CN106158666A - Manufacturing method of high-heat-conductivity assembly - Google Patents

Abstract

A method for manufacturing a high thermal conductive component is provided, which uses an impregnation method to immerse thermal conductive fibers in a liquid forming substrate, thereby large-area operation can be realized and the high thermal conductive component with the exposed thermal conductive fibers can be manufactured by simple process control.

Description

Manufacturing method of high thermal conductivity component

technical field

The invention relates to a method for manufacturing a thermally conductive component, in particular to a method for manufacturing a high thermally conductive component.

Background technique

With the development of semiconductor manufacturing technology becoming more and more mature, the integration level of semiconductor components is getting higher and higher. Therefore, "heat dissipation" has become one of the important technologies of semiconductor components. Especially for high-power components, the temperature of electronic products will rise rapidly due to the substantial increase of heat energy generated when the components operate. When the average operating temperature of electronic components increases by 10°C, the life of the components will be reduced by 50%. Therefore, how to develop a heat dissipation method that is more suitable for high-power components is a difficult problem for related manufacturers to overcome.

Generally, the heat dissipation of components is mostly provided with a heat dissipation structure (such as heat dissipation fins, heat sinks) on the components, and then the heat dissipation structure is used to dissipate the waste heat generated by the power components. The constituent materials of the aforementioned heat dissipation structure are generally metals with high thermal conductivity, or polymer composite materials doped with high thermal conductivity inorganic materials, such as boron nitride, aluminum nitride, etc., or directly with high thermal conductivity. Made of thermally conductive carbon fiber or graphite sheet. However, although metal has good thermal conductivity, its specific gravity is relatively heavy, so it will increase the overall weight of the component, and the high thermal conductivity inorganic material used for blending with polymer materials will be covered by polymers with poor thermal conductivity , which will reduce its heat dissipation.

Contents of the invention

The object of the present invention is to provide a method for manufacturing a high thermal conductivity component with high thermal conductivity.

The manufacturing method of the high thermal conductivity component of the present invention comprises: a preparation step, an impregnation step, and a curing step.

The preparation step is to prepare a liquid forming matrix, and control the viscosity of the forming matrix to be between 1000-30000cps. The impregnating step is to immerse one end of a plurality of heat-conducting fibers with a predetermined length into the forming matrix, and keep the other end of the heat-conducting fibers outside the forming matrix. In the curing step, the forming matrix containing the thermally conductive fibers is solidified into a support body to obtain the high thermally conductive component.

Preferably, as mentioned above, wherein the forming matrix comprises a material selected from polymer materials and metal materials.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity component, the polymer material is selected from one of the following groups: phenolic resin, furan resin, epoxy resin, silicone resin, polyurethane resin.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity component, the forming matrix further includes a viscosity modifier.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity component, wherein the polymer material is epoxy resin, and the viscosity regulator is selected from reactive viscosity regulators that can react with the epoxy resin, or do not react with the epoxy resin non-reactive viscosity modifier.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity component, wherein the reactive viscosity modifier is selected from one of the following groups: butyl glycidyl ether, 1,4-butanediol diglycidyl ether, ethylene glycol diol Glycidyl ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, C ₁₂ -C ₁₄ fatty glycidyl ether, benzyl glycidyl ether, 1,6-hexanediol diglycidyl ether, propylene oxide o-toluene base ether, propylene oxide o-cresyl glycidyl ether, neopentyl glycol diglycidyl ether.

Preferably, in the method for manufacturing the aforementioned high thermal conductivity component, wherein the non-reactive viscosity modifier is selected from one of the following groups: acetone, absolute ethanol, toluene, xylene, styrene, ethyl acetate, butyl acetate , dimethylformamide, benzyl alcohol, polyols.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity component, the metal material is selected from one of the following groups: silver, aluminum, copper, and aluminum alloy.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity component, the thermal conductive fiber is selected from metal fibers, high thermal conductive carbon fibers, or graphitized vapor deposition carbon fibers.

The beneficial effect of the present invention is that the heat-conducting fiber is directly impregnated into a liquid forming matrix by impregnation, so that the forming matrix is solidified and the heat-conducting fiber is exposed to the outside, the manufacturing process is simple and easy to control, and can be directly A highly thermally conductive component with exposed thermally conductive fibers is produced.

Description of drawings

Fig. 1 is a schematic diagram illustrating the schematic structure of the high thermal conductivity component in an embodiment of the manufacturing method of the high thermal conductivity component of the present invention; and

FIG. 2 is a text flow chart illustrating the production process of this embodiment.

detailed description

The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

The high thermal conductivity component of the present invention can be used for contacting with an electronic component 100 that generates heat, so as to dissipate the heat energy of the electronic component 100 .

Referring to FIG. 1 , an embodiment of the high thermal conductivity component 2 of the present invention includes: a support body 21 and a plurality of thermal conductivity fibers 22 .

The support body 21 has a bottom surface 211 in contact with the electronic component 100, and a base surface 212 opposite to the bottom surface 211, and the material of the support body 21 can be selected from metals, alloy metals, thermosetting polymer materials, or thermoplastic polymer materials. Preferably, the material of the support body 21 is selected from silver, aluminum, copper, aluminum alloy, phenolic resin, epoxy resin, silicone resin, polyurethane resin, or furan resin.

The heat-conducting fibers 22 have a predetermined length and are arranged in a direction substantially perpendicular to the base surface 212 of the support 21, wherein one end of the heat-conducting fibers 22 is covered by the support 21, and the other end passes through the support 21. The base surface 212 is exposed outside the support body 21 and is in direct contact with the external environment.

Specifically, the thermally conductive fiber 22 is selected from a thermally conductive material having a predetermined length and a thermal conductivity of 380-2000 W/m·K. The thermally conductive fiber 22 suitable for this embodiment can be selected from metal fiber (metal fiber) ), high thermal conductivity carbon fiber (high thermal conductivity carbon fiber), graphitized vapor deposition carbon fiber (GraphitizedVGCF).

The manufacturing method of the aforementioned embodiment of the high thermal conductivity component 2 is described as follows.

Referring to FIG. 2 , the manufacturing method of the high thermal conductivity component 2 of the present invention includes: a preparation step 31 , an impregnation step 32 , and a curing step 33 .

The preparation step 31 is to prepare a liquid forming matrix, and control the viscosity of the forming matrix to be between 1000-30000 cps.

The forming matrix includes a material mainly selected from polymer materials and metal materials, and the forming matrix also includes a viscosity regulator. Melting or dissolving the solid polymer material, metal, or alloy metal material in the viscosity regulator makes the polymer material, metal, or alloy metal into a liquid state. Specifically, the metal can be selected from one of the following groups: silver, aluminum, copper, tin, antimony, aluminum alloy; the polymer material can be selected from one of the following groups: phenolic resin, epoxy resin, Furan resin, polyurethane resin, or silicone resin, etc.

In order to avoid that the viscosity of the liquid forming matrix is too high, resulting in that the subsequent thermally conductive fibers 22 cannot be immersed in the forming matrix, or the viscosity is too low, so that the forming matrix is adsorbed due to capillary phenomenon during the immersion process of the heat conducting fibers 22 The surface of the heat-conducting fiber 22 is intended to be exposed. Therefore, preferably, the viscosity of the forming matrix should be controlled at 1000-30000 cps.

Specifically, when the composition of the forming matrix is selected from polymer materials, the overall viscosity of the forming matrix can be adjusted by mixing polymer materials with different melt viscosities, or by dissolving the polymer materials in the viscosity In the regulator, the overall viscosity of the forming matrix is adjusted by using a viscosity regulator, wherein the viscosity regulator can be selected from a reactive viscosity regulator that can react with the selected polymer material, or not react with the polymer material non-reactive viscosity modifier.

Taking epoxy resin as an example, the viscosity modifier can be selected from reactive viscosity modifiers that can react with epoxy resin, such as one of the following groups: butyl glycidyl ether, 1,4-butanediol Diglycidyl ether, ethylene glycol diglycidyl ether, phenyl glycidyl ether, polypropylene glycol diglycidyl ether, C ₁₂ -C ₁₄ fatty glycidyl ether, benzyl glycidyl ether, 1,6-hexanediol diol Glycidyl ether, propylene oxide o-cresyl ether, propylene oxide o-cresyl glycidyl ether, neopentyl glycol diglycidyl ether, or non-reactive viscosity modifiers that do not react with epoxy resins (that is, generally available Solvents for dissolving polymer materials), for example, one of the following groups selected from: acetone, absolute ethanol, toluene, xylene, styrene, ethyl acetate, butyl acetate, dimethylformamide, benzyl alcohol, polyhydric alcohol. And when the forming matrix is selected from alloy or alloy metal material, heating is used to melt the metal or alloy metal into a liquid state.

In this embodiment, the molding matrix is taken as an example of epoxy resin (EPON ^™ Resin 828, melt viscosity: 15000cps), and the non-reactive viscosity modifier is selected from glycidyl (C ₁₂ -C ₁₄ ) alkyl ether (ALKYL(C12-C14)GLYCIDYL ETHER, AGE). The preparation step 31 is to dissolve the epoxy resin in the non-reactive viscosity modifier at room temperature, and adjust the viscosity of the forming matrix to <2000cps (25°C), and place the forming matrix in a predetermined height mold (not shown). It should be noted that when the step 31 utilizes heating to melt the forming matrix into a liquid state, then preferably, the preparation step 31 should be operated under inert gas conditions to avoid the formation of the forming matrix due to high temperature oxidation. deteriorating.

The impregnating step 32 is to immerse one end of a plurality of heat-conducting fibers 22 with a predetermined length into the forming matrix, and keep the other end of the heat-conducting fiber 22 outside the forming matrix.

In detail, the impregnating step 32 is to fix the thermally conductive fibers 22 with a predetermined length in bundles, then gather multiple bundles of thermally conductive fiber bundles, clamp and fix one end of the thermally conductive fiber bundles, and use the other end Dip into the forming matrix.

More specifically, in order to avoid that when the thermally conductive fibers 22 are immersed in the forming matrix, the thermally conductive fibers 22 cannot smoothly enter the forming matrix because the viscosity of the forming matrix is too high, or because the viscosity of the forming matrix is too low, After the heat-conducting fibers 22 are immersed in the forming matrix, the forming matrix is adsorbed to the heat-conducting fibers 22 along the heat-conducting fibers 22 due to the capillary phenomenon caused by the gaps between the heat-conducting fibers 22. The surface to be exposed causes the problem that the exposed part of the heat-conducting fiber 22 is covered. Therefore, the viscosity of the forming matrix must be controlled within a predetermined range; in addition, in order to improve the operability of the impregnating step 32, the heat-conducting fiber 22 The length is not less than 0.1 mm. Preferably, the thermally conductive fiber 22 is selected from graphitized vapor deposition carbon fibers with a length not less than 0.1 mm and a thermal conductivity not lower than 1800 W/m·K.

Finally, the curing step 33 is performed to solidify the forming matrix containing the thermally conductive fibers, and make the cured forming matrix form the support body 21 to obtain the high thermal conductivity component 2 as shown in FIG. 1 .

Specifically, when the preparation step 31 is to heat and melt the forming matrix into a liquid state, the solidifying step 33 can be cooled to re-solidify the forming matrix; When dissolving the forming matrix into a liquid state, the curing step 33 can use heating to remove the non-reactive viscosity adjusting agent to solidify the forming matrix, or by letting the reactive viscosity adjusting agent and The molding matrix reacts to make it solidify; in addition, it should be noted that when the viscosity modifier is a reactive viscosity modifier, the curing step 33 can be maintained at a heating condition or at room temperature for a predetermined time, so that the reactive type The viscosity modifier can be cured by reacting with the molding matrix.

In the present invention, the heat-conducting fiber 22 is immersed in the liquid forming matrix by dipping and solidifying. Therefore, the exposure of the heat-conducting fiber 22 can be controlled during the forming process of the support body 21, without the need for subsequent processing to make the heat-conducting fiber 22 exposed. 22 are exposed, and the exposed length of the thermally conductive fibers 22 can be controlled during the manufacturing process. Therefore, the high thermally conductive component 2 with the exposed thermally conductive fibers 22 can be manufactured in a large area and in a simple manner.

In addition, it should be further explained that the high thermal conductivity component 2 can also further remove other parts of the support body 21 through post-processing, so as to increase the contact area of the thermal conductive fiber 22 with the outside, thereby improving the high thermal conductivity component. 2 heat dissipation. For example, part of the support body 21 can be further removed from the bottom surface 211 of the support body 21, so that the heat-conducting fiber 22 can be exposed from the support body 21 against the direction of the base surface 212; Other parts of the support body 21 are removed to form a hollow structure, so that the heat-conducting fibers 22 can be exposed from other positions of the support body 21 . The aforementioned hollow structure of the support body 21 is not particularly limited as long as the heat-conducting fiber 22 can be exposed outside the support body 21, and the removal method of the support body 21 can be removed by laser or sanding. remove.

In addition, it should be further explained that, in this preferred implementation, the surface of the electronic component 100 is described as a flat surface, therefore, the surface of the high thermal conductivity component 2 in contact with the electronic component 100 will also be a flat surface, However, it should be noted that the surface of the electronic component 100 can also have different surface types such as arc surface or curved surface. At this time, the surface of the high thermal conductivity component 2 in contact with the electronic component 100 can also match the The surface type has an arc or a curved surface, so as to improve the contact adhesion with the electronic component 100 .

To sum up, the present invention directly impregnates the thermally conductive fibers 22 into the liquid forming matrix in an impregnating manner, so that the forming matrix is cured and at the same time the thermally conductive fibers 22 are exposed to the outside, the manufacturing process is simple and easy to control, and can be directly A highly thermally conductive component 2 with exposed thermally conductive fibers 22 is produced.

Claims (9)

1. the manufacture method of a high heat-conductive assembly, it is characterised in that comprise:

One preparation process, prepares the shaping substrate of a kind of liquid, and controls to make this shaping base The viscosity of matter is between 1000～30000cps；

One impregnation step, by the heat conducting fiber of multiple tool predetermined lengths, soaks with wherein one end Enter in this shaping substrate, and maintenance makes the other end of described heat conducting fiber be positioned at this shaping substrate Outward；And

One curing schedule, by matrix immobilized for the shaping containing described heat conducting fiber one-tenth one Support body, and prepare this high heat-conductive assembly.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This shaping substrate comprises one selected from macromolecular material, metal material.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This macromolecular material selected from following group one of them: phenolic resin, furane resins, epoxy Resin, polysilicone, polyurethane resin.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This shaping substrate also comprises a kind of viscosity adjusters.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This macromolecular material is epoxy resin, and this viscosity adjusters is selected from reacting with this epoxy resin Response type viscosity adjusters, or the non-reactive viscosity that do not reacts with this epoxy resin adjusts Agent.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This response type viscosity adjusters selected from following group one of them: butyl glycidyl ether, 1,4- Butanediol diglycidyl ether, Ethylene glycol diglycidyl ether, phenyl glycidyl ether, poly- Propylene glycol diglycidylether, C₁₂-C₁₄Fatty glycidyl ether, benzyl glycidyl ether, 1,6-hexanediol diglycidyl ether, expoxy propane o-cresyl ether, expoxy propane neighbour's toluene Base glycidyl ether, neopentylglycol diglycidyl ether.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This non-reactive viscosity adjusters selected from following group one of them: acetone, dehydrated alcohol, Toluene, dimethylbenzene, styrene, ethyl acetate, butyl acetate, dimethylformamide, benzene Methanol, polyhydric alcohol.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: This metal material selected from following group one of them: silver, aluminum, copper, aluminium alloy.

The manufacture method of the highest heat-conductive assembly, it is characterised in that: Described heat conducting fiber is selected from metallic fiber, highly-conductive hot carbon fiber, or graphitization vapour deposition carbon Fiber.