CN106832768A - A kind of environmental type epoxy molding plastic with low stress - Google Patents
A kind of environmental type epoxy molding plastic with low stress Download PDFInfo
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- CN106832768A CN106832768A CN201611224313.0A CN201611224313A CN106832768A CN 106832768 A CN106832768 A CN 106832768A CN 201611224313 A CN201611224313 A CN 201611224313A CN 106832768 A CN106832768 A CN 106832768A
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- molding plastic
- type epoxy
- epoxy molding
- low stress
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/53—Core-shell polymer
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A kind of environmental type epoxy molding plastic with low stress, it includes：Epoxy resin, phenolic resin, inorganic filler, coupling agent, curing accelerator, fire retardant, stress modifying agent, releasing agent and colouring agent etc..The present invention introduces specific stress modifying agent, after each component precise, curing molding and epoxy molding plastic is obtained after crushing by optimizing inorganic filler content.The advantage of the invention is that using epoxy molding plastic obtained in the present invention, not only conform with environment protection requirement, and with low stress, agent of low hygroscopicity, high fluidity, low-expansion advantage, the problems such as filling that can solve to occur during material package is not complete, operational bad and is layered, meets requirement of the encapsulation client to the low stress of small form factor electronic product.
Description
Technical field
The present invention relates to miniature electric encapsulating material technical field, particularly a kind of environmental type ring with low stress
Oxygen moulding compound.
Background technology
With integrated antenna package miniaturization and the development of surface mounting technology, requirement of the people for epoxy molding plastic
Also more and more higher.Wherein, lamination problem be increasingly subject to semiconductor integrated circuit package manufacturer and complete-system vendor concern and
Pay attention to, meanwhile, it is also a difficult point of generally existing in industry.Layering will influence the reliability of encapsulated circuit and aging use
Feature afterwards.
Causing the factor of layering has a lot, the performance of epoxy molding plastic, the material of chip, the structure design of framework and molding
Technique may all influence whether the lamination problem of final packaging.For epoxy molding plastic, it is considered that mainly due to
The steam pressure of moisture is excessive when the pressure and high temperature reflux of internal stress are welded, so that occurring peeling off between making their interface
Phenomenon, results even in plastic-sealed body when serious or crackle occurs in chip.
The content of the invention
The technical problems to be solved by the invention are directed to the deficiencies in the prior art, there is provided a kind of low stress, agent of low hygroscopicity,
High fluidity, low-expansion satisfaction encapsulation client are to the low stress of small form factor electronic product requirement with low stress
Environmental type epoxy molding plastic.
The technical problems to be solved by the invention are achieved through the following technical solutions.It is a kind of with the green of low stress
Color environment-friendlyepoxy epoxy molding compound, is characterized in：It is made up of the raw material of following weight proportion：
3~15 parts of epoxy resin
3~10 parts of phenolic resin
75~90 parts of inorganic filler
0.5~2.5 part of coupling agent
0.2~1.2 part of curing accelerator
0.1~1.5 part of fire retardant
0.1~1.2 part of stress modifying agent
0.1~1.5 part of releasing agent
0.2~1.5 part of colouring agent.
In above-described epoxy molding plastic technical scheme：Described epoxy resin is in the prior art disclosed any one
Plant the epoxy resin for being suitable for epoxy molding plastic：It is preferential from dicyclopentadiene type epoxy resin, bisphenol-s epoxy resin,
It is used in mixed way for one or more in naphthalene nucleus type epoxy resin, biphenyl type epoxy resin.
In above-described epoxy molding plastic technical scheme：Described phenolic resin is in the prior art disclosed any one
Plant the phenolic resin for being suitable for epoxy molding plastic：Linear phenol-aldehyde resin, paraxylene modified phenolic resin, biphenyl structural
One or more in phenolic resin of combination.
In above-described epoxy molding plastic technical scheme：Described inorganic filler is preferentially from melting silicon powder.
High filler content can effectively reduce the thermal coefficient of expansion of epoxy molding plastic, and the purpose of thermal stress is reduced so as to reach；
But simultaneously too high filer content will increase the Young's modulus of epoxy molding plastic, cause stress to increase.The present invention is by optimizing nothing
Machine filer content so that the thermal coefficient of expansion and Young's modulus of epoxy molding plastic reach a balance well, reduce thermal stress.
In above-described epoxy molding plastic technical scheme：Described coupling agent is silane coupler.
In above-described epoxy molding plastic technical scheme：Described curing accelerator can be 2-methylimidazole, 2- first
The combination of any one or more in base -4- phenylimidazoles, triphenylphosphine.
In above-described epoxy molding plastic technical scheme：Described fire retardant can be Firebrake ZB, aluminium hydroxide, hydrogen-oxygen
One or more changed in magnesium is used in mixed way.This several equal halogen-free stibium-free of fire retardant, can meet environment protection requirement.
In above-described epoxy molding plastic technical scheme：The described preferred polymethyl methacrylate of stress modifying agent
（PMMA）.
Research shows, the increase of PMMA core shell structure elastomer contents and the reduction of elastomer particle diameter will make elastomer with
Total interfacial area increase between epoxy resin, is conducive to segment in the phase counterdiffusion of interface so as to reduce the Young of epoxy molding plastic
Modulus, reaches the effect of low stress.
In above-described epoxy molding plastic technical scheme：Described releasing agent can be calcium stearate, zinc stearate, mustard
It is used in mixed way for one or more in sour acid amides, lignite wax, Tissuemat E, Brazil wax.
The preparation method of epoxy molding plastic of the present invention, can be prepared using following methods：Each component is accurately claimed
After amount, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, will be mixed
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, just can be made into finished product, carries out performance survey
Examination.
Existing technology is compared, and the present invention introduces specific stress modifying agent, each group by optimizing inorganic filler content
After dividing precise, epoxy molding plastic is obtained after curing molding and crushing.The advantage of the invention is that using obtained in the present invention
Epoxy molding plastic, not only conforms with environment protection requirement, and with low stress, agent of low hygroscopicity, high fluidity, low-expansion excellent
Point, it is possible to resolve the problems such as filling occurred during material package is not complete, operability is bad and is layered, meets encapsulation client to small
The requirement of the low stress of type encapsulation electronic product.
Specific embodiment
A kind of environmental type epoxy molding plastic with low stress, it is made up of the raw material of following weight proportion：
3~15 parts of epoxy resin
3~10 parts of phenolic resin
75~90 parts of inorganic filler
0.5~2.5 part of coupling agent
0.2~1.2 part of curing accelerator
0.1~1.5 part of fire retardant
0.1~1.2 part of stress modifying agent
0.1~1.5 part of releasing agent
0.2~1.5 part of colouring agent.
In above-described epoxy molding plastic technical scheme：Described epoxy resin is in the prior art disclosed any one
Plant the epoxy resin for being suitable for epoxy molding plastic：It is preferential from dicyclopentadiene type epoxy resin, bisphenol-s epoxy resin,
It is used in mixed way for one or more in naphthalene nucleus type epoxy resin, biphenyl type epoxy resin.
In above-described epoxy molding plastic technical scheme：Described phenolic resin is in the prior art disclosed any one
Plant the phenolic resin for being suitable for epoxy molding plastic：Linear phenol-aldehyde resin, paraxylene modified phenolic resin, biphenyl structural
One or more in phenolic resin of combination.
In above-described epoxy molding plastic technical scheme：Described inorganic filler is preferentially from melting silicon powder.
High filler content can effectively reduce the thermal coefficient of expansion of epoxy molding plastic, and the purpose of thermal stress is reduced so as to reach；
But simultaneously too high filer content will increase the Young's modulus of epoxy molding plastic, cause stress to increase.The present invention is by optimizing nothing
Machine filer content so that the thermal coefficient of expansion and Young's modulus of epoxy molding plastic reach a balance well, reduce thermal stress.
In above-described epoxy molding plastic technical scheme：Described coupling agent is silane coupler.
In above-described epoxy molding plastic technical scheme：Described curing accelerator can be 2-methylimidazole, 2- first
The combination of any one or more in base -4- phenylimidazoles, triphenylphosphine.
In above-described epoxy molding plastic technical scheme：Described fire retardant can be Firebrake ZB, aluminium hydroxide, hydrogen-oxygen
One or more changed in magnesium is used in mixed way.This several equal halogen-free stibium-free of fire retardant, can meet environment protection requirement.
In above-described epoxy molding plastic technical scheme：The described preferred polymethyl methacrylate of stress modifying agent
（PMMA）.
Research shows, the increase of PMMA core shell structure elastomer contents and the reduction of elastomer particle diameter will make elastomer with
Total interfacial area increase between epoxy resin, is conducive to segment in the phase counterdiffusion of interface so as to reduce the Young of epoxy molding plastic
Modulus, reaches the effect of low stress.
In above-described epoxy molding plastic technical scheme：Described releasing agent can be calcium stearate, zinc stearate, mustard
It is used in mixed way for one or more in sour acid amides, lignite wax, Tissuemat E, Brazil wax.
The preparation method of epoxy molding plastic of the present invention, can be prepared using following methods：Each component is accurately claimed
After amount, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, will be mixed
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, just can be made into finished product, carries out performance survey
Examination.
Concrete technical scheme of the invention described further below, this is further understood in order to those skilled in the art
Invention, without constituting the limitation to its right.
Embodiment 1.72 grams of dicyclopentadiene type epoxy resin；54 grams of linear phenol-aldehyde resin；Inorganic filler melts silicon powder
774g：8.1 grams of silane coupler；2.7 grams of curing accelerator 2-methylimidazole；9 grams of fire retardant Firebrake ZB；The poly- first of stress modifying agent
Base methyl acrylate 4.5g；2.7 grams of releasing agent Tissuemat E；2.7 grams of colouring agent carbon black.Each component precise in above-mentioned formula
Afterwards, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, by mixing material
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, carries out performance test.
Embodiment 2.72 grams of dicyclopentadiene type epoxy resin；54 grams of linear phenol-aldehyde resin；Inorganic filler melts silicon powder
774g：8.1 grams of silane coupler；2.7 grams of curing accelerator 2-methylimidazole；9 grams of fire retardant Firebrake ZB；The poly- first of stress modifying agent
Base methyl acrylate 9g；2.7 grams of releasing agent Tissuemat E；2.7 grams of colouring agent carbon black.Each component precise in above-mentioned formula
Afterwards, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, by mixing material
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, carries out performance test.
Embodiment 3.72 grams of dicyclopentadiene type epoxy resin；54 grams of linear phenol-aldehyde resin；Inorganic filler melts silicon powder
720g：8.1 grams of silane coupler；2.7 grams of curing accelerator 2-methylimidazole；9 grams of fire retardant Firebrake ZB；The poly- first of stress modifying agent
Base methyl acrylate 4.5g；2.7 grams of releasing agent Tissuemat E；2.7 grams of colouring agent carbon black.Each component precise in above-mentioned formula
Afterwards, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, by mixing material
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, carries out performance test.
Embodiment 4.72 grams of dicyclopentadiene type epoxy resin；54 grams of linear phenol-aldehyde resin；Inorganic filler melts silicon powder
720g：8.1 grams of silane coupler；2.7 grams of curing accelerator 2-methylimidazole；9 grams of fire retardant Firebrake ZB；The poly- first of stress modifying agent
Base methyl acrylate 9g；2.7 grams of releasing agent Tissuemat E；2.7 grams of colouring agent carbon black.Each component precise in above-mentioned formula
Afterwards, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, by mixing material
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, carries out performance test.
Comparative example 1.72 grams of dicyclopentadiene type epoxy resin；54 grams of linear phenol-aldehyde resin；Inorganic filler melts silicon powder
774g：8.1 grams of silane coupler；2.7 grams of curing accelerator 2-methylimidazole；9 grams of fire retardant Firebrake ZB；The poly- first of stress modifying agent
Base methyl acrylate 0g；2.7 grams of releasing agent Tissuemat E；2.7 grams of colouring agent carbon black.Each component precise in above-mentioned formula
Afterwards, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, by mixing material
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, carries out performance test.
Comparative example 2.72 grams of dicyclopentadiene type epoxy resin；54 grams of linear phenol-aldehyde resin；Inorganic filler melts silicon powder
630g：8.1 grams of silane coupler；2.7 grams of curing accelerator 2-methylimidazole；9 grams of fire retardant Firebrake ZB；The poly- first of stress modifying agent
Base methyl acrylate 4.5g；2.7 grams of releasing agent Tissuemat E；2.7 grams of colouring agent carbon black.Each component precise in above-mentioned formula
Afterwards, melting mixing is carried out on double roll mill, melting temperature is 90~110 DEG C, and mixing time is 2 ~ 20 minutes, by mixing material
Material is pressed into the thick thin slices of 1.5mm, by evenly mixing after, cooling crush is pressed into material cake, carries out performance test.
Main performance index is tested using following methods in embodiment and contrast experiment：
1st, gel time：Hot plate method, 175 ± 1 DEG C are heated to by electric hot plate, are taken 2-3g sample powders and are placed on electric hot plate, powder
It is terminal when gradually becoming colloidal state by fluid, the time required to reading.
2nd, mobility：Determined by EMMI-1-66 helical flows metal die on transfer modling press, mold temperature exists
175 ± 2 DEG C, take 15g samples and tested.
3rd, water absorption rate is boiled：Epoxy molding plastic is made batten, 4h is toasted under the conditions of 175 DEG C, take out the G1 that weighs；Put afterwards
Enter and boil in water-bath 24h, sample dries the G2 that weighs after taking out cooling, calculates it and boils water absorption rate W=(G2-G1)/G1 × 100%.
4th, glass transition temperature：Use thermomechanical analyzer（TMA）Determine.
5th, linear expansion coefficient α 1 and linear expansion coefficient α 2：Use thermomechanical analyzer（TMA）Determine.
Young's modulus（At RT and 260 DEG C）：Use dynamic thermomechanical analysis apparatus（DMA）Determine.
Claims (9)
1. a kind of environmental type epoxy molding plastic with low stress, it is characterised in that it is by the raw material of following weight proportion
Composition：
3~15 parts of epoxy resin
3~10 parts of phenolic resin
75~90 parts of inorganic filler
0.5~2.5 part of coupling agent
0.2~1.2 part of curing accelerator
0.1~1.5 part of fire retardant
0.1~1.2 part of stress modifying agent
0.1~1.5 part of releasing agent
0.2~1.5 part of colouring agent.
2. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that the epoxy
During resin is dicyclopentadiene type epoxy resin, bisphenol-s epoxy resin, naphthalene nucleus type epoxy resin, biphenyl type epoxy resin
One or more of mixing.
3. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that described phenol
Urea formaldehyde is one or more in linear phenol-aldehyde resin, paraxylene modified phenolic resin, the phenolic resin of biphenyl structural
Mixing.
4. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that described nothing
Machine filler is from melting silicon powder.
5. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that coupling used
Agent is silane coupler.
6. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that described consolidates
Change the combination that accelerator is one or more in 2-methylimidazole, 2- methyl 4-phenyls imidazoles, triphenylphosphine.
7. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that described resistance
Combustion agent is the mixing of one or more in Firebrake ZB, aluminium hydroxide, magnesium hydroxide.
8. the environmental type epoxy molding plastic with low stress according to claim 1, it is characterised in that described should
Power modifying agent is polymethyl methacrylate.
9. the environmental type epoxy molding plastic with low stress according to claim 1, releasing agent used is stearic
One or more in sour calcium, zinc stearate, erucyl amide, lignite wax, Tissuemat E, Brazil wax of mixing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611224313.0A CN106832768A (en) | 2016-12-27 | 2016-12-27 | A kind of environmental type epoxy molding plastic with low stress |
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|---|---|---|---|
| CN201611224313.0A CN106832768A (en) | 2016-12-27 | 2016-12-27 | A kind of environmental type epoxy molding plastic with low stress |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108485186A (en) * | 2018-03-19 | 2018-09-04 | 长兴电子材料（昆山）有限公司 | A kind of high mould stream epoxy resin component of low smell and its application |
| CN109438920A (en) * | 2018-10-16 | 2019-03-08 | 无锡创达新材料股份有限公司 | A kind of great power LED reflector low stress white epoxy moulding compound |
| CN109486100A (en) * | 2018-11-27 | 2019-03-19 | 江苏中鹏新材料股份有限公司 | Epoxy resin for electronic packaging composition and preparation method thereof |
| CN109957210A (en) * | 2019-02-18 | 2019-07-02 | 英鸿纳米科技股份有限公司 | A kind of nanoscale electric chip encapsulation material |
| CN110104993A (en) * | 2019-05-08 | 2019-08-09 | 上海应用技术大学 | A kind of high glass-transition temperature epoxy molding plastic and preparation method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108485186A (en) * | 2018-03-19 | 2018-09-04 | 长兴电子材料（昆山）有限公司 | A kind of high mould stream epoxy resin component of low smell and its application |
| CN109438920A (en) * | 2018-10-16 | 2019-03-08 | 无锡创达新材料股份有限公司 | A kind of great power LED reflector low stress white epoxy moulding compound |
| CN109486100A (en) * | 2018-11-27 | 2019-03-19 | 江苏中鹏新材料股份有限公司 | Epoxy resin for electronic packaging composition and preparation method thereof |
| CN109957210A (en) * | 2019-02-18 | 2019-07-02 | 英鸿纳米科技股份有限公司 | A kind of nanoscale electric chip encapsulation material |
| CN110104993A (en) * | 2019-05-08 | 2019-08-09 | 上海应用技术大学 | A kind of high glass-transition temperature epoxy molding plastic and preparation method thereof |
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