CN106910617A - Chip capacitor - Google Patents
Chip capacitor Download PDFInfo
- Publication number
- CN106910617A CN106910617A CN201510969260.4A CN201510969260A CN106910617A CN 106910617 A CN106910617 A CN 106910617A CN 201510969260 A CN201510969260 A CN 201510969260A CN 106910617 A CN106910617 A CN 106910617A
- Authority
- CN
- China
- Prior art keywords
- chip
- chip capacitor
- housing section
- bending part
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a kind of chip capacitor, it includes：Chip portion, it is in tabular, and two electrodes are arranged with the opposing sides in chip portion；Two pins portion, it is in that left and right and upper and lower mirror image are set, and lead portion is plates, and its one end is fixedly connected on electrode, the relative other end stretches out；Housing section, it is coated in chip portion, has the flat hole stretched out for lead portion in housing section.The present invention solves the problems, such as that the lightening development of electronic product cannot be adapted to because capacitor volume is big in the prior art, so that the volume of capacitor is reduced, adapts to the welding manner of Reflow Soldering, and design and welded bands to integrated circuit carry out benefit.
Description
Technical field
The present invention relates to a kind of capacitor, in particular to a kind of chip capacitor.
Background technology
Capacitor is a kind of electronic component being widely used in electronic equipment, according to the difference of material, at present
The capacitor for being used includes porcelain capacitor, mica condenser, organic capacitor and electrolytic capacitor again
Etc..
The lead portion (2) in chip portion (1) and round wires shape of the current capacitor typically all including round pie.
But, as current electronic product gradually develops towards lightening direction, traditional capacitor is gradually
This trend cannot be adapted to.Main reason is that following two aspects：First, traditional annular shaped capacitor by
In the lead portion (2) for needing installation electrode (11) and round wires shape on chip, cannot accomplish in height more
It is small, and whole capacitor cannot accomplish that thickness is uniform；Second, the lead portion (2) of traditional annular shaped capacitor
It is only suitable for carrying out wave soldering, for the solder reflow techniques being particularly in lightening electronic product, it cannot be fitted
Should, therefore and it is unfavorable for the design and welding of integrated circuit.
The content of the invention
In consideration of it, the invention provides a kind of chip capacitor, it is intended to solve in the prior art because of capacitor body
Product cannot adapt to greatly the problem of the lightening development of electronic product, so that the volume of capacitor is contracted
It is small, the welding manner of Reflow Soldering is adapted to, design and welded bands to integrated circuit carry out benefit.
The invention provides a kind of chip capacitor, it includes：
Chip portion, it is in tabular, and two electrodes are arranged with the opposing sides in chip portion；
Two pins portion, it is in that left and right and upper and lower mirror image are set, and lead portion is plates, and its one end is fixed and connected
It is connected on electrode, the relative other end stretches out；
Housing section, it is coated in chip portion, has the flat hole stretched out for lead portion in housing section.
Further, the outside extension of above-mentioned lead portion has the first oblique bending part, and it is by chip portion
The center in a handing-over edge face thereto in two faces extend obliquely out, the first bending part is in housing section
It is internal.
Further, above-mentioned first bending part continues to form the second bending part to outside extension of housing section, the
Two bending parts are in inverted L-shaped.
Further, above-mentioned second bending part continues the 3rd bending part of horizontally extending formation.
Further, the both sides of above-mentioned housing section have outwardly swells.
Further, the section of above-mentioned swells is triangular in shape.
Further, above-mentioned lead portion is welded on electrode by solder.
Further, the rectangular shape of above-mentioned solder.
Further, the connection end semicircular in shape of above-mentioned lead portion and electrode.
Further, above-mentioned electrode is rounded.
The chip capacitor that the present invention is provided, by setting flat chip portion, and in the electrode in chip portion
It is upper to connect the lead portion of body in the form of sheets, and install the housing section with flat hole additional, while two lead portion are set
It is set to left and right and upper and lower mirror image is set so that whole capacitor has made a shape for flat box, compared to
Traditional annular shaped capacitor can form SMD capacitor so that wiring board is set by original one side circuit
Meter is changed to Double-side line design, reduces the volume of wiring board, and the height of paster is greatly reduced in addition, therefore
Substantially do small on thickness, while the lead portion of plates with circuit board when being attached, can fit completely
The welding manner of Reflow Soldering is answered, so as to the design and welded bands to integrated circuit come benefit, and basis herein
On can also adapt to the mode of traditional wave soldering.
Brief description of the drawings
By reading the detailed description of hereafter preferred embodiment, various other advantages and benefit are for ability
Domain those of ordinary skill will be clear understanding.Accompanying drawing is only used for showing the purpose of preferred embodiment, and simultaneously
It is not considered as limitation of the present invention.And in whole accompanying drawing, identical is denoted by the same reference numerals
Part.In the accompanying drawings：
Fig. 1 is the profile front view of chip capacitor provided in an embodiment of the present invention；
Fig. 2 is the profile top view of chip capacitor provided in an embodiment of the present invention；
Fig. 3 is the profile left view of chip capacitor provided in an embodiment of the present invention；
Fig. 4 is structure sectional view of the chip capacitor provided in an embodiment of the present invention under depression angle；
Fig. 5 be chip capacitor provided in an embodiment of the present invention under main view angle (removal housing section) knot
Structure sectional view.
Specific embodiment
The exemplary embodiment of the disclosure is more fully described below with reference to accompanying drawings.Although being shown in accompanying drawing
The exemplary embodiment of the disclosure, it being understood, however, that may be realized in various forms the disclosure without should be by
Embodiments set forth here is limited.Conversely, there is provided these embodiments are able to be best understood from this
It is open, and can by the scope of the present disclosure it is complete convey to those skilled in the art.
Referring to Fig. 1 to Fig. 5, the preferred structure of chip capacitor provided in an embodiment of the present invention is shown in figure.
The chip capacitor includes chip portion 1, two pins portion 2 and housing section 3, and chip portion 1 is in tabular, tool
Body can be the material such as ceramics, and be provided in round or other shapes tabular, in its opposing sides point
Two electrodes 11 are provided with, two pins portion 2 is set in left and right and upper and lower mirror image, and lead portion 2 is plates, its
One end is fixedly connected on electrode 11, the relative other end stretches out, and housing section 3 is coated on chip portion 1
On, there is the flat hole 31 stretched out for lead portion 2 in housing section 3.
The chip capacitor that the present embodiment is provided, by setting flat chip portion, and in chip portion
The lead portion of body in the form of sheets is connected on electrode, and installs the housing section with flat hole additional, while by two pins
Portion is set to left and right and upper and lower mirror image is set so that whole capacitor has made a shape for flat box, phase
SMD capacitor can be formed compared with traditional annular shaped capacitor so that wiring board is by original one side line
Road design is changed to Double-side line design, reduces the volume of wiring board, and the height of paster is greatly reduced in addition,
Therefore substantially do small on thickness, while the lead portion of plates with circuit board when being attached, can be with complete
The full welding manner for adapting to Reflow Soldering, so as to the design and welded bands to integrated circuit carry out benefit, and herein
On the basis of can also adapt to the mode of traditional wave soldering.
Referring to Fig. 5, the outside extension of lead portion 2 has the first oblique bending part 21, and it is by chip portion
The handing-over edge (can also outwards re-extend a little) in 1 two faces is extended obliquely out at the center in a face thereto,
First inside of the bending part 21 in housing section 3, thus can do small integral capacitor body product is ensured
While, the creep age distance between lead portion 2 can do greatly as best one can so that this capacitor both has volume
Small advantage, and have the advantages that creep age distance is big.
With continued reference to Fig. 5, the first bending part 21 continues to form the second bending part to outside extension of housing section 3
22, the second bending part 22 is in inverted L-shaped so that the creep age distance between lead portion 2 can also be as far as possible
Do again big in ground.
With continued reference to Fig. 5, the second bending part 22 continues the 3rd bending part 23 of horizontally extending formation,
In order to realize Reflow Soldering welding on circuit boards.
Referring to Fig. 3, the both sides of housing section 3 have outwardly swells 32, to force down electric capacity as far as possible
Ensure the installing space of internal components in the case of the thickness of device.
With continued reference to Fig. 3, the section of swells 32 is triangular in shape, can further ensure housing section 3
Overall steadiness, it is also possible to be easy in the way of two panels come assembled housing section 3, it is right to be formed in addition
The circulation water conservancy diversion of heat reduces the operating temperature of integral capacitor device in housing section 3.
Referring to Fig. 4, lead portion 2 is welded on electrode 11 by solder 4.The solder 4 is specifically as follows tin
Material etc., to ensure the firm connection between lead portion 2 and electrode 11.
With continued reference to Fig. 4, the rectangular shape of solder 4 can further ensure lead portion 2 and electrode 11
Between firm connection.
With continued reference to Fig. 4, the semicircular in shape of connection end 24 of lead portion 2 and electrode 11, compared to square
Connection end can effectively prevent the wedge angle when mounted may be to the damage caused by chip 1 and electrode 11.
With continued reference to Fig. 4, electrode 11 is rounded, can facilitate installation of the electrode 11 on chip 1.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this hair to the present invention
Bright spirit and scope.So, if it is of the invention these modification and modification belong to the claims in the present invention and
Within the scope of its equivalent technologies, then the present invention is also intended to comprising these changes and modification.
Claims (10)
1. chip capacitor, it is characterised in that including：
Chip portion (1), it is in tabular, and two electrodes are arranged with the opposing sides of the chip portion (1)
(11)；
Two pins portion (2), it is in that left and right and upper and lower mirror image are set, and the lead portion (2) is plates,
Its one end is fixedly connected on the electrode (11), the relative other end stretches out；
Housing section (3), it is coated on the chip portion (1), and having on the housing section (3) is used for
The flat hole (31) that the lead portion (2) stretches out.
2. chip capacitor according to claim 1, it is characterised in that the lead portion (2) to
Outer extension has oblique the first bending part (21), its by the chip portion (1) two friendships in face
The center in an edge fit edge face thereto extends obliquely out, and first bending part (21) is in the housing section
(3) inside.
3. chip capacitor according to claim 2, it is characterised in that first bending part (21)
Continue to form the second bending part (22), second bending part (22) to outside extension of the housing section (3)
In inverted L-shaped.
4. chip capacitor according to claim 3, it is characterised in that second bending part (22)
Continue the 3rd bending part (23) of horizontally extending formation.
5. chip capacitor according to claim 1, it is characterised in that the housing section (3)
Both sides have outwardly swells (32).
6. chip capacitor according to claim 5, it is characterised in that the swells (32)
Section it is triangular in shape.
7. chip capacitor according to claim 1, it is characterised in that the lead portion (2) is led to
Solder (4) is crossed to be welded on the electrode (11).
8. chip capacitor according to claim 7, it is characterised in that the solder (4) is in square
Shape.
9. the chip capacitor according to claim 1 or 7, it is characterised in that the lead portion (2)
With connection end (24) semicircular in shape of the electrode (11).
10. the chip capacitor according to claim 1 or 7, it is characterised in that the electrode (11)
It is rounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510969260.4A CN106910617A (en) | 2015-12-22 | 2015-12-22 | Chip capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510969260.4A CN106910617A (en) | 2015-12-22 | 2015-12-22 | Chip capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106910617A true CN106910617A (en) | 2017-06-30 |
Family
ID=59200370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510969260.4A Pending CN106910617A (en) | 2015-12-22 | 2015-12-22 | Chip capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106910617A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720593Y (en) * | 2004-07-27 | 2005-08-24 | 广东南方宏明电子科技股份有限公司 | Chip AC Ceramic Capacitors |
| JP2008270253A (en) * | 2007-04-16 | 2008-11-06 | Hitachi Aic Inc | Chip-type solid-state electrolytic capacitor and manufacturing method thereof |
| CN202275714U (en) * | 2011-10-26 | 2012-06-13 | 福建火炬电子科技股份有限公司 | Ceramic capacitor |
| CN202394718U (en) * | 2011-11-17 | 2012-08-22 | 福建火炬电子科技股份有限公司 | Three-dimensional stacked ceramic capacitor |
| CN202633053U (en) * | 2012-04-17 | 2012-12-26 | 福建火炬电子科技股份有限公司 | Multi-core-set ceramic capacitor |
| CN203277089U (en) * | 2013-03-27 | 2013-11-06 | 合肥联宝信息技术有限公司 | Capacitor and a mainboard using same |
| CN104658758A (en) * | 2015-02-05 | 2015-05-27 | 深圳江浩电子有限公司 | Flat aluminum electrolytic capacitor and manufacturing method thereof |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN204577251U (en) * | 2015-02-10 | 2015-08-19 | 鞍山奇发电子陶瓷科技有限公司 | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor |
| CN204668160U (en) * | 2015-06-17 | 2015-09-23 | 刘世军 | A kind of horizontal Disk Ceramic Capacitors |
| CN205354863U (en) * | 2015-12-22 | 2016-06-29 | 昆山万盛电子有限公司 | Chip capacitor |
-
2015
- 2015-12-22 CN CN201510969260.4A patent/CN106910617A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2720593Y (en) * | 2004-07-27 | 2005-08-24 | 广东南方宏明电子科技股份有限公司 | Chip AC Ceramic Capacitors |
| JP2008270253A (en) * | 2007-04-16 | 2008-11-06 | Hitachi Aic Inc | Chip-type solid-state electrolytic capacitor and manufacturing method thereof |
| CN202275714U (en) * | 2011-10-26 | 2012-06-13 | 福建火炬电子科技股份有限公司 | Ceramic capacitor |
| CN202394718U (en) * | 2011-11-17 | 2012-08-22 | 福建火炬电子科技股份有限公司 | Three-dimensional stacked ceramic capacitor |
| CN202633053U (en) * | 2012-04-17 | 2012-12-26 | 福建火炬电子科技股份有限公司 | Multi-core-set ceramic capacitor |
| CN203277089U (en) * | 2013-03-27 | 2013-11-06 | 合肥联宝信息技术有限公司 | Capacitor and a mainboard using same |
| CN104658758A (en) * | 2015-02-05 | 2015-05-27 | 深圳江浩电子有限公司 | Flat aluminum electrolytic capacitor and manufacturing method thereof |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN204577251U (en) * | 2015-02-10 | 2015-08-19 | 鞍山奇发电子陶瓷科技有限公司 | A kind of small-sized chip type surface attaching type high pressure, safety ceramic capacitor |
| CN204668160U (en) * | 2015-06-17 | 2015-09-23 | 刘世军 | A kind of horizontal Disk Ceramic Capacitors |
| CN205354863U (en) * | 2015-12-22 | 2016-06-29 | 昆山万盛电子有限公司 | Chip capacitor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8054608B2 (en) | MLCC module | |
| KR102041645B1 (en) | Power semiconductor module | |
| JP6741865B2 (en) | Rectangular impact resistant leaf spring type connector | |
| US8908386B2 (en) | Printed circuit board assembly chip package component and soldering component | |
| CN205354863U (en) | Chip capacitor | |
| JP2009010116A (en) | Surface-mounting type electronic component | |
| CN106910617A (en) | Chip capacitor | |
| TWI403231B (en) | Surface-mounted circuit board module and fabrication method thereof | |
| CN204069487U (en) | A kind of printed circuit board (PCB) | |
| US9538656B2 (en) | Electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector | |
| CN213184005U (en) | Oil-resistant aluminum electrolytic capacitor | |
| WO2023202676A1 (en) | Power module and motor controller | |
| CN205680820U (en) | A kind of attachment means | |
| CN106910648A (en) | The preparation method of lightening capacitor | |
| CN201001255Y (en) | Spring sheet on circuit board and electromagnetic shielding assembly | |
| JP6412234B1 (en) | Power storage module | |
| KR20120067654A (en) | Connector for pcb and electronic device having the same | |
| CN102348327A (en) | Printed circuit board | |
| JP2007123447A (en) | Electronic equipment | |
| CN207166853U (en) | A kind of novel stabilising structural circuit plate | |
| CN103957657B (en) | FPC and the optical module with the FPC | |
| CN204795861U (en) | Wireless router circuit board | |
| JP2009283561A (en) | Electronic device | |
| EP2170027A1 (en) | Upright circuit board assembly structure | |
| JP3167050U (en) | Portable connection shield case terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170630 |
|
| RJ01 | Rejection of invention patent application after publication |