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CN105765093A - 铜合金板、以及具备其的大电流用电子零件及散热用电子零件 - Google Patents

铜合金板、以及具备其的大电流用电子零件及散热用电子零件 Download PDF

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Publication number
CN105765093A
CN105765093A CN201480062948.8A CN201480062948A CN105765093A CN 105765093 A CN105765093 A CN 105765093A CN 201480062948 A CN201480062948 A CN 201480062948A CN 105765093 A CN105765093 A CN 105765093A
Authority
CN
China
Prior art keywords
copper alloy
alloy plate
mass
electronic component
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480062948.8A
Other languages
English (en)
Chinese (zh)
Inventor
柿谷明宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN105765093A publication Critical patent/CN105765093A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN201480062948.8A 2013-11-19 2014-08-29 铜合金板、以及具备其的大电流用电子零件及散热用电子零件 Pending CN105765093A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013239197A JP5632063B1 (ja) 2013-11-19 2013-11-19 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品
JP2013-239197 2013-11-19
PCT/JP2014/072822 WO2015075990A1 (ja) 2013-11-19 2014-08-29 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品

Publications (1)

Publication Number Publication Date
CN105765093A true CN105765093A (zh) 2016-07-13

Family

ID=52145011

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480062948.8A Pending CN105765093A (zh) 2013-11-19 2014-08-29 铜合金板、以及具备其的大电流用电子零件及散热用电子零件

Country Status (5)

Country Link
JP (1) JP5632063B1 (ja)
KR (1) KR101788497B1 (ja)
CN (1) CN105765093A (ja)
TW (1) TWI521073B (ja)
WO (1) WO2015075990A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110592421A (zh) * 2019-10-29 2019-12-20 吉林大学 铜合金、铜合金板材及其制备方法和应用
CN111197127A (zh) * 2018-11-19 2020-05-26 财团法人工业技术研究院 铜锆合金散热元件及铜锆合金壳体的制造方法
CN112281023A (zh) * 2020-11-23 2021-01-29 宁波博威合金材料股份有限公司 一种具有优异折弯性的铜合金材料及其制备方法和应用

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6464740B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP6464742B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP6464741B2 (ja) * 2014-12-26 2019-02-06 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用部品、端子及びバスバー
JP6749121B2 (ja) * 2016-03-30 2020-09-02 Ｊｘ金属株式会社 強度及び導電性に優れる銅合金板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
CN101100712A (zh) * 2007-08-01 2008-01-09 苏州有色金属研究院有限公司 一种抗疲劳的Cu-Ti合金及其生产方法
JP2010215935A (ja) * 2009-03-13 2010-09-30 Mitsubishi Shindoh Co Ltd 銅合金及びその製造方法
JP2010222624A (ja) * 2009-03-23 2010-10-07 Mitsubishi Shindoh Co Ltd 銅合金及びその製造方法
CN102356435A (zh) * 2009-01-26 2012-02-15 古河电气工业株式会社 布线用电线导体、布线用电线导体的制造方法、布线用电线及铜合金线料
JP2012207254A (ja) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp 強度、導電率及び曲げ加工性に優れたチタン銅及びその製造方法
CN103080347A (zh) * 2010-08-27 2013-05-01 古河电气工业株式会社 铜合金板材及其制造方法
CN103380221A (zh) * 2011-02-18 2013-10-30 三菱伸铜株式会社 Cu-Zr系铜合金板及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4157899B2 (ja) 2006-11-17 2008-10-01 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板
JP5312920B2 (ja) 2008-11-28 2013-10-09 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金板又は条
JP5432201B2 (ja) 2011-03-30 2014-03-05 Ｊｘ日鉱日石金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP6188273B2 (ja) 2011-11-18 2017-08-30 Ｊｘ金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
JP5847787B2 (ja) 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
CN101100712A (zh) * 2007-08-01 2008-01-09 苏州有色金属研究院有限公司 一种抗疲劳的Cu-Ti合金及其生产方法
CN102356435A (zh) * 2009-01-26 2012-02-15 古河电气工业株式会社 布线用电线导体、布线用电线导体的制造方法、布线用电线及铜合金线料
JP2010215935A (ja) * 2009-03-13 2010-09-30 Mitsubishi Shindoh Co Ltd 銅合金及びその製造方法
JP2010222624A (ja) * 2009-03-23 2010-10-07 Mitsubishi Shindoh Co Ltd 銅合金及びその製造方法
CN103080347A (zh) * 2010-08-27 2013-05-01 古河电气工业株式会社 铜合金板材及其制造方法
CN103380221A (zh) * 2011-02-18 2013-10-30 三菱伸铜株式会社 Cu-Zr系铜合金板及其制造方法
JP2012207254A (ja) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp 強度、導電率及び曲げ加工性に優れたチタン銅及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111197127A (zh) * 2018-11-19 2020-05-26 财团法人工业技术研究院 铜锆合金散热元件及铜锆合金壳体的制造方法
CN111197127B (zh) * 2018-11-19 2021-03-05 财团法人工业技术研究院 铜锆合金散热元件及铜锆合金壳体的制造方法
CN110592421A (zh) * 2019-10-29 2019-12-20 吉林大学 铜合金、铜合金板材及其制备方法和应用
CN112281023A (zh) * 2020-11-23 2021-01-29 宁波博威合金材料股份有限公司 一种具有优异折弯性的铜合金材料及其制备方法和应用
CN112281023B (zh) * 2020-11-23 2021-08-31 宁波博威合金材料股份有限公司 一种具有优异折弯性的铜合金材料及其制备方法和应用

Also Published As

Publication number Publication date
TW201522671A (zh) 2015-06-16
JP2015098628A (ja) 2015-05-28
WO2015075990A1 (ja) 2015-05-28
KR101788497B1 (ko) 2017-10-19
KR20160088379A (ko) 2016-07-25
JP5632063B1 (ja) 2014-11-26
TWI521073B (zh) 2016-02-11

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20160713