CN221748644U - Circuit board and electronic device with heat dissipation structure - Google Patents

Abstract

The embodiment of the utility model provides a circuit board with a heat dissipation structure and an electronic device, wherein the circuit board comprises: the circuit board comprises a circuit board main body, a radiator and a back plate, wherein heating devices are arranged on the front surface and the back surface of the circuit board main body; the radiator is contacted with at least part of heating devices arranged on the front surface of the circuit board main body and used for radiating the heating devices; the backboard is connected with the circuit board main body, the backboard is provided with a heat dissipation piece, the heat dissipation piece is contacted with at least part of heating devices arranged on the back surface of the circuit board main body, and the heat dissipation piece and the heat radiator form at least one heat dissipation link so that the heat dissipation piece can transmit heat to the heat radiator for heat dissipation. According to the circuit board provided by the embodiment, at least one heat dissipation link is formed between the heat dissipation piece arranged on the backboard and the radiator, so that heat at the back of the circuit board main body can be transmitted to the radiator positioned at the front for heat dissipation, and the heat dissipation quality and efficiency of the heat-generating devices arranged on the circuit board main body are effectively ensured.

Description

Circuit board and electronic device with heat dissipation structure

Technical Field

The utility model relates to the technical field of circuit boards, and in particular to a circuit board and an electronic device with a heat dissipation structure.

Background Art

A circuit board can be called a printed circuit board or a printed circuit board. Its English name can be Printed Circuit Board, so it can be called a PCB board. It is mainly composed of pads, vias, mounting holes, wires, components, connectors, etc.

However, during the use of the circuit board, the components located on the circuit board will generate a certain amount of heat during operation. If the heat cannot be dissipated in time, it may cause damage to the electrical components, thereby affecting the normal operation of the electronic equipment.

Utility Model Content

The embodiments of the utility model provide a circuit board and an electronic device with a heat dissipation structure, which can stably dissipate heat for heating components located on both sides of the circuit board, thereby ensuring stable and reliable operation of the electrical components.

In a first aspect, an embodiment of the utility model provides a circuit board with a heat dissipation function, comprising:

A circuit board body, wherein heating devices are disposed on the front and back of the circuit board body;

A heat sink, in contact with at least part of the heat generating device disposed on the front side of the circuit board body, for performing heat dissipation operation on the heat generating device;

A backplane is connected to the circuit board body, and a heat sink is arranged on the backplane. The heat sink contacts at least part of the heat generating components disposed on the back of the circuit board body, and the heat sink forms at least one heat dissipation link with the radiator so that the heat sink transfers heat to the radiator.

In some examples, the heat sink is embedded in the back plate, and an upper surface of the heat sink is in the same plane as an upper surface of the back plate.

In some examples, the heat sink is in contact with at least a portion of the heat generating components disposed on the front side of the circuit board body through a heat conductive member.

In some examples, the heat dissipation element is provided with at least one protruding end for connecting with the heat sink, and the at least one protruding end is in contact with the heat sink through a heat conductive element to form at least one heat dissipation link.

In some examples, the size of the back plate is larger than the size of the circuit board body, and a preset gap exists between the protruding end and the circuit board body.

In some examples, the heat sink includes at least one protruding end for connecting to the heat sink, the at least one protruding end is in contact with the heat sink through a heat conductive member, and a preset gap exists between the protruding end and the circuit board body.

In some examples, at least one first protruding end is provided on the heat sink, and the heat sink includes at least one second protruding end for contacting the first protruding end, and the first protruding end contacts the second protruding end through a heat conductive member to form at least one heat dissipation link.

In some examples, the back plate is an insulating plate, and the circuit board body is mounted and connected to the back plate through an insulating layer.

In some examples, the back plate is a non-insulated plate, and the heat conduction capacity of the heat sink is higher than that of the back plate.

In some examples, the heat sink is a pipe structure made of a thermally conductive material.

In some examples, the pipe structure is filled with a predetermined liquid.

In some examples, the heat sink is mounted on the upper front side of the circuit board body via a detachable connector.

In some examples, the circuit board body is fixed between an upper clamping plate and the back plate, the upper clamping plate is located between the circuit board body and the heat sink, and the circuit board body is detachably mounted on the substrate via the upper clamping plate and the back plate.

In a second aspect, an embodiment of the present utility model provides an electronic device, including:

Substrate;

The circuit board with heat dissipation function described in the first aspect above has at least one circuit board, and the circuit board can be detachably mounted on the substrate.

The circuit board and electronic device with a heat dissipation structure provided in the present embodiment, when heating devices are disposed on both the front and back sides of the circuit board body, the heat sink is used to dissipate heat for at least part of the heating devices on the front side of the circuit board body, and the heat sink disposed on the back side of the circuit board body is used to dissipate heat for at least part of the heating devices disposed on the back side of the circuit board body. Since at least one heat dissipation link can be formed between the heat sink and the heat sink, when the heat sink is used to dissipate heat for at least part of the heating devices on the back side of the circuit board body, the heat can be transferred to the heat sink on the front side for heat dissipation. This effectively ensures the quality and efficiency of heat dissipation for the heating devices disposed on the circuit board body, and further ensures the safety and reliability of the use of the circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

FIG1 is a structural schematic diagram 1 of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG2 is a second structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG3 is a third structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG4 is a fourth structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG5 is a schematic diagram of a structure in which a heat sink provided by an embodiment of the present utility model is deployed on a back plate;

FIG6 is a fifth structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG7 is a sixth structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG8 is a seventh structural diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG9 is a schematic structural diagram 8 of a circuit board with a heat dissipation structure provided by an embodiment of the utility model;

FIG10 is a schematic diagram of the structure of an electronic device provided by an embodiment of the utility model;

FIG. 11 is a schematic structural diagram of a circuit board with heat dissipation function provided in an application embodiment of the utility model.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

In the description of the embodiments of the present invention, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

In the description of the embodiments of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

The terms "including" and "having" and any variations thereof in the description and claims of the embodiments of the present invention are intended to cover non-exclusive inclusions. For example, a device that includes a process or structure that includes a series of steps is not necessarily limited to those structures or steps that are explicitly listed but may include other steps or structures that are not explicitly listed or that are inherent to these processes or devices.

In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the embodiments of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

FIG1 is a schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model; Referring to FIG1 , this embodiment provides a circuit board with a heat dissipation structure, which can stably dissipate heat for components that generate heat. Specifically, the circuit board may include: a circuit board body 1, a heat sink 3 located at the upper end of the circuit board body 1, and a backplane 4 located at the lower end of the circuit board body 1. Specifically:

A circuit board body 1, with heating components 2 disposed on the front and back of the circuit board body 1;

The heat sink 3 is in contact with at least part of the heat generating device 2 disposed on the front side of the circuit board body 1, and is used for heat dissipation of the heat generating device 2;

The back plate 4 is connected to the circuit board body 1, and a heat sink 5 is provided on the back plate 4. The heat sink 5 is in contact with at least part of the heating device 2 disposed on the back of the circuit board body 1, and the heat sink 5 forms at least one heat dissipation link with the radiator 3, so that the heat sink 5 can transfer heat to the radiator 3 for heat dissipation.

Among them, the circuit board body 1 can be a circuit board used to carry one or more components, and the components carried can include heat-generating components and non-heat-generating components. The above-mentioned heat-generating components can refer to components with high power and high heat generation, such as: resistors, chips, transistors, etc.; non-heat-generating components can refer to components with low power and low heat generation, such as: capacitors, switches, potentiometers, inductors, etc.

For the heating devices 2 deployed on the circuit board body 1, they can be deployed together on one side of the circuit board body 1. For example, all the heating devices 2 can be deployed (welded) on the front or back of the circuit board body 1. At this time, in order to ensure the stable and reliable operation of the heating devices 2, during the operation of the heating devices 2, a heat sink 3 for realizing heat dissipation operation can be deployed on the same side of the heating devices 2.

When the heating devices 2 are deployed on both sides of the circuit board body 1, that is, multiple heating devices 2 can be deployed on the front and back of the circuit board body 1, wherein the front of the circuit board body 1 can be a side where more components are deployed, and the back of the circuit board body 1 can be a side where fewer components are deployed. Of course, for the front and back of the circuit board body 1, those skilled in the art can flexibly configure according to specific application scenarios or application requirements, as long as the front and back of the circuit board body 1 can be distinguished. In addition, the number of heating devices 2 located on the front is the same as or different from the number of heating devices 2 located on the back, that is, the number of heating devices 2 located on the front can be greater than or less than the number of heating devices 2 located on the back.

In order to ensure that the heating devices 2 located on both sides of the circuit board body 1 can operate stably, structures for realizing heat dissipation operations can be deployed on both sides of the circuit board body 1. For example, as shown in FIG1 , when the number of heating devices 2 is 3, two heating devices 2 can be deployed on the front of the circuit board body 1, and the other heating device 2 can be deployed on the back of the circuit board body 1. At this time, in order to ensure the stable operation of the heating devices 2 located on the front of the circuit board body 1, a heat sink 3 can be provided on the upper side of the circuit board body 1. The heat sink 3 can be deployed at the upper end of the front of the circuit board body 1. The heat sink 3 can be installed on the upper end of the front of the circuit board body 1 through a detachable connector. The detachable connector can include at least one of the following: bolts, studs, screws, etc. This not only facilitates the disassembly, replacement and maintenance of the heat sink 3 and the circuit board body 1, but also reduces the cost of maintaining the circuit board.

For the deployed heat sink 3, the heat sink 3 can be in contact with at least part of the heat generating device 2 deployed on the front side of the circuit board body 1. In some instances, the heat sink 3 can directly abut against at least part of the heat generating device 2 deployed on the front side of the circuit board body 1, or the heat sink 3 abuts against at least part of the heat generating device 2 deployed on the front side of the circuit board body 1 through a heat conducting member, so as to be able to perform heat dissipation operations on at least part of the heat generating device 2 mentioned above.

Furthermore, for the radiator 3, the heat dissipation contact surface of the radiator 3 can be a regular plane for abutting against the heating device 2. At this time, for at least one heating device 2 on the front side of the circuit board body 1, the upper surfaces of all the heating devices 2 are the same plane or different planes. When the upper surfaces of all the heating devices 2 located on the front side of the circuit board body 1 are the same plane, the set radiator 3 can abut against all the heating devices 2. At this time, the radiator 3 can perform heat dissipation operations for all the heating devices 2 located on the front side of the circuit board body 1.

Among them, the upper surfaces of all the heating devices 2 located on the front side of the circuit board body 1 can not only be the same plane, but also different planes. As shown in Figure 2, the upper planes of all the heating devices 2 located on the front side of the circuit board body 1 can respectively form two different planes, namely plane 1 and plane 2. Since the heat dissipation contact surface of the radiator 3 is a regular plane for abutting against the heating device 2, the radiator 3 at this time can abut against the upper surfaces of some of the heating devices 2 located on the front side of the circuit board body 1, so as to be able to perform heat dissipation operations on the above-mentioned heating devices 2.

In addition, for the radiator 3, the heat dissipation contact surface of the radiator 3 can not only be a regular plane for abutting with the heating device 2, but also an irregular plane for abutting with the heating device 2. As shown in Figure 3, the contact surface of the radiator 3 for abutting with the heating device 2 can include a heat dissipation contact surface 1 and a heat dissipation contact surface 2. The heat dissipation contact surface 1 and the heat dissipation contact surface 2 are different planes. At this time, if the upper surfaces of all the heating devices 2 located on the front side of the circuit board body 1 are the same plane, the radiator 3 can only abut with some of the heating devices 2 located on the front side of the circuit board body 1, thereby realizing the heat dissipation operation of some of the heating devices 2 deployed on the front side of the circuit board body 1.

Correspondingly, referring to Figure 4, when the heat dissipation contact surface of the radiator 3 is an irregular plane for abutting against the heating device 2, if the upper surfaces of all the heating devices 2 located on the front side of the circuit board body 1 are different planes, the radiator 3 can abut against all the heating devices 2, that is, the heat dissipation contact surface 1 can abut against the upper surface of the heating device 2 located on the left side, and the heat dissipation contact surface 2 can abut against the upper surface of the heating device 2 located on the right side, thereby realizing the heat dissipation operation of all the heating devices 2 deployed on the front side of the circuit board body 1.

It should be noted that, for the heating devices 2 deployed on the circuit board body 1, the designers can flexibly configure or adjust the specific number and specific structural features of the heating devices 2 according to the specific application requirements or scenario requirements. After the heating devices 2 deployed on the circuit board body 1 are determined, in order to ensure the quality and efficiency of the heat dissipation of the heat dissipation devices 2, the heat dissipation contact surface of the heat sink 3 can be configured based on the specific structural features of the heating devices 2. In this way, it can be ensured that the heat dissipation contact surface of the heat sink 3 can be in contact with as many heating devices 2 as possible, so that more heating devices 2 can be cooled.

In addition, for the circuit board body 1, since the heating devices 2 are disposed on both the front and back sides of the circuit board body 1, the configured heat sink 3 can dissipate heat for at least part of the heating devices 2 disposed on the front side of the circuit board body 1. For the heating devices 2 disposed on the back side of the circuit board body 1, in order to ensure the stable and reliable operation of the heating devices 2 located on the back side of the circuit board body 1, a back plate 4 can be connected to the lower end of the circuit board body 1, wherein the back plates 4 of different materials can be installed and connected with the circuit board body 1 in different ways. In some examples, the back plate 4 can be an insulating plate, and the circuit board body 1 can be installed and connected with the back plate 4 through an insulating layer. Alternatively, in some examples, the back plate 4 can be a non-insulating plate, specifically, the back plate 4 can be a metal plate. At this time, in order to ensure that the heat sink 5 located on the circuit board body 1 can quickly and stably dissipate the heat generated by the heating devices 2, the heat conductivity of the heat sink 5 is higher than that of the back plate 4.

As for the heat sink 5 for performing heat dissipation operations that can be provided on the back plate 4, the heat sink 5 can be implemented as a pipe structure composed of a heat-conducting material or a solid block structure composed of a heat-conducting material. The above-mentioned heat-conducting material may include at least one of the following: copper, iron, aluminum, etc. Specifically, when the heat sink 5 is implemented as a pipe structure composed of a heat-conducting material, the heat sink 5 of the pipe structure can be embedded in the back plate 4, as shown in Figure 5. In order to improve the heat dissipation quality and effect, the heat sink 5 of the pipe structure is filled with a preset liquid. The preset liquid can be implemented as water, thermal oil, silicone oil, etc.

For the heat sink 5 arranged on the back plate 4, the heat sink 5 can contact with at least part of the heating components 2 deployed on the back side of the circuit board body 1. Specifically, the heat sink 5 can contact with at least part of the heating components 2 through a heat conductor. Since the heat sink 5 is arranged on the back plate 4, the heat sink 5 and the radiator 3 can form at least one heat dissipation link, so that the heat sink 5 can transfer heat to the radiator 3 for heat dissipation operation, thereby effectively ensuring the heat dissipation quality and effect.

On the other hand, this embodiment does not limit the specific implementation method of setting the heat sink 5 on the back plate 4. For example, the heat sink 5 can be set on the back plate 4 through a connector or an adhesive. In this case, the heat sink 5 can be fixedly set on the upper surface of the back plate 4. Further, since the back plate 4 is installed and connected with the circuit board body 1, in order to minimize the influence of the heat sink 5 on the installation and connection operation of the back plate 4 and the circuit board body 1, it is more preferred that the heat sink 5 is embedded in the back plate 4, and the upper surface of the heat sink 4 and the upper surface of the back plate 4 are in the same plane.

The circuit board with a heat dissipation structure provided in the present embodiment has heat-generating devices 2 disposed on both the front and back sides of the circuit board body 1. The heat sink 3 is used to dissipate heat for at least part of the heat-generating devices 2 on the front side of the circuit board body 1, and the heat-generating elements disposed on the back side of the circuit board body 1 are used to dissipate heat for at least part of the heat-generating devices 2 disposed on the back side of the circuit board body 1. Since at least one heat-dissipating link can be formed between the heat sink 5 and the heat sink 3, when the heat sink 5 is used to dissipate heat for at least part of the heat-generating devices 2 on the back side of the circuit board body 1, heat can be transferred to the heat sink 3 on the front side for heat dissipation. This effectively ensures the quality and efficiency of heat dissipation for the heat-generating devices 2 disposed on the circuit board body 1, and further ensures the stable reliability of the circuit board.

Figure 6 is a fourth structural schematic diagram of a circuit board with a heat dissipation structure provided in an embodiment of the utility model; on the basis of the above embodiment, referring to Figure 6, this embodiment does not limit the at least one heat dissipation link formed by the heat sink 5 and the heat sink 3. In some instances, the heat sink 5 can contact the heat sink 3 through the provided protruding end 501. At this time, the heat sink 5 is provided with at least one protruding end 501 for connecting to the heat sink 3, and at least one protruding end 501 is in contact with the heat sink 3 through a heat conductive member to form at least one heat dissipation link.

In addition, in order to ensure the normal operation of the circuit board, the size of the back plate 4 can be larger than the size of the circuit board body 1. In order to stably realize that the heat sink 5 can form a heat dissipation link with the radiator 3 through at least one protruding end 501, there can be a preset gap between the protruding end 501 and the circuit board body 1. The preset gap can refer to the gap between the edge of the protruding end 501 and the edge of the circuit board body 1, that is, the distance between the edge of the protruding end 501 and the edge of the circuit board body 1 can be greater than 0.

For the raised ends 501 set on the heat sink 5, the number of the raised ends 501 can be one or more, and the raised ends 501 can be integrally connected to the heat sink or fixedly connected. In order to ensure the heat transfer effect, the raised ends 501 can be in contact with the heat sink 3 through the heat conductor, thereby forming at least one heat dissipation link. Specifically, when the number of the raised ends 501 is multiple, multiple raised ends 501 can be in contact with the heat sink 3 through the heat conductor, thereby forming multiple heat dissipation links. The heat dissipation operation of the heat generating device 2 can be performed through the multiple heat dissipation links, thereby effectively ensuring the quality and effect of heat dissipation of the heat generating device 2 on the circuit board body 1.

Figure 7 is a sixth structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model; on the basis of the above embodiment, referring to Figure 7, at least one heat dissipation link formed by the heat sink 5 and the heat sink 3 can not only contact with the heat sink 3 through the protruding end 501 provided in the heat sink 5, but also contact with the heat sink 5 through the protruding end 301 provided in the heat sink 3 to form at least one heat dissipation link. Specifically, the heat sink 3 includes at least one protruding end 301 for connecting to the heat sink 5, at least one protruding end 301 contacts with the heat sink 5 through the heat conductive member 6, and there is a preset gap between the protruding end 301 and the circuit board body 1.

Among them, in order to ensure the normal operation of the circuit board, the size of the back plate 4 can be larger than the size of the circuit board body 1. In order to stably realize that the heat sink 5 can form a heat dissipation link with the radiator 3 through at least one protruding end 301, there can be a preset gap between the protruding end 301 and the circuit board body 1. The preset gap can refer to the gap between the edge of the protruding end 301 and the edge of the circuit board body 1, that is, the distance between the edge of the protruding end 301 and the edge of the circuit board body 1 can be greater than 0.

For the raised ends 301 provided on the heat sink 3, the number of the raised ends 301 can be one or more, and the raised ends 301 can be integrally connected to the heat sink 3 or fixedly connected. In order to ensure the heat transfer effect, the raised ends 301 can be in contact with the heat sink 3 through the heat conductor 6, thereby forming at least one heat dissipation link. Specifically, when the number of the raised ends 301 is multiple, the multiple raised ends 301 can be respectively in contact with the heat sink 3 through the heat conductor 6, thereby forming multiple heat dissipation links. The heat dissipation operation of the heating device 2 located on the back side of the circuit board body 1 can be performed through the multiple heat dissipation links. This not only ensures the flexibility and diversity of the heat dissipation link implementation, but also effectively ensures the quality and effect of heat dissipation of the heating device 2 on the circuit board body 1 based on the heat dissipation link.

Figure 8 is a structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the utility model; on the basis of the above embodiment, referring to Figure 8, the heat dissipation link can not only be realized by forming at least one heat dissipation link with the heat sink 3 through a raised end arranged on the heat sink 5, or by forming at least one heat dissipation link with the heat sink 5 through a raised end arranged on the heat sink 3, but also by realizing at least one heat dissipation link through raised ends arranged on the heat sink 5 and the heat sink 3. At this time, at least one first raised end 501 is arranged on the heat sink 5, and the heat sink 3 includes at least one second raised end 301 for contacting the first raised end 501, and the first raised end 501 contacts the second raised end 301 through the heat conductive member 6 to form at least one heat dissipation link.

Among them, in order to ensure the flexibility and reliability of the heat dissipation link setting, the heat dissipation link can not only be realized by the heat sink 5 contacting with the raised end set on the radiator 3, and by the radiator 3 contacting with the raised end set on the heat sink 5, but also by the second raised end 301 set on the radiator 3 contacting with the first raised end 501 set on the heat sink 5, and the first raised end 501 can be integrally set with the heat sink 5 or connected through a connecting member. Similarly, the second raised end 301 can be designed together with the radiator 3 or connected through a connecting member. As long as it can be ensured that the first raised end 501 can be stably connected to the heat sink 5 and the second raised end 301 can be stably connected to the radiator 3, it will not be repeated here.

Specifically, for the heat sink 5 arranged on the back plate 4, the structure and quantity of the heat sink 5 can be flexibly configured according to the structural characteristics between the back plate 4 and the circuit board body 1, especially for the number of raised ends 501 set on the heat sink 5, the number of first raised ends 501 set on the heat sink 5 can be at least one, and correspondingly, in order to enable the heat sink 5 to form at least one heat dissipation link with the radiator 3, the radiator 3 can be provided with at least one second raised end 301 for contacting the first raised end 501, that is, the number of second raised ends 301 can be the same as the number of first raised ends 501, and the contact surface of the second raised end 301 corresponds to the contact surface of the first raised end 501, so that not only the stable reliability of the generation of at least one heat dissipation link can be guaranteed, but also the quality and effect of heat dissipation of the heating device 2 based on the heat dissipation link can be guaranteed.

FIG9 is a schematic structural diagram eight of a circuit board with a heat dissipation structure provided by an embodiment of the utility model; on the basis of the above embodiment, referring to FIG9 , for the circuit board body 1, since the rigidity of the circuit board body 1 is relatively high, in order to avoid damage to the circuit board body 1 when the circuit board body 1 is installed and connected, when the circuit board is installed and configured, in order to ensure the safety of the circuit board body 1, the circuit board body 1 can be fixed between the upper clamping plate 7 and the back plate 4, and the upper clamping plate 7 is located between the circuit board body 1 and the radiator 3. The circuit board body 1 is detachably mounted on a substrate (not shown in the figure) through the upper clamping plate 7 and the back plate 4. It should be noted that not only one circuit board body 1 but multiple circuit board bodies 1 can be installed on the substrate. Specifically, the number of circuit board bodies 1 arranged on the substrate can be flexibly configured and adjusted according to application requirements or design requirements, so that an electronic device for realizing preset functions can be generated.

FIG10 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present utility model; with reference to FIG10 , this embodiment provides an electronic device, which may include:

Base plate 200;

In the above embodiment, the number of the circuit board 201 with heat dissipation function is at least one, and the circuit board 201 can be detachably mounted on the substrate 200 .

Among them, the specific shape structure, implemented functions and implemented effects of the circuit board 201 in this embodiment are similar to the specific shape structure, implemented functions and implemented effects of the circuit board in the above embodiment. Please refer to the above statements for details and will not be repeated here.

The electronic device in this embodiment can realize an electronic device with preset functions by configuring a circuit board 201 with a heat dissipation function on a substrate 200. Since the circuit board 2 has a heat dissipation structure, the stable and reliable operation of the circuit board 201 is effectively guaranteed, thereby further improving the safety and reliability of the use of the electronic device and further improving the practicality of the electronic device.

In specific application, referring to FIG. 11, taking a heat pipe as a heat sink 5 and a circuit board corresponding to an OCP accelerator module (OAM) corresponding to a parallel processing unit (PPU) as a circuit board body 1, this application embodiment provides a circuit board corresponding to an OAM module. The provided circuit board embeds a heat pipe 5 in a structural backplane 4 of the OAM module, and the heat of the heating device 2 deployed on the back of the OAM circuit board can be transferred to the top radiator 3 through the heat pipe 5, thereby solving the problems of complex assembly and poor maintainability of conventional back heat dissipation solutions. Specifically, the circuit board may include:

An OAM circuit board body 1, a heating device 2 is disposed on the front and back of the OAM circuit board body 1, and the OAM circuit board body 1 is fixed between an upper clamping plate (not shown in the figure) and a back plate 4;

The heat sink 3 is located at the upper end of the front side of the OAM circuit board body 1 and is in contact with the heating device 2 disposed on the front side of the circuit board body 1 through a heat-conducting material, so as to dissipate heat for the heating device 2;

The back plate 4 is detachably connected to the circuit board body 1, and a heat pipe 5 is embedded in the back plate 4, and the upper surface of the heat pipe 5 is in the same plane as the upper surface of the back plate 4. The heat pipe 5 is in contact with at least part of the heating device 2 deployed on the back of the circuit board body 1, and the length, shape and path of the heat pipe 5 can be flexibly adjusted according to the specific structure and layout of the components on the OAM circuit board body 1. The heat sink 5 and the heat sink 3 form at least one heat dissipation link, so that the heat sink 5 transfers heat to the heat sink 3 for heat dissipation.

The substrate 8, the OAM circuit board body 1 is installed on the substrate 8 through the backplane 4, and at least one OAM circuit board body 1 is deployed on the substrate 8 to realize the preset function.

It should be noted that the contact position or contact surface between the heat pipe on the back panel 4 and the top radiator 3 can be flexibly set or adjusted according to the component structure space and heat dissipation requirements on the circuit board body 1. In some instances, the heat pipe can be designed at any one or more of the four ends of the circuit board body 1, and the heat pipe can be made of other materials with strong thermal conductivity, such as copper blocks, aluminum blocks, etc. The boss structure where the heat pipe 5 contacts the radiator 3 can be the boss structure on the radiator 3, or it can be the boss structure of the heat pipe 5 on the back panel, thereby ensuring the flexibility and reliability of the circuit board design.

The circuit board provided in the present application embodiment can transfer the heat of the bottom heating device 2 of the circuit board body 1 to the radiator 3 on the top surface for heat dissipation through the heat pipe 5 or other high-temperature metal material embedded in the back plate 4. The heat dissipation solution is not only simple and reliable, but also adopts a top heat dissipation solution with high heat dissipation quality. At the same time, the heat dissipation structure is decoupled from the substrate and its back plate. This not only does not require grooving on the substrate, but also facilitates maintenance. When replacing and maintaining components, there is no need to replace the thermal conductive material, and the subsequent maintainability is good. This effectively ensures the flexible and reliable use of the circuit board, and further ensures the practicality of the circuit board.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims (14)

1. The utility model provides a circuit board with heat radiation structure which characterized in that includes:

The circuit board comprises a circuit board main body, wherein heating devices are arranged on the front surface and the back surface of the circuit board main body;

The radiator is contacted with at least part of heating devices arranged on the front surface of the circuit board main body and is used for radiating the heating devices;

The backboard is connected with the circuit board main body, a heat dissipation piece is arranged on the backboard, the heat dissipation piece is in contact with at least part of heating devices arranged on the back surface of the circuit board main body, and the heat dissipation piece and the radiator form at least one heat dissipation link so that the heat dissipation piece can transmit heat to the radiator to dissipate heat.

2. The circuit board of claim 1, wherein,

The heat dissipation piece is embedded on the backboard, and the upper surface of the heat dissipation piece and the upper surface of the backboard are in the same plane.

3. The circuit board of claim 1, wherein the heat sink is in contact with at least a portion of the heat generating devices disposed on the front surface of the circuit board body via a heat conductive member.

4. The circuit board of claim 1, wherein the heat sink is provided with at least one protruding end for connection to the heat sink, the at least one protruding end being in contact with the heat sink via a heat conducting member to form at least one heat dissipating link.

5. The circuit board of claim 4, wherein the back plate has a size greater than the size of the circuit board body, and wherein a predetermined gap exists between the protruding end and the circuit board body.

6. The circuit board of claim 1, wherein the heat sink comprises at least one protruding end for connection with the heat sink, the at least one protruding end is in contact with the heat sink through a heat conducting member, and a predetermined gap exists between the protruding end and the circuit board body.

7. The circuit board of claim 1, wherein the heat sink has at least one first bump end disposed thereon, the heat sink having at least one second bump end for contacting the first bump end, the first bump end contacting the second bump end through a heat conductive member to form at least one heat sink link.

8. The circuit board of any one of claims 1-7, wherein the back plate is an insulating plate, and the circuit board body is mounted and connected to the back plate through an insulating layer.

9. The circuit board of any one of claims 1-7, wherein the back plate is a non-insulating plate and the heat sink has a higher heat transfer capability than the back plate.

10. The circuit board of any one of claims 1-7, wherein the heat sink is a conduit structure comprised of a thermally conductive material.

11. The circuit board of claim 10, wherein the conduit structure is filled with a predetermined liquid.

12. The circuit board of any one of claims 1-7, wherein the heat sink is mounted to the front upper end of the circuit board body by a detachable connector.

13. The circuit board of any one of claims 1-7, wherein,

The circuit board main body is fixed between the upper clamping plate and the back plate, the upper clamping plate is positioned between the circuit board main body and the radiator, and the circuit board main body is detachably arranged on the substrate through the upper clamping plate and the back plate.

14. An electronic device, comprising:

a substrate;

The wiring board with a heat dissipation structure as defined in any one of claims 1 to 13, wherein the number of the wiring boards is at least one, and the wiring boards are detachably mounted on the substrate.