CN107072041B - A kind of two-sided PCB - Google Patents
A kind of two-sided PCB Download PDFInfo
- Publication number
- CN107072041B CN107072041B CN201710277759.8A CN201710277759A CN107072041B CN 107072041 B CN107072041 B CN 107072041B CN 201710277759 A CN201710277759 A CN 201710277759A CN 107072041 B CN107072041 B CN 107072041B
- Authority
- CN
- China
- Prior art keywords
- via hole
- stagnant
- laminate
- tin
- tin portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 39
- 238000003466 welding Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
A kind of bilayer PCB, including a laminate body, two laminate bodies, the first via hole is provided on the one laminate body, the position corresponding to first via hole is provided with the second via hole on the two laminate bodies, the junction of first via hole and second via hole is provided with stagnant tin portion of the aperture greater than the aperture of first via hole, second via hole, the planar portions of conductive matter are at least provided in the stagnant tin portion with one, the place plane of the planar portions is parallel to the surface of the laminate body.Rosin joint rate is low when there is the present invention wave-soldering to handle, the high advantage of welding stable degree.
Description
Technical field
The present invention relates to ring network cabinet shell structure fields, and in particular to a kind of bilayer PCB.
Background technique
Traditional low-voltage cable junction box top uses herringbone top, but the cabinet body higher ranked to IP is said, top-side weld seam
Must be using top welding deformation when being fully welded, is be easy to cause the case where.In addition, constantly the mentioning to cabinet body appearance requirement with people
Height, more and more low pressure feeder pillars use stainless steel material, this improves the appearance processing requirement of cabinet in the production process.
The top-side weld seam on traditional flip top runs through integral head side, and in the case where not doing any surface treatment, appearance compares
It is ugly.But sixty-four dollar question is that traditional welding line structure is single, this results in cabinet body weldering when receiving moisture corrosion
Seam is once occur rosin joint, and external moisture is just easy to invade interior of the cabinet from the position of weld seam, this allows for the reality of cabinet body
Border IP grade is not inconsistent with the IP grade indicated.So that the performance of cabinet body declines.
Summary of the invention
The object of the present invention is to provide a kind of bilayer PCB, the present invention promotes the anti-of commissure by setting reinforcement structure
The stable degree of damp performance and weld seam.
Above-mentioned technical purpose of the invention has the technical scheme that a kind of bilayer PCB, including one layer
Plate body, two laminate bodies, are provided with the first via hole on the laminate body, right in the first via hole institute on the two laminate bodies
Position is answered to be provided with the second via hole, the junction of first via hole and second via hole is provided with aperture and is greater than described the
The stagnant tin portion in the aperture of one via hole, second via hole is at least provided with the flat of conductive matter with one in the stagnant tin portion
Face, the place plane of the planar portions are parallel to the surface of the laminate body.
As a preference of the present invention, the stagnant tin portion is the end towards the two laminates body side of first via hole
Mouth carries out chamfered and is formed.
As a preference of the present invention, the stagnant tin portion is the end towards the laminate body side of second via hole
Mouth carries out chamfered and is formed.
As a preference of the present invention, being enclosed with conductive matter on the stagnant tin portion inner wall.
As a preference of the present invention, the conductive matter that arrives is conductive copper layers of foil.
As a preference of the present invention, be provided between the two laminate bodies and the side plate body conductive welding disk and
Insulating layer, the insulating layer are identical as the thickness of the conductive welding disk.
As a preference of the present invention, stagnant tin portion further include a guidance tin material to first via hole or described second
The corner portion of via hole.
In conclusion the invention has the following beneficial effects:
Rosin joint rate is low when there is the present invention wave-soldering to handle, the high advantage of welding stable degree.
Detailed description of the invention
Fig. 1 is the first example structure schematic diagram of the invention；
Fig. 2 is second of example structure schematic diagram of the invention；
In figure:
Mono- laminate body of 1-；Bis- laminate body of 2-；The first via hole of 3-；The second via hole of 4-；The stagnant tin portion 5-；6- conduction matter；7- chamfering
Portion.
Specific embodiment
Below in conjunction with attached drawing, invention is further described in detail.
Embodiment one
As shown in Figure 1, being provided with the first mistake on a laminate body 1 the embodiment of the present invention includes a laminate body 1, two laminate bodies 2
Hole 3, the position corresponding to the first via hole 3 is provided with the second via hole 4, the company of the first via hole 3 and the second via hole 4 on two laminate bodies 2
The place of connecing is provided with stagnant tin portion 5 of the aperture greater than the aperture of the first via hole 3, the second via hole 4, at least has one in stagnant tin portion 5 and sets
The planar portions 10 of conductive matter 6 are equipped with, the place plane of planar portions 10 is parallel to the surface of a laminate body 1.It is conduction to conductive matter 6
Copper foil layer.Conductive welding disk 9 and insulating layer 8, insulating layer 8 and conductive welding disk 9 are provided between two laminate bodies 2 and side plate body
Thickness is identical.Stagnant tin portion 5 further include one guidance tin material to the first via hole 3 or the second via hole 4 corner portion 7.Stagnant tin portion 5
Port progress chamfered for direction two laminate bodies, 2 side of the first via hole 3 is formed.Conduction is enclosed on stagnant 5 inner wall of tin portion
Matter 6.Embodiment one is advantageous in that planar portions 10 are set to lower section, this results in tin material to be fully blocked in stagnant tin portion 5, into
One step ensures welding stable degree, and corner portion 7 can facilitate tin material quickly to appear the first via hole 3 to circuit board surface upward.
Embodiment two
As shown in Fig. 2, being provided with the first mistake on a laminate body 1 the embodiment of the present invention includes a laminate body 1, two laminate bodies 2
Hole 3, the position corresponding to the first via hole 3 is provided with the second via hole 4, the company of the first via hole 3 and the second via hole 4 on two laminate bodies 2
The place of connecing is provided with stagnant tin portion 5 of the aperture greater than the aperture of the first via hole 3, the second via hole 4, at least has one in stagnant tin portion 5 and sets
The planar portions 10 of conductive matter 6 are equipped with, the place plane of planar portions 10 is parallel to the surface of a laminate body 1.It is conduction to conductive matter 6
Copper foil layer.Conductive welding disk 9 and insulating layer 8, insulating layer 8 and conductive welding disk 9 are provided between two laminate bodies 2 and side plate body
Thickness is identical.Stagnant tin portion 5 further include one guidance tin material to the first via hole 3 or the second via hole 4 corner portion 7.That states is stagnant
Tin portion 5 is that the port progress chamfered of direction one laminate body, 1 side of the second via hole 4 is formed.Embodiment two is advantageous in that
Corner portion 7 is set to lower section, this allows for tin material when moving back tin can form a package well on component pin,
So that the solder of component pin is uniform, component conductive stable when being powered ensure that.
The stagnant tin portion 5 being arranged in two kinds of embodiments of the invention can when wave-soldering, tin material by wave crest head into
Filling is entering the first via hole 3, since the strength of wave-soldering is enough, so not having to worry tin to stagnant tin portion 5 after second via hole 4
Material can not be ejected from the first via hole 3 to wrap up component pin, but after wave crest is decorporated, the tin material in stagnant tin portion 5 is almost
The second via hole 4 can not be rejected, this guarantees component pins at least at the second via hole 4 can firm welded, eliminate void
A possibility that weldering.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Claims (3)
1. a kind of bilayer PCB, it is characterised in that: including a laminate body (1), two laminate bodies (2), set on the laminate body (1)
It is equipped with the first via hole (3), the position corresponding to first via hole (3) is provided with the second via hole on the two laminate bodies (2)
(4), the junction of first via hole (3) and second via hole (4) be provided with aperture greater than first via hole (3) and
The stagnant tin portion (5) in the aperture of second via hole (4), the stagnant tin portion (5) is interior to be at least provided with conductive matter (6) with one
Planar portions (10), the place plane of the planar portions (10) is parallel to the surface of the laminate body (1), the stagnant tin portion
(5) port for first via hole (3) towards two laminates body (2) side carries out chamfered formation or described stagnant
Tin portion (5) is that the port progress chamfered towards laminate body (1) side of second via hole (4) is formed, described
Stagnant tin portion (5) inner wall on be enclosed with conductive matter (6), be provided between the two laminate bodies (2) and a laminate body
Conductive welding disk (9) and insulating layer (8), the insulating layer (8) are identical as the thickness of conductive welding disk (9).
2. a kind of bilayer PCB according to claim 1, it is characterised in that: the conductive matter (6) is conductive copper layers of foil.
3. a kind of bilayer PCB according to claim 1, it is characterised in that: the stagnant tin portion (5) further includes a guidance
Tin material is to first via hole (3) or the corner portion (7) of second via hole (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710277759.8A CN107072041B (en) | 2017-04-25 | 2017-04-25 | A kind of two-sided PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710277759.8A CN107072041B (en) | 2017-04-25 | 2017-04-25 | A kind of two-sided PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107072041A CN107072041A (en) | 2017-08-18 |
| CN107072041B true CN107072041B (en) | 2019-10-11 |
Family
ID=59604468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710277759.8A Active CN107072041B (en) | 2017-04-25 | 2017-04-25 | A kind of two-sided PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072041B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4147723B2 (en) * | 2000-06-05 | 2008-09-10 | 松下電器産業株式会社 | Printed wiring board |
| JP2003069200A (en) * | 2001-08-27 | 2003-03-07 | Sharp Corp | Through hole structure |
| CN103517579B (en) * | 2012-06-20 | 2016-08-03 | 深南电路有限公司 | A kind of wiring board and processing method thereof |
| KR102149797B1 (en) * | 2014-01-10 | 2020-08-31 | 삼성전기주식회사 | Substrate and manufacturing method thereof |
-
2017
- 2017-04-25 CN CN201710277759.8A patent/CN107072041B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107072041A (en) | 2017-08-18 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A double-sided PCB Effective date of registration: 20230113 Granted publication date: 20191011 Pledgee: Industrial and Commercial Bank of China Limited Guangde sub branch Pledgor: ANHUI HONGXIN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023110000023 |