CN105828570A - Heat dissipation device - Google Patents

Abstract

The present application provides a heat dissipation device, including: a metal bracket arranged in a terminal device, a heat conduction layer, and an airfoil vapor chamber; wherein, the metal bracket is provided with a stepped groove, and the airfoil vapor chamber There are step groups matching the stepped grooves on both sides; the step groups on both sides of the airfoil vapor chamber are connected with the stepped grooves on the metal bracket; the heat conduction layer is arranged on Between the airfoil vapor chamber and the heat generating chip in the terminal device, the airfoil chamber and the heat generating chip are connected through the heat conducting layer. The application solves the problems of slow heat dissipation and short service life of terminal equipment in the prior art.

Description

a cooling device

technical field

The present application relates to the technical field of communication equipment, in particular to a heat dissipation device.

Background technique

With the rapid development of the electronic communication industry, portable electronic devices such as mobile phones and tablet computers that we often use in our daily life are developing in the direction of multi-core high frequency. The power consumption of terminal devices is getting higher and higher, and the heat generated is also increasing. Getting bigger and bigger requires more and more space to dissipate heat.

However, at present, in order to meet the needs of users, the terminal equipment is constantly developing towards thinner and thinner, which makes the internal space of the terminal equipment smaller and smaller, which is not conducive to the release of heat generated by the terminal equipment during operation. If the heat concentration cannot be released in time, the local temperature in the terminal equipment will rise sharply. When the local temperature is too high, it will seriously affect the normal operation of the components, especially for some electronic components that are sensitive to temperature. It will cause damage to the rising electronic components and seriously affect the service life of the terminal equipment.

It can be seen that how to improve the heat dissipation performance of the terminal equipment in a limited space and ensure that the terminal equipment always operates at a normal working temperature is a problem urgently to be solved by those skilled in the art.

Contents of the invention

The present application provides a heat dissipation device to solve the problems of slow heat dissipation speed and short service life of terminal equipment in the prior art.

In order to solve the above problems, the present application discloses a heat dissipation device, including: a metal bracket, a heat conduction layer and an airfoil vapor chamber arranged in the terminal equipment;

in,

The metal bracket is provided with a stepped groove, and the two sides of the airfoil vapor chamber are provided with step groups matching the stepped groove;

The step groups on both sides of the airfoil chamber are matched with the stepped grooves provided on the metal bracket;

The heat conduction layer is disposed between the airfoil chamber and the heating chip in the terminal device, and the airfoil chamber and the heat generation chip are connected through the heat conduction layer.

Optionally, the airfoil vapor chamber includes: a metal plate, and a heat pipe or a heat plate; wherein, the heat pipe or heat plate includes at least one vacuum heat conduction chamber arranged at a first set interval;

The heat pipe or the heat plate is centrally arranged on the metal plate and connected to the metal plate; wherein, the length of the metal plate is greater than the length of the heat pipe or the heat plate.

Optionally, the set of steps includes: steps formed between the left and right end surfaces of the metal plate and the left and right sides of the heat pipe or heat plate.

Optionally, the airfoil vapor chamber includes: an upper top plate and a lower bottom plate; wherein, the upper top plate is arranged in a straight line, and the left and right ends of the lower bottom plate are arranged in a stepped shape;

The upper top plate is connected to the stepped ends of the lower bottom plate to form a U-shaped cavity; the U-shaped cavity includes at least one vacuum heat conduction cavity arranged at a second set interval.

Optionally, the set of steps includes: steps formed by the left and right end surfaces of the upper top plate and the left and right end surfaces of the lower bottom plate.

Optionally, the airfoil vapor chamber includes: an aluminum plate with two ends arranged in a stepped shape; wherein, the interior of the aluminum plate includes at least one vacuum heat conduction cavity arranged at a third set interval.

Optionally, the set of steps includes: steps formed at both ends of the stepped aluminum plate.

Optionally, the heat conduction layer includes: heat conduction paste or heat conduction silica gel.

Optionally, the terminal device includes at least one of the following devices: a mobile terminal, a tablet computer, a vehicle computer, and a handheld smart device.

Compared with the prior art, the embodiment of the present application includes the following advantages:

A heat dissipation device disclosed in an embodiment of the present application may include: a metal bracket arranged in a terminal device, a heat conduction layer, and an airfoil vapor chamber. Wherein, the metal bracket is provided with stepped grooves, and the two sides of the airfoil chamber are provided with step groups matching the stepped grooves; the step groups on both sides of the airfoil chamber are Fitted and connected with the stepped groove provided on the metal bracket; the heat conduction layer is arranged between the airfoil vapor chamber and the heating chip in the terminal equipment, and the airfoil chamber and the The heating chip is connected through the heat conducting layer. It can be seen that in the embodiment of the present application, the heat generated by the heating chip can be quickly transferred to the airfoil vapor chamber through the heat conduction layer, and the heat will be quickly dissipated on the airfoil chamber after being conducted to the airfoil chamber , and then transmitted to the entire metal bracket, realizing rapid heat dissipation of the terminal equipment and improving the heat dissipation performance of the terminal equipment. At the same time, the airfoil vapor chamber can conduct heat more evenly to the metal bracket, avoiding the sharp rise of the temperature in the local area of the terminal equipment caused by the concentration of hot spots, avoiding the damage of components due to excessive temperature, and improving the efficiency of the terminal equipment. service life.

Further, in the embodiment of the present application, the inside of the metal bracket is hollowed out to obtain the stepped groove, and then the airfoil vapor chamber is placed in the stepped groove, in other words, the The airfoil vapor chamber can be regarded as being embedded in the metal bracket without adding additional thickness, which ensures the thickness requirements of the terminal equipment, avoids the increase of the thickness of the whole machine, and improves the user experience.

Description of drawings

FIG. 1 is a schematic structural view of a heat dissipation device in Embodiment 1 of the present application;

Fig. 2 is a schematic structural view of an airfoil vapor chamber in Embodiment 2 of the present application;

Fig. 3 is a schematic structural view of another airfoil vapor chamber in Embodiment 2 of the present application;

Fig. 4 is a schematic structural view of another airfoil vapor chamber in Embodiment 2 of the present application. .

detailed description

In the description of this application, unless otherwise stated, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", "outer" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating or implying that the machine or element referred to must have a specific orientation, use a specific Azimuth configuration and operation, therefore, should not be construed as limiting the application.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.

In order to make the above objects, features and advantages of the present application more obvious and comprehensible, the present application will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

Embodiment one

Referring to FIG. 1 , it shows a schematic structural diagram of a heat dissipation device in Embodiment 1 of the present application. In this embodiment, the heat dissipation device may include: a metal bracket 1 , a heat conduction layer 2 and an airfoil vapor chamber 3 arranged in the terminal device.

As shown in Figure 1, the metal bracket 1 is provided with stepped grooves, and the airfoil chamber 3 is convexly arranged. In other words, the two sides of the airfoil chamber 3 are provided with set of steps.

Among them, the metal bracket 1 described in this embodiment is the same as the existing metal brackets: it can be used to fix and install various parts in the terminal equipment, for example, the metal bracket 1 described in this embodiment can be used with the terminal The screen connection of the device, to fix the screen, etc. The main difference between the metal bracket 1 described in this embodiment and the existing metal brackets is that: the metal bracket 1 described in this embodiment is provided with stepped grooves. Of course, those skilled in the art should understand that the location of the stepped groove can be determined according to the actual situation. In this embodiment, the heat sink is mainly used to quickly dissipate heat from the terminal equipment. The position on the bracket 1 can be determined according to the actual need for heat dissipation (position of components). For example, the chip is a type of heat-generating component that generates a large amount of heat in the terminal equipment. For the heat-generating chip 4 shown in FIG. That is, the location of the stepped groove matches the location of the heat generating chip 4 in the terminal device.

As mentioned above, the stepped grooves set on the metal bracket 1 are matched with the step groups on both sides of the airfoil chamber 3, so the metal bracket 1 can be connected to the metal bracket 1 through the stepped grooves and step groups The airfoil vapor chamber 3 is connected: the step groups on both sides of the airfoil vapor chamber 3 are connected with the stepped groove provided on the metal bracket 1 . Of course, those skilled in the art should understand that the metal bracket 1 and the airfoil chamber 3 can be connected in any appropriate way, such as including but not limited to: welding, riveting and glue.

Further, the heat conduction layer 2 can be arranged between the airfoil vapor chamber 3 and the heat generating chip 4 in the terminal device, and the airfoil chamber 3 and the heat generating chip 4 are connected through the heat conduction layer. The heat conduction layer 2 can transfer the heat generated by the heat generating chip 4 more efficiently, thereby improving the thermal conductivity. Of course, in some special cases, the airfoil vapor chamber 3 can also be directly connected to the heating chip 4 .

It should be noted that the heat dissipation device described in this embodiment can be used, but not limited to, to dissipate heat from the heat generating chip 4. For example, the heat dissipation device described in this embodiment can be connected to any heat generating component in the terminal equipment, and then Rapid conduction of heat generated by heat-generating components to achieve rapid heat conduction and rapid heat dissipation.

To sum up, the heat dissipation device described in this embodiment may include: a metal bracket, a heat conduction layer, and an airfoil vapor chamber arranged in the terminal device. Among them, the metal bracket is provided with stepped grooves, and the two sides of the airfoil uniform temperature plate are provided with step groups matching the stepped grooves; the step groups on both sides of the airfoil uniform temperature The grooves are matched and connected; the heat conduction layer is arranged between the airfoil vapor chamber and the heating chip in the terminal device, and the airfoil vapor chamber and the heat generation chip are connected through the heat conduction layer. It can be seen that in this embodiment, the heat generated by the heating chip can be quickly transferred to the airfoil vapor chamber through the heat conduction layer, and after the heat is transferred to the airfoil vapor chamber, it will quickly dissipate on the airfoil vapor chamber, and then It is transmitted to the entire metal bracket, realizing rapid heat dissipation of the terminal equipment and improving the heat dissipation performance of the terminal equipment. At the same time, the heat can be more evenly transmitted to the metal bracket through the airfoil chamber, avoiding the sharp rise in the temperature of the local area of the terminal equipment caused by the concentration of hot spots, avoiding the damage of components due to excessive temperature, and improving the use of terminal equipment life.

Further, in this embodiment, the inside of the metal bracket is hollowed out to obtain a stepped groove, and then the airfoil vapor chamber is placed in the stepped groove. In other words, the airfoil vapor chamber can As it is embedded in the metal bracket, no additional thickness will be added, which ensures the thickness requirements of the terminal equipment, avoids the increase of the thickness of the whole machine, and improves the user experience.

Embodiment two

Combining with the above-mentioned embodiments, this embodiment further describes the structure of a heat dissipation device in detail. In this embodiment, the heat dissipation device may, but is not limited to, be applied to terminal equipment with large heat generation and poor heat dissipation, so as to realize rapid heat dissipation of the terminal equipment and improve heat dissipation performance. Wherein, the terminal device includes but not limited to at least one of the following devices: a mobile terminal, a tablet computer, a vehicle computer and a handheld smart device. For example, the heat dissipation device can be set in the mobile terminal (mobile phone), that is, in this embodiment, a mobile terminal can include a heat dissipation device, and then the rapid heat dissipation of the mobile terminal can be realized through the heat dissipation device, so as to avoid movement caused by concentrated hot spots. Conditions where the temperature in the local area of the terminal is too high.

Referring to FIG. 1 shown in the first embodiment above, in this embodiment, the heat dissipation device may include: a metal bracket 1 , a heat conduction layer 2 and an airfoil vapor chamber 3 arranged in the terminal equipment. Wherein, the metal bracket 1 is provided with stepped grooves, and the two sides of the airfoil equalization plate 3 are provided with step groups matching the stepped grooves. The step groups on both sides of the airfoil chamber 3 are matched with the stepped grooves provided on the metal bracket 1 . The heat conducting layer 2 is arranged between the airfoil vapor chamber 3 and the heating chip 4 in the terminal equipment, and the airfoil chamber 3 and the heating chip 4 are connected through the heat conducting layer 2 .

In this embodiment, the specific structure of the airfoil chamber 3 is mainly described in detail. The specific structure of the above-mentioned airfoil chamber 3 may include but not limited to the following structural forms:

In a preferred solution of this embodiment, refer to FIG. 2 , which shows a schematic structural diagram of an airfoil chamber in Embodiment 2 of the present application. Wherein, the airfoil vapor chamber 3 may specifically include: a metal plate 5, and a heat pipe or a heat plate; wherein, the heat pipe or heat plate includes at least one vacuum heat conduction cavity arranged at a first set interval.

Take the heat pipe as an example, such as the heat pipe 6 shown in FIG. 2 , the heat pipe 6 includes at least one vacuum heat conduction cavity arranged at a first set interval, such as a first vacuum heat conduction cavity 701 and a second vacuum heat conduction cavity 702 . Wherein, the size of the first set interval may be determined according to actual conditions, and the intervals between the various vacuum heat conduction chambers may not be completely the same.

The heat pipe 6 (or heat plate) is centrally arranged on the metal plate 5 and connected (eg, welded) to the metal plate 5 . Wherein, the length of the metal plate 5 is greater than the length of the heat pipe 6 (or heat plate). As shown in Figure 2, the heat pipe 6 (or heat plate) is connected to the metal plate 5, and the steps formed by the left and right end surfaces of the metal plate 5 and the left and right sides of the heat pipe 6 (or heat plate) are the above-mentioned airfoil uniformity. Step set for warm plate 3.

In yet another preferred solution of this embodiment, referring to FIG. 3 , it shows a schematic structural view of another airfoil chamber in Embodiment 2 of the present application. Wherein, the airfoil vapor chamber 3 may specifically include: an upper top plate 8 and a lower bottom plate 9 . Wherein, the upper top plate 8 is arranged in a straight line, and the left and right ends of the lower bottom plate 9 are arranged in a stepped shape.

The stepped two ends of the upper top plate 8 and the lower bottom plate 9 are connected (eg, welded) as shown in FIG. 3 . After the upper top plate 8 and the lower bottom plate 9 are welded, a U-shaped cavity is obtained. Wherein, the inside of the U-shaped cavity includes at least one vacuum heat conduction cavity arranged according to the second set interval, such as the third vacuum heat conduction cavity 703 and the fourth vacuum heat conduction cavity 704 and so on. Wherein, the size of the second set interval may be determined according to actual conditions, and the intervals between the various vacuum heat conduction chambers may not be completely the same.

It should be noted that, as shown in FIG. 3 , the stepped ends of the upper top plate 8 and the lower bottom plate 9 are connected, and the steps formed by the left and right end surfaces of the upper top plate 8 and the left and right end surfaces of the lower bottom plate are the above-mentioned airfoils. Step group of vapor chamber 3.

In another preferred solution of this embodiment, refer to FIG. 4 , which shows a schematic structural diagram of another airfoil chamber in Embodiment 2 of the present application. Wherein, the airfoil vapor chamber 3 may specifically include: an aluminum plate 10 with two ends arranged in a stepped shape. Of course, those skilled in the art should understand that the aluminum plate 10 can also be replaced by other metals with higher thermal conductivity, which is not limited in this embodiment.

The interior of the aluminum plate 10 includes at least one vacuum heat conduction cavity arranged at a third predetermined interval, such as the fifth vacuum heat conduction cavity 705 and the sixth vacuum heat conduction cavity 706 . Wherein, the size of the third set interval may be determined according to actual conditions, and the intervals between the various vacuum heat conduction chambers may not be completely the same. Further, the stepped ends of the aluminum plate 10 can be regarded as the above-mentioned step group of the airfoil chamber 3 .

Of course, those skilled in the art can also further process the existing vacuum chamber chamber on the basis of the existing vacuum chamber chamber to obtain the structure of the above airfoil chamber 3 . Alternatively, during the processing of the existing vacuum chamber vapor chamber, it is also possible to directly process according to the structure of the above-mentioned airfoil chamber 3 in this embodiment, so as to obtain the airfoil chamber 3 described in this embodiment . This embodiment does not limit this.

In addition, it should be noted that the heat conduction layer 2 may be any suitable heat conduction material layer, for example, the heat conduction layer 2 may include, but is not limited to: heat conduction paste or heat conduction silica gel.

To sum up, the heat dissipation device described in this embodiment may include: a metal bracket, a heat conduction layer, and an airfoil vapor chamber arranged in the terminal device. Among them, the metal bracket is provided with stepped grooves, and the two sides of the airfoil uniform temperature plate are provided with step groups matching the stepped grooves; the step groups on both sides of the airfoil uniform temperature The grooves are matched and connected; the heat conduction layer is arranged between the airfoil vapor chamber and the heating chip in the terminal device, and the airfoil vapor chamber and the heat generation chip are connected through the heat conduction layer. It can be seen that in this embodiment, the heat generated by the heating chip can be quickly transferred to the airfoil vapor chamber through the heat conduction layer, and after the heat is transferred to the airfoil vapor chamber, it will quickly dissipate on the airfoil vapor chamber, and then It is transmitted to the entire metal bracket, realizing rapid heat dissipation of the terminal equipment and improving the heat dissipation performance of the terminal equipment. At the same time, the heat can be more evenly transmitted to the metal bracket through the airfoil chamber, avoiding the sharp rise in the temperature of the local area of the terminal equipment caused by the concentration of hot spots, avoiding the damage of components due to excessive temperature, and improving the use of terminal equipment life.

Further, in this embodiment, the inside of the metal bracket is hollowed out to obtain a stepped groove, and then the airfoil vapor chamber is placed in the stepped groove. In other words, the airfoil vapor chamber can As it is embedded in the metal bracket, no additional thickness will be added, which ensures the thickness requirements of the terminal equipment, avoids the increase of the thickness of the whole machine, and improves the user experience.

The heat dissipation device provided by this application has been introduced in detail above. In this paper, specific examples are used to illustrate the principle and implementation of this application. The description of the above embodiment is only used to help understand the method and its core of this application. At the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims (9)

1. A heat dissipating device, comprising: the metal bracket, the heat conduction layer and the wing-shaped temperature-equalizing plate are arranged in the terminal equipment;

wherein,

a stepped groove is formed in the metal support, and step groups matched with the stepped groove are arranged on two sides of the wing-shaped temperature-uniforming plate;

the step groups on the two sides of the wing-shaped temperature-uniforming plate are matched and connected with the stepped grooves arranged on the metal bracket;

the heat conducting layer is arranged between the wing-shaped temperature equalizing plate and the heating chip in the terminal equipment, and the wing-shaped temperature equalizing plate is connected with the heating chip through the heat conducting layer.

2. The apparatus of claim 1, wherein the airfoil temperature equalization plate comprises: metal plates, and heat pipes or heat plates; the heat pipe or the hot plate comprises at least one vacuum heat conducting cavity arranged at a first set interval;

the heat pipe or the hot plate is arranged on the metal plate in the middle and is connected with the metal plate; wherein the length of the metal plate is greater than the length of the heat pipe or the heat plate.

3. The apparatus of claim 2, wherein the step group comprises: and the left end surface and the right end surface of the metal plate and the left side surface and the right side surface of the heat pipe or the hot plate form steps.

4. The apparatus of claim 1, wherein the airfoil temperature equalization plate comprises: an upper top plate and a lower bottom plate; the upper top plate is linearly arranged, and the left end and the right end of the lower bottom plate are arranged in a stepped manner;

the upper top plate is connected with the stepped two ends of the lower bottom plate to form a U-shaped cavity; the U-shaped cavity comprises at least one vacuum heat conducting cavity arranged at a second set interval.

5. The apparatus of claim 4, wherein the step group comprises: and the left end surface and the right end surface of the upper top plate and the left end surface and the right end surface of the lower bottom plate form steps.

6. The apparatus of claim 1, wherein the airfoil temperature equalization plate comprises: the two ends of the aluminum plate are arranged in a ladder shape; wherein, the aluminum plate is internally provided with at least one vacuum heat-conducting cavity arranged according to a third set interval.

7. The apparatus of claim 6, wherein the step group comprises: the aluminum plate is provided with steps formed at two stepped ends.

8. The device of any one of claims 1-7, wherein the thermally conductive layer comprises: heat conductive paste or heat conductive silica gel.

9. The apparatus according to any of claims 1-7, wherein the terminal device comprises at least one of: mobile terminal, panel computer, on-vehicle computer and handheld smart machine.