CN113831878B - Epoxy resin composition and application thereof - Google Patents
Epoxy resin composition and application thereof Download PDFInfo
- Publication number
- CN113831878B CN113831878B CN202111232864.2A CN202111232864A CN113831878B CN 113831878 B CN113831878 B CN 113831878B CN 202111232864 A CN202111232864 A CN 202111232864A CN 113831878 B CN113831878 B CN 113831878B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- resin composition
- mixture
- composition according
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 86
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 86
- 239000000203 mixture Substances 0.000 title claims abstract description 66
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 20
- -1 indene modified bentonite Chemical class 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000007822 coupling agent Substances 0.000 claims abstract description 10
- 239000003607 modifier Substances 0.000 claims abstract description 8
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 8
- 238000011049 filling Methods 0.000 claims abstract description 6
- 239000003086 colorant Substances 0.000 claims abstract description 5
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 18
- 239000000440 bentonite Substances 0.000 claims description 16
- 229910000278 bentonite Inorganic materials 0.000 claims description 16
- 229920003986 novolac Polymers 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 11
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000001993 wax Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 3
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 239000012170 montan wax Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 claims description 3
- 235000021286 stilbenes Nutrition 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 description 13
- 239000000047 product Substances 0.000 description 13
- 239000004033 plastic Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 235000010919 Copernicia prunifera Nutrition 0.000 description 1
- 244000180278 Copernicia prunifera Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000003867 organic ammonium compounds Chemical class 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000010074 rubber mixing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to an epoxy resin composition and application thereof. An epoxy resin composition comprises the following components in parts by weight: 2-15 parts of epoxy resin, 2-10 parts of hardener, 0.01-1 part of hardening accelerator, 70-95 parts of inorganic filling material, 0.1-0.8 part of coupling agent, 0.1-1.0 part of organic indene modified bentonite, 0.1-0.6 part of release agent, 0.1-1 part of stress modifier and 0.01-1 part of colorant. The epoxy resin composition provided by the invention has the advantages that the effective control and the good adhesion to the pores of a large PAD product are shown, and the reliability and the electrical performance of the product are stable; in addition, the product has good processability. The epoxy resin composition of the present invention is suitable for use in discrete device and integrated circuit packages.
Description
Technical Field
The invention relates to the field of packaging discrete devices and integrated circuits, in particular to an epoxy resin composition and application thereof.
Background
In recent years, a polymer composite material-epoxy molding compound using epoxy resin as matrix resin is widely applied to packaging of the microelectronics industry due to the advantages of low cost, thinness, simple production process, suitability for automatic production and the like, and becomes a main packaging material for packaging consumer electronics and higher-compactness electronics. As electronic packages become more and more integrated, the chip size is larger and the internal wiring is denser and the performance requirements for the epoxy resin composition are higher and higher. For the plastic package body, the problems of appearance, productivity, wire punching, reliability and the like are considered.
For packaging discrete devices and integrated circuits, the adhesion fastness between the epoxy resin composition and the frame is ensured, and the problems of operability during packaging, electric performance after water absorption and the like are also considered, so that the reliability and the productivity of products are prevented from being influenced by water absorption and frame adhesion.
At present, a customer packaging integrated circuit is pursued to simply package a low-cost high-efficiency chip, for example, a circuit chip which is larger in size and more integrated in the existing packaging form, so that requirements on a packaging material frame, silver paste, wires and EMC (epoxy resin composition) are higher. The chip is large, the PAD of the loaded chip is larger, but the overall dimension is unchanged, so that the volume ratio is changed, the overall dimension of the plastic package material and the size ratio of the PAD are closer, the general ratio is larger than 80%, the situation can influence the die flow of the plastic package material, the plastic package material enters a die cavity to have two different flow paths of the PAD, the upper flow speed and the lower flow speed of the epoxy resin composition are different in the PAD due to the fact that the PAD is larger, the epoxy resin composition in the upper flow path and the lower flow path heals before exhausting, gas in the die cavity and the EMC body cannot be exhausted, air holes remain on the surface or inside of a packaged product, in addition, the packaging factory can gradually increase the number of single-mode and single-chip products from the aspects of cost and efficiency, for example, SOP8 is changed from the original 5 rows to 8 rows, and then the plastic package material is designed into 15 rows of products, and thus the requirement on the EMC flow control is higher. The flow channel is long, thin and small in wire diameter, so that EMC viscosity is low, reaction cannot be too fast, solidification cannot be too slow, plastic package materials with low viscosity are easy to cause reverse package in the cavity, and air holes are not easy to control.
The factors influencing the reliability of the epoxy resin composition are more, such as mechanical, thermal, electrical, radiation, chemical factors and the like, the mechanical aspect is mainly influenced by the stress variation of products, the thermal influence is mainly caused by the temperature in the production process, the electrical influence is mainly caused by the abnormal performance in the use process, the problems of electric energy heat loss, electromigration and the like, and the chemical influence is mainly caused by the corrosion, oxidation, ion migration and the like caused by the environment; the chemical factors have a great influence on the reliability of the epoxy resin composition, moisture is a main problem affecting the reliability of the plastic package device in a humid environment, the epoxy resin composition absorbs moisture in a high-temperature and high-humidity environment, and partial substances which do not participate in the reaction are extracted out to form byproducts which enter the interface between the metal base bonded by the chip and the plastic package material, and the performance of the device is degraded and even fails due to corrosion, oxidation and ion migration. The failure modes described above can also cross, such as thermal failure leading to mechanical failure that exacerbates corrosion.
The organic bentonite is an inorganic mineral/organic ammonium compound, which is prepared by taking bentonite as a raw material, utilizing the lamellar structure of montmorillonite in the bentonite and the characteristic that the lamellar structure can be swelled and dispersed into colloid-grade cosmid in water or an organic solvent, and inserting an organic covering agent through an ion exchange technology. The organic bentonite can form gel in various organic solvents, oils and liquid resins, has good thickening property, thixotropy, suspension stability, high-temperature stability, lubricity, film forming property, water resistance and chemical stability, and has important application value in the paint industry. It is also widely used in the industries of paint and ink, aviation, metallurgy, chemical fiber, petroleum, etc. However, if used directly, the high bentonite ion content, the basicity, the passivation of terminal hydroxyl groups, and the high water absorption affect the performance of the epoxy resin composition.
Disclosure of Invention
The invention aims to overcome the defects of air holes, poor interface adhesion, poor reliability and the like of the conventional epoxy resin composition during the packaging of large pads, and provides the epoxy resin composition suitable for the packaging of large pads.
The inventor finds that the indene oligomer modified bentonite can give consideration to the characteristics of the bentonite, has the low-pressure thickening and high-pressure thixotropic properties, and solves the problems of higher sodium ion content and passivation of the hydroxyl end groups of the indene oligomer in the bentonite. Since the indene oligomer and bentonite in the organic indene modified bentonite are connected in a hydrogen bond mode, the decrease of the adhesive force caused by the passivation of the terminal hydroxyl groups of the indene oligomer in the production process of the epoxy resin composition is avoided, the introduction of the indene oligomer enables the interface connection to have the acting force of hydrogen bonds in the encapsulation process and the bonding force of polycondensation reaction, and the interface delamination caused by the decrease of the acting force of the hydrogen bonds at high temperature is avoided, so that the problems of abnormal die flow and interface adhesion can be effectively solved by introducing the organic indene oligomer bentonite in the epoxy resin composition.
An epoxy resin composition comprises, by mass, 2-15 parts of epoxy resin, 2-10 parts of a hardener, 0.01-1 part of a hardening accelerator, 70-95 parts of an inorganic filler, 0.1-0.8 part of a coupling agent, 0.1-1.0 part of an organic indene modified bentonite, 0.1-0.6 part of a release agent, 0.1-1 part of a stress modifier and 0.01-1 part of a colorant.
The epoxy resin is one or a mixture of a plurality of bisphenol epoxy resin, biphenyl epoxy resin, triphenol methane type epoxy resin, naphthol type epoxy resin, stilbene type epoxy resin, epoxy resin containing triazine nucleus structure, phenolic epoxy resin, modified phenolic epoxy resin and dicyclopentadiene epoxy resin according to any proportion.
The hardener is one or a mixture of more of novolac resin, cresol novolac resin, naphthalene type novolac resin and cyclopentadiene type novolac resin according to any proportion; the hardening accelerator is one or a mixture of more than one of amine and nitrogen-containing heterocyclic compounds according to any proportion.
The inorganic filling material is one or a mixture of two of silicon micropowder and alumina in any proportion; the silicon micro powder and the aluminum oxide are spherical, and the maximum particle size of the silicon micro powder and the aluminum oxide is less than 75 microns.
The coupling agent is a silane coupling agent; the release agent is one or a mixture of a plurality of the palmitoleic wax, the montan wax and the synthetic wax according to any proportion.
The preparation method of the organic indene modified bentonite is as follows,
adding the organic bentonite and the indene oligomer into n-heptane, stirring uniformly, adding a proper amount of silane coupling agent, stirring fully for 1-3 h, placing in a 80-90 DEG blast box after stirring is finished until the organic bentonite and the indene oligomer are dried and agglomerated, crushing the obtained blocks, sieving, and bagging for later use.
The molecular formula of the indene oligomer is as follows:
r represents a hydrogen atom, a methyl group or an ethyl group; m=5 to 10; n=5 to 15; the molecular weight is 2000-3000;
the stress modifier is one or a mixture of a plurality of nitrile rubber, ABS rubber copolymer and organic silicone oil according to any proportion.
Use of an epoxy resin composition as an encapsulation material for discrete device and integrated circuit packages.
The invention has the advantages that: the epoxy resin composition adopts the organic indene modified bentonite, has good dispersion compatibility in the epoxy resin composition, improves the low-pressure high-viscosity characteristic and the low-ion high-interface cohesiveness of the product, can solve the problems of inner and outer pores and the cohesiveness of a metal interface of the packaged product, and has the characteristics of good appearance and high reliability when being used as a packaging material for packaging discrete devices and integrated circuits.
Detailed Description
The present invention will be described in further detail with reference to the following examples, which are only for the purpose of illustrating the invention and are not to be construed as limiting the scope of the invention.
The first embodiment is as follows: the embodiment provides an epoxy resin composition which is prepared from 2-15 parts by weight of epoxy resin, 2-10 parts by weight of hardener, 0.01-1 part by weight of hardening accelerator, 70-95 parts by weight of inorganic filling material, 0.1-0.8 part by weight of coupling agent, 0.1-1.0 part by weight of organic indene modified bentonite, 0.1-0.6 part by weight of release agent, 0.1-1 part by weight of stress modifier and 0.01-1 part by weight of colorant.
An epoxy resin composition of the present embodiment is prepared by the steps of: weighing each component, uniformly mixing the coupling agent and the filler, uniformly mixing the coupling agent, the filler, the epoxy resin, the hardener, the hardening accelerator, the release agent, the organic indene modified bentonite, the stress modifier and the colorant, mixing on a rubber mixing mill at 80-110 ℃ for 2-10 minutes, pulling the sheet after uniform mixing, cooling, crushing and cake forming.
In the epoxy resin composition of the embodiment, epoxy groups of epoxy resin are subjected to ring opening and phenolic hydroxyl crosslinking reaction in a hardening agent to form a network structure under the action of the hardening accelerator at high temperature; in the high-temperature reaction process, the surface wetting of the filler is increased, and good dispersibility is shown.
According to the epoxy resin composition, the organic indene modified bentonite is introduced, so that free Na ions can be removed, the problem of passivation of hydroxyl end groups of indene oligomers can be solved, the low-pressure high-viscosity property can be solved, the electrical property defect caused by high ions is not influenced, the defect of insufficient adhesiveness of the epoxy resin composition due to passivation of hydroxyl end groups is also overcome, and therefore the internal and external air holes of a customer packaging product are improved, and the reliability of the product is improved.
The second embodiment is as follows: the present embodiment differs from the specific embodiment in that: the epoxy resin comprises one or a mixture of more of bisphenol epoxy resin, biphenyl epoxy resin, triphenol methane epoxy resin, naphthol epoxy resin, stilbene epoxy resin, epoxy resin containing triazine nucleus structure, phenolic epoxy resin, modified phenolic epoxy resin and dicyclopentadiene epoxy resin according to any proportion.
And a third specific embodiment: the present embodiment differs from the specific embodiment in that: the hardener is one or a mixture of more of novolac resin, cresol novolac resin, naphthalene type novolac resin and cyclopentadiene type novolac resin according to any proportion; the hardening accelerator is one or a mixture of more of amines, imidazole compounds and nitrogen-containing heterocyclic compounds according to any proportion.
The specific embodiment IV is as follows: the present embodiment differs from the specific embodiment in that: the inorganic filling material is one or a mixture of two of silicon micropowder and alumina in any proportion; the silicon micro powder and the aluminum oxide are spherical, and the maximum particle size of the silicon micro powder and the aluminum oxide is less than 75 microns.
Fifth embodiment: the present embodiment differs from the specific embodiment in that: the coupling agent is a silane coupling agent; the release agent is one or a mixture of a plurality of the palmitoleic wax, the montan wax and the synthetic wax according to any proportion.
Specific embodiment six: the present embodiment differs from the specific embodiment in that: the organic indene modified bentonite is prepared by the following method:
adding the organic bentonite and the indene oligomer into n-heptane, stirring uniformly, adding a proper amount of silane coupling agent, stirring fully for 1-3 h, placing in a 80-90 DEG blast box after stirring is finished until the mixture is dried and agglomerated, crushing the obtained block materials, sieving, and bagging for later use.
The molecular formula of the indene oligomer is as follows:
r represents a hydrogen atom, a methyl group or an ethyl group; m=5 to 10; n=5 to 15; the molecular weight is 2000-3000;
in the embodiment, the organic indene modified bentonite is adopted to improve the low-pressure high-viscosity property and low-ion high-interface cohesiveness of the product, and meanwhile, the problems of inner and outer pores of the packaged product and cohesiveness of a metal interface are solved, and the organic indene modified bentonite has the characteristics of good appearance and high reliability when used as a packaging material for packaging discrete devices and integrated circuits.
Seventh embodiment: the present embodiment differs from the specific embodiment in that: the stress modifier is one or a mixture of a plurality of nitrile rubber, ABS rubber copolymer and organic silicone oil according to any proportion.
Eighth embodiment: the present embodiment provides an application of an epoxy resin composition: the epoxy resin composition is used as an encapsulation material for discrete devices and integrated circuit packages.
The following examples are used to verify the benefits of the present invention:
the present example provides an epoxy resin composition, by adding different amounts of test products for performance differences.
The evaluation method of the examples is as follows:
viscosity test: taking a proper amount of epoxy resin composition powder, preforming the powder into a cylinder with the diameter of 10+/-0.3 mm, and testing the cylinder by using a high-temperature rheometer.
Adhesion force: the cylinder was made with a transfer molding process (bottom diameter 3.5 mm. Height 5 mm), and the black was bonded to Ag/Cu/Ni plated metal sheets (6.5 mm. 6.5 mm) and tested with a pusher while heating to 75 degrees.
Air holes: adopting an SOP8 five-row frame mold, preparing epoxy resin composition powder into 43 x 50g cake materials, preheating, putting into a heated mold, performing injection molding through a punch rod, cooling after solidification, taking out, and observing inner and outer air holes and layering through a microscope and a scanner.
Disc flow: 8-10 g of epoxy resin composition powder is taken and vertically poured on a heating platform, and is directly pressed on the conical powder through a 5-10 kg flat plate, the flat plate is taken down after solidification, and the diameter of the solidified epoxy resin composition cake is tested by a ruler.
The evaluation results are shown in Table 1.
The component codes referred to in table 1 of this example are described as follows:
epoxy resin E: polyaromatic epoxy resin HP5000, available from DIC, japan
Hardening agent P: phenol formaldehyde type phenolic resin TD-2090, available from DIC in Japan
Inorganic filler S: silica micropowder SS-0183R, available from Korea KOSEM
Hardening accelerator C1: triphenylphosphine and process for preparing same
Coupling agent C2: silane coupling agent KH560
The organoindene modified bentonite F is prepared from organobentonite (GEL-1) and indene oligomer (IP 100 new day iron)
Organobentonite H organobentonite GEL-1
Mold release agent W: carnauba wax Carnauba No.1, available from east Asia chemical Co
Carbon black C3: MA-600, available from Mitsubishi Japan.
Examples 1 to 4, in which organobentonite was used in example 1, organoindene oligomer bentonite was not used, comparative example 1, bentonite was not used, and examples 2 to 4 were added with different amounts of organoindene oligomer bentonite, using the method steps of one to eight of the above embodiments, the substances of the respective component codes involved were brought into the specific methods, and the specific content data were shown in the graphs.
List one
Where SF is the helical flow length, GT is the gel time, and Vis is the melt viscosity.
As can be seen from Table 1, the epoxy resin compositions of examples 1 to 4 were tested, and the test results showed that they had a slightly lower SF at high pressure and a slightly higher viscosity, but the flow of the low pressure flow Disc was significantly decreased; in examples 1 to 4, the low pressure die flow of the material added with the organoindene modified bentonite is obviously reduced, and the increase is obvious from the aspect of the adhesive force; however, the adhesion of the organobentonite which is not modified with the indene oligomer is significantly reduced, and thus it is found that the epoxy resin composition of the present invention can effectively improve the reliability of the product. The above embodiments should not limit the present invention in any way, and all technical solutions obtained by equivalent substitution or equivalent conversion fall within the protection scope of the present invention.
Claims (8)
1. An epoxy resin composition characterized in that: comprises the following components in percentage by mass: 2-15 parts of epoxy resin, 2-10 parts of hardener, 0.01-1 part of hardening accelerator, 70-95 parts of inorganic filling material, 0.1-0.8 part of coupling agent, 0.1-1 part of organic indene modified bentonite, 0.1-0.6 part of release agent, 0.1-1 part of stress modifier and 0.01-1 part of colorant.
2. The epoxy resin composition according to claim 1, wherein: the epoxy resin is one or a mixture of a plurality of bisphenol epoxy resin, biphenyl epoxy resin, triphenol methane type epoxy resin, naphthol type epoxy resin, stilbene type epoxy resin, epoxy resin containing triazine nucleus structure, phenolic epoxy resin, modified phenolic epoxy resin and dicyclopentadiene epoxy resin according to any proportion.
3. The epoxy resin composition according to claim 1, wherein: the hardener is one or a mixture of more of novolac resin, cresol novolac resin, naphthalene type novolac resin and cyclopentadiene type novolac resin according to any proportion; the hardening accelerator is one or a mixture of more of amines and nitrogen-containing heterocyclic compounds.
4. The epoxy resin composition according to claim 1, wherein: the inorganic filling material is one or a mixture of two of silicon micropowder and alumina; the silicon micro powder and the aluminum oxide are spherical, and the maximum particle size of the silicon micro powder and the aluminum oxide is less than 75 microns.
5. The epoxy resin composition according to claim 1, wherein: the coupling agent is a silane coupling agent; the release agent is one or a mixture of a plurality of the palmitoleic wax, the montan wax and the synthetic wax.
6. The epoxy resin composition according to claim 1, wherein: the organic indene modified bentonite is prepared by the following method:
adding organic bentonite and indene oligomer into n-heptane, stirring uniformly, adding a proper amount of silane coupling agent, stirring fully for 1-3 h, placing in a 80-90 DEG blast box after stirring is finished until the materials are dried and agglomerated, and crushing and sieving the obtained blocky materials for later use;
the molecular formula of the indene oligomer is as follows:
r represents a hydrogen atom, a methyl group or an ethyl group; m=5 to 10; n=5 to 15; the molecular weight is 2000-3000.
7. The epoxy resin composition according to claim 1, wherein: the stress modifier is one or a mixture of a plurality of nitrile rubber, ABS rubber copolymer and organic silicone oil.
8. Use of an epoxy resin composition according to any one of claims 1 to 7, characterized in that: the epoxy resin composition is used as an encapsulation material for discrete devices and integrated circuit packages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111232864.2A CN113831878B (en) | 2021-10-22 | 2021-10-22 | Epoxy resin composition and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111232864.2A CN113831878B (en) | 2021-10-22 | 2021-10-22 | Epoxy resin composition and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113831878A CN113831878A (en) | 2021-12-24 |
| CN113831878B true CN113831878B (en) | 2023-07-07 |
Family
ID=78965802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111232864.2A Active CN113831878B (en) | 2021-10-22 | 2021-10-22 | Epoxy resin composition and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113831878B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114276651B (en) * | 2021-12-24 | 2023-06-23 | 江苏华海诚科新材料股份有限公司 | Epoxy resin composition suitable for low-pressure encapsulation and preparation method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4156874B2 (en) * | 2002-07-08 | 2008-09-24 | 新日鐵化学株式会社 | Aromatic oligomer, epoxy resin composition and cured product thereof |
| JP5570453B2 (en) * | 2011-02-10 | 2014-08-13 | 新日鉄住金化学株式会社 | Epoxy resin composition and cured product |
| CN111315820A (en) * | 2017-11-14 | 2020-06-19 | 松下知识产权经营株式会社 | Resin composition for encapsulating semiconductor chip and semiconductor package |
| CN113897163B (en) * | 2021-12-09 | 2022-03-11 | 武汉市三选科技有限公司 | Adhesive, chip bonding film and preparation method thereof |
-
2021
- 2021-10-22 CN CN202111232864.2A patent/CN113831878B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113831878A (en) | 2021-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7083474B2 (en) | Recyclable LED packaging conductive adhesive composition and its manufacturing method | |
| US7692318B2 (en) | Liquid epoxy resin composition and semiconductor device | |
| CN113403022B (en) | Organic silicon heat-conducting pouring sealant and preparation method thereof | |
| JP2008127577A (en) | Epoxy resin composition for sealing multi-chip package and multi-chip package using the same | |
| CN110128781A (en) | Epoxy molding compound, its preparation method and use | |
| CN117143550B (en) | Underfill glue for eliminating flow marks, preparation method thereof and flip-chip | |
| CN105038129B (en) | A kind of composition epoxy resin of Flip-Chip Using | |
| CN113831878B (en) | Epoxy resin composition and application thereof | |
| CN117844176A (en) | Epoxy resin composition, epoxy resin material, and preparation method and application thereof | |
| CN114276653B (en) | Epoxy resin composition and application thereof, epoxy resin and preparation method thereof | |
| CN114276652B (en) | Epoxy resin composition and application thereof, epoxy resin and preparation method and application thereof | |
| Komori et al. | Development trend of epoxy molding compound for encapsulating semiconductor chips | |
| CN1321179A (en) | Epoxy resin composition and semiconductor device | |
| CN117487489B (en) | Underfill with high stretching rate, preparation method thereof and chip packaging structure | |
| CN116515255A (en) | Epoxy plastic package material with high adhesive force to plastic package substrate | |
| CN101955629B (en) | Epoxy resin composition capable of being used as semiconductor encapsulating material | |
| EP4410890A1 (en) | Epoxy resin composition for molding | |
| CN111471278A (en) | Low-temperature high-radiant-heat epoxy resin composition and application thereof | |
| KR20100079280A (en) | Liquid epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same | |
| CN115093815B (en) | Underfill material with good compatibility with soldering flux | |
| JPH08153831A (en) | Semiconductor device | |
| KR19980030543A (en) | Epoxy resin composition for sealing semiconductor devices with high thermal conductivity and low thermal expansion coefficient | |
| CN108384195B (en) | Nickel-to-epoxy resin composition with high adhesion and application thereof | |
| TW202405109A (en) | Antioxidant conductive heat dissipation copper paste and method for manufacturing the same | |
| CN117487315A (en) | Epoxy resin composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215300 No.267 middle Qingyang Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Applicant after: Kunshan Xingkai semiconductor material Co.,Ltd. Address before: 215300 No.267 middle Qingyang Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Applicant before: CHANGXING ELECTRONIC MATERIAL (KUNSHAN) Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |