CN106061099A - Printed circuit board and mobile terminal having the same - Google Patents

Abstract

The invention discloses a printed circuit board and a mobile terminal having the same, wherein the printed circuit board comprises: the heat-conducting heating element comprises a main board, a heating element, a heat-conducting piece and a tin pick layer, wherein a copper exposing layer is formed on the lower surface of the main board; the heating element is arranged on the upper surface of the mainboard and corresponds to the copper exposure layer in the vertical direction, and a through hole extending to the copper exposure layer and the heating element is formed in the mainboard; the heat conducting piece is arranged in the through hole to conduct heat between the heating element and the copper-exposed layer; the tin pick layer is arranged on the copper exposed layer. The printed circuit board provided by the embodiment of the invention has stronger heat dissipation capability, and the running stability and reliability of the printed circuit board are improved, so that the service life can be prolonged.

Description

Printed circuit board and mobile terminal having same

technical field

The invention relates to the technical field of mobile terminals, in particular to a printed circuit board and a mobile terminal with the printed circuit board.

Background technique

In the mobile terminal in the related art, the fuselage tends to be lighter and lighter, therefore, the space layout of the printed circuit board inside the mobile terminal is also more and more compact. Therefore, the heat generated by the heating element during operation cannot be effectively dissipated. Affects operational performance and stability, resulting in shortened product life.

Contents of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present invention is to provide a printed circuit board, which has a stronger heat dissipation capability and improves the running stability and reliability of the printed circuit board.

Another object of the present invention is to provide a mobile terminal having the above-mentioned printed circuit board.

The printed circuit board according to the embodiment of the first aspect of the present invention includes: a main board, a copper exposed layer is formed on the lower surface of the main board; a heating element, the heating element is arranged on the upper surface of the main board and is connected to the The exposed copper layer corresponds to the position in the up and down direction, and the main board is provided with a via hole extending to the exposed copper layer and the heating element; a heat conduction element, the heat conduction element is arranged in the via hole to support the The heating element conducts heat conduction with the exposed copper layer; the tin pick layer is arranged on the exposed copper layer.

The heat dissipation capability of the printed circuit board according to the embodiment of the present invention is enhanced, the operation stability and reliability of the printed circuit board are improved, and the service life is extended.

In addition, the printed circuit board according to the present invention can also have the following additional technical features:

According to some embodiments of the present invention, the horizontal projection of the heating element is located within the horizontal projection of the exposed copper layer.

According to some embodiments of the present invention, the via holes include a plurality of spaced apart ones.

Optionally, a plurality of via holes are distributed at equal intervals.

Further, the via hole is formed as a cylindrical hole and the extending direction of the via hole is the same as the thickness direction of the main board.

According to some embodiments of the present invention, the tin pick layer includes a plurality of layers arranged at intervals.

Optionally, multiple tin pick layers are distributed at equal intervals.

According to some embodiments of the present invention, the outer peripheral surface of the heat conduction member is attached to the inner peripheral wall surface of the via hole.

According to some embodiments of the present invention, the heat conducting member is formed as a copper pillar.

The mobile terminal according to the embodiment of the second aspect of the present invention includes the printed circuit board according to the embodiment of the first aspect of the present invention.

According to the mobile terminal of the second aspect of the present invention, by arranging the printed circuit board according to the first aspect of the present invention, it can effectively dissipate heat, improve the operation stability and reliability, and thus prolong the service life.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a cross-sectional view of a printed circuit board according to an embodiment of the present invention.

Reference signs:

100: printed circuit board;

1: Main board; 2: Heating element; 3: Thermal conductor; 4: Tin pick layer; 10: Via hole; 11: Exposed copper layer.

detailed description

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

A printed circuit board 100 according to an embodiment of the first aspect of the present invention, ie a PCB board, will be described in detail below with reference to FIG. 1 . The printed circuit board 100 can be used in a mobile terminal, but is not limited thereto. Wherein, the up-down direction is subject to the up-down direction shown in FIG. 1 .

As shown in FIG. 1 , a printed circuit board 100 according to an embodiment of the present invention may include: a main board 1 , a heating element 2 , a heat conducting element 3 and a tin pick layer 4 .

Specifically, as shown in Figure 1, a exposed copper layer 11 can be formed on the lower surface of the main board 1, and the heating element 2 can be arranged on the upper surface of the main board 1, and the heating element 2 can be aligned with the exposed copper layer 11 in the vertical direction. The upper position corresponds, so that the heat generated by the heating element 2 can be conducted through the exposed copper layer 11 .

The main board 1 can be provided with a via hole 10 extending to the exposed copper layer 11 and the heating element 2 , and the heat conducting element 3 can be provided in the via hole 10 to conduct heat to the heating element 2 and the exposed copper layer 11 to improve the heat conduction efficiency.

As shown in Figure 1, the tin pick layer 4 can be arranged on the exposed copper layer 11, so that the heat conducted to the exposed copper layer 11 through the heat conduction member 3 can be diffused by the tin pick layer 4, thereby enhancing the heat dissipation capability and effectively dissipating heat. The heat of the printed circuit board 100 is reduced, and the operation stability and reliability of the printed circuit board 100 and the heating element 2 are improved.

According to the printed circuit board 100 of the embodiment of the present invention, by forming the exposed copper layer 11 on the lower surface of the main board 1, the heating element 2 is arranged on the upper surface of the main board 1 and corresponds to the position of the exposed copper layer 11 in the up and down direction, A via hole 10 extending to the exposed copper layer 11 and the heating element 2 is provided on the main board 1, and a heat conduction member 3 is arranged in the via hole 10, and the heat conduction member 3 is used to conduct heat conduction to the heating element 2 and the exposed copper layer 11, and the exposed The tin pick layer 4 is arranged on the copper layer 11, and the tin pick layer 4 is used to realize heat dissipation, thereby enhancing the heat dissipation capability, effectively dissipating heat, and reducing the heat of the printed circuit board 100, thereby improving the operation stability of the printed circuit board 100 and the heating element 2 and reliability, extending service life.

According to some embodiments of the present invention, as shown in FIG. 1, the horizontal projection of the heating element 2 may be located within the horizontal projection of the exposed copper layer 11, that is to say, the size of the heating element 2 in the horizontal direction is smaller than or equal to that of the exposed copper layer. 11 in the horizontal direction, the size of the exposed copper layer 11 is larger, and the heat dissipation area is larger, so as to further dissipate heat for the heating element 2 and reduce the heat accumulation of the heating element 2 .

In some embodiments of the present invention, the via holes 10 may include a plurality of spaced apart via holes 10, so that the heat generated by the operation of the heating element 2 can be conducted to the exposed copper layer 11 by using a plurality of spaced apart via holes 10, and the heat conduction efficiency is improved. High, so that the local temperature rise of the heating element 2 can be avoided from being too high.

Optionally, a plurality of via holes 10 may be distributed at equal intervals. Thus, the speed and uniformity of heat conduction can be further improved, so that the performance of the printed circuit board 100 is better.

As shown in FIG. 1, the via hole 10 may be formed as a cylindrical hole, and the extending direction of the via hole 10 may be the same as the thickness direction of the main board 1, that is, the via hole 10 may be formed as a cylindrical hole and extend in the up-down direction. And penetrate the upper surface and the lower surface of the main board 1 . Therefore, the size of the via hole 10 is relatively short, the manufacturing is convenient and simple, and the efficiency of heat conduction can be further improved to ensure the effect of heat dissipation.

According to some embodiments of the present invention, as shown in FIG. 1 , the tin pick layer 4 can include multiple tin pick layers 4 arranged at intervals, so that multiple tin pick layers 4 can be used for heat dissipation, and by spacing the multiple tin pick layers 4 Turning on the setting can improve the stability and uniformity of heat dissipation to a certain extent, further improve the heat dissipation efficiency, and improve the heat dissipation effect.

Optionally, as shown in FIG. 1 , multiple tin pick layers 4 may be distributed at equal intervals. Thus, the stability and uniformity of heat dissipation can be further improved, the temperature of the heating element 2 and the main board 1 can be reduced, and the performance of the printed circuit board 100 can be guaranteed.

In some embodiments of the present invention, the outer peripheral surface of the heat conduction element 3 can be attached to the inner peripheral wall surface of the via hole 10 , that is to say, the heat conduction element 3 can fill the entire via hole 10 . Thus, the heat dissipation efficiency can be further improved, and the heat dissipation effect can be ensured.

According to some embodiments of the present invention, the heat conduction member 3 can be formed as a copper column. Since the copper column has excellent thermal conductivity, the use of a copper column for heat conduction can quickly transfer the heat generated by the heating element 2 to the exposed copper layer 11, thereby The heat dissipation is realized through the exposed copper layer 11 and the tin pick layer 4, the heat dissipation is fast and the heat dissipation effect is good, and at the same time, the processing is convenient and the cost is low.

The mobile terminal according to the embodiment of the second aspect of the present invention includes the printed circuit board 100 according to the embodiment of the first aspect of the present invention. The control elements of the mobile terminal can be arranged on the printed circuit board 100, and the installation of the control elements on the printed circuit board 100 and the installation of the printed circuit board 100 on the mobile terminal are understandable and easy to implement by those skilled in the art. , and will not be described in detail here.

According to the mobile terminal of the embodiment of the present invention, by disposing the printed circuit board 100 according to the above-mentioned embodiment of the present invention, it can effectively dissipate heat, improve the operation stability and reliability of the mobile terminal, and thus prolong the service life.

The mobile terminal according to the embodiment of the present invention may be a mobile phone or a tablet computer, etc. Other configurations and operations of the mobile terminal are known to those skilled in the art and will not be described in detail here.

In describing the present invention, it is to be understood that the terms "centre", "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "inner", The orientations or positional relationships indicated by "outer", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation should therefore not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

In the description of this specification, references to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and modifications can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (10)

1. A printed circuit board, characterized in that, comprising: Main board, the lower surface of the main board is formed with exposed copper layer; A heating element, the heating element is arranged on the upper surface of the main board and corresponds to the position of the exposed copper layer in the up and down direction, and the main board is provided with a pass extending to the exposed copper layer and the heating element hole; a heat conduction element, the heat conduction element is arranged in the via hole to conduct heat conduction to the heating element and the exposed copper layer; A tin pick layer, the tin pick layer is provided on the exposed copper layer. 2. The PCB board according to claim 1, wherein the horizontal projection of the heating element is located within the horizontal projection of the exposed copper layer. 3. The PCB board according to claim 1, wherein the via holes comprise a plurality of spaced apart ones. 4. The PCB board according to claim 2, characterized in that, a plurality of via holes are equally spaced. 5 . The PCB board according to claim 2 , wherein the via hole is formed as a cylindrical hole and the extending direction of the via hole is the same as the thickness direction of the main board. 6. The PCB board according to claim 1, wherein the tin pick layer comprises a plurality of layers arranged at intervals. 7. The PCB board according to claim 6, characterized in that, a plurality of said tin pick layers are equally spaced. 8 . The PCB board according to claim 1 , wherein the outer peripheral surface of the heat conduction member is attached to the inner peripheral wall surface of the via hole. 9 . 9. The PCB board according to claim 1, wherein the heat conducting element is formed as a copper pillar. 10. A mobile terminal, comprising the printed circuit board according to any one of claims 1-9.