CN102348327A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN102348327A CN102348327A CN2010102401728A CN201010240172A CN102348327A CN 102348327 A CN102348327 A CN 102348327A CN 2010102401728 A CN2010102401728 A CN 2010102401728A CN 201010240172 A CN201010240172 A CN 201010240172A CN 102348327 A CN102348327 A CN 102348327A
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- CN
- China
- Prior art keywords
- tinsel
- circuit board
- printed circuit
- pcb
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention provides a printed circuit board. The printed circuit board comprises a first surface and a second surface which are back to back with each other. A first metal foil is arranged on the first surface. The second surface is used for surface-mounting electronic components. A second metal foil and a third metal foil are arranged on the second surface and electronically isolated from each other. The second and third metal foils are both at least partially projected in the first metal foil, and are used for connecting to the two electronic components surface-mounted on the second surface respectively, so that the second and third metal foils form two capacitors connected in series between the two electronic components with the first metal foil. The second metal foil, the third metal foil and the electronic components surface-mounted on the printed circuit board are all positioned on the second surface of the printed circuit board, and through holes are not required to be formed for connection. Therefore, compared with the prior art, the printed circuit board provided by the invention is relatively simpler.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), relate in particular to a kind of printed circuit board (PCB) with print capacitor (PCB electric capacity).
Background technology
Printed circuit board (PCB) uses print capacitor to replace traditional straight cutting or patch capacitor usually.Print capacitor is arranged on the tinsel of printed circuit board (PCB) both sides with comprising two alignment, and these two tinsels are equivalent to the two poles of the earth of print capacitor.Yet,, therefore need usually on printed circuit board (PCB), to offer via hole print capacitor is connected to other electronic components because electronic component is arranged on the printed circuit board (PCB) one side mostly.But via hole makes printed circuit board (PCB) become complicated.
Summary of the invention
In view of this, be necessary to provide a kind of printed circuit board (PCB) simple in structure.
A kind of printed circuit board (PCB), it comprises opposing a first surface and a second surface.One first tinsel is set on this first surface.This second surface is used for mounted with electronic components, and it is provided with one second tinsel and one the 3rd tinsel of electrical isolation.The 3rd tinsel and this second tinsel all have at least a portion to be projected in this first tinsel.This second and third tinsel is used for being connected to respectively two electronic components that are mounted on this second surface, so that this second and third tinsel and this first tinsel form two electric capacity that are connected between these two electronic components.
Because this second and third tinsel and the electronic component that is mounted on this printed circuit board (PCB) are located on the second surface of this printed circuit board (PCB), its connection need not to be provided with via hole.Therefore, compared with prior art, printed circuit board (PCB) of the present invention is fairly simple.
Description of drawings
Fig. 1 is the structural representation of the printed circuit board (PCB) of first execution mode of the present invention.
Fig. 2 is the schematic cross-section of the printed circuit board (PCB) IV-IV along the line of Fig. 1.
Fig. 3 is the equivalent circuit diagram of the printed circuit board (PCB) of Fig. 1.
Fig. 4 is the structural representation of the printed circuit board (PCB) of second execution mode of the present invention.
Fig. 5 is the structural representation of first tinsel of the printed circuit board (PCB) of the 3rd execution mode of the present invention.
The main element symbol description
Printed circuit board (PCB) 10
The first tinsel L1
The second tinsel L2
The 3rd tinsel L3
Sub-paillon foil D
Electronic component B, C
Connecting line J1, J2, J3
Embodiment
Please refer to Fig. 1 and Fig. 2, the printed circuit board (PCB) 10 of better embodiment of the present invention comprises a plate body 11, and plate body 11 comprises opposing a first surface 12 and a second surface 14.Plate body 11 can like the epocel plate, be processed by insulating material.First surface 12 is provided with rectangular first a tinsel L1, and it can be processed by conductive metallic materials such as copper, silver, gold or aluminium.Second surface 14 is used for mounted with electronic components, and (like electronic component B, C), it is provided with one second tinsel L2 and one the 3rd tinsel L3 of mutual electrical isolation.The second tinsel L2 and the 3rd tinsel L3 all are rectangle and area equates.The second tinsel L2 and long limit separately adjacent with the 3rd tinsel L3 is parallel to each other.The second tinsel L2 and the 3rd tinsel L3 are projected in respectively on the both sides on the long side direction of the first tinsel L1.
Please combine Fig. 3 again because the second tinsel L2 is projected in the first tinsel L1 and in the middle of both across plate body 11, so one first capacitor C 1 of the second tinsel L2 and first tinsel L1 formation.The second tinsel L2 and the first tinsel L1 are respectively two electrodes of first capacitor C 1.The capacitance c1 of first capacitor C 1 is:
c1＝εA/D，
Wherein, ε is the dielectric coefficient of plate body 11, and A is the area of the second tinsel L2, and D is the thickness of plate body 11.In like manner, one second capacitor C 2, the three tinsel L3 of the 3rd tinsel L3 and first tinsel L1 formation and the first tinsel L1 are respectively two electrodes of second capacitor C 2.The capacitance of second capacitor C 2 also can draw with reference to above-mentioned formula.
J2 so, only needs through connecting line J1 is set on second surface 14, just can be connected to the second tinsel L2 and the 3rd tinsel L3 other electronic components of mounting on the printed circuit board (PCB) 10 (like electronic component B, C).At this moment, the equivalent electric circuit of entire circuit as shown in Figure 3, first capacitor C 1 and second capacitor C 2 are connected on electronic component B, between the C.So, just need not on printed circuit board (PCB) 10, to offer via hole, simple thereby printed circuit board (PCB) 10 becomes.
The shape that is appreciated that the first tinsel L1, the second tinsel L2 and the 3rd tinsel L3 is not limited to this execution mode.As, the second tinsel L2 and the 3rd tinsel L3 also can be that a part is projected in the first tinsel L1 (as shown in Figure 4), and this moment, the area A (adding the oblique line part among Fig. 4) of projection section was the required area of calculating capacitance.Simultaneously, the area of the second tinsel L2 and the 3rd tinsel L3 can design according to the actual requirements, and the big I of its area needn't be identical.Moreover; The shape of the first tinsel L1, the second tinsel L2 and the 3rd tinsel L3 also can be other; Like circle; Shapes such as triangle; Perhaps; As shown in Figure 5, the first tinsel L1 also can be that two corresponding with the second tinsel L2 and the 3rd tinsel L3 respectively sub-paillon foil D interconnect through connecting line J3.
Be appreciated that under spirit of the present invention electronic component B, C are not limited to two different electronic components, it also can be represented with an electronic component two different terminals of (figure does not show).
Those skilled in the art will be appreciated that; Above execution mode only is to be used for illustrating the present invention; And be not to be used as qualification of the present invention; As long as within connotation scope of the present invention, appropriate change that above embodiment did is all dropped within the scope that the present invention requires to protect with changing.
Claims (7)
1. printed circuit board (PCB); It comprises opposing a first surface and a second surface; One first tinsel is set on this first surface; This second surface is used for mounted with electronic components; It is provided with one second tinsel and one the 3rd tinsel of electrical isolation; The 3rd tinsel and this second tinsel all have at least a portion to be projected in this first tinsel; This second and third tinsel is used for being connected to respectively two electronic components that are mounted on this second surface, so that this second and third tinsel and this first tinsel form two electric capacity that are connected between these two electronic components.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that, this printed circuit board (PCB) comprises a plate body, and this first surface and a second surface are positioned at the opposing both sides of this plate body.
3. printed circuit board (PCB) as claimed in claim 1 is characterized in that, this second tinsel and the 3rd tinsel all are rectangle, and this second tinsel and long limit or minor face separately adjacent with the 3rd tinsel are parallel to each other.
4. printed circuit board (PCB) as claimed in claim 1 is characterized in that, this first tinsel is rectangle, and this second tinsel and the 3rd tinsel are projected in the long side direction of this first tinsel or the both sides on the short side direction respectively.
5. printed circuit board (PCB) as claimed in claim 1 is characterized in that, this first tinsel comprise two rectangular respectively with this second tinsel and the corresponding sub-paillon foil of the 3rd tinsel and a connecting line that electrically connects these two sub-paillon foils.
6. printed circuit board (PCB) as claimed in claim 1 is characterized in that, the material of this first, second and third tinsel is copper, silver, gold or aluminium.
7. printed circuit board (PCB) as claimed in claim 1 is characterized in that, this second surface is provided with two connecting lines, and these two connecting lines are connected to this two electronic components with this second tinsel and the 3rd tinsel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102401728A CN102348327A (en) | 2010-07-29 | 2010-07-29 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102401728A CN102348327A (en) | 2010-07-29 | 2010-07-29 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102348327A true CN102348327A (en) | 2012-02-08 |
Family
ID=45546490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102401728A Pending CN102348327A (en) | 2010-07-29 | 2010-07-29 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102348327A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316457A (en) * | 2019-04-11 | 2019-10-11 | 武汉大学 | Printed electronic packing device and design method based on magnetic resonance wireless power technology |
| CN110329660A (en) * | 2019-04-11 | 2019-10-15 | 武汉大学 | Printed sensor packing device and design method based on magnetic resonance wireless power technology |
| CN110329631A (en) * | 2019-04-11 | 2019-10-15 | 武汉大学 | The luminous packing device of printing based on magnetic resonance wireless power technology and design method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| CN201196923Y (en) * | 2008-04-30 | 2009-02-18 | 苏州路之遥科技有限公司 | Thin film press key display panel |
| CN101932189A (en) * | 2009-06-25 | 2010-12-29 | 北京普源精电科技有限公司 | A measuring device and its amplifying circuit, impedance components and multilayer printed circuit board |
-
2010
- 2010-07-29 CN CN2010102401728A patent/CN102348327A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
| CN201196923Y (en) * | 2008-04-30 | 2009-02-18 | 苏州路之遥科技有限公司 | Thin film press key display panel |
| CN101932189A (en) * | 2009-06-25 | 2010-12-29 | 北京普源精电科技有限公司 | A measuring device and its amplifying circuit, impedance components and multilayer printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316457A (en) * | 2019-04-11 | 2019-10-11 | 武汉大学 | Printed electronic packing device and design method based on magnetic resonance wireless power technology |
| CN110329660A (en) * | 2019-04-11 | 2019-10-15 | 武汉大学 | Printed sensor packing device and design method based on magnetic resonance wireless power technology |
| CN110329631A (en) * | 2019-04-11 | 2019-10-15 | 武汉大学 | The luminous packing device of printing based on magnetic resonance wireless power technology and design method |
| CN110316457B (en) * | 2019-04-11 | 2021-01-26 | 武汉大学 | Printing electronic packaging device based on magnetic resonance wireless power supply technology and design method |
| CN110329660B (en) * | 2019-04-11 | 2021-01-26 | 武汉大学 | Printed sensor packaging device based on magnetic resonance wireless power supply technology and design method |
| CN110329631B (en) * | 2019-04-11 | 2021-01-26 | 武汉大学 | Printing light-emitting packaging device and design method based on magnetic resonance wireless power supply technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120208 |