CN106879174B - A kind of PCB - Google Patents
A kind of PCB Download PDFInfo
- Publication number
- CN106879174B CN106879174B CN201710277760.0A CN201710277760A CN106879174B CN 106879174 B CN106879174 B CN 106879174B CN 201710277760 A CN201710277760 A CN 201710277760A CN 106879174 B CN106879174 B CN 106879174B
- Authority
- CN
- China
- Prior art keywords
- lock ring
- arc
- plate body
- lock
- button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
A kind of PCB, including plate body are provided with the lock soldering disk for solid tin on the plate body, and the plate body edge is provided with unilateral rotation technique edges；The lock soldering disk includes perforation, the first lock ring, the second lock ring, conductor portion, and the conductor portion is arranged between first lock ring and the second lock ring, and the perforation is set to first lock ring center, is connected with conducting wire on second lock ring；The adjacent plate body is attached by the unilateral rotation technique edges, and only towards the opposing face of the lock soldering disk setting, there are rotational actions for the adjacent plate body after connection.As a preference of the present invention, the welding side of the side plate turns down formation welding flanging inwardly, the end of the welding flanging forms the flange that angle is acute angle.The present invention has rosin joint rate low, and pad solder is firm, the advantage of solder connection abundance.
Description
Technical field
The present invention relates to aluminum-base printed circuit board construction applications, and in particular to a kind of PCB.
Background technique
For the PCB of plug-in type device, wave-soldering is a kind of very common factory's welding equipment, but PCB exists
The problem of be easy to causeing rosin joint when passing through wave-soldering, one of the origin cause of formation of rosin joint first are exactly PCB in individual frock clamp
The lower vibration influence being easy by track, and when the wave crest that tin furnace is dug when through tin furnace acts on PCB surface
It is easy to cause PCB to float, and common single welding hole may move back tin during floating, so as to cause rosin joint, existing skill
Art solves the problems, such as this merely by the modes such as weight for increasing frock clamp, the prior art be not found cause rosin joint be because
Caused by for wave crest reflux, and the not simple weight that increases can solve PCB without shaking.
Summary of the invention
The object of the present invention is to provide a kind of PCB, the present invention is solved PCB by the interaction of two structures and passed through
The problem of rosin joint is be easy to cause when wave-soldering.
Above-mentioned technical purpose of the invention has the technical scheme that a kind of PCB, including plate body, institute
The lock soldering disk for solid tin is provided on the plate body stated, the plate body edge is provided with unilateral rotation technique edges；
The lock soldering disk includes perforation, the first lock ring, the second lock ring, conductor portion, and the conductor portion is arranged in institute
It states between the first lock ring and the second lock ring, the perforation is set to first lock ring center, is connected on second lock ring
Conducting wire；
The adjacent plate body is attached by the unilateral rotation technique edges, and the adjacent plate body after connection is only towards institute
Stating the opposing face that lock soldering disk is arranged, there are rotational actions.As a preference of the present invention, the welding side of the side plate is inside
Rollover folding forms welding flanging, and the end of the welding flanging forms the flange that angle is acute angle.
As a preference of the present invention, first lock ring and second lock ring are in the ring that section is protrusion arc
Shape.
As a preference of the present invention, the surface of first lock ring and second lock ring is zinc-plated.
As a preference of the present invention, the conductor portion and the conducting wire connection.
As a preference of the present invention, the unilateral rotation technique edges include the opposite sides side for being separately positioned on the plate body
On edge and button side, the arc groove that section is arc is provided on the button side, section is provided on the edge as arc
The arc button of shape, the phase support that the restricted arc button is rotated up is arranged in the upper end port of the arc groove, described
Arc button on be provided with planar portions with phase support cooperation, the lower end port of the arc groove is provided with arc end
Mouthful.
As a preference of the present invention, the phase support and the mutual contact plane of the planar portions are parallel to the plate body
Surface, it is only 0 ° that the relatively described button side of the edge, which is rotated up angle,.
As a preference of the present invention, the promising arc port of lower part setting of the arc button provides activity space
Interior arc portion.
As a preference of the present invention, being provided with narrow wall part between the unilateral rotation technique edges and the plate body.
In conclusion the invention has the following beneficial effects:
The present invention has rosin joint rate low, and pad solder is firm, the advantage of solder connection abundance.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the embodiment of the present invention；
Fig. 2 is the attachment structure schematic diagram of the unilateral rotation technique edges of the embodiment of the present invention；
Fig. 3 is the overlooking structure diagram of lock soldering disk of the embodiment of the present invention；
In figure:
1- plate body；2- locks soldering disk；The unilateral rotation technique edges of 3-；201- perforation；The first lock ring of 202-；203- second locks
Ring；204- conductor portion；205- conducting wire；101- edge；102- detains side；10201- arc groove；10101- arc button；10202- phase
Support；10102- planar portions；10203- arc port；Arc portion in 10103-；4- narrow wall part.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
As shown in Figure 1 and Figure 2, the embodiment of the present invention includes plate body 1, the lock soldering disk 2 for solid tin is provided on plate body 1,
1 edge of plate body is provided with unilateral rotation technique edges 3；It is provided between unilateral rotation technique edges 3 and plate body 1 and facilitates manual separation
Narrow wall part 4.
As shown in Figure 1, Figure 3, the lock soldering disk 2 of the embodiment of the present invention include for pass through component pin perforation 201,
The solder reflow appeared from perforation 201 when for being blocked in wave-soldering is threaded back through first lock ring 202 in hole 201, for stopping weldering
Tin spills into second lock ring 203 on 1 surface of plate body, for preventing pad to be detached from conductor portion 204, and conductor portion 204 is arranged first
Between lock ring 202 and the second lock ring 203, perforation 201 is set to 202 center of the first lock ring, is connected with conducting wire on the second lock ring 203
205；First lock ring 202 and the second lock ring 203 are the ring-type of protrusion arc in section.First lock ring 202 and the second lock ring 203
Surface it is zinc-plated.Conductor portion 204 and 205 connection of conducting wire.
As shown in Figure 1 and Figure 2, the adjacent plate body 1 of the embodiment of the present invention is attached by unilateral rotation technique edges 3, connection
Only towards the opposing face of the lock setting of soldering disk 2, there are rotational actions for adjacent plate body 1 afterwards.Unilateral rotation technique edges 3 include setting respectively
It sets when the opposite sides of plate body 1 is in upper edge 101 and button 102, detains the arc groove for being provided with that section is arc on side 102
10201, the arc button 10101 that section is arc is provided on edge 101, the upper end port setting of arc groove 10201 is limited
The phase support 10202 that arc button 10101 processed is rotated up, is provided on arc button 10101 and phase support 10202 cooperates
Promising arc end mouth 10203 is arranged in the lower end port of planar portions 10102, arc groove 10201.Phase support 10202 and planar portions
10102 mutual contact planes are parallel to the surface of plate body 1, and it is only 0 ° that the opposite button side 102 of edge 101, which is rotated up angle,.Arc
The lower part of shape button 10101 is arranged promising arc end mouth 10203 and provides the interior arc portion 10103 of activity space.
The present embodiment be easy to cause rosin joint by the interaction of two structures to solve PCB when passing through wave-soldering
The problem of, one of the origin cause of formation of rosin joint first is exactly PCB easy vibration influence by track under individual frock clamp, and
It is easy to cause PCB to float when acting on PCB surface by the wave crest that tin furnace when tin furnace is dug, and common single weldering
Hole may move back tin during floating, and so as to cause rosin joint, and the present embodiment will be owned using unilateral rotation technique edges 3
PCB connection, and the PCB connected into can only be rotated downward, this allows for PCB very good can cut when being jacked up by wave crest
The surface at multiplex peak, the tin material top reflow hole that will move out, to solve the problem of faulty soldering for lacking tin in welding hole, simultaneously because this reality
The structure setting of example is applied, so that the contained side type fixture of lightweight can be used in frock clamp, and does not have to use heavy frame
Fixture.And welding hole uses lock soldering disk 2, when tin material is once ejected perforation 201, tin material will be entered naturally and be led
Body portion 204, while by the first lock ring 202 of 204 two sides of conductor portion and the second lock ring 203 to being limited in conductor portion 204, in this way
The tin that moves back of the tin material of bond pad surface will be made to be stopped when moving back tin by the first lock ring 202, while the tin in conductor portion 204
Material can also pull back to moving back tin and playing the role of one, thus control the tin material of bond pad surface, solve bond pad surface after moving back tin
The problem of tin material causes the physical impact in later period that device pin is loosened very little.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Claims (7)
1. a kind of PCB, it is characterised in that: including plate body (1), the lock soldering disk for solid tin is provided on the plate body (1)
(2), the plate body (1) edge is provided with unilateral rotation technique edges (3)；
The lock soldering disk (2) includes perforation (201), the first lock ring (202), the second lock ring (203), conductor portion (204), institute
The conductor portion (204) stated is arranged between first lock ring (202) and the second lock ring (203), and the perforation (201) is set to
First lock ring (202) center is connected with conducting wire (205) on second lock ring (203)；
The adjacent plate body (1) is attached by the unilateral rotation technique edges (3), the adjacent plate body (1) after connection
Only towards the opposing face of lock soldering disk (2) setting, there are rotational actions；
First lock ring (202) and second lock ring (203) are the ring-type of protrusion arc in section.
2. a kind of PCB according to claim 1, it is characterised in that: first lock ring (202) and second lock ring
(203) surface is zinc-plated.
3. a kind of PCB according to claim 1, it is characterised in that: the conductor portion (204) and the conducting wire (205) join
It is logical.
4. a kind of PCB according to claim 1, it is characterised in that: the unilateral rotation technique edges (3) include being respectively set
When the opposite sides of the plate body (1) is in upper edge (101) and button (102), section is provided on the button side (102)
For the arc groove (10201) of arc, the arc button (10101) that section is arc, the arc are provided on the edge (101)
The phase support (10202) that the restricted arc button (10101) is rotated up, institute is arranged in the upper end port of shape slot (10201)
The planar portions (10102) with the phase support (10202) cooperation, the arc are provided on the arc button (10101) stated
The lower end port of slot (10201) is provided with arc port (10203).
5. a kind of PCB according to claim 4, it is characterised in that: the phase support (10202) and the planar portions
(10102) mutual contact plane is parallel to the surface of the plate body (1), the relatively described button side (102) of the edge (101) to
Upper rotational angle is only 0 °.
6. a kind of PCB according to claim 4, it is characterised in that: the lower part of the arc button (10101) is provided with
The interior arc portion (10103) of activity space is provided for the arc port (10203).
7. a kind of PCB according to claim 1, it is characterised in that: the unilateral rotation technique edges (3) and the plate body
(1) narrow wall part (4) are provided between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710277760.0A CN106879174B (en) | 2017-04-25 | 2017-04-25 | A kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710277760.0A CN106879174B (en) | 2017-04-25 | 2017-04-25 | A kind of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106879174A CN106879174A (en) | 2017-06-20 |
| CN106879174B true CN106879174B (en) | 2019-05-10 |
Family
ID=59161622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710277760.0A Active CN106879174B (en) | 2017-04-25 | 2017-04-25 | A kind of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879174B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698847B (en) * | 2020-06-29 | 2022-07-29 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03159291A (en) * | 1989-11-17 | 1991-07-09 | Toshiba Corp | Printed wiring board |
| JPH09266364A (en) * | 1996-03-28 | 1997-10-07 | Sumitomo Bakelite Co Ltd | Printed circuit board |
| CN202310292U (en) * | 2011-07-20 | 2012-07-04 | 温州环科电子信息科技有限公司 | Plug-in type LED fluorescent lamp substrate |
| CN206061287U (en) * | 2016-07-19 | 2017-03-29 | 广州冠图电子科技有限公司 | A kind of novel plug power supply terminal pad device |
-
2017
- 2017-04-25 CN CN201710277760.0A patent/CN106879174B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03159291A (en) * | 1989-11-17 | 1991-07-09 | Toshiba Corp | Printed wiring board |
| JPH09266364A (en) * | 1996-03-28 | 1997-10-07 | Sumitomo Bakelite Co Ltd | Printed circuit board |
| CN202310292U (en) * | 2011-07-20 | 2012-07-04 | 温州环科电子信息科技有限公司 | Plug-in type LED fluorescent lamp substrate |
| CN206061287U (en) * | 2016-07-19 | 2017-03-29 | 广州冠图电子科技有限公司 | A kind of novel plug power supply terminal pad device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106879174A (en) | 2017-06-20 |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A PCB Effective date of registration: 20230113 Granted publication date: 20190510 Pledgee: Industrial and Commercial Bank of China Limited Guangde sub branch Pledgor: ANHUI HONGXIN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023110000023 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |