CN202394718U - Three-dimensional stacked ceramic capacitor - Google Patents
Three-dimensional stacked ceramic capacitor Download PDFInfo
- Publication number
- CN202394718U CN202394718U CN2011204564876U CN201120456487U CN202394718U CN 202394718 U CN202394718 U CN 202394718U CN 2011204564876 U CN2011204564876 U CN 2011204564876U CN 201120456487 U CN201120456487 U CN 201120456487U CN 202394718 U CN202394718 U CN 202394718U
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- capacitor
- ceramic capacitor
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Abstract
The utility model discloses a three-dimensional stacked ceramic capacitor which comprises two pins, wherein a plurality of welding sheets are led out from each pin; a plurality of capacitor chips are welded among the welding sheets of the two pins and are arranged by at least two layers; each layer of capacitor chips comprises at least two rows of capacitor chips; and each row of capacitor chips comprises at least two capacitor chips. Compared with the prior art, according to the three-dimensional stacked ceramic capacitor, the capacitor chips are arranged by the at least two layers, each layer of capacitor chips comprises the at least two rows, and each row of capacitor chips comprises the at least two capacitor chips; the capacitor chips are stacked in a three-dimensional manner, so that the capacity of the ceramic capacitor is increased greatly in a finite space, and a special demand in a specific occasion is fully met.
Description
Technical field
The utility model relates to the ceramic capacitor field.
Background technology
Ceramic capacitor particularly multicore group ceramic capacitor is widely used at military project, civil area because capacity is big; Its manufacture process is to adopt a lead frame; Be provided with pin and welding rib in the lead frame; With chips welding on the welding rib, then with Chip Packaging, make ceramic capacitor after cutting muscle and removing the lead frame waste material.Multicore group ceramic capacitor of the prior art is that single capacitor chip is arranged to be provided with to make and formed usually, and its capacity still can be very limited in limited space, can't satisfy the specific demand of specific occasion.
The utility model content
The main purpose of the utility model is to overcome the shortcoming of prior art, and a kind of three-dimensional ceramic capacitor that piles up is provided, and can in limited space, strengthen capacitor volume, satisfies the specific demand of specific occasion.
The utility model adopts following technical scheme:
A kind of three-dimensional ceramic capacitor that piles up; Include two pins; Each pin is respectively drawn some bonding pads, is welded with a plurality of capacitor chips between the bonding pad of two pins, and these a plurality of capacitor chips are arranged as two-layer at least; And every layer is at least two rows, whenever drains into to comprise two capacitor chips less.
Bonding pad sum on the two pins is at least three, and is set in distance.
Bonding pad on the two pins all is provided with at grade.
At said a plurality of capacitor chip coverings packaging plastic is housed.
Can know by above-mentioned description the utility model; Compared with prior art, the utility model a kind of three-dimensional piled up ceramic capacitor because a plurality of capacitor chips are arranged as two-layerly at least, and every layer be at least two rows; Whenever drain into and comprise two capacitor chips less; Capacitor chip is three-dimensionally stacked, in limited space, has greatly strengthened the capacity of ceramic capacitor, fully satisfies the specific demand of specific occasion.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the pin of the utility model embodiment and the structural representation of bonding pad.
Embodiment
Below the utility model is done further to describe through embodiment.
See figures.1.and.2, a kind of three-dimensional ceramic capacitor that piles up of the utility model includes two pins 10,20, and pin 10 is drawn two bonding pads 30,40, and pin 20 is drawn bonding pad 50, and bonding pad 50 is folded in two bonding pads 30, between 40.Be provided with row's capacitor chip between the upper and lower surface of bonding pad 50 and the upper and lower surface of bonding pad 30, every row has three capacitor chips 60; Be provided with row's capacitor chip between the upper and lower surface of bonding pad 50 and the upper and lower surface of bonding pad 40, every row has three capacitor chips 60.
The utility model at first is welded on capacitor chip 60 on the bonding pad 30,40,50 during fabrication, and then at capacitor chip 60 outer package packaging plastics, carries out certain post-processing again, can make the three-dimensional ceramic capacitor that piles up.
An above-mentioned embodiment that is merely the utility model, but the design concept of the utility model is not limited thereto allly utilizes this design that the utility model is carried out the change of unsubstantiality, all should belong to the behavior of invading the utility model protection range.
Claims (4)
1. three-dimensional ceramic capacitor that piles up; It is characterized in that: include two pins; Each pin is respectively drawn some bonding pads, is welded with a plurality of capacitor chips between the bonding pad of two pins, and these a plurality of capacitor chips are arranged as two-layer at least; And every layer is at least two rows, whenever drains into to comprise two capacitor chips less.
2. a kind of three-dimensional ceramic capacitor that piles up as claimed in claim 1, it is characterized in that: the bonding pad sum on the two pins is at least three, and is set in distance.
3. a kind of three-dimensional ceramic capacitor that piles up as claimed in claim 2, it is characterized in that: the bonding pad on the two pins all is provided with at grade.
4. a kind of three-dimensional ceramic capacitor that piles up as claimed in claim 1 is characterized in that: at said a plurality of capacitor chip coverings packaging plastic is housed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204564876U CN202394718U (en) | 2011-11-17 | 2011-11-17 | Three-dimensional stacked ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204564876U CN202394718U (en) | 2011-11-17 | 2011-11-17 | Three-dimensional stacked ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202394718U true CN202394718U (en) | 2012-08-22 |
Family
ID=46669625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204564876U Expired - Lifetime CN202394718U (en) | 2011-11-17 | 2011-11-17 | Three-dimensional stacked ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202394718U (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299786A (en) * | 2013-07-19 | 2015-01-21 | 北京元六鸿远电子技术有限公司 | High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads |
| CN106910648A (en) * | 2015-12-21 | 2017-06-30 | 昆山万盛电子有限公司 | The preparation method of lightening capacitor |
| CN106910617A (en) * | 2015-12-22 | 2017-06-30 | 昆山万盛电子有限公司 | Chip capacitor |
| CN110111998A (en) * | 2019-04-24 | 2019-08-09 | 福建火炬电子科技股份有限公司 | The encapsulating pulse power capacitor device and its application method of changeable capacity |
| CN111223665A (en) * | 2020-03-19 | 2020-06-02 | 福建火炬电子科技股份有限公司 | Five-terminal ceramic capacitor and use method thereof |
| CN111243861A (en) * | 2018-11-29 | 2020-06-05 | 三星电机株式会社 | Electronic assembly |
| CN111261407A (en) * | 2020-03-19 | 2020-06-09 | 福建火炬电子科技股份有限公司 | Three-terminal ceramic capacitor and use method thereof |
| CN111261406A (en) * | 2020-03-19 | 2020-06-09 | 福建火炬电子科技股份有限公司 | Four-terminal ceramic capacitor and use method thereof |
| JP2022119920A (en) * | 2015-12-09 | 2022-08-17 | ケメット エレクトロニクス コーポレーション | Bulk MLCC capacitor module |
-
2011
- 2011-11-17 CN CN2011204564876U patent/CN202394718U/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299786A (en) * | 2013-07-19 | 2015-01-21 | 北京元六鸿远电子技术有限公司 | High capacity multilayer ceramic dielectric capacitor composed of chips and provided with leads |
| JP7250517B2 (en) | 2015-12-09 | 2023-04-03 | ケメット エレクトロニクス コーポレーション | Bulk MLCC capacitor module |
| JP2022119920A (en) * | 2015-12-09 | 2022-08-17 | ケメット エレクトロニクス コーポレーション | Bulk MLCC capacitor module |
| CN106910648A (en) * | 2015-12-21 | 2017-06-30 | 昆山万盛电子有限公司 | The preparation method of lightening capacitor |
| CN106910617A (en) * | 2015-12-22 | 2017-06-30 | 昆山万盛电子有限公司 | Chip capacitor |
| US11276532B2 (en) * | 2018-11-29 | 2022-03-15 | Samsung Electro-Mechanics Co., Ltd. | Electronic component |
| KR20200064551A (en) * | 2018-11-29 | 2020-06-08 | 삼성전기주식회사 | Electronic component |
| CN111243861A (en) * | 2018-11-29 | 2020-06-05 | 三星电机株式会社 | Electronic assembly |
| CN111243861B (en) * | 2018-11-29 | 2023-02-17 | 三星电机株式会社 | Electronic assembly |
| KR102712630B1 (en) * | 2018-11-29 | 2024-10-02 | 삼성전기주식회사 | Electronic component |
| CN110111998A (en) * | 2019-04-24 | 2019-08-09 | 福建火炬电子科技股份有限公司 | The encapsulating pulse power capacitor device and its application method of changeable capacity |
| CN110111998B (en) * | 2019-04-24 | 2024-02-06 | 福建火炬电子科技股份有限公司 | Capacity-switchable encapsulated pulse power capacitor and method of use thereof |
| CN111261407A (en) * | 2020-03-19 | 2020-06-09 | 福建火炬电子科技股份有限公司 | Three-terminal ceramic capacitor and use method thereof |
| CN111261406A (en) * | 2020-03-19 | 2020-06-09 | 福建火炬电子科技股份有限公司 | Four-terminal ceramic capacitor and use method thereof |
| CN111223665A (en) * | 2020-03-19 | 2020-06-02 | 福建火炬电子科技股份有限公司 | Five-terminal ceramic capacitor and use method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120822 |