CN105782854A - Automobile headlamp module capable of achieving lamplight switching and brightness regulation and preparation method and control method thereof - Google Patents
Automobile headlamp module capable of achieving lamplight switching and brightness regulation and preparation method and control method thereof Download PDFInfo
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- CN105782854A CN105782854A CN201610339022.XA CN201610339022A CN105782854A CN 105782854 A CN105782854 A CN 105782854A CN 201610339022 A CN201610339022 A CN 201610339022A CN 105782854 A CN105782854 A CN 105782854A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000002184 metal Substances 0.000 claims description 57
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000000741 silica gel Substances 0.000 claims description 33
- 229910002027 silica gel Inorganic materials 0.000 claims description 33
- 238000004806 packaging method and process Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 19
- 239000000843 powder Substances 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 7
- 238000003618 dip coating Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XNMARPWJSQWVGC-UHFFFAOYSA-N 2-[3-[11-[[5-(dimethylamino)naphthalen-1-yl]sulfonylamino]undecanoylamino]propoxy]-4-[(5,5,8,8-tetramethyl-6,7-dihydronaphthalene-2-carbonyl)amino]benzoic acid Chemical compound CC1(C)CCC(C)(C)C=2C1=CC(C(=O)NC=1C=C(C(=CC=1)C(O)=O)OCCCNC(=O)CCCCCCCCCCNS(=O)(=O)C1=C3C=CC=C(C3=CC=C1)N(C)C)=CC=2 XNMARPWJSQWVGC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052724 xenon Inorganic materials 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
Abstract
The invention relates to an automobile headlamp module capable of achieving lamplight switching and brightness regulation. The automobile headlamp module comprises a fast-assembly support, an LED panel, a lead plate, a support base and wires. The LED panel is connected with the lead plate. The LED panel is installed on the quick-assembly support. The quick-assembly support is installed on the support base. LED chips on the LED panel are distributed into an M*N array, wherein M represents the number of rows, N represents the number of lines, and M and N are both larger than or equal to 2. The LED chips distributed into the M*N array are connected in a single-row multi-point series control manner, wherein by means of single-row control connection, each row is independently powered on and powered off; and according to multi-point series control, the number of the switched-on LED chips in the LED chips connected in series in single rows are sequentially increased or decreased in order according to the positions of electrodes of the switched-on LED chips. The invention further relates to a preparation method and a control method of the automobile headlamp module capable of achieving lamplight switching and brightness regulation. The automobile headlamp module, the preparation method and the control method are simple in structure and convenient to control, and belong to the technical field of automobile headlamps.
Description
Technical field
The present invention relates to a kind of car headlamp, specifically, relate to a kind of car headlamp module realizing light switching and brightness regulation and preparation method thereof, control method.
Background technology
As the eyes of automobile, car headlamp is not only the important component part of car configuration, closely bound up with the safe driving under driving at night or severe weather conditions especially.Being developed so far from 20th century, car headlamp have passed through kerosene lamp, electric filament lamp, halogen vehicle lamp, xenon headlight, LED headlamp and the laser headlight of forefront.In 2008, Audi R8 became in the world that first equips the volume production vehicle of full LED car lamp, its distance-light, turn to, the illumination functions of daytime running lamps lamp headlight all uses LED element.
But, the business-like automotive LED headlamp of current volume production is all made up of many freestanding LED component, and its illuminating module structure is complicated, manufacture, installation cost height, take up room big, require higher to heat radiation, electrical control etc., therefore, LED headlamp is more applied in the vehicle of middle and high end.
Summary of the invention
For the technical problem existed in prior art, it is an object of the invention to: a kind of car headlamp module realizing light switching and brightness regulation and preparation method thereof, control method are provided, control multiaspect multiple chips array, compact by the series connection of single file multiple spot, control flexibly.
In order to achieve the above object, the present invention adopts the following technical scheme that
A kind of car headlamp module realizing light switching and brightness regulation, including fast-assembling bracket, LED panel, lead plate, bracket base and electric wire；LED panel and lead plate connect, and LED panel is arranged on fast-assembling bracket, and fast-assembling bracket is arranged on bracket base；LED chip in LED panel is distributed as M N array distribution, and M is line number, and N is columns, and M, N are all higher than being equal to 2；M N array distribution LED chip is that the series connection of single file multiple spot controls to connect, wherein single file controls to be connected as the independent break-make of each row, and the LED chip that multiple spot series connection controls to be connected as on single file connecting accessing increases successively in order according to the electrode position of the LED chip turned on or reduces the LED chip quantity connected.
LED chip is flip-over type LED chip, the same side that the p/n electrode of LED chip is positioned below.
LED panel includes PCB；PCB has been sequentially arranged M row metal wire, same row metal wire is divided into N+1 to be interrupted and the metal guide line segment of mutual insulating according to LED chip installation site, with the distance of a line neighboring metallic wires intersegmental distance p-electrode less than or equal to flip-over type LED chip and n-electrode.
In same row metal wire, 2nd the "-" end to n-th metal guide line segment embeds metal heat sink, metal heat sink is positioned at the n-electrode pad place of LED chip and runs through PCB, be welded with electric wire below metal heat sink, the 1st to the N-1 metal guide line segment "+" end is as the p-electrode pad of adjacent LED chip.
LED panel is provided with box dam, is filled with the fluorescent material plastic packaging layer of silica gel that the changes in temperature colour temperature with microlens array covering LED chip is alternate in box dam；Wherein when the fluorescent material plastic packaging layer of silica gel of warm colour temperature is positioned at the odd number row of M N array distribution LED chip, the fluorescent material plastic packaging layer of silica gel of cool colour temperature is positioned at even number line；And when the fluorescent material plastic packaging layer of silica gel of warm colour temperature is positioned at the even number line of M N array distribution LED chip, the fluorescent material plastic packaging layer of silica gel of cool colour temperature is positioned at odd number row.
In the microlens array of fluorescent material plastic packaging layer of silica gel, microlens shape is spheroid, cone, cylinder, prism or pyramid.
Fast-assembling bracket has at least three side, each side is equipped with two and inserts the conduit installed for LED panel, wherein a conduit is lead-in wire conduit, is provided with lead plate in lead-in wire conduit, and lead plate is provided with the electrode interface that individual and LED panel the M row LED chip of M connects.
The outer surface of fast-assembling bracket is coated with the heat dissipating layer by spraying, brush or dip coating manner adhering to.
The preparation method of a kind of car headlamp module realizing light switching and brightness regulation, comprises the steps: that S1. arranges M × (N+1) section metal guide line segment in PCB；S2. hole is got through at the "-" end of 2 to the n-th metal guide line segment of every a line；S3. metal heat sink is embedded in through hole；S4. flip-over type LED chip is welded on PCB counter electrode pin place；S5. the fluorescent powder silica gel that instillation changes in temperature colour temperature is alternate in box dam；S6. heat and when making fluorescent powder silica gel reach semi-cured state, use microlens array template that fluorescent powder silica gel carries out impressing plastic packaging further curing molding；S7. at LED panel back side respective metal heat sink place's welding electric wire；S8. the LED panel of respective numbers is mounted on fast-assembling bracket, and lead plate is installed；S9., electric wire and bracket base are installed.
A kind of control method of the car headlamp module realizing light switching and brightness regulation, the control logic realizing light switching and brightness regulation is: P1. realizes long-and-short distant light switching: in LED panel, the 1st is control dipped headlights to M/2 row, and it is control high beam that M/2+1 walks to M row；P2. the switching of changes in temperature colour temperature light is realized: LED panel is cool colour temperature light by the line number of the fluorescent powder silica gel plastic packaging of cool colour temperature, the line number of the fluorescent powder silica gel plastic packaging of warm colour temperature is warm colour temperature light；P3. brightness regulation is realized: in the ordinary course of things, before the LED chip connected with a line in LED panel is, (50%～70%) × N arranges, when needs increase brightness, after continuing to turn on same a line, (30%～50%) × N row chip carries out light filling, when needs weaken brightness, then only connect (30%～50%) × N row before same a line, wherein, (50%～70%) × N and the equal round numbers of (30%～50%) × N.Wherein, the first row refers to a line away from bracket base.M/2 takes positive integer, when it is decimal, then takes any one of closest two integer.
Principles of the invention is:
LED panel is provided with the LED chip of M N array distribution, and LED chip is that the series connection of single file multiple spot controls to connect.Single file controls to be connected as each row LED chip and individually connects with power supply, individually controls the break-make of each row LED chip, is achieved in the switching of nearly high beam or the switching of changes in temperature color temperature lamp.Multiple spot series connection controls to be connected as the LED chip of single file and is arranged in order, and the quantity of the LED chip switched on power of connecting according to the position control of the electrode of the LED chip turned on is achieved in brightness regulation.
Flip-over type LED chip is welded in PCB, and the n-electrode of LED chip is connected the series connection of Access Control circuit realiration multiple spot by metal heat sink and controls with the electric wire at the back side.
Covering the fluorescent material plastic packaging layer of silica gel that cold-warm color temperature is alternate in LED panel, the single file of cooperated with LED chip controls, it is achieved the control of cold-warm color light.
Adopting many sides formula fast-assembling bracket, LED panel is inserted in the conduit of side by LED chip in the way of outwardly, it is achieved board plug type Fast Installation.Preferably, fast-assembling bracket is regular prism shape, and side is positioned on the side of regular prism.
Generally speaking, present invention have the advantage that
1. can realize automobile headlamp light switching and brightness control function.
2. can realize the changes in temperature lamp handoff functionality of automobile headlamp light.
3. volume is little, brightness is high, can multifaceted light-emitting.
4. simple in construction, easy for installation, reduce the manufacturing cost of illumination module, installation cost.
5. heat dissipating layer is set on fast-assembling bracket, can quick heat radiating.
Accompanying drawing explanation
Fig. 1 is LED panel internal structure schematic diagram.
Fig. 2 is the LED panel structural representation prepared.
Fig. 3 is car headlamp module preparation technology flow chart.
Fig. 4 is LED panel and lead plate connection diagram.
Fig. 5 independently derives wire schematic below metal heat sink in LED panel.
Fig. 6 a is the front view of fast-assembling bracket.
Fig. 6 b is the profile of Fig. 6 a.
Fig. 7 a and Fig. 7 b is that car headlamp module realizes light transition diagram.
The control logic chart of LED chip in LED panel when Fig. 8 is cool colour temperature dipped headlights.
Fig. 9 be cool colour temperature dipped headlights when light filling of turning right (highlighting) in LED panel LED chip light logic chart.
Shown in figure:
null1-LED panel，11-PCB wiring board，12-metal guide line segment，121-metal guide line segment extended electrode joint，13-metal heat sink，14-LED chip，15-box dam，16-cool colour temperature fluorescent material plastic packaging layer of silica gel，17-warm colour temperature fluorescent material plastic packaging layer of silica gel，161-microlens array，18-is welded in the electric wire below metal heat sink，21-metal guide line segment "-" end，22-metal guide line segment "+" end，The fluorescent powder silica gel adhesive dispensing device that 51-changes in temperature colour temperature is alternate，61-microlens array template，71-fast-assembling bracket，711-fast-assembling bracket side lead-in wire conduit，712-fast-assembling bracket side conduit，713-heat dissipating layer，72-lead plate，721-lead plate electrode interface，73-connects the electric wire of external power source，81-bracket base.
Detailed description of the invention
Come that the present invention will be further described in detail below.
A kind of car headlamp module realizing light switching and brightness regulation, including fast-assembling bracket 71, LED panel 1, lead plate 72, bracket base 81 and electric wire (containing the electric wire 18 being welded in below metal heat sink and the electric wire 73 connecting external power source).
As it is shown in figure 1, LED chip 14 is distributed as 10 × 5 array distribution in described LED panel 1,10 is line number, and 5 is columns；10 × 5 described array distribution LED chips are that the series connection of single file multiple spot controls to connect, wherein single file controls to be connected as in 10 × 5 arrays each row and can individually control whether to connect, the LED chip that multiple spot series connection controls to be connected as on single file connecting to access can increase according to the metal heat sink position turned on or reduce the LED chip quantity of connection in order successively, each of which row LED chip is sequentially connected in series, and the metal guide line segment at the 1st LEDs chip place is outward extended with metal guide line segment extended electrode joint 121 on this row, this metal guide line segment extended electrode joint 121 is corresponding with lead plate electrode interface 721 to be connected, lead plate external power supply.The LED chip of series connection in above-mentioned every a line, it is welded with electric wire as independent derived circuit below the metal heat sink 13 at the n-electrode pad place of each LEDs chip, when electric wire below the 1st metal heat sink turns on, 1st LEDs chip is connected, all the other 4 chips disconnect, when electric wire below the 2nd metal heat sink turns on, 1st, the 2nd LEDs chip is connected, all the other 3 LEDs chips disconnect, by that analogy, can increase or reduce the LED chip quantity connected in order successively according to the metal heat sink position turned on, as shown in Figure 4,5.
Described LED panel 1, its LED chip 14 is flip-over type LED chip, and the p/n electrode of chip is positioned below the same side.
Described LED panel 1, including PCB 11, PCB 11 has been sequentially arranged 10 row metal wires, same row metal wire is divided into 6 to be interrupted and the metal guide line segment 12 of mutual insulating according to LED chip installation site, with a line neighboring metallic wires section 12 spacing distance less than or equal to flip-over type LED chip p/n electrode.
Described same row metal wire, as shown in Figure 3,2nd the "-" end 21 to the 5th metal guide line segment of this row metal wire embeds metal heat sink 13, its metal heat sink 13 is positioned at the n-electrode pad place of LED chip and runs through PCB, it is welded with electric wire below metal heat sink 13, the 1st to the 4th metal guide line segment "+" end 22 is as the p-electrode pad of adjacent LED chip.
As shown in Figure 2, the fluorescent material plastic packaging layer of silica gel that the changes in temperature colour temperature with microlens array is alternate is covered above described LED panel 1, wherein cool colour temperature fluorescent material plastic packaging layer of silica gel 16 is positioned at the odd number row of 10 × 5 arrays, and warm colour temperature fluorescent material plastic packaging layer of silica gel 17 is positioned at even number line.
The fluorescent material plastic packaging layer of silica gel that the described changes in temperature colour temperature with microlens array 161 is alternate, its microlens shape is hemisphere.
As shown in Figure 4, described fast-assembling bracket 71 is positive six prisms, has 6 sides, and side is bilateral is provided with conduit, is wherein installed with lead plate 72 in lead-in wire conduit, lead plate 72 is provided with lead plate electrode interface 721, and electrode interface quantity is 10.
As shown in figure 6 a and 6b, the fast-assembling bracket outer surface of positive six prisms is covered with heat dissipating layer 713, and heat dissipating layer preparation method can be spraying, brush or dip coating manner, and the will that heat dissipating layer raw material is commercial contains board ZS-411 type heat loss through radiation High tailored coating；This heat dissipating layer can reduce the temperature of car headlamp module 5%～10%.
The preparation method of a kind of car headlamp module realizing light switching and brightness regulation, as it is shown on figure 3, its preparation technology is: S1. arranges 10 × 6 metal guide line segments 12 according to designing requirement in PCB 11；S2. hole is got through at the 2nd of every a line the to the 5th metal guide line segment "-" end 21；S3. metal heat sink 13 is embedded in above-mentioned through hole；S4. flip-over type LED chip 14 is welded on counter electrode pin place；S5. the fluorescent powder silica gel that instillation changes in temperature colour temperature is alternate in box dam 15；S6. heat and when making silica gel reach semi-cured state, use microlens array template 61 that silica gel carries out impressing plastic packaging further curing molding；S7. at the heat sink 13 place's welding electric wires of above-mentioned LED panel 1 back side respective metal；S8. 6 LED panel 1 are mounted on fast-assembling bracket 71, and lead plate 72 is installed；S9., electric wire and bracket base 81 are installed, thus preparing the car headlamp module that can realize light switching and brightness regulation.
A kind of control method of the car headlamp module realizing light switching and brightness regulation, as illustrated in figs. 7 a and 7b, it realizes light conversion and brightness regulation control logic is: P1. realizes long-and-short distant light switching: the 1st to the 5th row in LED panel, namely region, ABCA ' B ' C ' face is to control dipped headlights, 6th walks to the 10th row, and namely region, DEFD ' E ' F ' face is to control high beam.P2. the switching of changes in temperature colour temperature light is realized: LED panel is cool colour temperature light when connection odd number row LED chip, disconnection even number line LED chip；And be warm colour temperature light when disconnecting odd number row LED chip, connection even number line LED chip.P3. brightness regulation is realized: in the ordinary course of things during open cold colour temperature dipped headlights, in LED panel chip controls logic chart as shown in Figure 8 (in figure numeral " 1 " represent connect, numeral " 0 " represent disconnect), wherein AA ' BB ' CC ' face odd number row each row only connects 3 row LED chips, and region, high beam DEFD ' E ' F ' face is off-state entirely.And when automobile turn right needs blind area, right side is carried out light filling time, needs highlight, now in LED panel, LED chip controls logic chart as shown in Figure 9, wherein odd number row whole LED chip in A ' BB ' C face is connected, 3 row LED chips are still connected for odd number row each row in AC ' face, and region, DEFD ' E ' F ' face is still off-state.
Above-described embodiment is the present invention preferably embodiment; but embodiments of the present invention are also not restricted to the described embodiments; the change made under other any spirit without departing from the present invention and principle, modification, replacement, combination, simplification; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1. the car headlamp module that can realize light switching and brightness regulation, it is characterised in that: include fast-assembling bracket, LED panel, lead plate, bracket base and electric wire；LED panel and lead plate connect, and LED panel is arranged on fast-assembling bracket, and fast-assembling bracket is arranged on bracket base；LED chip in LED panel is distributed as M N array distribution, and M is line number, and N is columns, and M, N are all higher than being equal to 2；M N array distribution LED chip is that the series connection of single file multiple spot controls to connect, wherein single file controls to be connected as the independent break-make of each row, and the LED chip that multiple spot series connection controls to be connected as on single file connecting accessing increases successively in order according to the electrode position of the LED chip turned on or reduces the LED chip quantity connected.
2. a kind of car headlamp module realizing light switching and brightness regulation described in claim 1, it is characterised in that: described LED chip is flip-over type LED chip, the same side that the p/n electrode of LED chip is positioned below.
3. a kind of car headlamp module realizing light switching and brightness regulation described in claim 2, it is characterised in that: described LED panel includes PCB；PCB has been sequentially arranged M row metal wire, same row metal wire is divided into N+1 to be interrupted and the metal guide line segment of mutual insulating according to LED chip installation site, with the distance of a line neighboring metallic wires intersegmental distance p-electrode less than or equal to flip-over type LED chip and n-electrode.
4. a kind of car headlamp module realizing light switching and brightness regulation described in claim 3, it is characterized in that: in same row metal wire, 2nd the "-" end to n-th metal guide line segment embeds metal heat sink, metal heat sink is positioned at the n-electrode pad place of LED chip and runs through PCB, be welded with electric wire below metal heat sink, the 1st to the N-1 metal guide line segment "+" end is as the p-electrode pad of adjacent LED chip.
5. a kind of car headlamp module realizing light switching and brightness regulation described in claim 1, it is characterized in that: described LED panel is provided with box dam, in box dam, be filled with the fluorescent material plastic packaging layer of silica gel that the changes in temperature colour temperature with microlens array covering LED chip is alternate；Wherein when the fluorescent material plastic packaging layer of silica gel of warm colour temperature is positioned at the odd number row of M N array distribution LED chip, the fluorescent material plastic packaging layer of silica gel of cool colour temperature is positioned at even number line；And when the fluorescent material plastic packaging layer of silica gel of warm colour temperature is positioned at the even number line of M N array distribution LED chip, the fluorescent material plastic packaging layer of silica gel of cool colour temperature is positioned at odd number row.
6. a kind of car headlamp module realizing light switching and brightness regulation described in claim 5, it is characterized in that: in the microlens array of described fluorescent material plastic packaging layer of silica gel, microlens shape is spheroid, cone, cylinder, prism or pyramid.
7. a kind of car headlamp module realizing light switching and brightness regulation described in claim 1, it is characterized in that: described fast-assembling bracket has at least three side, each side is equipped with two and inserts the conduit installed for LED panel, wherein a conduit is lead-in wire conduit, in lead-in wire conduit, lead plate is installed, lead plate is provided with the electrode interface that individual and LED panel the M row LED chip of M connects.
8. a kind of car headlamp module realizing light switching and brightness regulation described in claim 1, it is characterised in that: the outer surface of described fast-assembling bracket is coated with the heat dissipating layer by spraying, brush or dip coating manner adhering to.
9. the preparation method of a kind of car headlamp module realizing light switching and brightness regulation according to any one of claim 1 to 8, it is characterised in that: comprise the steps:
S1. in PCB, arrange M × (N+1) section metal guide line segment；
S2. hole is got through at the "-" end of 2 to the n-th metal guide line segment of every a line；
S3. metal heat sink is embedded in through hole；
S4. flip-over type LED chip is welded on PCB counter electrode pin place；
S5. the fluorescent powder silica gel that instillation changes in temperature colour temperature is alternate in box dam；
S6. heat and when making fluorescent powder silica gel reach semi-cured state, use microlens array template that fluorescent powder silica gel carries out impressing plastic packaging further curing molding；
S7. at LED panel back side respective metal heat sink place's welding electric wire；
S8. the LED panel of respective numbers is mounted on fast-assembling bracket, and lead plate is installed；
S9., electric wire and bracket base are installed.
10. the control method of a kind of car headlamp module realizing light switching and brightness regulation according to any one of claim 1 to 8, it is characterized in that: the control logic realizing light switching and brightness regulation is: P1. realizes long-and-short distant light switching: in LED panel, the 1st is control dipped headlights to M/2 row, and it is control high beam that M/2+1 walks to M row；
P2. the switching of changes in temperature colour temperature light is realized: LED panel is cool colour temperature light by the line number of the fluorescent powder silica gel plastic packaging of cool colour temperature, the line number of the fluorescent powder silica gel plastic packaging of warm colour temperature is warm colour temperature light；
P3. brightness regulation is realized: in the ordinary course of things, before the LED chip connected with a line in LED panel is, (50%～70%) × N arranges, when needs increase brightness, after continuing to turn on same a line, (30%～50%) × N row chip carries out light filling, when needs weaken brightness, then only connect (30%～50%) × N row before same a line, wherein, (50%～70%) × N and the equal round numbers of (30%～50%) × N.
Priority Applications (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488104A (en) * | 2016-12-23 | 2017-03-08 | 广州市锐星信息科技有限公司 | A smart micro-recorder |
| CN110375280A (en) * | 2019-07-22 | 2019-10-25 | 嘉兴咩哞贸易有限公司 | A kind of semiconductor light-emitting-diode dispatching management information system for color change |
| CN110878931A (en) * | 2018-09-06 | 2020-03-13 | 廊坊广通电子设备有限公司 | A car light based on Micro LED technology |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1865764A (en) * | 2005-05-02 | 2006-11-22 | 西铁城电子股份有限公司 | Led illumination lamp device |
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN202140941U (en) * | 2011-06-14 | 2012-02-08 | 芜湖安瑞光电有限公司 | Light-emitting diode (LED) automotive lamp with adjustable color temperature |
| CN103968311A (en) * | 2013-02-04 | 2014-08-06 | 刘胜 | LED vehicle lighting light source with elongated light emitting area |
| CN204227259U (en) * | 2014-09-11 | 2015-03-25 | 天津港第一港埠有限公司 | Tractor headlight lighting device |
-
2016
- 2016-05-20 CN CN201610339022.XA patent/CN105782854B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1865764A (en) * | 2005-05-02 | 2006-11-22 | 西铁城电子股份有限公司 | Led illumination lamp device |
| CN202140941U (en) * | 2011-06-14 | 2012-02-08 | 芜湖安瑞光电有限公司 | Light-emitting diode (LED) automotive lamp with adjustable color temperature |
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN103968311A (en) * | 2013-02-04 | 2014-08-06 | 刘胜 | LED vehicle lighting light source with elongated light emitting area |
| CN204227259U (en) * | 2014-09-11 | 2015-03-25 | 天津港第一港埠有限公司 | Tractor headlight lighting device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488104A (en) * | 2016-12-23 | 2017-03-08 | 广州市锐星信息科技有限公司 | A smart micro-recorder |
| CN110878931A (en) * | 2018-09-06 | 2020-03-13 | 廊坊广通电子设备有限公司 | A car light based on Micro LED technology |
| CN110375280A (en) * | 2019-07-22 | 2019-10-25 | 嘉兴咩哞贸易有限公司 | A kind of semiconductor light-emitting-diode dispatching management information system for color change |
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