CN106129024A - A power semiconductor device module based on heat dissipation design - Google Patents

Abstract

The invention relates to a power semiconductor device module based on a heat dissipation design, and belongs to the field of power semiconductor devices. The power semiconductor device comprises a power semiconductor device, a metal radiator and a PCB substrate, wherein an opening is formed in the PCB substrate, a circuit of the power semiconductor device is arranged on the front surface of the PCB substrate, the back surface of the PCB substrate is fixed on the metal radiator, the power semiconductor device is fixed on the metal radiator in the opening, and pins of the power semiconductor device are welded on the circuit. The invention is applied to the relevant aspects of power semiconductor devices, can realize the integrated design of the PCB substrate and the metal radiator and improve the radiating effect, and can replace an aluminum substrate with a common PCB substrate so as to reduce the cost; in addition, the copper bar is selected as the radiator, so that the radiating effect is realized, and the copper bar can be used as a power line to play a current-carrying role.

Description

A power semiconductor device module based on heat dissipation design

technical field

The invention belongs to the field of power semiconductor devices, and in particular relates to a power semiconductor device module based on heat dissipation design.

Background technique

Power semiconductor devices, also known as power electronic devices, are mainly used for power conversion of power electronic circuits. When power electronic devices are working, the power loss will cause the device to generate heat and heat up. Excessive device temperature will shorten the life of the device, or even burn the device, which is also an important reason for limiting the current and capacity of power electronic devices.

Therefore, the heat dissipation and cooling of power semiconductor devices must be considered. The heat dissipation of power semiconductor devices is an important and difficult point in the design of power electronic devices. Aluminum substrate PCB is a conventional means to solve the problem of thermal installation of power semiconductor devices. This solution needs to weld the power semiconductor device on the aluminum substrate, and weld the control circuit part on the ordinary PCB, so that the two circuit boards need to be connected by wires to work. Moreover, due to the price of the aluminum substrate PCB, the cost of using this method is very high, and the structure is also very cumbersome.

Contents of the invention

In view of this, the object of the present invention is to overcome the deficiencies of the prior art, provide a power semiconductor device module based on heat dissipation design, realize the integrated design of ordinary PCB substrate and metal heat sink, and improve the heat dissipation effect.

To achieve the above object, the present invention adopts the following technical solutions:

A power semiconductor device module based on heat dissipation design, including a power semiconductor device, a metal radiator and a PCB substrate, the PCB substrate is provided with an opening, the front of the PCB substrate is provided with a circuit of the power semiconductor device, and the PCB The back of the substrate is fixed on the metal heat sink, the power semiconductor device is fixed on the metal heat sink in the opening, and the pins of the power semiconductor device are welded on the circuit.

Further, the metal radiator is a copper bar.

Further, the power semiconductor device matches the opening.

Further, there is a gap between the power semiconductor device and the opening.

Further, the metal heat sink is composed of a copper bar and a copper block, the back of the PCB substrate is fixed on the copper bar, the copper block is fixed on the copper bar in the opening, and the power semiconductor The device is fixed on the copper block.

Further, the copper block matches the opening.

Further, there is a gap between the copper block and the opening.

Further, the PCB substrate and the metal heat sink, and the power semiconductor device and the metal heat sink are respectively fixed by soldering.

Further, the copper bar and the copper block are fixed by soldering.

Further, the copper bar is integrated with the copper block.

The present invention adopts the above technical solutions, and at least has the following beneficial effects:

In the present invention, the PCB substrate is provided with an opening, the back of the PCB substrate is fixed on the metal radiator, and the power semiconductor device is fixed on the metal radiator in the opening of the PCB substrate, so as to realize the integrated design of the PCB substrate and the metal radiator and improve the heat dissipation effect. In the invention, an ordinary PCB substrate can be used to replace the aluminum substrate to reduce costs; in addition, the present invention uses a copper row as a radiator, which can also be used as a power supply line to carry current while realizing the heat dissipation effect.

Description of drawings

1 is a cross-sectional view of Embodiment 1 of a power semiconductor device module based on heat dissipation design in the present invention;

FIG. 2 is a cross-sectional view of Embodiment 2 of a power semiconductor device module based on heat dissipation design in the present invention;

3 is a cross-sectional view of Embodiment 3 of a power semiconductor device module based on heat dissipation design in the present invention;

FIG. 4 is a cross-sectional view of Embodiment 3 of a power semiconductor device module based on heat dissipation design according to the present invention.

In the figure: 1, power semiconductor device; 101, pin; 2, metal radiator; 201, copper bar; 202, copper block; 3, metal radiator; 4, solder.

detailed description

The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.

As shown in Figure 1 and Figure 2, the present invention provides a power semiconductor device module based on heat dissipation design, including a power semiconductor device 1, a metal radiator 2 and a metal radiator 3, the PCB substrate 3 is provided with an opening, so The front of the PCB substrate 3 is provided with the circuit of the power semiconductor device 1, the back of the PCB substrate 3 is fixed on the metal radiator 2, and the power semiconductor device 1 is fixed on the metal radiator in the opening. 2, the pins 101 of the power semiconductor device 1 are soldered to the circuit.

It can be seen that the present invention is provided with an opening through the PCB substrate, the back of the PCB substrate is fixed on the metal radiator, and the power semiconductor device is fixed on the metal radiator in the opening of the PCB substrate, so as to realize the integrated design of the PCB substrate and the metal radiator and improve heat dissipation Effect.

As a further improvement of the present invention, the metal radiator 2 is a copper bar 101 .

It can be understood that the present invention selects the copper row as the heat sink, which can also serve as a power line to carry current while realizing the heat dissipation effect.

Further, as shown in FIG. 1 , the power semiconductor device 1 matches the opening; preferably, as shown in FIG. 2 , there is a gap between the power semiconductor device 1 and the opening.

It can be understood that, because the shapes of each power semiconductor device are different, the power semiconductor device 1 and the opening are designed to match each other, as shown in FIG. The probability of assembly errors; and from the perspective of heat dissipation, increasing the heat dissipation space as much as possible can effectively improve the heat dissipation effect, so there is a gap between the power semiconductor device 1 and the opening, as shown in Figure 2, to increase the heat dissipation space.

As shown in Figure 3 and Figure 4, as a further improvement of the heat dissipation of the present invention, the metal heat sink 2 is composed of a copper bar 201 and a copper block 202, and the back of the PCB substrate 3 is fixed on the copper bar 201, the The copper block 202 is fixed on the copper bar 201 in the opening, the power semiconductor device 1 is fixed on the copper block 202, the heat dissipation area is increased by adding the copper block 202, and the power The semiconductor device 1 protrudes from the PCB substrate 3, so that the present invention realizes a three-dimensional heat dissipation structure and further improves the heat dissipation effect.

Further, as shown in FIG. 3 , the copper block 202 matches the opening, so that there is no gap between the copper block 202 and the opening that causes shaking, which is convenient for fixed assembly and does not require additional Position equipment to ensure consistent assembly.

Further, as shown in FIG. 4 , there is a gap between the copper block 202 and the opening, so in terms of heat dissipation, increasing the heat dissipation space as much as possible can effectively improve the heat dissipation effect.

The above provides two schemes for the design of the copper block 202 and the opening, and in specific circumstances, a suitable scheme can be selected in consideration of the heat generation effect of the power semiconductor device 1 .

Further, solder 4 is used to fix between the PCB substrate 3 and the metal heat sink 2 and between the power semiconductor device 1 and the metal heat sink 2 respectively. In actual operation, solder can be injected between the two surfaces that need to be fixed, so as to ensure the maximum heat dissipation area and improve the heat dissipation effect.

The copper bar 201 and the copper block 202 are fixed by solder 4, and solder can also be injected between the two surfaces to be fixed, so as to ensure the maximum heat dissipation area and improve the heat dissipation effect. Preferably, in order to improve the heat dissipation effect and reduce welding steps, the copper bar 201 and the copper block 202 are integrally structured.

The PCB substrate in the present invention is an ordinary PCB substrate, such as a PCB substrate made of FR4 material, and the copper row, device and ordinary PCB substrate are designed as an integrated structure. First, the copper row is welded on the PCB, and then the heat dissipation of the power semiconductor device The surface is welded on the copper bar, and its pins are welded on the PCB. In this way, under the premise of effectively realizing heat dissipation, the aluminum PCB substrate can be used instead to reduce costs, and all devices including power semiconductor devices and control circuit components can be installed on a common PCB.

The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the scope of the present invention. Protection scope, within the spirit and principles of the present invention, any modification, equivalent replacement, improvement, etc., shall be included in the protection scope of the present invention.

Claims (10)

1. A power semiconductor device module based on heat dissipation design, characterized in that: it comprises a power semiconductor device, a metal heat sink and a PCB substrate, the PCB substrate is provided with an opening, and the front side of the PCB substrate is provided with the power semiconductor device The circuit, the back of the PCB substrate is fixed on the metal heat sink, the power semiconductor device is fixed on the metal heat sink in the opening, and the pins of the power semiconductor device are welded on the circuit. 2. The power semiconductor device module based on heat dissipation design according to claim 1, wherein the metal heat sink is a copper bar. 3 . The power semiconductor device module based on heat dissipation design according to claim 2 , wherein the power semiconductor device matches the opening. 4 . 4. The power semiconductor device module based on heat dissipation design according to claim 2, wherein there is a gap between the power semiconductor device and the opening. 5. The power semiconductor device module based on heat dissipation design according to claim 1, characterized in that: the metal heat sink is composed of a copper bar and a copper block, the back of the PCB substrate is fixed on the copper bar, the A copper block is fixed on the copper bar in the opening, and the power semiconductor device is fixed on the copper block. 6 . The power semiconductor device module based on heat dissipation design according to claim 5 , wherein the copper block matches the opening. 7 . 7. The power semiconductor device module based on heat dissipation design according to claim 5, wherein there is a gap between the copper block and the opening. 8. The power semiconductor device module based on heat dissipation design according to any one of claims 1 to 7, characterized in that: between the PCB substrate and the metal heat sink, and between the power semiconductor device and the metal heat sink The radiators are respectively fixed by soldering. 9. The power semiconductor device module based on heat dissipation design according to any one of claims 5 to 7, wherein the copper bar and the copper block are fixed by soldering. 10 . The power semiconductor device module based on heat dissipation design according to any one of claims 5 to 7 , wherein the copper bar and the copper block are integrally structured. 11 .