CN106163213A - High-heat-conductivity cover and manufacturing method thereof - Google Patents

Abstract

A method for manufacturing a high thermal conductive cover includes a mixing step and a connecting step. The mixing step is to mix a plurality of heat-conducting fibers into a matrix and solidify the matrix to form a heat-conducting pre-solid, wherein the heat-conducting fibers have a heat-conducting coefficient of 380-2000W/m.K. The connecting step is to connect the heat-conducting pre-solid with an inner surface of a shell, which is preset to face the electronic device, so as to manufacture a high heat-conducting cover. The present invention also provides a high thermal conductive cover, comprising: a housing having an inner surface and an outer surface opposite to each other; and a thermally conductive pre-solid coupled to the inner surface and comprising a matrix and a plurality of thermally conductive fibers dispersed in the matrix. The invention utilizes the bendable heat-conducting fibers with high heat conductivity to prepare the heat-conducting pre-solid body, thereby increasing the overall heat dissipation performance of the high heat-conducting cover.

Description

High thermal conductivity cover and manufacturing method thereof

technical field

The invention relates to a shell cover and a manufacturing method thereof, in particular to a high thermal conductivity cover and a manufacturing method thereof.

Background technique

With the development of semiconductor manufacturing technology becoming more and more mature, the integration level of semiconductor components is also getting higher and higher. Therefore, "heat dissipation" has become one of the important technologies of semiconductor components. Especially for high-power components, the temperature of electronic products will rise rapidly due to the substantial increase of heat energy generated when the components operate. Especially for handheld electronic devices, such as mobile phones, tablet computers, etc., since the mobile phone or tablet computer is often placed against the hands or knees during operation, the heat dissipation problem is particularly important.

At present, the heat dissipation method commonly used in handheld electronic devices such as mobile phones or tablet computers is to paste a layer of graphite sheet on the inner surface of the shell of these handheld electronic devices, and use the high thermal conductivity of the graphite sheet to heat the mobile phone or tablet computer. The heat generated when the device operates is guided to the casing, and then the heat energy is transferred to the outside through the casing to achieve the purpose of heat dissipation. However, because the casings of hand-held electronic devices such as mobile phones or tablet computers on the market generally have a certain curvature, the graphite sheet is a thin sheet, which is brittle and cannot be bent. The arc fit of the shell can only fit the flat part of the shell, so the graphite sheet cannot completely cover the required covering position.

Contents of the invention

The object of the present invention is to provide a method for manufacturing a high thermal conductivity cover for an electronic device.

The manufacturing method of the high thermal conductivity cover of the present invention is used for an electronic device, comprising: a mixing step and a connecting step.

In the mixing step, after mixing a plurality of heat-conducting fibers into a matrix, the matrix is solidified to form a heat-conducting pre-solid, wherein the heat-conducting coefficient of the heat-conducting fibers is between 380-2000 W/m·K. The connecting step is to connect the thermally conductive pre-solid with an inner surface of a shell that is predetermined to face the electronic device, so as to make a high thermally conductive cover.

Preferably, the manufacturing method of the aforementioned high thermal conductivity cover further includes a removing step of removing at least a part of the matrix of the thermal conductive pre-solid, so that at least a part of the thermal conductive fibers are exposed and directly contact with the outside.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, wherein the heat conduction fibers are exposed from the periphery of the heat conduction pre-solid, and after the heat conduction presolid is connected with the housing, the heat conduction fibers will be exposed from the periphery of the housing , while in contact with the outside world.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, in the removing step, laser, sandblasting or cutting is used to remove part of the matrix, so that the thermal conductivity fibers are exposed.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, the connecting step is to attach the thermal conductivity pre-solid to the casing.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, the connecting step is to prepare a first mold with a first groove, and a first mold corresponding to the first mold and having a shape capable of forming the shell. In the second mold with two grooves, place the heat-conducting pre-solid in the first groove, inject a molding fluid between the second mold and the heat-conducting pre-solid, and remove the first, The second mold is used to obtain the casing, and the thermally conductive presolid formed integrally with the casing to obtain the high thermally conductive cover.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, wherein the casing has an outer surface opposite to the inner surface of the casing, and the part of the thermally conductive pre-solid passes through the inner surface of the casing, and from the The outer surface is bare.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, wherein the casing has an outer surface opposite to the inner surface of the casing, and the part of the thermally conductive pre-solid passes through the inner surface of the casing and extends to the The outer surface.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, the substrate is selected from polymer materials, metal materials, or ceramic materials.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, the polymer material is selected from one of the following groups: epoxy resin, phenolic resin, furan resin, and polyurethane resin.

Preferably, in the manufacturing method of the aforementioned high thermal conductivity cover, wherein the thermal conductivity fibers are selected from metal fibers, high thermal conductivity carbon fibers, or graphitized vapor deposition carbon fibers.

Another object of the present invention is to provide a high thermal conductivity cover for an electronic device.

The high heat conduction cover of the present invention comprises a casing and a heat conduction presolid, and the casing has an inner surface and an outer surface opposite to each other. The heat conduction pre-solid is connected with the inner surface and includes a matrix and a plurality of heat conduction fibers dispersed in the matrix.

Preferably, in the above-mentioned high thermal conductivity cover, at least a part of the thermal conductivity fibers is exposed outside the matrix and is in contact with the external environment.

Preferably, in the above-mentioned high thermal conductivity cover, the part of the thermal conductivity pre-solid passes through the inner surface of the casing and is exposed from the outer surface.

Preferably, the aforementioned high thermal conductivity cover, wherein the thermal conductivity fibers are selected from metal fibers, high thermal conductivity carbon fibers, or graphitized vapor deposition carbon fibers.

Preferably, in the aforementioned high thermal conductivity cover, the substrate is selected from polymer materials, metal materials, or ceramic materials.

The beneficial effect of the present invention is that: the heat conduction pre-solid is made of high heat conduction and bendable heat conduction fiber, and the overall heat dissipation of the high heat conduction cover is increased.

Description of drawings

FIG. 1 is an exploded side view illustrating a first embodiment of the high thermal conductivity cover for electronic devices of the present invention;

2 is an exploded side view illustrating a second embodiment of the high thermal conductivity cover for electronic devices of the present invention;

FIG. 3 is an exploded side view illustrating another state of the second embodiment of the high thermal conductivity cover for electronic devices of the present invention;

4 is a text flow chart illustrating a mixing step, a removing step and a connecting step of a manufacturing method of a high thermal conductivity cover for an electronic device according to the present invention;

Fig. 5 is a perspective view illustrating that at least a part of a plurality of thermally conductive fibers of a thermally conductive presolid of the first embodiment of the high thermally conductive cover of the present invention is exposed and directly contacts with the outside;

Fig. 6 is a perspective view illustrating how the heat-conducting pre-solid is connected to a housing in the first embodiment; and

Fig. 7 is a side view illustrating another way of connecting the thermally conductive presolid and the casing.

detailed description

The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to FIG. 1, FIG. 2 and FIG. 3, the high thermal conductivity cover 1 of the present invention can be used in electronic devices 100 such as mobile phones and tablet computers to increase the heat dissipation effect of a power component 200 disposed on the electronic device 100. In this embodiment In the illustration, the application of the high thermal conductivity cover 1 to a mobile phone is taken as an example.

Referring to FIG. 1 again, a first embodiment of the high thermal conductivity cover 1 includes a casing 11 and a thermal conductivity pre-solid 12 . The casing 11 has an inner surface 111 and an outer surface 112 opposite to the inner surface 111 . The material of the casing 11 can be metal or polymer material, such as titanium alloy, aluminum alloy, polycarbonate, or acrylic resin.

With reference to FIG. 5 , the heat conduction pre-solid 12 is tightly connected to the inner surface 111 along the inner surface 111 of the shell 11, and the heat conduction pre-solid 12 includes a matrix 121 and a plurality of doped doped in the matrix 121. Thermally conductive fibers 122. Wherein, the matrix 121 is selected from a polymer material, a metal material, or a ceramic material, more specifically, the polymer material is selected from one of the following groups: epoxy resin, phenolic resin, furan resin, and polyurethane resin; the The metal material can be selected from silver, copper, tin, antimony, aluminum, aluminum-magnesium alloy, aluminum oxide, etc.; the ceramic material can be selected from silicon, silicon carbide, etc.; 2000W/m·K high thermal conductivity fiber, such as metal fiber, high thermal conductivity carbon fiber, or graphitized vapor deposition carbon fiber.

Preferably, the heat-conducting fiber 122 is exposed from the heat-conducting pre-solid 12 and is in contact with the external environment, thereby increasing the overall heat dissipation of the heat-conducting pre-solid 12, for example, the heat-conducting fiber 122 can be separated from the heat-conducting pre-solid 12. The periphery of the solid 12 is exposed, or the heat-conducting fibers 122 can be arranged along the direction parallel to the short side of the casing 11 and can be exposed from the long-side periphery of the casing 11, and contact with the outside through the heat-conducting fibers The heat energy absorbed by 122 can be exported along the heat-conducting fiber 122 through the shortest path, so as to have better heat dissipation.

As shown in FIG. 1 , in actual use, the high thermal conductivity cover 1 replaces the packaging cover of the electronic device 100 , and the high thermal conductivity cover 1 is connected to the electronic device 100 with the side of the thermal conductivity presolid 12 facing the power component 200 . Just combine.

Referring to FIG. 2, a second embodiment of the high thermal conductivity cover 1 of the present invention is substantially the same as the first embodiment, and also includes the housing 11 and the heat conduction pre-solid 12, which differs from the first embodiment in that The heat-conducting presolid 12 is partially connected to the inner surface 111 of the housing 11 , and another part passes through the inner surface 111 of the housing 11 and is exposed from the outer surface 112 .

More specifically, the part of the thermally conductive presolid 12 that is expected to be in contact with the power assembly 200 is combined with the inner surface 111 , and another part of the thermally conductive presolid 12 is allowed to pass through the inner surface 111 of the housing 11 to automatically The outer surface 112 is exposed to form a structure as shown in FIG. 2; preferably, referring to FIG. In this way, the surface 112 can increase the contact area between the thermally conductive pre-solid 12 and the outside, and further improve its heat dissipation.

The manufacturing method of the first embodiment of the aforementioned high thermal conductivity cover 1 is described as follows:

Referring to FIG. 1 , FIG. 4 and FIG. 5 , the manufacturing method of the high thermal conductivity cover of the present invention includes a mixing step 21 , a removing step 22 , and a connecting step 23 .

The mixing step 21 is to mix a plurality of thermally conductive fibers 122 into the matrix 121, and then solidify the matrix 121 to form a thermally conductive pre-solid whose shape is substantially equivalent to that of the inner surface 111 of the shell 11 to be connected subsequently. 12, wherein, the thermal conductivity of the thermally conductive fibers 122 is between 380 and 2000 W/m·K, and the thermally conductive fibers 122 can be distributed in the matrix 121 in an interlaced manner as shown in FIG. 5 , or along the arranged in a predetermined direction (not shown), and distributed on the matrix 121 . In this embodiment, the housing 11 is elongated as an example, therefore, the shape of the heat conducting pre-solid 12 is generally elongated. But in fact, the heat conduction presolid 12 can be designed to only correspond to the power module 200 according to the requirements, or to be in any shape such as trapezoidal, polygonal, etc., and does not need to completely match the shape of the inner surface 111 of the housing 11 .

In detail, when the matrix 121 is selected from metal or polymer materials, the mixing step 21 is to melt the matrix 121 first, then mix the molten matrix 121 with the heat-conducting fibers 122, and then make The matrix 121 is solidified to obtain the thermally conductive pre-solid 12 . The heat-conducting pre-solid 12 can be further trimmed to a desired size and shape as required.

And when the matrix 121 is made of ceramic material, ceramic powder (Si or SiC, etc.) is added to the dispersant solution (polyethyleneimine/isopropyl alcohol), and then ultrasonically oscillated to make it evenly dispersed, and then the solution is poured Put it into a resin (this takes phenolic resin as an example) to make a slurry, then lay the thermally conductive fiber 122 and soak it in the slurry, heat it to 1100°C after hot pressing at 150-170°C The phenolic resin is pyrolyzed and carbonized, and finally treated at 1450° C. for 3 hours to obtain the thermally conductive pre-solid 12 in which the matrix 121 is a ceramic material.

The removing step 22 is to remove at least a portion of the matrix 121 of the thermally conductive pre-solid 12 , so that at least a portion of the thermally conductive fibers 122 are exposed outside the matrix 121 and directly contact with the outside. Specifically, the removing step 22 is to remove part of the matrix 121 by means of laser, sandblasting or cutting, so that at least a part of the heat conducting fiber 122 is exposed.

It should be added that if the matrix 121 is made of metal, the removing step 22 may still use chemical etching to remove part of the matrix 121 .

Preferably, the removing step 22 is to remove at least a part of the matrix 121 around the thermally conductive pre-solid 12, so that at least a part of the thermally conductive fiber 122 is exposed from the side of the thermally conductive pre-solid 12 and directly contacts the outside world, To increase the heat dissipation of the heat-conducting pre-solid 12, preferably, when the heat-conducting fibers 122 are arranged parallel to the short side direction of the housing 11 and can correspond to the length of the housing 11 after the removal step 22 If the edge is exposed, the heat energy absorbed by the heat-conducting fiber 122 can be exported to the outside along the heat-conducting fiber 122 in the shortest path, thereby having better heat dissipation.

Referring to FIG. 1 and FIG. 6 , the connecting step 23 is to connect the heat-conducting pre-solid 12 with the inner surface 111 of the housing 11 that is predetermined to face the electronic device 100 .

The connecting step 23 can be by laminating the heat conduction pre-solid 12 to the inner surface 111 of the casing 11 by using glue, or using in-mold molding to make the heat conduction pre-solid 12 and the casing 11 Integrally connected and formed to obtain the high thermal conductivity cover 1 shown in the first embodiment.

Referring to Fig. 7 and cooperating with Fig. 1, in detail, the in-mold molding method is to prepare a first mold 3 with a first groove 31, and a mold corresponding to the first mold 3 and having a mold capable of forming the shell. The second mold 4 of the second groove 41 in the shape of the body 11, after the heat conduction pre-solid 12 is placed in the first groove 31, the second groove 41 of the second mold 4 and the heat conduction pre-solid 12 Injection molding - the molding fluid that can make the shell 11, after hardening, remove the first and second molds 3, 4 to get the shell 11 and the heat conduction mold integrally formed with the shell 11 Pre-solid 12 to obtain the high thermal conductivity cover 1 .

In addition, it should be noted that the purpose of the removing step 22 is to expose the heat-conducting fiber 122 from the matrix 121 to increase the heat dissipation of the heat-conducting pre-solid 12 as a whole. Therefore, the heat-conducting pre-solid can also be viewed as The use environment or heat dissipation requirements of 12 do not need to go through the removing step 22 , and the prepared heat-conducting pre-solid 12 can be directly bonded to the casing 11 .

Next, the manufacturing method of the aforementioned high thermal conductivity cover of the second embodiment will be described.

As shown in FIG. 4 , the manufacturing method of the second embodiment of the high thermal conductivity cover of the present invention includes: a mixing step 21 , a removing step 22 , and a connecting step 23 . The mixing step 21 and the removing step 22 are the same as the manufacturing method of the first embodiment, so no more details are given here. The difference is that in the manufacturing method of the second embodiment, the connecting step 23 is to use the in-mold forming method described in the first embodiment to produce the high thermal conductivity cover 1 as shown in FIG. 2 or FIG. 3 .

In detail, the connecting step 23 is to use the same in-mold forming mold as shown in FIG. , and need to be adjusted accordingly depending on the material of the matrix 121 . Specifically, when the base material 121 is a polymer material and a metal material, due to the flexibility of the polymer material and metal material, the heat-conducting pre-solid 12 can be made into a sheet and placed in a mold, and the mold can be directly pressed. The high thermal conductivity cover 1 can be produced by combining the sheet-like thermal conduction pre-solid 12 into a predetermined bending shape, and then using in-mold molding. However, if the base material 121 is a ceramic material, since the sintered ceramic material is not flexible, in the mixing step 21, the ceramic material must be pre-molded when preparing the heat-conducting pre-solid 12 (as shown in Figure 2 L-shape shown or Z-shape shown in Figure 3).

In addition, it should be noted that no matter whether the thermally conductive pre-solid 12 is bonded to the housing 11 or in-molded, the thermally conductive fibers 122 exposed on the side of the matrix 121 are controlled When the casing 11 is further exposed and directly in contact with the outside air, in this way, when the electronic device 100 and the power component 200 generate heat, the heat can be conducted to the outside air through the heat-conducting fibers 122 exposed on the periphery of the casing 11 , and get better heat dissipation.

In the present invention, the thermally conductive pre-solid 12 made of the thermally conductive fiber 122 can be closely attached to the high thermally conductive cover 1 according to the shape of the high thermally conductive cover 1 , avoiding that the existing graphite sheet cannot be attached along the arc. Therefore, the laying area of the heat-conducting pre-solid 12 can be increased to increase the heat dissipation area. In addition, the heat generated by the electronic device 100 and the power component 200 can also dissipate to the outside through the heat-conducting fibers 122 exposed on the periphery of the housing 11 , thus effectively increasing heat dissipation.

Claims (16)

1. a manufacture method for high conductive cover, for an electronic installation, it is characterised in that Comprise:

Multiple heat conducting fiber are blended after a kind of substrate, make this substrate by one blend step Solidification, forms a pre-solid of heat conduction, wherein, the heat conductivity of described heat conducting fiber between 380～2000W/m K；And

One connecting step, makes a reservation for fill towards this electronics by pre-for this heat conduction solid and a housing The inner surface put connects, and prepares a high conductive cover.

The manufacture method of the highest conductive cover, it is characterised in that: institute State the manufacture method of high conductive cover also to comprise one and remove step, by the base of pre-for this heat conduction solid Removing at least partially of matter, make described heat conducting fiber the most exposed and direct with Extraneous contact.

The manufacture method of the highest conductive cover, it is characterised in that: institute It is exposed from the periphery of the pre-solid of this heat conduction for stating heat conducting fiber, and the pre-solid of this heat conduction and this shell After body connects, described heat conducting fiber can be exposed from this housing perimeter, and and extraneous contact.

The manufacture method of the highest conductive cover, it is characterised in that: should Removing step is the substrate utilizing laser, sandblasting or cutting mode to remove part, and makes described Heat conducting fiber is exposed.

The manufacture method of the highest conductive cover, it is characterised in that: should Connecting step is that pre-for this heat conduction solid is fitted in this housing.

The manufacture method of the highest conductive cover, it is characterised in that: should Connecting step is to prepare first mould with first groove, and one with this One mould is corresponding and has the second mould of second groove that can form this hull shape Tool, after pre-for this heat conduction solid is placed in this first groove, in this second mould and this heat conduction A kind of molding fluid of injection between pre-solid, to be hardened after, remove this first, second mould, Obtain this housing, and the pre-solid of this heat conduction being one of the forming with this housing, and obtain this height Conductive cover.

The manufacture method of the highest conductive cover, it is characterised in that: should Housing has an outer surface reverse with the inner surface of this housing, and the pre-solid of this heat conduction Partially pass through the inner surface of this housing, and exposed from this outer surface.

The manufacture method of the highest conductive cover, it is characterised in that: should Housing has an outer surface reverse with the inner surface of this housing, and the pre-solid of this heat conduction Partially pass through the inner surface of this housing and extend to this outer surface.

The manufacture method of the highest conductive cover, it is characterised in that: should Substrate is selected from macromolecular material, metal material, or ceramic material.

The manufacture method of the highest conductive cover, it is characterised in that: should Macromolecular material is selected from one of following group: epoxy resin, phenolic resin, furane resins, And polyurethane resin.

The manufacture method of 11. the highest conductive cover, it is characterised in that: institute State heat conducting fiber and be selected from metallic fiber, highly-conductive hot carbon fiber, or graphitization vapour deposition carbon is fine Dimension.

12. 1 kinds of high conductive cover, it is characterised in that including:

One housing, has a reversely with each other inner surface and an outer surface；And

One pre-solid of heat conduction, is connected with this inner surface, including a substrate and multiple dispersion Heat conducting fiber in this substrate.

13. high conductive cover according to claim 12, it is characterised in that: described heat conduction Being exposed at least partially outside this substrate of fiber, and contact with external environment.

14. high conductive cover according to claim 12, it is characterised in that: this heat conduction is pre- The inner surface partially passing through this housing of solid, and exposed from this outer surface.

15. high conductive cover according to claim 12, it is characterised in that: described heat conduction Fiber is selected from metallic fiber, highly-conductive hot carbon fiber, or graphitization vapour deposition carbon fiber.

16. high conductive cover according to claim 12, it is characterised in that: this substrate is selected From macromolecular material, metal material, or ceramic material.