CN103421272A - Epoxy resin composition used for electronic packaging and preparation method thereof - Google Patents
Epoxy resin composition used for electronic packaging and preparation method thereof Download PDFInfo
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- CN103421272A CN103421272A CN2012101592568A CN201210159256A CN103421272A CN 103421272 A CN103421272 A CN 103421272A CN 2012101592568 A CN2012101592568 A CN 2012101592568A CN 201210159256 A CN201210159256 A CN 201210159256A CN 103421272 A CN103421272 A CN 103421272A
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- epoxy resin
- composition epoxy
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 43
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 43
- 239000000203 mixture Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 238000004100 electronic packaging Methods 0.000 title claims description 4
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000000654 additive Substances 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 229920003987 resole Polymers 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 229940058344 antitrematodals organophosphorous compound Drugs 0.000 claims description 6
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000012764 mineral filler Substances 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 239000007858 starting material Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 2
- 229910000077 silane Inorganic materials 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 150000004693 imidazolium salts Chemical class 0.000 claims 1
- 125000005375 organosiloxane group Chemical group 0.000 claims 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 1
- -1 tertiary amine compound Chemical class 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 15
- 239000004033 plastic Substances 0.000 abstract description 12
- 238000000465 moulding Methods 0.000 abstract description 11
- 238000005476 soldering Methods 0.000 abstract description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 229920001568 phenolic resin Polymers 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 10
- 102100032515 Male-specific lethal 3 homolog Human genes 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 239000000206 moulding compound Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 101001014562 Homo sapiens Male-specific lethal 3 homolog Proteins 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 210000004400 mucous membrane Anatomy 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 101001027796 Homo sapiens Male-specific lethal 1 homolog Proteins 0.000 description 2
- 101000639802 Homo sapiens U2 small nuclear ribonucleoprotein B'' Proteins 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 102100034461 U2 small nuclear ribonucleoprotein B'' Human genes 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 235000015895 biscuits Nutrition 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/88—Thermal treatment of the stream of extruded material, e.g. cooling
- B29C48/911—Cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
- B29C48/04—Particle-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/36—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die
- B29C48/395—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders
- B29C48/40—Means for plasticising or homogenising the moulding material or forcing it through the nozzle or die using screws surrounded by a cooperating barrel, e.g. single screw extruders using two or more parallel screws or at least two parallel non-intermeshing screws, e.g. twin screw extruders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/25—Component parts, details or accessories; Auxiliary operations
- B29C48/92—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92504—Controlled parameter
- B29C2948/92704—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C2948/00—Indexing scheme relating to extrusion moulding
- B29C2948/92—Measuring, controlling or regulating
- B29C2948/92819—Location or phase of control
- B29C2948/92857—Extrusion unit
- B29C2948/92876—Feeding, melting, plasticising or pumping zones, e.g. the melt itself
- B29C2948/92895—Barrel or housing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention relates to an epoxy resin composition with high humidity resistance, low stress and high reliability, and a preparation method thereof. The epoxy resin composition comprises an epoxy resin, a phenolic resin, a curing accelerator, an inorganic filling material and other additives. By selection of the epoxy resin and the phenolic resin which have specific structures and by selection of the proper curing accelerator and a proper low-stress accelerator, the epoxy moulding plastic obtained by curing is used for SOP (Small Out-Line Package) and QFP (Plastic Quad Flat Package) chip packaging, reaching the JEDEC (Joint Electron Device Engineering Council) reliability standard, and meeting requirements of lead-free reflow soldering at 260 DEG C.
Description
Technical field
The invention belongs to the electronic package material technical field, further, the invention belongs to middle and high end electronic package material technical field, be specifically related to a kind of high moisture-proof, low-stress and there is composition epoxy resin of high reliability and preparation method thereof.
Background technology
Epoxy molding plastic is widely used in the Electronic Packaging field.In the middle and high end encapsulation field, in the encapsulation for SOP (Small Out-Line Package) and QFP (Plastic Quad Flat Package) form, the requirement of the high-end customer of main flow at present is must be by 260
oThe C reflow soldering, zero layer and operate continuously are greater than 250 moulds, not the operational problems such as punching silk, pore, dirty mould.
The encapsulation of SOP and QFP form, because its chip area is large, spun gold thin, the lead-in wire pitch is little, in follow-up encapsulation process, the possibility of spun gold distortion, package warpage, cracking, layering increases greatly, affects package reliability, and significantly reduces yield rate.Need to add the resin raising epoxy molding plastic of low viscosity, low-stress, low water absorption and the cohesive force of various metals in improving the package reliability process.But the adverse consequences of simultaneously bringing is the operability that has affected technological process, and the phenomenons such as mucous membrane, dirty mould easily occur.
Summary of the invention
The purpose of this invention is to provide the composition epoxy resin that a kind of SOP of meeting and QFP encapsulate high moisture-proof, low-stress and have high reliability.
To guarantee to there is high reliability and good operability simultaneously, must utilize neo-epoxy resin and regulate it and various component as the proportioning of solidifying agent, promotor etc., to the properties that makes the finished product, all meet the demands.The present invention is by selecting low viscosity, low water absorbable, low-stress, high heat-resisting epoxy resin and/or the heat-resisting high-voltage resistance capability of resol raising epoxy molding plastic; The mouldability that simultaneously by adjusting other component, as kind and the content of wax, coupling agent, low-stress agent, improves epoxy molding plastic, and improve the cohesive strength between final composition epoxy resin and lead frame, chip etc.
Viscosity and mobility that kind and proportioning by optimizing epoxy resin and solidifying agent and the content of adjusting curing catalyst are regulated epoxy molding plastic, make reliability and operability all meet the demands.Composition epoxy resin in the present invention has low expansion, low-stress, low water absorbable, the outstanding advantages such as high-adhesive-strength, and also meet environmental requirement.
The preparation method of composition epoxy resin of the present invention is: by after the accurate weighing by weight ratio of each component, first the starting material of various solid state are mixed in high speed agitator to 20-30 minute, then add liquid additive to continue to mix 15-20 minute, carry out mixing extrusion under 90-110 ℃ by twin screw extruder, finally cooling, pulverize and mix.
The chief component of fast-curing epoxy resin provided by the invention is counted as follows by weight:
Epoxy resin 2～10%
Solidifying agent 2～10%
Curing catalyst 0.01～2%
Mineral filler 65～90%
Fire retardant 0～15%
Coupling agent 0.1～3
Releasing agent 0.2～3%
Tinting material 0.1～1%.
Embodiment
The invention is further illustrated by the following examples.
Embodiment 1
By 5.8 parts of epoxy resin with Dove aromatic ring (MAR), 3.2 the resol of part Dove aromatic ring (MAR), 88 parts of spherical silicas (through size-grade distribution optimization), 0.7 part epoxy, sulfydryl, amino coupling agent, 0.3 part releasing agent (new demoulding system), 1.0 part stress properties-correcting agent, 0.4 part ion capturing agent, 0.4 part carbon black, after 0.2 a part latent organo phosphorous compounds derivative catalyst is used homogenizer to stir, putting into twin screw extruder is heated, mixing and extrude, product after extruding is rolled, cooling and pulverize, obtain the moulding compound powder and test its performance, product performance are listed in table 1.
Embodiment 2
By 6.2 parts of epoxy resin with Dove aromatic ring (MAR), 3. the resol of part Dove aromatic ring (MAR), 88 parts of spherical silicas (through size-grade distribution optimization), 0.5 part epoxy, sulfydryl, amino coupling agent, 0.3 part releasing agent (new demoulding system), 1.0 part stress properties-correcting agent, 0.4 part ion capturing agent, 0.4 part carbon black, after 0.2 a part latent organo phosphorous compounds derivative catalyst is used homogenizer to stir, putting into twin screw extruder is heated, mixing and extrude, product after extruding is rolled, cooling and pulverize, obtain the moulding compound powder and test its performance, product performance are listed in table 1.
Embodiment 3
By 5.8 parts of epoxy resin with Dove aromatic ring (MAR), 3.15 the resol of part Dove aromatic ring (MAR), 88 parts of spherical silicas (through size-grade distribution optimization), 0.7 part epoxy, sulfydryl, amino coupling agent, 0.35 part releasing agent (new demoulding system), 1.0 part stress properties-correcting agent, 0.4 part ion capturing agent, 0.4 part carbon black, after 0.2 a part latent organo phosphorous compounds derivative catalyst is used homogenizer to stir, putting into twin screw extruder is heated, mixing and extrude, product after extruding is rolled, cooling and pulverize, obtain the moulding compound powder and test its performance, product performance are listed in table 1.
Embodiment 4
By 5.65 parts of epoxy resin with Dove aromatic ring (MAR), 3.5 the resol of part Dove aromatic ring (MAR), 88 parts of spherical silicas (through size-grade distribution optimization), 0.5 part epoxy, sulfydryl, amino coupling agent, 0.3 part releasing agent (new demoulding system), 1.0 part stress properties-correcting agent, 0.4 part ion capturing agent, 0.4 part carbon black, after 0.2 a part latent organo phosphorous compounds derivative catalyst is used homogenizer to stir, putting into twin screw extruder is heated, mixing and extrude, product after extruding is rolled, cooling and pulverize, obtain the moulding compound powder and test its performance, product performance are listed in table 1.
The comparative example
Prior art: by the resol of 6 parts of epoxy resin with Dove aromatic ring (MAR), 3 parts of Dove aromatic rings (MAR), 88 parts of spherical silicas, 0.7 part of epoxy and sulfydryl coupling agent, 0.3 part of releasing agent, 1.0 parts of stress properties-correcting agent, 0.4 part of ion capturing agent, 0.4 part of carbon black, after 0.2 a part latent organo phosphorous compounds derivative catalyst is used homogenizer to stir, put into twin screw extruder heated, mixing and extrude, by the calendering of the product after extruding, cooling and pulverizing, obtain the moulding compound powder and test its performance, product performance are listed in table 1.
Characterizing method
The main performance index of composition epoxy resin is tested as follows:
<gelation time>: reference standard HW/ZL/JS015-HPGT;
<helicoidal flow length>: reference standard HW/ZL/JS015-SF;
<viscosity>: reference standard HW/ZL/JS027;
<second-order transition temperature/thermal expansivity>: reference standard HW/ZL/JS015TMA;
<water-intake rate>
Composition epoxy resin is made to the 50mm diameter under 75 ℃/10MPa condition, the sample piece of 3mm thickness, and in the baking oven of 175 ℃ after fixing 6 hours.Then its weight of weighing, then put into sample the PCT proofing box, and condition is 121 ℃/100% humidity, and test period is 24H.After off-test, its biscuit weight of test, calculate its water-intake rate.
<flame retardant resistance>
Composition epoxy resin is made under 175 ℃/10MPa condition to the sample piece of 1/8inch thickness, and in the baking oven of 175 ℃ after fixing 6 hours, finally by vertical combustion, send out by GBT2408-2008 and carry out flame retardant test;
<cohesive force>
Composition epoxy resin is encapsulated in to the special-purpose Cu of Tab Pull, on the Ag framework, elder generation's after fixing 6 hours (PMC) in the baking oven of 175 ℃, again by JEDEC MSL3 (60 ℃/60%/40h) and MSL1(85 ℃/85%/168h) condition under carry out the moisture absorption processing, then the sample of handling well is refluxed 3 times under the condition of 260 ℃, the cohesive force of last test composition epoxy resin and Tab Pull framework.
<storage modulus/second-order transition temperature>
Use TA dynamic mechanical analysis instrument, model is Q800, is tested, and measuring parameter is: 3 ℃/min is heated to 265 ℃.
<reliability testing>
With reference to the QFP44 of intra-company: composition epoxy resin is encapsulated on the QFP44 mould, after molding completes, sample is examined according to JEDEC MSL3, concrete steps are as follows, elder generation's after fixing 6 hours (PMC) in the baking oven of 175 ℃, scan (C-SAM) preliminary scanning by ultrasonic electronic whether layering is arranged, after demixing scan completes, sample enters dry 24 hours of baking oven 125 degree, again by JEDEC MSL3 (60 ℃/60%/40h) and MSL1(85 ℃/85%/168h) condition under carry out the moisture absorption processing, then the sample of handling well is refluxed 3 times under the condition of 260 ℃, be confirmed whether layering finally by scan (C-SAM) by ultrasonic electronic.
Prior art (being the comparative example) gained epoxy molding plastic exists high water absorbing capacity, high-modulus and lower Ag(silver) problem of cohesive force, also have in addition the operational problems such as mucous membrane, also there is the phenomenon of base island layering in the MSL3 test.
The present invention, by the problem of epoxy molding plastic mucous membrane of having selected applicable releasing agent to solve, has meanwhile also kept the height silver cohesive force of product; The length of flow that improves product by the size-grade distribution of regulating filler in composition epoxy resin meets high-density SOP& The requirement of QFP encapsulation.Epoxy molding plastic of the present invention can reach JEDEC MSL3@260
oThe excellent results of C zero layer.
In sum, the various over-all propertieies of epoxy molding plastic of the present invention have compared with prior art all reached raising, and reliability and operability are also improved thereupon.
Claims (11)
1. a composition epoxy resin comprises: resol and mineral filler that the epoxy resin that weight fraction is 4～10%, weight fraction are 4～10%, it is characterized in that described epoxy resin contains the structure shown in formula I,
The formula I
Described resol refers to that general formula is II resol
The formula II
The above-mentioned weight fraction all weight based on composition epoxy resin is 100%.
2. composition epoxy resin according to claim 1, is characterized in that described filler is preparing spherical SiO 2.
3. composition epoxy resin according to claim 1, the weight fraction that it is characterized in that described filler is 80%～92%, the weight of above-mentioned weight fraction based on composition epoxy resin is 100%.
4. composition epoxy resin according to claim 1, is characterized in that comprising curing catalyst, is preferably one or more in organo phosphorous compounds, imidazolium compounds, tertiary amine compound and derivative thereof.
5. composition epoxy resin according to claim 1, is characterized in that comprising coupling agent, is preferably silane containing epoxy group(ing), containing the silane of sulfydryl, containing one or more in amino silane.
6. composition epoxy resin according to claim 1, is characterized in that comprising remover, is preferably natural wax and/or synthetic wax.
7. composition epoxy resin according to claim 1, is characterized in that comprising low-stress promotor, is preferably organo-siloxane class and/or rubber.
8. composition epoxy resin according to claim 1, is characterized in that comprising tinting material.
9. according to the composition epoxy resin shown in claim 1, it is characterized in that comprising ion capturing agent.
10. the application of the described composition epoxy resin of claim 1～9 on Electronic Packaging.
11. the preparation method of the described composition epoxy resin of claim 1～9, it is characterized in that comprising following steps: by after the accurate weighing by weight ratio of each component, first the starting material of various solid state are mixed in high speed agitator to 20-30 minute, then add liquid additive to continue to mix 15-20 minute, carry out mixing extrusion under 90-110 ℃ by twin screw extruder, finally cooling, pulverize and mix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101592568A CN103421272A (en) | 2012-05-22 | 2012-05-22 | Epoxy resin composition used for electronic packaging and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101592568A CN103421272A (en) | 2012-05-22 | 2012-05-22 | Epoxy resin composition used for electronic packaging and preparation method thereof |
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| CN103421272A true CN103421272A (en) | 2013-12-04 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104513462A (en) * | 2014-12-22 | 2015-04-15 | 科化新材料泰州有限公司 | High-thermal-conductivity environment-friendly type epoxy resin composition and preparation method thereof |
| CN105778409A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Epoxy resin composition for semiconductor packaging, and preparation method thereof |
| CN105778411A (en) * | 2014-12-18 | 2016-07-20 | 北京首科化微电子有限公司 | Secondary mixing method of epoxy resin composition for semiconductor encapsulation |
| WO2016145661A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound, its manufacturing process and use, and transistor outline package product containing molded product thereof |
| WO2016145651A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound, preparation and use thereof |
| WO2016145648A1 (en) * | 2015-03-19 | 2016-09-22 | Ablestik (Shanghai) Ltd. | Epoxy molding compound for high power soic semiconductor package application |
| CN106674911A (en) * | 2016-12-30 | 2017-05-17 | 科化新材料泰州有限公司 | High-adhesion epoxy molding compound for packaging semiconductor |
| CN106832768A (en) * | 2016-12-27 | 2017-06-13 | 江苏中鹏新材料股份有限公司 | A kind of environmental type epoxy molding plastic with low stress |
| CN108530842A (en) * | 2016-08-26 | 2018-09-14 | 孙豆豆 | A kind of modified epoxy plastic packaging preparation method for material for Electronic Packaging |
| CN108641645A (en) * | 2018-03-29 | 2018-10-12 | 江苏矽时代材料科技有限公司 | A kind of encapsulating semiconductor packaging plastic and preparation method thereof |
| CN110194882A (en) * | 2018-02-24 | 2019-09-03 | 衡所华威电子有限公司 | A kind of low alpha epoxy molding plastic and preparation method thereof |
| CN111153631A (en) * | 2020-02-25 | 2020-05-15 | 长兴电子材料（昆山）有限公司 | High-thermal-conductivity and high-reliability epoxy resin composition and application thereof |
| CN116410712A (en) * | 2021-12-30 | 2023-07-11 | 中国石油天然气股份有限公司 | Temperature-sensitive plugging agent and preparation method and application thereof |
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