CN112188814B - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN112188814B CN112188814B CN202011157100.7A CN202011157100A CN112188814B CN 112188814 B CN112188814 B CN 112188814B CN 202011157100 A CN202011157100 A CN 202011157100A CN 112188814 B CN112188814 B CN 112188814B
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- Prior art keywords
- heat
- electronic device
- heat dissipation
- portable electronic
- assembly
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an electronic device, comprising: a portable electronic device and a base detachably mounted with the portable electronic device; wherein, portable electronic device includes: a first housing; a first heat dissipating assembly mounted within the first housing for contacting a heat source; the base includes: the second shell is provided with a plurality of ventilation openings; the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly. According to the invention, the second heat dissipation component is arranged in the base, so that the thickness problem, the noise problem and the heat dissipation problem of the portable electronic device are solved, the cruising ability of the portable electronic device in a low-load state is improved, the portable electronic device can be thinner and has zero noise, and the portable electronic device can be provided with a high-power-consumption processor, so that the performance of the portable electronic device is improved.
Description
Technical Field
The invention belongs to the field of heat dissipation devices, and particularly relates to electronic equipment.
Background
Along with development of technology, more and more portable electronic devices enter life of people, so that the life of people is facilitated, the portable electronic devices become an essential important tool for people, and the current tablet personal computer cannot be installed and used for radiating due to the small-size and thin-thickness requirements, so that in order to meet the radiating requirements, the power consumption of a processor of the general tablet personal computer is low, and the performance is poor.
Accordingly, in view of the above-described technical problems, it is necessary to provide an electronic apparatus.
Disclosure of Invention
In view of the above, the present invention is directed to an electronic device for achieving good heat dissipation.
In order to achieve the above object, an embodiment of the present invention provides the following technical solution:
an electronic device, comprising:
A portable electronic device and a base detachably mounted with the portable electronic device;
Wherein, portable electronic device includes:
A first housing;
a first heat sink assembly mounted within the first housing for effecting heat transfer with a heat source;
A base, comprising:
The second shell is provided with a plurality of ventilation openings;
the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly; and is configured to:
In a state that the portable electronic device and the base are mounted in a matched mode, the first heat dissipation assembly is in contact with the second heat dissipation assembly, heat generated by the heat source is transferred to the second heat dissipation assembly through the first heat dissipation assembly, and heat dissipation airflow flows through the heat dissipation channel to take away the heat on the second heat dissipation assembly;
in a state that the portable electronic device and the base are separated, heat generated by the heat source is radiated to the outside through the first radiating component.
In an embodiment, the first heat dissipation component includes a first vapor chamber that generates heat transfer with a heat source and that performs heat transfer with a second heat dissipation component in a state in which the portable electronic device and the base are mounted in a mating manner.
In one embodiment, heat transfer is generated between the first vapor chamber and the heat source through a heat pipe.
In an embodiment, the first vapor chamber is formed with a first connection portion for heat transfer with the heat pipe, and a second connection portion for contact with the second heat dissipation component in a state where the portable electronic device and the base are mounted in a matched manner.
In an embodiment, the second heat dissipation assembly includes a fan, and a heat dissipation fin assembly that is mounted in cooperation with the fan and that is in cooperation with the first heat dissipation assembly in a state in which the portable electronic device and the base are mounted, an internal flow passage is formed in the heat dissipation fin assembly, the internal flow passage has an air inlet opening and an air outlet opening, the air inlet opening is mounted in cooperation with an air outlet of the fan, and the air outlet opening is communicated with the outside through a vent.
In an embodiment, the second heat dissipation assembly further includes a second vapor chamber installed on the heat dissipation fin assembly and configured to perform heat transfer with the first heat dissipation assembly in a state in which the portable electronic device and the base are mounted in a matched manner.
In one embodiment, the heat dissipation fin assembly includes a first mounting plate, a second mounting plate, and fins mounted between the first mounting plate and the second mounting plate, wherein an internal flow channel is formed between the fins and the first mounting plate and between the fins and the second mounting plate, and the second soaking plate is mounted on the first mounting plate or the second mounting plate.
In one embodiment, the heat pipe is mounted in cooperation with the heat source via a mounting plate.
In an embodiment, the ventilation openings include a first ventilation opening and a second ventilation opening, and the first ventilation opening and the second ventilation opening respectively correspond to the heat dissipation channel.
Compared with the prior art, the invention has the following advantages:
According to the invention, the second heat dissipation component is arranged in the base, so that the thickness problem, the noise problem and the heat dissipation problem of the portable electronic device are solved, the cruising ability of the portable electronic device in a low-load state is improved, the portable electronic device can be thinner and has zero noise, and the portable electronic device can be provided with a high-power-consumption processor, so that the performance of the portable electronic device is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic side view of an electronic device according to an embodiment of the invention;
FIG. 2 is a schematic diagram illustrating an internal structure of a portable electronic device according to an embodiment of the invention;
FIG. 3 is a schematic view of a base according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of a base according to an embodiment of the invention;
FIG. 5 is a schematic view illustrating an internal structure of a base according to an embodiment of the invention;
fig. 6 is a schematic side view of a heat sink fin assembly according to an embodiment of the invention;
FIG. 7 is a schematic cross-sectional view of an electronic device according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a partial cross-sectional structure of an electronic device according to an embodiment of the invention;
fig. 9 is a schematic diagram illustrating an internal structure of an electronic device according to an embodiment of the invention.
Detailed Description
The present invention will be described in detail below with reference to the embodiments shown in the drawings. The embodiments are not intended to limit the invention, but structural, methodological, or functional modifications of the invention from those skilled in the art are included within the scope of the invention.
The invention discloses an electronic device, comprising:
A portable electronic device and a base detachably mounted with the portable electronic device;
Wherein, portable electronic device includes:
A first housing;
the first heat dissipation component is arranged in the first shell and realizes heat transfer with the heat source;
A base, comprising:
The second shell is provided with a plurality of ventilation openings;
the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly; and is configured to:
In a state that the portable electronic device and the base are mounted in a matched mode, the first heat dissipation assembly is in contact with the second heat dissipation assembly, heat generated by the heat source is transferred to the second heat dissipation assembly through the first heat dissipation assembly, and heat dissipation airflow flows through the heat dissipation channel to take away the heat on the second heat dissipation assembly;
in a state that the portable electronic device and the base are separated, heat generated by the heat source is radiated to the outside through the first radiating component.
The invention is further illustrated below with reference to specific examples.
Referring to fig. 1, an electronic device includes: the portable electronic device 10 and the base 20 detachably mounted to the portable electronic device 10, the portable electronic device 10 is typically a tablet computer, and the base 20 is typically a magnetic keyboard.
Referring to fig. 2, the portable electronic device 10 includes a first housing 11 and a first heat dissipating component installed in the first housing 11 and realizing heat transfer with a heat source, wherein the first heat dissipating component is installed in cooperation with the heat source through a mounting plate 123, and the heat source is typically a high power component such as a CPU, and the first heat dissipating component includes a heat pipe 121 and a first heat homogenizing plate 122 installed in cooperation with the heat pipe 121, the heat pipe 121 is installed in cooperation with the heat source through the mounting plate 123, the heat pipe 121, the first heat homogenizing plate 122 and the mounting plate 123 are installed together through welding, the mounting plate 123 is made of copper material, the mounting plate 123 is attached to the heat source to guide heat generated by the heat source to the heat pipe 121, and the heat on the heat pipe 121 is transferred to the first heat homogenizing plate 122.
Further, the first vapor chamber 122 is formed with a first connection portion 1221 connected to the heat pipe 121 and a second connection portion 1222 connected to the first connection portion 1221, the first connection portion 1221 and the second connection portion 1222 are formed by bending and a bending angle therebetween is 90 ° to 120 °, preferably 90 °, and a side surface of the first connection portion 1221 is closely attached to the heat pipe 121 by welding, thereby securing a heat conductive effect.
Referring to fig. 2, the bottom of the first housing 11 has a first opening with the y-axis direction as a reference direction, the second connection portion 1222 is located in or protrudes from the first opening, the bottom of the second connection portion 1222 is higher than the bottom of the first housing 11 or the bottom of the second connection portion 1222 is flush with the bottom of the first housing 11 or the bottom of the second connection portion 1222 protrudes from the bottom of the first housing 11.
Referring to fig. 3 and referring to fig. 4, the base 20 includes a second housing 21, the second housing 21 has a groove 211, the groove 211 is located at one end of the second housing 21, the second housing 21 includes a bottom plate 212 and a cover plate 213 mounted on the bottom plate 212, the cover plate 213 includes a third connecting portion 2131, a fourth connecting portion 2132, a fifth connecting portion 2133 and a sixth connecting portion 2134 which are sequentially connected, the third connecting portion 2131, the fourth connecting portion 2132, the fifth connecting portion 2133 and the sixth connecting portion 2134 are mounted through the side plate and the bottom plate 212 in a matched manner, an included angle between the third connecting portion 2131 and the fourth connecting portion 2132 is 100 ° to 160 °, preferably 140 °, an included angle between the fourth connecting portion 2132 and the fifth connecting portion 2133 is 90 ° to 120 °, preferably 90 °, the sixth connecting portion 2134 is connected with the bottom plate 212 through own bending, the portable electronic device 10 is placed through the groove 211, and the second opening is specifically placed in the groove 211, and the fourth connecting portion 2132 are placed in the groove 11 and the groove 11, and the fourth connecting portion 2132 is placed in the groove 11 and the corresponding to the groove 11, and the first opening can be placed in the groove 11, and the corresponding to the first opening 11 is guaranteed.
Referring to fig. 4 and referring to fig. 5, a second heat dissipation assembly is installed in the second housing 21, the second heat dissipation assembly is installed in a receiving cavity formed between the cover plate 213 and the bottom plate 212, a heat dissipation channel is formed in the second heat dissipation assembly, specifically, the second heat dissipation assembly includes a fan 241, a heat dissipation fin assembly 242 mounted in cooperation with the fan 241, an inner flow channel is formed in the heat dissipation fin assembly 242, the inner flow channel of the heat dissipation fin assembly 242 has an air inlet opening and an air outlet opening, the air inlet opening is mounted in cooperation with an air outlet of the fan 241, the air outlet opening is communicated with the outside, and the heat dissipation channel is formed between the inner flow channel of the fan 241 and the inner flow channel of the heat dissipation fin assembly 242.
Referring to fig. 5, a plurality of ventilation openings are formed in the second housing 21, the heat dissipation channel is communicated with the ventilation openings, specifically, the ventilation openings include a first ventilation opening 22 and a second ventilation opening 23, the first ventilation opening 22 and the second ventilation opening 23 respectively correspond to two ends of the heat dissipation channel, the first ventilation opening 22 and the second ventilation opening 23 are both formed in the bottom plate 212, wherein the first ventilation opening 22 is located below the air inlet of the fan 241, the second ventilation opening 23 corresponds to the air outlet opening of the inner flow channel of the heat dissipation fin assembly 242, a bending portion 2121 is formed at an end of the bottom plate 212 close to the air outlet opening of the heat dissipation fin assembly 242, and the second ventilation opening 23 is arranged on the bending portion 2121 so as to ensure correspondence to the air outlet opening of the inner flow channel of the heat dissipation fin assembly 242.
Referring to fig. 6, the heat dissipation fin assembly 242 includes a first mounting plate 2421, a second mounting plate 2422, and fins 2423 mounted between the first mounting plate 2421 and the second mounting plate 2422, the first mounting plate 2421 and the second mounting plate 2422 are disposed in a vertical distribution, the fins 2423 are disposed side by side, and an internal flow channel of the heat dissipation fin assembly 242 is formed between the fins 2423 and the first mounting plate 2421 and the second mounting plate 2422.
Referring to fig. 8 in combination with fig. 7, the second heat dissipation assembly further includes a second vapor chamber 243 mounted on the heat dissipation fin assembly 242, further, the second vapor chamber 243 is mounted on the first mounting plate 2421, the second vapor chamber 243 fully covers the upper surface of the first mounting plate 2421, and in a state where the portable electronic device 10 and the base 20 are mounted in a matched manner, the second connection portion 1222 contacts the second vapor chamber 243 to realize heat transfer.
Referring to fig. 6 and referring to fig. 7 and 8, the first mounting plate 2421 is bent towards the bottom of the second housing 21 to form a first bending portion 24211 and a second bending portion 24212, a bending angle between the first bending portion 24211 and the second bending portion 24212 is 100 ° to 160 °, preferably 140 °, the second soaking plate 243 is bent in cooperation with the first mounting plate 2421, the second soaking plate 243 located at the top of the first bending portion 24211 is in contact with the second connecting portion 1222, in order to ensure that the second soaking plate 243 can be in better contact with the second connecting portion 1222, the second soaking plate 243 located at the top of the first bending portion 24211 has a protruding portion 2431 with a width equal to that of the second connecting portion 1222, the protruding portion 2431 protrudes from or is lower than the top of the second opening, the protruding portion 2431 and the second soaking plate 243 are integrally formed, and the protruding portion 2431 can be set according to requirements, the protruding portion 2431 can enable the second soaking plate 243 to be better in contact with the second connecting portion 1222, and it is noted that, since the first opening and the second soaking plate 243 has a certain thickness and can be located in the first opening and the second opening can be located in the first opening and the second opening 1222 or the second opening can be located in the second opening and the first opening and the second opening 1222 or the second opening can be located in the first opening and the second opening 1222.
In this embodiment, the contact surface of the second connection portion 1222 and the contact surface of the second vapor chamber 243 contacting the second connection portion 1222 can be made as required to ensure a sufficient contact surface therebetween, thereby ensuring a heat transfer effect.
Referring to fig. 6 and referring to fig. 7 and 8, the second mounting plate 2422 is bent toward the bottom of the second housing 21 to form a third bending part 24221 and a fourth bending part 24222, the bending angle between the third bending part 24221 and the fourth bending part 24222 is 100 ° to 160 °, preferably 140 °, and the first mounting plate 2421 and the second mounting plate 2422 are bent to provide a good mounting angle for the portable electronic device 10 and the base 20, so that the use is convenient for the user, and the internal flow channel of the heat dissipation fin assembly 242 corresponds to the second air vent 23, and a certain gap is provided between the second mounting plate 2422 and the second housing 21 below by bending the second mounting plate 2422, so that the contact area between the second housing 21 and the heat dissipation fin assembly 242 is reduced, and excessive heat transfer to the second housing 21 is prevented.
In a state where the portable electronic device 10 and the base 20 are separated, the heat source generates heat to be guided to the heat pipe 121, and the heat pipe 121 guides the heat to the first soaking plate 122, and the first soaking plate 122 is contacted with the external air to radiate heat.
Referring to fig. 9, in the state where the portable electronic device 10 and the base 20 are mounted in a matched manner, at this time, the first vapor chamber 122 is in contact with the second vapor chamber 243, the heat generated by the heat source is guided to the first vapor chamber 122 by the heat pipe 121, the first vapor chamber 122 transfers the heat to the second vapor chamber 243, further, the heat is transferred to the heat sink assembly 242 by the second vapor chamber 243 and is filled in the inner channel of the heat sink assembly 242, at this time, the fan 241 rotates to absorb the external air through the first ventilation opening 22, the generated heat-dissipating airflow flows through the inner channel of the heat sink assembly 242 and flows out through the second ventilation opening 23, so as to take away the heat on the heat sink assembly 242.
The technical scheme shows that the invention has the following beneficial effects:
According to the invention, the second heat dissipation component is arranged in the base, so that the thickness problem, the noise problem and the heat dissipation problem of the portable electronic device are solved, the cruising ability of the portable electronic device in a low-load state is improved, the portable electronic device can be thinner and has zero noise, and the portable electronic device can be provided with a high-power-consumption processor, so that the performance of the portable electronic device is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment contains only one independent technical solution, and that such description is provided for clarity only, and that the technical solutions of the embodiments may be appropriately combined to form other embodiments that will be understood by those skilled in the art.
Claims (5)
1. An electronic device, comprising:
A portable electronic device and a base detachably mounted with the portable electronic device;
Wherein, portable electronic device includes:
A first housing;
the first heat dissipation component is arranged in the first shell and realizes heat transfer with the heat source;
A base, comprising:
The second shell is provided with a plurality of ventilation openings;
the second heat dissipation assembly is arranged in the second shell, and a heat dissipation channel communicated with the ventilation opening is formed in the second heat dissipation assembly; and is configured to:
In a state that the portable electronic device and the base are mounted in a matched mode, the first heat dissipation assembly is in contact with the second heat dissipation assembly, heat generated by the heat source is transferred to the second heat dissipation assembly through the first heat dissipation assembly, and heat dissipation airflow flows through the heat dissipation channel to take away the heat on the second heat dissipation assembly;
In a state that the portable electronic device is separated from the base, heat generated by the heat source is dissipated to the outside through the first heat dissipation component;
the first heat dissipation component comprises a first vapor chamber which generates heat transfer with a heat source and realizes heat transfer with the second heat dissipation component in a state of being matched and installed with the portable electronic device and the base;
Heat transfer is generated between the first vapor chamber and the heat source through a heat pipe;
the first vapor chamber is provided with a first connecting part for realizing heat transfer with the heat pipe and a second connecting part contacted with the second heat radiating component in a state that the portable electronic device and the base are matched and installed;
The heat pipe is installed with the heat source through the installation plate in a matched mode.
2. The electronic device of claim 1, wherein the second heat dissipating assembly comprises a fan, a heat dissipating fin assembly mounted in cooperation with the fan and in cooperation with the first heat dissipating assembly in a mounted state of the portable electronic apparatus and the base, an internal flow passage is formed in the heat dissipating fin assembly, the internal flow passage has an air inlet opening and an air outlet opening, the air inlet opening is mounted in cooperation with an air outlet of the fan, and the air outlet opening is communicated with the outside through a vent.
3. The electronic device of claim 2, wherein the second heat sink assembly further comprises a second heat spreader plate mounted on the heat sink fin assembly and configured to effect heat transfer with the first heat sink assembly in a mated configuration of the portable electronic device and the base.
4. The electronic device of claim 3, wherein the heat sink fin assembly comprises a first mounting plate, a second mounting plate, and fins mounted between the first mounting plate and the second mounting plate, the fins and the first mounting plate and the second mounting plate forming an internal flow path therebetween, the second soaking plate being mounted on either the first mounting plate or the second mounting plate.
5. The electronic device of claim 1, wherein the vent comprises a first vent and a second vent, the first vent and the second vent corresponding to the heat dissipation channel, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011157100.7A CN112188814B (en) | 2020-10-26 | 2020-10-26 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011157100.7A CN112188814B (en) | 2020-10-26 | 2020-10-26 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112188814A CN112188814A (en) | 2021-01-05 |
| CN112188814B true CN112188814B (en) | 2024-10-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011157100.7A Active CN112188814B (en) | 2020-10-26 | 2020-10-26 | Electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN112188814B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103576809A (en) * | 2012-07-24 | 2014-02-12 | 联想(北京)有限公司 | Electronic device, first electronic device and second electronic device thereof and first electronic device switching method |
| CN213343145U (en) * | 2020-10-26 | 2021-06-01 | 太仓欣华盈电子有限公司 | Electronic device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101174168A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Cooling structure of electronic device |
| CN102231085A (en) * | 2009-10-22 | 2011-11-02 | 鸿富锦精密工业（深圳）有限公司 | External radiating device for laptop |
| TWI485555B (en) * | 2010-10-29 | 2015-05-21 | Compal Electronics Inc | Electronic apparatus |
| CN204065998U (en) * | 2014-08-22 | 2014-12-31 | 联想(北京)有限公司 | Terminal device |
| US9600044B2 (en) * | 2015-05-12 | 2017-03-21 | Cooler Master Co., Ltd. | Portable electronic device and detachable auxiliary heat-dissipating module thereof |
| US11839050B2 (en) * | 2017-08-17 | 2023-12-05 | Compal Electronics, Inc. | Heat dissipation module and electronic device |
-
2020
- 2020-10-26 CN CN202011157100.7A patent/CN112188814B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103576809A (en) * | 2012-07-24 | 2014-02-12 | 联想(北京)有限公司 | Electronic device, first electronic device and second electronic device thereof and first electronic device switching method |
| CN213343145U (en) * | 2020-10-26 | 2021-06-01 | 太仓欣华盈电子有限公司 | Electronic device |
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| CN112188814A (en) | 2021-01-05 |
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