CN201194446Y - PCB circuit board - Google Patents

Abstract

The utility model relates to a PCB circuit board, which comprises a main board, on which a PCB sub-board for conducting current and dissipating heat is arranged. The PCB circuit board of the utility model uses the PCB sub-board to guide and dissipate heat in the area of the main board with high temperature. On the one hand, it can achieve a good shunt heat dissipation effect, and on the other hand, it does not need to consider the safety insulation distance from the peripheral devices. At the same time, the cost is low, the volume is small, and the layout space of the main board is not occupied, which reduces the layout density of the main board; in addition, the realization process is simple, and has better consistency and reliability.

Description

PCB circuit board

technical field

The utility model relates to a circuit board, in particular to a PCB circuit board which guides and dissipates heat from a main board through a PCB sub-board.

Background technique

As the power design density continues to increase, some areas on the board often need to pass a large current, which leads to a higher temperature in this area, so the heat dissipation problem has become the focus of attention. At present, the more common solutions are: 1. Using bus bars to guide and dissipate heat; 2. Using radiators to guide and dissipate heat; 3. Using manual tinning to guide and dissipate heat. Defects of the prior art: a, adopt the bus bar conduction heat dissipation mode, 1), the material of the bus bar is generally copper, so the cost is higher; 2), the bus bar volume is not small, and itself is an electrical conductor, so it is still It is necessary to consider the safety insulation distance between the surrounding devices, which leads to a larger layout space for this solution, which is in contradiction with the high-density design of the product; 3), considering the EMC problem of the single board, the bus bar needs to be connected with the PCB The copper laying direction of the layer is consistent, which often leads to the multi-bending design of the bus bar, which brings certain difficulties to the processing and production of the bus bar itself; Connected to the PCB, first of all, it is difficult to realize the process. In addition, the radiator itself is not small, which does not match the high-density design of the product; c. It is troublesome to implement the process by hand-tinning, and it takes a lot of man-hours. In addition, product consistency is difficult to guarantee.

Utility model content

The technical problem to be solved by the utility model is to provide a PCB circuit board that guides and dissipates heat from the main board through the PCB sub-board in view of the above-mentioned defects of the prior art.

The technical scheme adopted by the utility model to solve the technical problem is: to construct a PCB circuit board, including a main board, on which a PCB sub-board for guiding and dissipating heat is arranged.

In the PCB circuit board described in the present invention, the PCB sub-board is arranged on the main board at a position staggered from the SMD device area.

In the PCB circuit board of the present invention, the main board is provided with welding pads, and the PCB sub-board is correspondingly provided with welding holes, and the PCB sub-board is welded and fixed on the main board.

Preferably, the PCB sub-board is soldered on the main board by reflow soldering.

Preferably, the outline of the pad is square, and the outline of the welding hole is ellipse.

The PCB circuit board implementing the utility model has the following beneficial effects: by using the PCB sub-board to guide and dissipate heat in the area with a higher temperature of the main board, on the one hand, due to the copper foil in the PCB sub-board, good shunting and heat dissipation can be realized As a result, on the other hand, the outer layer of the PCB sub-board has an insulating medium, so there is no need to consider the safety insulation distance from the peripheral devices. The areas of chip devices are staggered, which will not occupy the layout space of the main board, and reduce the layout density of the main board; in addition, the connection is made by reflow soldering, which realizes a simple process and has better consistency and reliability.

Description of drawings

The utility model will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:

Fig. 1 is the structural representation of an embodiment of the utility model PCB circuit board;

Fig. 2 is a top view of the PCB circuit board shown in Fig. 1;

Fig. 3 is a structural schematic diagram of the motherboard shown in Fig. 2;

FIG. 4 is a schematic structural diagram of the PCB sub-board shown in FIG. 2 .

Detailed ways

The technical solution of the utility model mainly considers that the copper foil can realize conduction and heat dissipation, and in addition there is copper foil in the PCB, so the bus bar/radiator can be replaced by the PCB to guide the heat dissipation. In addition, there is an insulating medium on the outer layer of the PCB, so there is no need to consider the safety insulation distance from peripheral devices.

As shown in FIGS. 1 and 2 , in one embodiment of the PCB circuit board of the present invention, a main board 1 is included, and a PCB sub-board 2 for conduction and heat dissipation is arranged on the main board 1 . In practice, it is mainly to fix the PCB sub-board 2 on a region with a higher temperature on the main board 1, so as to realize a fixed electrical connection between the two PCBs. In this way, part of the large current on the main board 1 can be shunted to the PCB sub-board 2 , so as to finally realize the conduction and heat dissipation function of the PCB sub-board 2 on the main board 1 .

In addition, considering the layout space and layout density of the main board 1, the PCB sub-board 2 is placed on the main board 1 in the area where the plug-ins The corresponding positions of the pins are opened, so that the layout space of the main board 1 will not be occupied, and the layout density of the main board 1 will be reduced.

As shown in Figures 2, 3 and 4, in implementation, for the connection mode between the PCB sub-board 2 and the main board 1, by setting the pads 12 on the main board 1, the PCB sub-board 2 is correspondingly provided with solder holes 21, so it can be Solder and fix the PCB sub-board 2 on the main board 1. Wherein the quantity that pad 12 and welding hole 21 are set can be changed according to actual needs, if the area area with higher temperature on main board 1 is big, causes the area of required PCB sub-board 2 to be larger, therefore just can be on main board 1 Several more pads 12 are provided, and the same number of welding holes 21 are correspondingly provided on the PCB sub-board 21 . As shown in FIGS. 3 and 4 , in a specific implementation, the outline of the pad 12 is square, and the outline of the welding hole 21 is elliptical. However, the contour shapes of the solder pads 12 and the solder holes 21 can also be changed according to actual needs, as long as they can achieve good effects of fixing and conduction and heat dissipation.

In addition, considering that reflow soldering has better consistency and reliability than wave soldering, this solution adopts reflow soldering to achieve interconnection soldering between the PCB sub-board 2 and the main board 1 . After actual testing, it is confirmed that the PCB sub-board can completely replace the bus bar or the heat sink, and realize the function of effective conduction and heat dissipation for the corresponding area on the main board 1 .

For the method of using the PCB sub-board 2 to conduct heat dissipation on the main board 1 in this technical solution, one of them is specifically applied to a single-sided SMD circuit board, and the SMD IC is set on the reverse side of the main board 1, such as the PCB sub-board 2 can be set The reverse side of the main board 1 can also be arranged on its front side.

The utility model is illustrated through several specific embodiments. Those skilled in the art should understand that various transformations and equivalent substitutions can be made to the utility model without departing from the scope of the invention. In addition, various modifications can be made to the utility model for specific situations or specific situations without departing from the scope of the utility model. Therefore, the invention is not limited to the specific embodiments disclosed, but should include all implementations falling within the scope of the claims of the invention.

Claims (5)

1. A PCB circuit board, comprising a main board, is characterized in that, a PCB sub-board for conduction and heat dissipation is provided on the main board. 2 . The PCB circuit board according to claim 1 , wherein the PCB sub-board is arranged on the main board at a position staggered from the SMD device area. 3 . 3. The PCB circuit board according to claim 1 or 2, wherein the main board is provided with solder pads, and the PCB sub-board is correspondingly provided with welding holes, and the PCB sub-board is welded and fixed on the main board superior. 4. The PCB circuit board according to claim 3, wherein the PCB sub-board is welded on the main board by reflow soldering. 5 . The PCB circuit board according to claim 4 , wherein the outline of the pad is square, and the outline of the solder hole is oval.

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