CN109526134B - A driving module, manufacturing method and display device - Google Patents
A driving module, manufacturing method and display device Download PDFInfo
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- CN109526134B CN109526134B CN201811547233.8A CN201811547233A CN109526134B CN 109526134 B CN109526134 B CN 109526134B CN 201811547233 A CN201811547233 A CN 201811547233A CN 109526134 B CN109526134 B CN 109526134B
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- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 claims description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 51
- 229910052802 copper Inorganic materials 0.000 claims description 51
- 239000010949 copper Substances 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009825 accumulation Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种驱动模组、制作方法以及显示装置所述驱动模组包括：电路板，包括第一表面和第二表面；承载所述电路板，且对电路板进行散热的散热件；以及导热固定件，将所述电路板固定到所述散热件；其中，所述电路板还包括：设置在所述电路板的第一表面的发热器件；以及设置在所述电路板的第二表面的导热件，与所述发热器件相背设置，与所述发热器件的位置相对应；所述导热件与所述导热固定件连接。本方案可以有效的降低发热器件工作的温度，避免了发热器件因为积热出现烧毁的情况发生，提高了显示面板的品质。
The present invention discloses a driving module, a manufacturing method and a display device. The driving module includes: a circuit board, including a first surface and a second surface; a heat sink that carries the circuit board and dissipates heat from the circuit board; and a heat-conducting fixing member that fixes the circuit board to the heat sink; wherein the circuit board also includes: a heating device arranged on the first surface of the circuit board; and a heat-conducting member arranged on the second surface of the circuit board, which is arranged opposite to the heating device and corresponds to the position of the heating device; the heat-conducting member is connected to the heat-conducting fixing member. This solution can effectively reduce the working temperature of the heating device, avoid the heating device from being burned due to heat accumulation, and improve the quality of the display panel.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a driving module, a manufacturing method, and a display device.
Background
With the development and progress of technology, display devices are becoming mainstream products of displays due to the thin body, low power consumption, low radiation, and the like. The display device comprises a driving module, and the driving module drives the display panel to display pictures. The driving module comprises a circuit board and a plurality of heating devices, such as chips, arranged on the circuit board.
In the driving module, the heat dissipation of the heating device on the circuit board generally dissipates heat through the external environment, so that the heat dissipation effect is poor, and the problem of overheating of the heating device is easily caused.
Disclosure of Invention
The invention aims to provide a driving module, a manufacturing method and a display device, so as to improve the heat dissipation efficiency of the driving module.
The driving module comprises a circuit board, a heat dissipation part, a heat conduction fixing part and a heat conduction part, wherein the circuit board comprises a first surface and a second surface, the heat dissipation part is used for bearing the circuit board and dissipating heat of the circuit board, the heat conduction fixing part is used for fixing the circuit board to the heat dissipation part, the heat conduction part is arranged on the first surface of the circuit board, the heat conduction part is arranged on the second surface of the circuit board, the heat conduction part is arranged opposite to the heat generation part and corresponds to the position of the heat generation part, and the heat conduction part is connected with the heat conduction fixing part.
Optionally, the heating device is a chip, the chip comprises a chip main body and pins, the chip main body is connected with the pins, the pins comprise signal pins and heat dissipation pins, the signal pins and the heat dissipation pins are insulated, the circuit board comprises a bonding pad arranged on the first surface, and a through hole communicated with the first surface and the second surface, a heat conduction layer is formed in the through hole, one end of the heat conduction layer is connected with the bonding pad, the other end of the heat conduction layer is connected with the heat conduction piece, and the heat dissipation pins are connected with the bonding pad.
Optionally, the heat conductive member is a metal pattern formed on the second surface of the circuit board.
Optionally, the metal pattern includes a first portion and a second portion, where the first portion is disposed corresponding to the heat generating device and is formed on the second surface of the circuit board, one end of the second portion is connected to the first portion, and the other end of the second portion is connected to the heat conducting fixing member.
Optionally, the circuit board comprises a substrate, a first copper layer arranged on the first surface and a second copper layer arranged on the second surface, wherein the outer sides of the first copper layer and the second copper layer are respectively provided with an insulating layer, the metal pattern is formed by etching the second copper layer, and the insulating layer positioned on the outer side of the metal pattern is correspondingly hollowed to form exposed copper.
Optionally, the second copper layer is further formed with a circuit trace, the exposed copper and the circuit trace are arranged on the same layer and are insulated from each other, and the exposed copper and the circuit trace are formed through the same process.
Optionally, the shape and size of the first portion of the heat conducting member are completely consistent with the shape and size of the heat generating device.
Optionally, the heat dissipation part is a back plate, the heat conduction fixing part is a screw, the circuit board at least comprises a first screw hole, one end of the screw is fixedly connected with the first screw hole in a screwed mode, and the other end of the screw is fixedly connected with the back plate.
The invention also discloses a manufacturing method of the driving module, which comprises the following steps:
The heat conduction device is arranged on the first surface of the circuit board, and the heat conduction element is arranged opposite to the heat generation device at the position corresponding to the heat generation device on the second surface of the circuit board;
And a heat conducting fixing piece fixedly connected with the heat conducting piece is arranged on the circuit board, and the circuit board is fixed on the heat radiating piece through the heat conducting fixing piece.
The invention also discloses a display device, which comprises the driving module.
In the scheme, the heating device is arranged on the first surface of the circuit board, the heat conducting piece is arranged on the second surface of the circuit board and is opposite to the heating device, the heat conducting piece is connected with the heat radiating piece through the heat conducting fixing piece while the heat conducting piece is connected with the heating device, so that the heat conducting piece is formed at the position which is most concentrated with respect to the heating device, the heat conducting piece has a heat conducting function, the heat conducting piece can be used for conducting heat through the connecting part of the heat conducting piece and the heating device, the heat of the heating device can be conducted to the heat radiating piece through the heat conducting piece and the heat conducting fixing piece, the heat radiating effect is improved, and the surface of the heating device far away from the heat conducting piece can radiate through air, so that the heat radiating path of the heating device is increased, the working temperature of the heating device can be effectively reduced, and the burning condition of the heating device due to heat accumulation is avoided.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is evident that the figures in the following description are only some embodiments of the application, from which other figures can be obtained without inventive effort for a person skilled in the art. In the drawings:
FIG. 1 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a chip structure according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 7 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a driving module according to an embodiment of the invention;
FIG. 9 is a schematic diagram illustrating a process of manufacturing a driving module according to another embodiment of the invention;
FIG. 10 is a schematic diagram illustrating a process of manufacturing a driving module according to another embodiment of the invention;
fig. 11 is a schematic view of a display device according to another embodiment of the present invention.
Wherein, 1, display device, 10, driving module, 11, circuit board, 111, heat conductive piece/metal pattern, 1111, first part, 1112, second part, 1113, third part, 112, heat conductive fixing piece/screw, 1121, inner wall, 1122, first screw hole, 1123, second screw hole, 113, first surface, 114, second surface, 115, substrate, 117, insulating layer, 118, bonding pad, 119, via hole, 12, heat generating device/chip, 120, pin, 121, chip body, 122, heat dissipating pin, 123, signal pin, 13, heat dissipating piece/back plate, 131, protruding part, 14, heat conductive layer, 15, first copper layer, 16, second copper layer.
Detailed Description
It is to be understood that the terminology used herein, the specific structural and functional details disclosed are merely representative for the purpose of describing particular embodiments, but that the application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or implicitly indicating the number of technical features indicated. Thus, unless otherwise indicated, features defining "a first", "a second", and "a plurality" may include one or more of such features explicitly or implicitly, and "a plurality" means two or more. The terms "comprises," "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or groups thereof may be present or added.
In addition, terms of the azimuth or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are described based on the azimuth or relative positional relationship shown in the drawings, are merely for convenience of description of the present application, and do not indicate that the apparatus or element referred to must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present application.
Furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be either permanently connected, removably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
The invention is further described below with reference to the drawings and alternative embodiments.
As shown in fig. 1 to 8, an embodiment of the present invention discloses a driving module 10, wherein the driving module 10 includes a circuit board 11 including a first surface 113 and a second surface 114, a heat sink 13 for carrying the circuit board 11 and dissipating heat from the circuit board 11, and a heat conducting fixing member 112 for fixing the circuit board 11 to the heat sink 13, wherein the circuit board 11 further includes a heat generating device 12 disposed on the first surface 113 of the circuit board 11, and a heat conducting member 112 disposed on the second surface 114 of the circuit board 11 opposite to the heat generating device 12 and corresponding to a position of the heat generating device 12, and the heat conducting member 111 is connected to the heat conducting fixing member 112.
In the scheme, the heating device 12 is arranged on the first surface 113 of the circuit board 11, the heat conducting piece 111 is formed on the second surface 114, the temperature of the position corresponding to the heating device 12 on the second surface is highest, the heat conducting piece 111 is arranged corresponding to the heating device 12, heat generated by the heating device 12 during operation can be conducted to the heat conducting piece 111 arranged on the second surface 114 of the circuit board 11 through the circuit board 11 and then conducted to the heat radiating piece 13 through the heat conducting fixing piece 112, so that the heat radiating path of the heating device 12 is increased, the working temperature of the heating device 12 can be effectively reduced, the burning of the heating device 12 due to accumulated heat is avoided, and the quality of the driving module 10 is improved.
As shown in fig. 1, fig. 1 is a top view of a circuit board disposed on a heat dissipation member, and fig. 2 is a schematic diagram of a second surface of the circuit board, wherein a surface of the circuit board 11 away from the heat dissipation member 13 is a first surface, and a surface of the circuit board 11 near the heat dissipation member 13 is a second surface 114, and of course, the first surface may also be a surface of the circuit board 11 near the heat dissipation member 13, and the second surface may be a surface of the circuit board 11 far from the heat dissipation member 13.
In one embodiment, the heat generating device 12 is a chip 12. In this embodiment, the driving module 10 includes a plurality of heat generating devices 12, such as chips 12 or resistors, and it is particularly important that the heat generated by the heat generating devices 12 is dissipated, if the heat generated by the heat generating devices 12 gathers too much heat, short circuit or burning may occur, which affects the normal operation of the driving module 10. Of course, the heat generating device 12 may be other heat generating electronic components.
As shown in fig. 4, fig. 4 is a schematic structural diagram of a chip, in an embodiment, the chip 12 includes a chip main body 121 and a pin 120, the chip main body 121 is connected to the pin 120, the pin 120 includes a signal pin 123 and a heat dissipation pin 122, the signal pin 123 and the heat dissipation pin 122 are insulated, the circuit board 11 includes a pad 118 disposed on the first surface 113, and a via hole 119 communicating the first surface 113 and the second surface 114, a heat conducting layer 14 is formed in the via hole 119, one end of the heat conducting layer 14 is connected to the pad, the other end is connected to the heat conducting member 111, and the heat dissipation pin 122 is connected to the pad 118.
Taking the chip 12 in the driving module 10 of the display device 1 as an example, the chip 12 processes data and controls the driving module to display pictures according to the processed data, which is an important component in the driving module, meanwhile, because the chip 12 is a high-integrated circuit and generates heat easily, heat generated on the chip main body 121 is conducted to the via hole 119 through the heat dissipation pin, and the via hole 119 conducts the heat to the heat conducting piece 111, so that the chip 12 can be effectively dissipated, the temperature of the chip 12 is reduced, the normal work of the chip 12 is ensured, and the quality of the driving module 10 is improved. The heat dissipation pin 122 may be a ground pin of the chip, and the heat dissipation pin 122 is connected to the heat conducting member 111 through the bonding pad 118 and then connected to the heat dissipation member 13, so that the heat dissipation and grounding effects can be achieved simultaneously by grounding the heat dissipation member 13.
Of course, the chip 12 may be connected to the heat conductive member 111 by other means, such as an insulating heat conductive material, e.g. silicone, so as to realize heat conductive connection between the chip 12, and even the bonding pad 118 where the chip 12 is located, and the heat conductive member 111.
As shown in fig. 2, in an embodiment, the heat conductive member 111 is a metal pattern formed on the second surface of the circuit board. In this scheme, the radiating effect of metal is good, can effectually with the heat conduction that the device 12 produced that generates heat on the fixed radiating member 13 like this. Of course, the heat conducting member 111 may be made of other heat dissipating materials.
As shown in fig. 5, fig. 5 is a schematic diagram of a second surface of a circuit board, in an embodiment, the metal pattern includes a first portion 1111 and a second portion 1112, the first portion 1111 is disposed corresponding to the heat generating device 12 and is formed on the second surface of the circuit board, one end of the second portion 1112 is connected to the first portion 1111, and the other end of the second portion 1112 is connected to the heat conducting fixing member 112.
In this embodiment, the metal pattern 111 includes a first portion 1111 and a second portion 1112, and the first portion 1111 and the second portion 1112 can dissipate heat by themselves to increase a heat dissipation path, and the first portion 1111 corresponds to a position of the heat generating device 12 where heat is most concentrated, and the first portion 1111 conducts heat to the second portion 1112, and then to the heat dissipating member 13 after passing through the heat conducting fixing member 112. The heat is conducted in the metal patterns 111 one by one, so that the local high temperature of the metal patterns 111 is avoided, the temperature of the heating device 12 is reduced, the normal operation of the heating device 12 is ensured, and the quality of the driving module is improved.
In an embodiment, the width of the first portion 1111 is greater than the width of the second portion 1112, the first portion 111 is relatively close to the heat generating device 12, so that the temperature of the heat generating device 12 is reduced, the width of the first portion 1111 is greater than the second portion 1112, and the first portion 111 can reduce its own temperature by heat exchange with the external environment, thereby improving the heat dissipation efficiency of the heat generating device 12. The width of the first portion 1111 may be equal to or smaller than the width of the second portion 1112, and is not limited to the arrangement of the present embodiment.
In an embodiment, the circuit board 11 includes a substrate 115, a first copper layer 15 disposed on a first surface, and a second copper layer 16 disposed on a second surface 114, wherein the outer sides of the first copper layer 15 and the second copper layer 16 are respectively provided with an insulating layer 117, the metal pattern 111 is formed by etching the second copper layer 16, and the insulating layer 117 located on the outer side of the metal pattern 111 is correspondingly hollowed out to form exposed copper.
In this scheme, the metal pattern 111 is exposed copper, and the exposed copper is formed by etching the second copper layer of the circuit board 11, so that the material of the circuit board 11 is utilized, and no additional material is added to form the heat conducting member, thereby saving the production cost.
In an embodiment, the second copper layer 16 is further formed with a circuit trace, the exposed copper and the circuit trace are disposed on the same layer and are insulated from each other, and the exposed copper and the circuit trace are formed by the same process.
In the scheme, the exposed copper and the circuit wiring are formed by the same etching process and are mutually insulated, the exposed copper is not electrically connected with the circuit wiring or other electronic components, and adverse effects of static electricity accumulated on the exposed copper on the circuit wiring are avoided. Of course, a person skilled in the art can set the connection state of the exposed copper and the circuit trace according to the own requirement.
In an embodiment, the pattern shape of the first portion 1111 is rectangular, and of course, those skilled in the art may set the pattern shape of the first portion 1111, such as square, round, or even irregular pattern, according to their own needs.
In one embodiment, the area of the first portion 1111 is larger than the area of the heat generating device 12. In this scheme, the area of first portion 1111 is greater than the area of heating device 12, heating device 12 can conduct more heat to first portion 1111, and then reduces the temperature of heating device 12, has ensured the normal work of heating device 12 like this, has improved the quality of drive module. Of course, in this embodiment, the area of the first portion 1111 may be equal to the area of the heat generating device 12, so that the heat dissipating effect of the heat generating device 12 may be achieved. In addition, the area of the first portion 1111 is smaller than the area of the heat generating device 12, and the area relationship between the first portion 1111 and the heat generating device 12 applicable to the present embodiment may be selected. In one embodiment, the first portion of the heat conducting member has a shape and size that is substantially identical to the shape and size of the heat generating device.
Optionally, the first portion 1111 is disposed opposite to the heat generating device 12, and the heat generating device 12 is completely within the projected area of the first portion 1111. In this embodiment, the first portion 1111 is opposite to the heat generating device 12, and the heat conducting path from the heat generating device 12 to the first portion 1111 is shortest, so that the heat dissipation efficiency of the heat generating device 12 may be improved. Of course, a person skilled in the art can set the portion of the first portion 1111 corresponding to the heat generating chip 12 according to the own requirement, and the first portion 1111 can be closer to the edge of the circuit board 11, so that the heat dissipation path of the heat generating device 12 is short, which is beneficial to heat dissipation of the heat generating device 12, and ensures normal operation of the heat generating device 12.
Optionally, the width of the second portion 1112 may range from 1 to 3 millimeters (mm). In this embodiment, the width of the second portion 1112 is 1-3mm, and when the width of the second portion 1112 is smaller than 1mm, the heat conduction efficiency from the first portion 1111 to the second portion 1112 is low, and the heat dissipation effect is poor. When the width of the second portion 1112 is greater than 3mm, the driving module tends to be thinner, which increases the area of the circuit board 11, so that the driving module structure is increased. Of course, the width of the second portion 1112 may be 2mm, so that the heat dissipation of the heat generating device 12 with high efficiency is ensured without affecting the arrangement of other components on the circuit board 11. Of course, the width of the second portion 1112 may be set by those skilled in the art according to their own needs.
In one embodiment, as shown in fig. 1, the thermally conductive fixing member 112 is a screw, and the circuit board 11 includes a first screw hole 1122, and the screw is screwed and fixed with the first screw hole 1122. In this scheme, the screw is made for metal material, has played fixed circuit board 11 and radiating effect. Of course, the heat-conducting fixing member 112 may be made of other heat-dissipating materials, such as heat-dissipating glue, and other fixing forms, such as a buckle, welding, etc., may be selected.
As shown in fig. 6, fig. 6 is a schematic diagram of a different structure of the present application, and in one embodiment, the heat dissipation element 13 is a back plate 13. In this scheme, backplate 13 is the main structure of bearing circuit board 11 and other parts, and backplate 13 is direct to be connected with external environment, is as radiating main selection part, has utilized driving module's structure, does not need additionally to increase driving module's structure, realizes easily. Of course, a person skilled in the art can select other components of the driving module as the heat dissipation element 13 according to his own needs, and of course, the heat dissipation element 13 can be additionally added.
In one embodiment, the number of the first screw holes 1122 is four, and the second portion 1112 is connected to one of the first screw holes 1122. In this embodiment, the second portion 1112 is connected to the first screw hole 1122, and the heat of the second portion 1112 can be transferred to the screw through the first screw hole 1122, and the heat of the screw can be transferred to the heat sink 13 for heat dissipation because the screw is connected to the heat sink 13. On the other hand, the screws can fix the circuit board 11 and the heat dissipation piece 13, so that the falling of the circuit board 11 and the heat dissipation piece 13 caused by shaking is avoided, the heat dissipation of the heat dissipation piece 13 to the heating device 12 is ensured, and the quality of the driving module is improved.
Of course, the second portion 1112 may be connected to two first screw holes 1122, or may be connected to three first screw holes 1122, or even four first screw holes 1122, which increases the surface area of the heat conducting member 111 on the one hand, so that the heat dissipation area of the heat conducting member 111 is large, and thus the heat dissipation efficiency of the heat conducting member 111 is increased. On the other hand, the heat dissipation path of the heat conducting member 111 is increased, so that the heat of the heat conducting member 111 can be conducted to the back plate 13 through a plurality of paths, and the heat dissipation efficiency of the heat generating device 12 is further improved. Of course, the number of screw holes may be set by those skilled in the art according to their own needs, and is not limited to the number in this embodiment.
In one embodiment, a copper layer 116 is disposed around the first screw hole 1122. Of course, those skilled in the art may select other metal materials to be disposed around the first screw holes 1122.
In one embodiment, the heat conductive member 111 includes a third portion 1113, one end of the third portion is connected to the first portion 1111, the other end of the third portion 1113 is connected to the third portion 1113, and the third portion 1113 is disposed around the first screw hole 1122. In this scheme, set up the third portion 1113 around first screw hole 1122, the heat of third portion 1113 can pass through first screw hole 1122, then on the heat dissipation piece 13 through the screw conduction for the area increase of heat conduction piece 111 with the screw has improved the heat transfer efficiency of heat conduction piece 111 with heat conduction mounting 112, has improved backplate 13 to the radiating efficiency of heating device 12. Of course, the third portion 1113 may be provided by one skilled in the art according to own needs.
Of course, the width of the third portion 1113 is different from the width of the second portion 1112. Of course, the width of the second portion 1112 may be larger than the width of the third portion 1113, and those skilled in the art may adjust the width relationship between the second portion 1112 and the third portion 1113 according to their own needs.
In one embodiment, the first screw holes 1122, which are not connected to the second portions 1112, are also provided with the copper layer 116. Of course, those skilled in the art can perform the arrangement of the copper layer 116 on the first screw hole 1122 according to their own needs.
As shown in fig. 7, fig. 7 is a schematic cross-sectional view of the circuit board, in an embodiment, the inner wall 1121 of the first screw hole 1122 is provided with a copper layer 116, and of course, the inner wall 1121 of the screw hole may be provided with other heat dissipation materials, such as aluminum or aluminum alloy, as the heat dissipation layer.
In one embodiment, the first screw hole 1122 is disposed at a corner of the circuit board 11, and the second portion 1112 extends from a side edge of the first portion 1111 to a top corner of the first screw hole 1122. Of course, one skilled in the art may set the departure point and connection point of the second portion 1112 as desired by himself.
In one embodiment, the second portion 1112 is a straight line. In this embodiment, the second portion 1112 is a straight line, so that the distance between the heat conducting member 111 and the first screw hole 1122 is short, and the heat of the heat conducting member 111 can be transferred to the first screw hole 1122 with higher heat conducting efficiency, and then transferred to the screw. This improves the heat radiation efficiency of the heat conductive member 111 to the heat generating device 12. Of course, since other functional components may be further disposed on the circuit board 11, the second portion 1112 needs to be set to avoid, so that in order to ensure normal operation of the other functional components, the second portion 1112 may be a fold line, so that normal operation of the other functional components is not affected while normal heat dissipation is performed, and quality of the driving module is improved. In addition, other arrangements of the second portion 1112 suitable for use in the present embodiment may be employed.
In one embodiment, one end of the second portion is connected to a side of the first portion. Of course, one end of the second portion is connected to the top corner of the first portion.
As shown in fig. 8, fig. 8 is a schematic cross-sectional view of the circuit board and the heat dissipation member after the circuit board is mated, the back plate 13 includes a protrusion 131, the protrusion 131 extends from a surface of the back plate 13 near the circuit board 11 to the circuit board 11, the protrusion 131 is provided with a first screw hole, and the back plate 13 is fixed with the first screw hole 1122 of the circuit board 11 by a screw through the first screw hole 1122. In this scheme, backplate 13 is the main structure of bearing circuit board 11 and other parts, and backplate 13 is direct to be connected with external environment, is as radiating main selection part, has utilized driving module's structure, does not need additionally to increase driving module's structure, realizes easily. Of course, other components of the driving module may also be used as the heat sink 13, and even the heat sink 13 may be additionally added.
In addition, the back plate 13 comprises four protruding parts 131, each protruding part 131 is provided with a second screw hole 1123, the second screw holes 1123 are arranged corresponding to the first screw holes 1122, the circuit board 11 and the back plate 13 are fixed through screws, and the first screw holes 1122 are fixedly connected with the second screw holes 1123 through the screws.
In this scheme, backplate 13 and circuit board 11 fixed back owing to be provided with bellying 131 on the backplate 13, and the surface of circuit board 11 is with not direct laminating, owing to backplate 13 mostly uses metal material to make, probably can gather static, if backplate 13 and circuit board 11 laminate directly, the static on the backplate 13 probably leads to the fact the influence to the electronic components on the circuit board 11, has ensured driving module 10's normal work like this. Of course, the position, number, etc. of the protrusions 131 may be set according to the own needs by those skilled in the art.
In another embodiment, as shown in FIG. 1, a driving module 10 includes a circuit board 11 having a first surface 113 and a second surface 114; a chip 12 member disposed on the first surface 113 of the circuit board 11; a back plate 13 for carrying the circuit board 11 and dissipating heat from the circuit board 11, wherein a second surface 114 of the circuit board 11 is close to the back plate 13; the circuit board 11 is fixed to the back plate 13 through a screw, the chip 12 is arranged on the first surface 113, the second surface 114 comprises a copper exposure 111, the copper exposure 111 is connected with the screw, the screw is connected with the back plate 13, the copper exposure 111 corresponds to the heating device 12, the chip 12 comprises a main body, a signal pin and a heat dissipation pin, the main body and the signal pin are connected with the heat dissipation pin, the circuit board 11 further comprises a bonding pad 118 and a via hole 119, the via hole 119 penetrates through the circuit board 11, one end of the via hole 119 is connected with the bonding pad 118, the other end of the via hole 119 is connected with the copper exposure 111, the copper exposure 111 comprises a first part 1111, a second part 1112 and a third part 1113, the first part 1111 and the third part 1113 are rectangular in shape, one end of the second part 1112 is connected with the side edge of the first part, the other end of the second part 1112 and the third part 1112 are connected with the third part 1112, the top corner is connected with the first part of the first part, the top corner is larger than the top corner of the first part 1122 and the third part 1112 is connected with the top corner of the first part 1122, the top corner of the top of the first part of the chip is larger than the top corner of the first part 1112 is connected with the top part of the first part 1122, the copper layer 116 is rectangular in shape, the back plate 13 comprises a protruding portion 131, the protruding portion 131 is provided with a second screw hole 1123, and the first screw is arranged corresponding to the second screw hole 1123.
As shown in fig. 9, in an embodiment, the present invention discloses a method for manufacturing a driving module, which includes the steps of:
S10, providing a circuit board, arranging a heating device on the first surface of the circuit board, and forming a heat conduction piece opposite to the heating device on the second surface of the circuit board at a position corresponding to the heating device;
And S11, installing a heat-conducting fixing piece fixedly connected with the heat-conducting piece on the circuit board, and fixing the circuit board on the heat-radiating piece through the heat-conducting fixing piece.
In another embodiment, as shown in fig. 10, the invention discloses a method for manufacturing a driving module, which comprises the following steps:
S20, providing a circuit board, wherein a heating device such as a chip is arranged on the first surface of the circuit board;
S21, etching and cleaning the second surface of the circuit board and the second copper layer of the circuit board and the insulating layer outside the second copper layer corresponding to the position of the heating device to form exposed copper as a heat conduction member;
S22, fixing the circuit board to a heat dissipation piece through the exposed copper by using a heat conduction fixing piece, wherein the heat conduction fixing piece is arranged on the exposed copper of the circuit board.
It should be noted that, the limitation of each step in the present solution is not to be considered as limiting the sequence of steps on the premise of not affecting the implementation of the specific solution, and the steps written in the previous step may be executed before, or executed after, or even executed simultaneously, so long as the implementation of the present solution is possible, all the steps should be considered as falling within the protection scope of the present invention.
As shown in fig. 11, in another embodiment, the present application discloses a display device 1, where the display device 1 includes a display panel, and a driving module 10 for driving the display panel.
The above description of the invention in connection with specific alternative embodiments is further detailed and it is not intended that the invention be limited to the specific embodiments disclosed. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.
Claims (8)
1. A drive module, the drive module comprising:
a circuit board including a first surface and a second surface;
A heat dissipation member for carrying the circuit board and dissipating heat from the circuit board, and
A heat conductive fixing member fixing the circuit board to the heat sink;
wherein, the circuit board still includes:
A heat generating device disposed on the first surface of the circuit board, and
The heat conducting piece is arranged on the second surface of the circuit board, is arranged opposite to the heating device and corresponds to the heating device in position, and is connected with the heat conducting fixing piece;
The heating device is a chip and comprises a chip main body and pins, wherein the chip main body is connected with the pins, the pins comprise signal pins and heat dissipation pins, the signal pins and the heat dissipation pins are insulated, the circuit board comprises a bonding pad arranged on a first surface and a through hole communicated with the first surface and a second surface, a heat conduction layer is formed in the through hole, one end of the heat conduction layer is connected with the bonding pad, the other end of the heat conduction layer is connected with the heat conduction piece, and the heat dissipation pins are connected with the bonding pad;
The heat conducting piece is a metal pattern formed on the second surface of the circuit board, the metal pattern comprises a first part and a second part, the first part is arranged corresponding to the heating device and is formed on the second surface of the circuit board, one end of the second part is connected with the first part, and the other end of the second part is connected with the heat conducting fixing piece;
The radiating piece is a back plate, the back plate comprises a protruding portion, the protruding portion extends to the circuit board from the surface of the back plate, which is close to the circuit board, the protruding portion is provided with a first screw hole, and the back plate is fixed through the first screw hole and the first screw hole of the circuit board through screws.
2. The driving module as claimed in claim 1, wherein the circuit board comprises a substrate, a first copper layer disposed on the first surface, and a second copper layer disposed on the second surface, and the outer sides of the first copper layer and the second copper layer are respectively provided with an insulating layer;
The metal pattern is formed by etching the second copper layer, and the insulating layer positioned on the outer side surface of the metal pattern is correspondingly hollowed out to form exposed copper.
3. The driving module as recited in claim 2 wherein said second copper layer further defines circuit traces, said exposed copper and said circuit traces being disposed on the same layer and insulated from each other, said exposed copper and said circuit traces being formed by the same process.
4. A driving module according to claim 1, wherein the first portion of the heat conducting member has a shape and size that is substantially identical to the shape and size of the heat generating device.
5. The driving module as recited in claim 1 wherein said heat sink is a back plate;
the heat conduction fixing piece is a screw, and the circuit board at least comprises a first screw hole;
One end of the screw is fixedly connected with the first screw hole in a threaded manner, and the other end of the screw is fixedly connected with the backboard.
6. A drive module according to claim 1, wherein the width of the first portion is greater than the width of the second portion.
7. A drive module as claimed in claim 1, wherein the area of the first portion is larger than the area of the heat generating device.
8. A display device comprising the drive module of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811547233.8A CN109526134B (en) | 2018-12-18 | 2018-12-18 | A driving module, manufacturing method and display device |
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| CN201811547233.8A CN109526134B (en) | 2018-12-18 | 2018-12-18 | A driving module, manufacturing method and display device |
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| CN109526134A CN109526134A (en) | 2019-03-26 |
| CN109526134B true CN109526134B (en) | 2024-12-06 |
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|---|---|---|---|---|
| TW201248947A (en) * | 2011-05-20 | 2012-12-01 | Unistars | Thermal structure for LED device |
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
| CN209845431U (en) * | 2018-12-18 | 2019-12-24 | 惠科股份有限公司 | Drive module and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100559583C (en) * | 2006-10-31 | 2009-11-11 | 日立电线株式会社 | LED components |
| CN101556941B (en) * | 2009-05-13 | 2011-09-07 | 重庆三祥汽车电控系统有限公司 | Heat radiation structure of surface mounting high-power element |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201248947A (en) * | 2011-05-20 | 2012-12-01 | Unistars | Thermal structure for LED device |
| CN106061099A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal having the same |
| CN209845431U (en) * | 2018-12-18 | 2019-12-24 | 惠科股份有限公司 | Drive module and display device |
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