelectric generation assembly 40 is electrically connected with the power supply 22 through the regulator circuit.
Since the temperature difference between the thermoelectric generation assembly 40 and the two sides is not constant, the generated potential difference is not stable, and therefore a voltage stabilizing circuit needs to be added to the circuit board 20 to provide a stable voltage for the power supply 22. Note that the regulator circuit is integrated on the circuit board 20 at the beginning of designing the circuit board 20.
Referring to fig. 2 and 3, the thermoelectric generation module 40 includes a power generation sheet 41 and a metal heat sink 42 abutting each other, and the power generation sheet 41 is disposed between the metal heat sink 42 and the power generation sheet 41.
Specifically, the thermoelectric heating assembly includes a power generating sheet 41 and a metal heat dissipating sheet 42, the power generating sheet 41 is close to a heat source, and a temperature difference is generated between two surfaces of the power generating sheet 41 and the metal heat dissipating sheet 42, so that electrons move from a high temperature region to a low temperature region along with the temperature difference, and the migration of the electrons forms a potential difference. The metal heat sink 42 can dissipate heat from the side of the thermoelectric generation assembly 40 facing away from the heat source, further increasing the temperature difference between the two surfaces, and thus allowing a higher potential difference to be generated. In addition, the thermoelectric generation module 40 may also be made of two different metal sheets, such as a copper sheet and an iron sheet, or may be made of a copper-free sheet, which is not limited herein.
Referring to fig. 3, an insulating layer 50 is further disposed between the power generating chip 41 and the circuit board 20.
In order to avoid the potential difference between the two sides of the thermoelectric generation assembly 40 from interfering with the components on the circuit board 20, an insulating layer 50 is arranged between the power generation sheet 41 and the circuit board 20, the insulating layer 50 can be connected with the power generation sheet 41 or the circuit board 20 in a sticking manner, and the connecting manner is simple and easy to operate. Specifically, the insulating layer 50 may be a silica gel layer, or a layer of insulating silica gel is brushed between the surface power generating sheets 41.
Referring to fig. 2, a temperature sensor 60 is further disposed in the cavity 11, and the temperature sensor 60 is electrically connected to the circuit board 20.
In this embodiment, the temperature sensor 60 is used to detect the temperature of the corresponding position, when the temperature in the cavity 11 reaches a preset temperature threshold, the heat dissipation fan 30 is turned on to dissipate heat, and when the temperature is lower than the preset threshold, the heat dissipation fan 30 does not operate, so as to reduce energy consumption.
Referring to fig. 2 and 3, the chassis 10 is provided with a vent hole 12 adjacent to the metal heat sink 42 for communicating with the outside.
In order to increase the convection of the air in the cavity 11, a ventilation hole 12 is formed in the chassis 10 adjacent to the metal heat sink 42, and the heat dissipation fan 30 forms air convection during operation, so as to bring the heat generated by the integrated circuit chip 21 and the circuit board 20 to the power generating chip 41. The metal heat sink 42 does not abut against the housing 10 so as not to block the ventilation hole 12 and affect the air convection.
Specifically, the ventilation holes 12 are disposed opposite to the metal heat sink 42.
In the present embodiment, the ventilation hole 12 is disposed opposite to the metal heat sink 42, and the heat dissipation fan 30 is disposed opposite to the power generating plate 41, so that the ventilation hole 12 is disposed opposite to the heat dissipation fan 30, and the hot air flow generated by the heat dissipation fan 30 passing through the circuit board 20 directly faces the power generating plate 41, thereby reducing the heat loss. In a preferred embodiment, the ventilation hole 12, the integrated circuit chip 21, the fan and the power generating chip 41 are located on the same straight line, so that the path through which the air flow passes is shortened, the temperature difference between the power generating chip 41 and the metal heat sink 42 is increased, and a higher potential difference is formed.
Further, the vent holes 12 are provided in plural, and the plurality of vent holes 12 are arranged at even intervals.
In this embodiment, the plurality of ventilation holes 12 are uniformly arranged on the case 10 at intervals, so that the metal cooling fins 42 are more uniformly spaced from the side of the power generating fin 41, the temperature difference of the thermoelectric power generating assembly 40 is more uniformly distributed, and a stable potential difference is generated. The shape of the vent hole 12 may be circular, or may be other shapes, which is not limited herein.
Referring to fig. 2 and 3, a dust screen 70 is disposed at the opening of the ventilation hole 12.
Preferably, the opening of the vent hole 12 is provided with a dust screen 70 to prevent external dust from entering the cavity 11 and falling on the metal heat sink 42, which affects the power generation effect. In addition, dust enters the containing cavity 11 and falls on heating elements such as the circuit board 20 or the integrated circuit chip 21, the heat dissipation effect is affected, potential safety hazards are brought, the operation speed of integrated circuit chips is reduced, and the service life of the integrated circuit chips is shortened. A mounting groove may be formed in the side wall of the vent hole 12, and the dust screen 70 may be mounted in the mounting groove.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (9)
1. A server for an application specific integrated circuit chip, comprising:
the device comprises a case, a base and a power supply, wherein a containing cavity is formed in the case;
the circuit board is arranged in the containing cavity, and an integrated circuit chip and a power supply are arranged on the circuit board at intervals;
the heat radiation fan is arranged on the side wall of the containing cavity and is arranged opposite to the circuit board, and the heat radiation fan is electrically connected with the power supply;
the thermoelectric generation assembly is arranged in the containing cavity and is abutted against one side of the heat dissipation fan, and the thermoelectric generation assembly is electrically connected with the circuit board.
2. The server according to claim 1, wherein the circuit board is provided with a voltage stabilizing circuit, and the thermoelectric generation assembly is electrically connected with the power supply through the voltage stabilizing circuit.
3. The server according to claim 2, wherein the thermoelectric generation module includes a power generation sheet and a metal heat sink abutting against each other, the power generation sheet being provided between the metal heat sink and the power generation sheet.
4. The server according to claim 3, wherein an insulating layer is further provided between the power generating sheet and the circuit board.
5. The server according to any one of claims 1 to 4, wherein a temperature sensor is further disposed in the cavity, and the temperature sensor is electrically connected to the circuit board.
6. The server according to claim 3, wherein the chassis is provided with a vent hole communicating with the outside adjacent to the metal heat sink.
7. The server according to claim 6, wherein the vent is disposed opposite the metal heat sink.
8. The server according to claim 7, wherein the ventilation hole is provided in plurality, and the plurality of ventilation holes are arranged at regular intervals.
9. The server according to claim 8, wherein a dust screen is provided at an opening of the ventilation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020572029.8U CN211653594U (en) | 2020-04-16 | 2020-04-16 | Server of special integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020572029.8U CN211653594U (en) | 2020-04-16 | 2020-04-16 | Server of special integrated circuit chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211653594U true CN211653594U (en) | 2020-10-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020572029.8U Active CN211653594U (en) | 2020-04-16 | 2020-04-16 | Server of special integrated circuit chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211653594U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566451A (en) * | 2020-11-13 | 2021-03-26 | 珠海格力电器股份有限公司 | Heat abstractor and contain its electrical equipment |
| WO2023216097A1 (en) * | 2022-05-07 | 2023-11-16 | 北京嘉楠捷思信息技术有限公司 | Thermoelectric conversion apparatus, electronic device, and waste heat recycling system |
-
2020
- 2020-04-16 CN CN202020572029.8U patent/CN211653594U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566451A (en) * | 2020-11-13 | 2021-03-26 | 珠海格力电器股份有限公司 | Heat abstractor and contain its electrical equipment |
| WO2023216097A1 (en) * | 2022-05-07 | 2023-11-16 | 北京嘉楠捷思信息技术有限公司 | Thermoelectric conversion apparatus, electronic device, and waste heat recycling system |
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