CN105782854B - Car headlamp mould group of a kind of achievable light switching and brightness regulation and preparation method thereof, control method - Google Patents
Car headlamp mould group of a kind of achievable light switching and brightness regulation and preparation method thereof, control method Download PDFInfo
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- CN105782854B CN105782854B CN201610339022.XA CN201610339022A CN105782854B CN 105782854 B CN105782854 B CN 105782854B CN 201610339022 A CN201610339022 A CN 201610339022A CN 105782854 B CN105782854 B CN 105782854B
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- silica gel
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- 230000033228 biological regulation Effects 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title abstract description 10
- 238000009826 distribution Methods 0.000 claims abstract description 8
- 238000004070 electrodeposition Methods 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000000741 silica gel Substances 0.000 claims description 33
- 229910002027 silica gel Inorganic materials 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 31
- 238000004806 packaging method and process Methods 0.000 claims description 26
- 239000004020 conductor Substances 0.000 claims description 21
- 238000009434 installation Methods 0.000 claims description 12
- 230000001680 brushing effect Effects 0.000 claims description 3
- 238000003618 dip coating Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- XNMARPWJSQWVGC-UHFFFAOYSA-N 2-[3-[11-[[5-(dimethylamino)naphthalen-1-yl]sulfonylamino]undecanoylamino]propoxy]-4-[(5,5,8,8-tetramethyl-6,7-dihydronaphthalene-2-carbonyl)amino]benzoic acid Chemical compound CC1(C)CCC(C)(C)C=2C1=CC(C(=O)NC=1C=C(C(=CC=1)C(O)=O)OCCCNC(=O)CCCCCCCCCCNS(=O)(=O)C1=C3C=CC=C(C3=CC=C1)N(C)C)=CC=2 XNMARPWJSQWVGC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
Abstract
The present invention relates to a kind of achievable light switching and the car headlamp mould groups of brightness regulation, including fast-assembling bracket, LED panel, lead plate, bracket base and electric wire；LED panel and lead plate connect, and LED panel is mounted on fast-assembling bracket, and fast-assembling bracket is mounted on bracket base；LED chip in LED panel is distributed as M N array distribution, and M is line number, and N is columns, and M, N are all larger than equal to 2；M N array is distributed LED chip for the connection of uniline multiple spot series control, wherein uniline control is connected as the independent on-off of every row, and multiple spot series control be connected as connecting on the uniline LED chip of access successively increases or reduces in order the LED chip quantity of connection according to the electrode position of the LED chip be connected.Further relate to the preparation method and control method of the car headlamp mould group of a kind of achievable light switching and brightness regulation.The present invention has structure simple, easy to control, belongs to automotive headlamps technical field.
Description
Technical field
The present invention relates to a kind of car headlamps, specifically, are related to a kind of achievable light switching and brightness regulation
Car headlamp mould group and preparation method thereof, control method.
Background technique
As the eyes of automobile, car headlamp is not only the important component of car configuration, even more and night
Safe driving under driving or severe weather conditions is closely bound up.It is developed so far from 20th century, car headlamp have passed through kerosene
Lamp, incandescent lamp, halogen vehicle lamp, xenon headlight, LED headlamp and the laser of forefront headlight.In 2008, Audi R8 at
For in the world first equip the volume production vehicle of full LED car lamp, distance-light, steering, daytime running lamps lamp headlight illumination function
LED element can be used.
However, the commercialized automotive LED headlamp of volume production is made of more freestanding LED components at present, shine
Bright modular structure is complicated, and manufacture, installation cost are high, and occupied space is big, more demanding to heat dissipation, electrical control etc., therefore, LED
Headlight is more applied in the vehicle of middle and high end.
Summary of the invention
For the technical problems in the prior art, the object of the present invention is to provide a kind of achievable light switching and
Car headlamp mould group of brightness regulation and preparation method thereof, control method pass through uniline multiple spot series control multi-panel multi-chip
Array, compact, control are flexible.
In order to achieve the above object, the present invention adopts the following technical scheme:
A kind of car headlamp mould group of achievable light switching and brightness regulation, including fast-assembling bracket, LED panel, draw
Line plate, bracket base and electric wire；LED panel and lead plate connect, and LED panel is mounted on fast-assembling bracket, fast-assembling bracket installation
On bracket base；LED chip in LED panel is distributed as M N array distribution, and M is line number, and N is columns, and M, N are all larger than
Equal to 2；It is that uniline multiple spot series control connects that M N array, which is distributed LED chip, and wherein uniline controls and is connected as every row and individually leads to
It is disconnected, multiple spot series control be connected as connecting on uniline access LED chip according to the electrode position of the LED chip be connected by suitable
Sequence successively increases or reduces the LED chip quantity connected.
LED chip is flip-over type LED chip, underlying the same side of p/n electrode of LED chip.
LED panel includes PCB circuit board；M row metal conducting wire, same row metal conducting wire have been sequentially arranged in PCB circuit board
It is divided into the plain conductor section of N+1 interruption and mutual insulating according to LED chip installation site, between a line neighboring metallic wires section
Distance is less than or equal to the p-electrode of flip-over type LED chip and the distance of n-electrode.
In same row metal conducting wire, the 2nd to n-th plain conductor section "-" end is embedded in metal heat sink, metal heat sink position
At the n-electrode pad of LED chip and run through PCB circuit board, electric wire, the 1st to the N-1 gold are welded with below metal heat sink
Belong to p-electrode pad of the "+" end of conducting line segment as adjacent LED chip.
LED panel is equipped with box dam, the changes in temperature colour temperature phase with microlens array filled with covering LED chip in box dam
Between fluorescent powder plastic packaging layer of silica gel；Wherein when the fluorescent powder plastic packaging layer of silica gel of warm colour temperature is located at M N array distribution LED chip
When singular row, the fluorescent powder plastic packaging layer of silica gel of cool colour temperature is located at even number line；And when the fluorescent powder plastic packaging layer of silica gel of warm colour temperature is located at M
When × N array is distributed the even number line of LED chip, the fluorescent powder plastic packaging layer of silica gel of cool colour temperature is located at singular row.
In the microlens array of fluorescent powder plastic packaging layer of silica gel, microlens shape is sphere, cone, cylindrical body, prism
Or pyramid.
Fast-assembling bracket has at least three sides, and each side is equipped with two conduits for LED panel insertion installation,
In conduit be lead conduit, lead plate is installed in lead conduit, the M row of M and LED panel is disposed on lead plate
The electrode interface that LED chip connects.
The outer surface of fast-assembling bracket is covered with the heat dissipating layer adhered to by spraying, brushing or dip coating manner.
A kind of preparation method of the car headlamp mould group of achievable light switching and brightness regulation, includes the following steps:
S1. M × (N+1) section plain conductor section is arranged in PCB circuit board；S2. in every a line the 2nd to n-th plain conductor section
Hole is got through at "-" end；S3. metal heat sink is embedded in through-hole；S4. flip-over type LED chip is welded on PCB circuit board counter electrode
At pin；S5. the alternate fluorescent powder silica gel of instillation changes in temperature colour temperature in box dam；S6. heating makes fluorescent powder silica gel reach semi-solid preparation
Coining plastic packaging and further curing molding are carried out to fluorescent powder silica gel using microlens array template when state；S7. in LED panel
Place's welding wire that back side respective metal is heat sink；S8. the LED panel of respective numbers is installed to fast-assembling bracket, and lead is installed
Plate；S9., electric wire and bracket base are installed.
A kind of control method of the car headlamp mould group of achievable light switching and brightness regulation, realize light switching and
The control logic of brightness regulation are as follows: P1. realizes long-and-short distant light switching: the 1st is to control dipped headlight to M/2 row in LED panel, the
M/2+1 row to M row is control high beam；P2. the switching of changes in temperature colour temperature light is realized: by the fluorescent powder of cool colour temperature in LED panel
The line number of silica gel plastic packaging is cool colour temperature light, and the line number by the fluorescent powder silica gel plastic packaging of warm colour temperature is warm colour temperature light；P3. it realizes
Brightness regulation: under normal circumstances, (50%~70%) × N is arranged before the LED chip connected in LED panel with a line is, when need
When increasing brightness, (30%~50%) × N column chip carries out light filling after continuing to turn on same a line, when needing to weaken brightness,
(30%~50%) × N is arranged before then only connecting same a line, wherein (50%~70%) × N and (30%~50%) × N are rounded
Number.Wherein, the first row refers to a line far from bracket base.M/2 takes positive integer, when it is decimal, then takes closest
Any one of two integers.
The principle of the present invention is:
LED panel is equipped with the LED chip of M N array distribution, and LED chip is the connection of uniline multiple spot series control.Uniline
Control is connected as every row LED chip and is individually connected to power supply, individually controls the on-off of every row LED chip, is achieved in nearly distance light
The switching of lamp or the switching of changes in temperature color temperature lamp.The LED chip that multiple spot series control is connected as uniline is arranged successively, according to being connected
LED chip electrode the quantity of LED chip that powers on of position control series connection, be achieved in brightness regulation.
Flip-over type LED chip is welded in PCB circuit board, and the n-electrode of LED chip passes through the electric wire of metal heat sink and the back side
Connection access control circuit realizes multiple spot series control.
The alternate fluorescent powder plastic packaging layer of silica gel of changes in temperature colour temperature is covered in LED panel, the uniline control of cooperated with LED chip is real
The control of existing changes in temperature colored lights.
Using more side formula fast-assembling brackets, LED panel is to realize in the conduit that LED chip is inserted into side in a manner of outwardly
Board plug type Fast Installation.Preferably, fast-assembling bracket is positive prismatic, and side is located on the side of regular prism.
Generally speaking, the present invention has the advantage that
1. automobile headlamp light switching and brightness control function can be realized.
2. the changes in temperature lamp handoff functionality of automobile headlamp light can be realized.
3. small in size, brightness is high, can multifaceted light-emitting.
4. structure is simple, easy for installation, manufacturing cost, the installation cost of illumination module are reduced.
5. heat dissipating layer is set on fast-assembling bracket, it can rapid cooling.
Detailed description of the invention
Fig. 1 is LED panel schematic diagram of internal structure.
Fig. 2 is the LED panel structural schematic diagram for preparing completion.
Fig. 3 is car headlamp mould group preparation technology flow chart.
Fig. 4 is LED panel and lead plate connection schematic diagram.
Fig. 5 is independently to export wire schematic in LED panel below metal heat sink.
Fig. 6 a is the main view of fast-assembling bracket.
Fig. 6 b is the sectional view of Fig. 6 a.
Fig. 7 a and Fig. 7 b are that car headlamp mould group realizes light transition diagram.
When Fig. 8 is cool colour temperature dipped headlight in LED panel LED chip control logic figure.
Fig. 9 is that at light filling of turning right (highlighting), LED chip lights logic chart to cool colour temperature dipped headlight in LED panel.
It is shown in figure:
1-LED panel, 11-PCB wiring board, 12- plain conductor section, 121- plain conductor section extended electrode connector, 13- gold
Belong to heat sink, 14-LED chip, 15- box dam, 16- cool colour temperature fluorescent powder plastic packaging layer of silica gel, 17- warm colour temperature fluorescent powder plastic packaging silica gel
Layer, 161- microlens array, 18- are welded in the electric wire below metal heat sink, 21- plain conductor section "-" end, 22- plain conductor section
"+" end, the alternate fluorescent powder silica gel adhesive dispensing device of 51- changes in temperature colour temperature, 61- microlens array template, 71- fast-assembling bracket, 711- are fast
Dress side face lead conduit, 712- fast-assembling bracket side conduit, 713- heat dissipating layer, 72- lead plate, 721- lead plate electrode connect
Mouthful, the electric wire of 73- connection external power supply, 81- bracket base.
Specific embodiment
It is next below that the present invention will be further described in detail.
A kind of car headlamp mould group of achievable light switching and brightness regulation, including fast-assembling bracket 71, LED panel 1,
Lead plate 72, bracket base 81 and electric wire (electric wire 73 containing the electric wire 18 and connection external power supply that are welded in below metal heat sink).
As shown in Figure 1, LED chip 14 is distributed as 10 × 5 array distributions in the LED panel 1,10 be line number, and 5 be column
Number；10 × 5 array distribution LED chips are the connection of uniline multiple spot series control, and wherein uniline control is connected as 10 × 5 times
Whether every row can be controlled separately connection in column, multiple spot series control be connected as connecting on uniline access LED chip according to being led
Logical metal heat sink position can successively increase or reduce in order connect LED chip quantity, wherein every a line LED chip be according to
It is secondary concatenated, and the plain conductor section on the row where the 1st LED chip is outward extended with plain conductor section extended electrode connector
121, which is correspondingly connected with lead plate electrode interface 721, lead plate external power supply.On
Concatenated LED chip in every a line is stated, electric wire work is welded with below the metal heat sink 13 at the n-electrode pad of each LED chip
It is independent derived circuit, when the electric wire below the 1st metal heat sink is connected, the 1st LED chip is connected, remaining 4 chips
It disconnecting, when the electric wire below the 2nd metal heat sink is connected, the 1st, the connection of the 2nd LED chip, remaining 3 LED chip are disconnected,
And so on, the LED chip quantity connected can be successively increased or reduced in order according to the metal heat sink position be connected, such as schemed
4, shown in 5.
The LED panel 1, LED chip 14 are flip-over type LED chips, and the p/n electrode of chip is located below same
Side.
The LED panel 1, including PCB circuit board 11 have been sequentially arranged 10 row metal conducting wires in PCB circuit board 11, together
A line plain conductor is divided into the plain conductor section 12 of 6 interruptions and mutual insulating according to LED chip installation site, adjacent with a line
Distance is less than or equal to the distance of flip-over type LED chip p/n electrode between plain conductor section 12.
The same row metal conducting wire, as shown in figure 3, the 2nd of the row metal conducting wire to the 5th plain conductor section
"-" end 21 is embedded in metal heat sink 13, and metal heat sink 13 is located at the n-electrode pad of LED chip and runs through PCB circuit board,
Electric wire is welded with below metal heat sink 13, the 1st to the 4th plain conductor section "+" end 22 is welded as the p-electrode of adjacent LED chip
Disk.
As shown in Fig. 2, the fluorescent powder that covering has the changes in temperature colour temperature of microlens array alternate above the LED panel 1
Plastic packaging layer of silica gel, wherein cool colour temperature fluorescent powder plastic packaging layer of silica gel 16 is located at the singular row of 10 × 5 arrays, warm colour temperature fluorescent powder plastic packaging
Layer of silica gel 17 is located at even number line.
The alternate fluorescent powder plastic packaging layer of silica gel of the changes in temperature colour temperature with microlens array 161, microlens shape
For hemisphere.
As shown in figure 4, the fast-assembling bracket 71 is regular hexagonal prism, there are 6 sides, side is bilateral to be equipped with conduit,
Lead plate 72 is installed in middle one side lead conduit, lead plate electrode interface 721, electrode interface quantity are disposed on lead plate 72
It is 10.
As shown in figure 6 a and 6b, the fast-assembling bracket outer surface of regular hexagonal prism is covered with heat dissipating layer 713, heat dissipating layer preparation method
It can be that commercially available will contains board ZS-411 type heat loss through radiation High tailored coating for spraying, brushing or dip coating manner, heat dissipating layer raw material；This is dissipated
Thermosphere can reduce the temperature of car headlamp mould group 5%~10%.
The preparation method of the car headlamp mould group of a kind of achievable light switching and brightness regulation, as shown in figure 3, it is made
Standby technique are as follows: S1. arranges 10 × 6 plain conductor sections 12 according to design requirement in PCB circuit board 11；S2. the 2nd of every a line the
Hole is got through to the 5th plain conductor section "-" end 21；S3. metal heat sink 13 is embedded in above-mentioned through-hole；S4. by flip-over type LED core
Piece 14 is welded at counter electrode pin；S5. the alternate fluorescent powder silica gel of instillation changes in temperature colour temperature in box dam 15；S6. heating makes
Coining plastic packaging and further curing molding are carried out to silica gel using microlens array template 61 when silica gel reaches semi-cured state；
S7. the welding wire at above-mentioned 1 back side respective metal heat sink 13 of LED panel；S8. by 6 installations of LED panel 1 to fast-assembling bracket
On 71, and lead plate 72 is installed；S9. installation electric wire and bracket base 81, so that achievable light switching and brightness regulation be made
Car headlamp mould group.
The control method of the car headlamp mould group of a kind of achievable light switching and brightness regulation, such as Fig. 7 a and 7b institute
Show, realize light conversion and brightness regulation control logic are as follows: P1. realizes long-and-short distant light switching: the 1st to the 5th in LED panel
Row, the i.e. face ABCA ' B ' C ' region are control dipped headlights, and the 6th row to the 10th row, the i.e. face DEFD ' E ' F ' region are control high beams.
P2. it realizes the switching of changes in temperature colour temperature light: being cool colour when connecting singular row LED chip in LED panel, disconnecting even number line LED chip
Warm light；It and is warm colour temperature light when disconnecting singular row LED chip, connecting even number line LED chip.P3. brightness regulation is realized:
When opening cool colour temperature dipped headlight under normal circumstances, chip controls logic chart (digital " 1 " table in figure as shown in Figure 8 in LED panel
Show that connection, number " 0 " indicate to disconnect), wherein the face AA ' BB ' CC ' the every row of odd number row only connects 3 column LED chips, high beam DEFD '
The face E ' F ' region is all off-state.And when automobile turns right needs to right side blind area progress light filling, it needs to highlight, at this time
LED chip control logic figure in LED panel is as shown in figure 9, wherein odd number row whole LED chip in the face A ' BB ' C is connected, and the face AC ' is still
3 column LED chips are connected for the every row of singular row, and the face E ' F ' DEFD ' region is still off-state.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (8)
1. the car headlamp mould group of a kind of achievable light switching and brightness regulation, it is characterised in that: including fast-assembling bracket,
LED panel, lead plate, bracket base and electric wire；LED panel and lead plate connect, and LED panel is mounted on fast-assembling bracket, fastly
Dress bracket is mounted on bracket base；LED chip in LED panel is distributed as M N array distribution, and M is line number, and N is columns,
And M, N are all larger than equal to 2；M N array is distributed LED chip for the connection of uniline multiple spot series control, and wherein uniline control is connected as
Every independent on-off of row, is achieved in the switching of nearly high beam or the switching of changes in temperature color temperature lamp, multiple spot series control are connected as uniline
The LED chip of upper series connection access successively increases or reduces in order the LED connected according to the electrode position of the LED chip be connected
Number of chips is achieved in brightness regulation；
The LED panel is equipped with box dam, the changes in temperature colour temperature phase with microlens array filled with covering LED chip in box dam
Between fluorescent powder plastic packaging layer of silica gel；Wherein when the fluorescent powder plastic packaging layer of silica gel of warm colour temperature is located at M N array distribution LED chip
When singular row, the fluorescent powder plastic packaging layer of silica gel of cool colour temperature is located at even number line；And when the fluorescent powder plastic packaging layer of silica gel of warm colour temperature is located at M
When × N array is distributed the even number line of LED chip, the fluorescent powder plastic packaging layer of silica gel of cool colour temperature is located at singular row；
Realize the control logic of light switching and brightness regulation are as follows:
P1. realize long-and-short distant light switching: the 1st is control dipped headlight to M/2 row in LED panel, and M/2+1 row to M row is
Control high beam；
P2. it realizes the switching of changes in temperature colour temperature light: by the line number of the fluorescent powder silica gel plastic packaging of cool colour temperature being cold color temperature lamp in LED panel
Light, the line number by the fluorescent powder silica gel plastic packaging of warm colour temperature are warm colour temperature light；
P3. realize brightness regulation: under normal circumstances, in LED panel with a line connect LED chip be before (50%~70%)
× N column, when needing to increase brightness, (30%~50%) × N column chip carries out light filling after continuing to turn on same a line, when needs subtract
When weak brightness, then (30%~50%) × N is arranged before only connecting same a line, wherein (50%~70%) × N and (30%~50%)
The equal round numbers of × N.
2. the car headlamp mould group of a kind of achievable light switching described in accordance with the claim 1 and brightness regulation, feature
Be: the LED chip is flip-over type LED chip, underlying the same side of p/n electrode of LED chip.
3. the car headlamp mould group of a kind of achievable light switching and brightness regulation according to claim 2, feature
Be: the LED panel includes PCB circuit board；M row metal conducting wire, same row metal conducting wire have been sequentially arranged in PCB circuit board
It is divided into the plain conductor section of N+1 interruption and mutual insulating according to LED chip installation site, between a line neighboring metallic wires section
Distance is less than or equal to the p-electrode of flip-over type LED chip and the distance of n-electrode.
4. the car headlamp mould group of a kind of achievable light switching described in accordance with the claim 3 and brightness regulation, feature
Be: in same row metal conducting wire, the 2nd to n-th plain conductor section "-" end is embedded in metal heat sink, and metal heat sink is located at
At the n-electrode pad of LED chip and run through PCB circuit board, is welded with electric wire below metal heat sink, the 1st to the N-1 metal
P-electrode pad of the "+" end of conducting line segment as adjacent LED chip.
5. the car headlamp mould group of a kind of achievable light switching described in accordance with the claim 1 and brightness regulation, feature
Be: in the microlens array of the fluorescent powder plastic packaging layer of silica gel, microlens shape is sphere, cone, cylindrical body, prism
Or pyramid.
6. the car headlamp mould group of a kind of achievable light switching described in accordance with the claim 1 and brightness regulation, feature
Be: the fast-assembling bracket has at least three sides, and each side is equipped with two conduits for LED panel insertion installation,
Wherein a conduit is lead conduit, is equipped with lead plate in lead conduit, and the M row of M and LED panel is disposed on lead plate
The electrode interface that LED chip connects.
7. the car headlamp mould group of a kind of achievable light switching described in accordance with the claim 1 and brightness regulation, feature
Be: the outer surface of the fast-assembling bracket is covered with the heat dissipating layer adhered to by spraying, brushing or dip coating manner.
8. according to the car headlamp of a kind of achievable light switching and brightness regulation described in any one of claims 1 to 7
The preparation method of mould group, characterized by the following steps:
S1. M × (N+1) section plain conductor section is arranged in PCB circuit board；
S2. hole is got through to the "-" end of n-th plain conductor section in the 2nd in every a line；
S3. metal heat sink is embedded in through-hole；
S4. flip-over type LED chip is welded at PCB circuit board counter electrode pin；
S5. the alternate fluorescent powder silica gel of instillation changes in temperature colour temperature in box dam；
S6. heating imprints fluorescent powder silica gel using microlens array template to fluorescent powder silica gel when reaching semi-cured state
Plastic packaging and further curing molding；
S7. in the heat sink place's welding wire of LED panel back side respective metal；
S8. the LED panel of respective numbers is installed to fast-assembling bracket, and lead plate is installed；
S9., electric wire and bracket base are installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610339022.XA CN105782854B (en) | 2016-05-20 | 2016-05-20 | Car headlamp mould group of a kind of achievable light switching and brightness regulation and preparation method thereof, control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610339022.XA CN105782854B (en) | 2016-05-20 | 2016-05-20 | Car headlamp mould group of a kind of achievable light switching and brightness regulation and preparation method thereof, control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105782854A CN105782854A (en) | 2016-07-20 |
| CN105782854B true CN105782854B (en) | 2019-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610339022.XA Active CN105782854B (en) | 2016-05-20 | 2016-05-20 | Car headlamp mould group of a kind of achievable light switching and brightness regulation and preparation method thereof, control method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488104A (en) * | 2016-12-23 | 2017-03-08 | 广州市锐星信息科技有限公司 | A kind of intelligent micro- record instrument |
| CN110878931A (en) * | 2018-09-06 | 2020-03-13 | 廊坊广通电子设备有限公司 | A car light based on Micro LED technology |
| CN110375280A (en) * | 2019-07-22 | 2019-10-25 | 嘉兴咩哞贸易有限公司 | A kind of semiconductor light-emitting-diode dispatching management information system for color change |
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| CN1865764A (en) * | 2005-05-02 | 2006-11-22 | 西铁城电子股份有限公司 | Led illumination lamp device |
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN202140941U (en) * | 2011-06-14 | 2012-02-08 | 芜湖安瑞光电有限公司 | Light-emitting diode (LED) automotive lamp with adjustable color temperature |
| CN103968311A (en) * | 2013-02-04 | 2014-08-06 | 刘胜 | LED vehicle lighting light source with elongated light emitting area |
| CN204227259U (en) * | 2014-09-11 | 2015-03-25 | 天津港第一港埠有限公司 | Tractor headlight lighting device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1865764A (en) * | 2005-05-02 | 2006-11-22 | 西铁城电子股份有限公司 | Led illumination lamp device |
| CN202140941U (en) * | 2011-06-14 | 2012-02-08 | 芜湖安瑞光电有限公司 | Light-emitting diode (LED) automotive lamp with adjustable color temperature |
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN103968311A (en) * | 2013-02-04 | 2014-08-06 | 刘胜 | LED vehicle lighting light source with elongated light emitting area |
| CN204227259U (en) * | 2014-09-11 | 2015-03-25 | 天津港第一港埠有限公司 | Tractor headlight lighting device |
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| CN105782854A (en) | 2016-07-20 |
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