CN106879174A - A kind of PCB - Google Patents
A kind of PCB Download PDFInfo
- Publication number
- CN106879174A CN106879174A CN201710277760.0A CN201710277760A CN106879174A CN 106879174 A CN106879174 A CN 106879174A CN 201710277760 A CN201710277760 A CN 201710277760A CN 106879174 A CN106879174 A CN 106879174A
- Authority
- CN
- China
- Prior art keywords
- lock ring
- plate body
- arc
- lock
- button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 10
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 10
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 230000001154 acute effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 7
- 238000007667 floating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
A kind of PCB, including plate body, are provided with the lock soldering disk for solid tin on described plate body, described plate body edge is provided with unilateral rotation technique edges；Described lock soldering disk includes perforation, the first lock ring, the second lock ring, conductor portion, and described conductor portion is arranged between first lock ring and the second lock ring, and the perforation is arranged at the first lock ring center, and wire is connected with second lock ring；The adjacent plate body is attached by the unilateral rotation technique edges, and the opposing face that the adjacent described plate body after connection is only set towards the lock soldering disk has rotational action.As it is of the invention preferably, the welding side of described side plate folding of inwardly turning on one's side forms welding flanging, and the end of the welding flanging forms the flange that angle is acute angle.The present invention has rosin joint rate low, and pad solder is consolidated, the sufficient advantage of solder connection.
Description
Technical field
The present invention relates to aluminum-base printed circuit board construction applications, and in particular to a kind of PCB.
Background technology
For the PCB of plug-in type device, wave-soldering is a kind of very conventional factory's welding equipment, but PCB exists
The problem of rosin joint is easily caused when by wave-soldering, one of origin cause of formation of rosin joint first is exactly PCB in single frock clamp
When easily being acted on PCB surface by the vibration influence of track, and the crest that tin stove is dug when by tin stove down
PCB floatings are easily caused, and common single welding hole may move back tin during floating, so as to cause rosin joint, existing skill
Art solves the problem merely by the mode such as weight for increasing frock clamp, prior art be not found cause rosin joint be because
For crest flows back what is caused, and the not simple weight that increases causes that PCB does not shake what can just be solved.
The content of the invention
It is an object of the invention to provide a kind of PCB, the present invention solves PCB and is passing through by two interactions of structure
The problem of rosin joint is easily caused when wave-soldering.
Above-mentioned technical purpose of the invention technical scheme is that：A kind of PCB, including plate body, institute
The lock soldering disk for solid tin is provided with the plate body stated, described plate body edge is provided with unilateral rotation technique edges；
Described lock soldering disk includes perforation, the first lock ring, the second lock ring, conductor portion, and described conductor portion is arranged on described the
Between one lock ring and the second lock ring, the perforation is arranged at the first lock ring center, and wire is connected with second lock ring；
The adjacent plate body is attached by the unilateral rotation technique edges, and the adjacent described plate body after connection is only towards the lock
There is rotational action in the opposing face that soldering disk is set.As it is of the invention preferably, the welding side of described side plate is inwardly turned on one's side
Folding forms welding flanging, and the end of the welding flanging forms the flange that angle is acute angle.
As the first of the invention preferred, described lock ring with second lock ring in the ring that section is protrusion arc
Shape.
As it is of the invention preferably, the plating zinc on surface of described the first lock ring and second lock ring.
As it is of the invention preferably, the conductor portion and the wire UNICOM.
As it is of the invention preferably, the unilateral rotation technique edges include being separately positioned on the opposite sides side of the plate body
On edge with button side, be provided with described button side section be arc deep-slotted chip breaker, be provided with the edge section be arc
The arc button of shape, the upper end port of the deep-slotted chip breaker sets the phase support that the restricted arc button is rotated up, described
Arc button on be provided with the planar portions coordinated with the phase support, the lower end port of described deep-slotted chip breaker is provided with arc tips
Mouthful.
As it is of the invention preferably, the described phase support contact plane mutual with the planar portions is parallel to the plate body
Surface, it is only 0 ° that the relatively described button side of the edge is rotated up angle.
The promising arc port is set as the bottom of of the invention preferred, described arc button activity space is provided
Interior arc portion.
As of the invention preferred, narrow wall part is provided between described unilateral rotation technique edges and the plate body.
In sum, the present invention has the advantages that：
The present invention has rosin joint rate low, and pad solder is consolidated, the sufficient advantage of solder connection.
Brief description of the drawings
Fig. 1 is embodiment of the present invention structural representation；
Fig. 2 is the attachment structure schematic diagram of the unilateral rotation technique edges of the embodiment of the present invention；
Fig. 3 is the overlooking the structure diagram that the embodiment of the present invention locks soldering disk；
In figure：
1- plate bodys；2- locks soldering disk；The unilateral rotation technique edges of 3-；201- perforates；The lock rings of 202- first；The lock rings of 203- second；
204- conductor portions；205- wires；101- edges；102- detains side；10201- deep-slotted chip breakers；10101- arc buttons；10202- offsets
Portion；10102- planar portions；10203- arcs port；Arc portion in 10103-；4- narrow wall parts.
Specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1 and Figure 2, the embodiment of the present invention includes plate body 1, and the lock soldering disk 2 for solid tin is provided with plate body 1,
The edge of plate body 1 is provided with unilateral rotation technique edges 3；It is provided between unilateral rotation technique edges 3 and plate body 1 and facilitates manual separation
Narrow wall part 4.
As shown in Figure 1, Figure 3, the lock soldering disk 2 of the embodiment of the present invention include for the perforation 201 through component pin,
First lock ring 202 in hole 201 is threaded back through for being blocked in the solder reflow appeared from perforation 201 during wave-soldering, is welded for stop
Tin spills into second lock ring 203 on the surface of plate body 1, for preventing pad from departing from conductor portion 204, conductor portion 204 is arranged on first
Between the lock ring 203 of lock ring 202 and second, perforation 201 is arranged at the center of the first lock ring 202, and wire is connected with the second lock ring 203
205；First lock ring 202 and the second lock ring 203 are the ring-type of protrusion arc in section.First lock ring 202 and the second lock ring 203
Plating zinc on surface.Conductor portion 204 and the UNICOM of wire 205.
As shown in Figure 1 and Figure 2, the adjacent plate body 1 of the embodiment of the present invention is attached by unilateral rotation technique edges 3, connection
There is rotational action in the opposing face that adjacent plate body 1 afterwards is only set towards lock soldering disk 2.Unilateral rotation technique edges 3 include setting respectively
The opposite sides in plate body 1 is put when upper edge 101 is with button 102, the deep-slotted chip breaker that section is arc is provided with button side 102
10201, the arc button 10101 that section is arc is provided with edge 101, the upper end port of deep-slotted chip breaker 10201 sets limited
The phase support 10202 that arc button 10101 processed is rotated up, is provided with and the cooperation of phase support 10202 on arc button 10101
Planar portions 10102, the lower end port of deep-slotted chip breaker 10201 sets promising arc tips mouthful 10203.Phase support 10202 and planar portions
Parallel to the surface of plate body 1, it is only 0 ° that the relative button side 102 of edge 101 is rotated up angle to 10102 mutual contact planes.Arc
The bottom of shape button 10101 sets the interior arc portion 10103 that promising arc tips mouthful 10203 provide activity space.
The present embodiment solves PCB and easily causes rosin joint when by wave-soldering by two interactions of structure
Problem, first one of origin cause of formation of rosin joint be exactly PCB under single frock clamp easily by track vibration influence, and
The crest that tin stove is dug when by tin stove easily causes PCB and floats when acting on PCB surface, and common single weldering
Hole may move back tin during floating, and so as to cause rosin joint, and the present embodiment will be all using unilateral rotation technique edges 3
PCB is connected, and the PCB for connecting into can only rotate downward, and this allows for PCB and very good can be cut when by crest jack-up
The surface at multiplex peak, the tin material top reflow hole that will move out lacks the problem of faulty soldering of tin so as to solve, simultaneously because this reality in welding hole
Apply the structure setting of example so that frock clamp can use the contained side type fixture of lightweight, and without using heavy framework
Fixture.And welding hole employs lock soldering disk 2, when tin material is once ejected perforation 201, tin material will naturally be entered into and led
Body portion 204, while by the first lock ring 202 of the both sides of conductor portion 204 and the second lock ring 203 to being limited in conductor portion 204, so
Will be so that the tin that moves back of the tin material of bond pad surface be stopped by the first lock ring 202, while the tin in conductor portion 204 when tin is moved back
Material also can play the role of one to moving back tin and pull back, and thus control the tin material of bond pad surface, solve and move back bond pad surface after tin
Tin material causes the physical impact in later stage very little so that the problem that releases of device pin.
This specific embodiment is only explanation of the invention, and it is not limitation of the present invention, people in the art
Member can make the modification without creative contribution to the present embodiment as needed after this specification is read, but as long as at this
All protected by Patent Law in the right of invention.
Claims (8)
1. a kind of PCB, it is characterised in that：Including plate body（1）, described plate body（1）On be provided with lock soldering disk for solid tin
（2）, described plate body（1）Edge is provided with unilateral rotation technique edges（3）；
Described lock soldering disk（2）Including perforation（201）, the first lock ring（202）, the second lock ring（203）, conductor portion（204）, institute
The conductor portion stated（204）It is arranged on first lock ring（202）With the second lock ring（203）Between, the perforation（201）It is arranged at
First lock ring（202）Center, second lock ring（203）On be connected with wire（205）；
The adjacent plate body（1）By the unilateral rotation technique edges（3）It is attached, the adjacent described plate body after connection（1）
Only towards the lock soldering disk（2）There is rotational action in the opposing face of setting.
2. a kind of PCB according to claim 1, it is characterised in that：The first described lock ring（202）With second lock ring
（203）It is the ring-type of protrusion arc in section.
3. a kind of PCB according to claim 1, it is characterised in that：The first described lock ring（202）With second lock ring
（203）Plating zinc on surface.
4. a kind of PCB according to claim 1, it is characterised in that：The conductor portion（204）With the wire（205）Connection
It is logical.
5. a kind of PCB according to claim 1, it is characterised in that：The unilateral rotation technique edges（3）Including being respectively provided with
In the plate body（1）Opposite sides side on edge（101）With button side（102）, described button side（102）On be provided with section
It is the deep-slotted chip breaker of arc（10201）, the edge（101）On be provided with section be arc arc button（10101）, the arc
Shape groove（10201）Upper end port the restricted arc button is set（10101）The phase support being rotated up（10202）, institute
The arc button stated（10101）On be provided with and the phase support（10202）The planar portions of cooperation（10102）, described arc
Groove（10201）Lower end port be provided with arc port（10203）.
6. a kind of PCB according to claim 5, it is characterised in that：Described phase support（10202）With the planar portions
（10102）Mutual contact plane is parallel to the plate body（1）Surface, the edge（101）Relatively described button side（102）To
Upper rotational angle is only 0 °.
7. a kind of PCB according to claim 5, it is characterised in that：Described arc button（10101）Bottom be provided with
It is the arc port（10203）The interior arc portion of activity space is provided（10103）.
8. a kind of PCB according to claim 1, it is characterised in that：Described unilateral rotation technique edges（3）With the plate body
（1）Between be provided with narrow wall part（4）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710277760.0A CN106879174B (en) | 2017-04-25 | 2017-04-25 | A kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710277760.0A CN106879174B (en) | 2017-04-25 | 2017-04-25 | A kind of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106879174A true CN106879174A (en) | 2017-06-20 |
| CN106879174B CN106879174B (en) | 2019-05-10 |
Family
ID=59161622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710277760.0A Active CN106879174B (en) | 2017-04-25 | 2017-04-25 | A kind of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879174B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698847A (en) * | 2020-06-29 | 2020-09-22 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03159291A (en) * | 1989-11-17 | 1991-07-09 | Toshiba Corp | Printed wiring board |
| JPH09266364A (en) * | 1996-03-28 | 1997-10-07 | Sumitomo Bakelite Co Ltd | Printed circuit board |
| CN202310292U (en) * | 2011-07-20 | 2012-07-04 | 温州环科电子信息科技有限公司 | Plug-in type LED fluorescent lamp substrate |
| CN206061287U (en) * | 2016-07-19 | 2017-03-29 | 广州冠图电子科技有限公司 | A kind of novel plug power supply terminal pad device |
-
2017
- 2017-04-25 CN CN201710277760.0A patent/CN106879174B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03159291A (en) * | 1989-11-17 | 1991-07-09 | Toshiba Corp | Printed wiring board |
| JPH09266364A (en) * | 1996-03-28 | 1997-10-07 | Sumitomo Bakelite Co Ltd | Printed circuit board |
| CN202310292U (en) * | 2011-07-20 | 2012-07-04 | 温州环科电子信息科技有限公司 | Plug-in type LED fluorescent lamp substrate |
| CN206061287U (en) * | 2016-07-19 | 2017-03-29 | 广州冠图电子科技有限公司 | A kind of novel plug power supply terminal pad device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698847A (en) * | 2020-06-29 | 2020-09-22 | 四川海英电子科技有限公司 | Method for accurately positioning layers of high-frequency circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106879174B (en) | 2019-05-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A PCB Effective date of registration: 20230113 Granted publication date: 20190510 Pledgee: Industrial and Commercial Bank of China Limited Guangde sub branch Pledgor: ANHUI HONGXIN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023110000023 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |