CN105254321B - Ceramic/metal connection method based on Ni B/Ti Transient liquid phase reaction in-situs - Google Patents
Ceramic/metal connection method based on Ni B/Ti Transient liquid phase reaction in-situs Download PDFInfo
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Abstract
基于Ni‑B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它涉及一种钎焊连接方法,本发明要解决现有陶瓷/金属接头强度低、稳定性差的问题。本发明陶瓷/金属连接方法如下:使用电镀或化学镀的方法在Ni箔片表面沉积Ni‑B非晶合金,制成(Ni/Ni‑B)复合箔片,将一定厚度比例的(Ni/Ni‑B)复合箔片和Ti箔片置于被焊金属和陶瓷之间,组成待焊件,放入真空压力烧结炉中焊接,即完成陶瓷/金属的连接。本方法可在陶瓷/金属焊缝中原位产生TiB晶须增强体,有效缓解了接头应力,提高接头强度。使用本方法得到的接头抗剪强度可达92~136MPa,接头强度提高了43%~72%。本方法可用于陶瓷/金属钎焊连接领域。
A ceramic/metal connection method based on Ni-B/Ti instantaneous liquid-phase in-situ reaction relates to a brazing connection method. The invention aims to solve the problems of low strength and poor stability of existing ceramic/metal joints. Ceramic/metal connection method of the present invention is as follows: use the method for electroplating or electroless plating to deposit Ni-B amorphous alloy on the surface of Ni foil, make (Ni/Ni-B) composite foil, (Ni/ Ni‑B) The composite foil and Ti foil are placed between the metal to be welded and the ceramic to form the part to be welded, and put into a vacuum pressure sintering furnace for welding, which completes the ceramic/metal connection. The method can in-situ generate TiB whisker reinforcements in ceramic/metal welds, effectively relieves joint stress and improves joint strength. The shear strength of the joint obtained by using the method can reach 92-136MPa, and the joint strength is increased by 43%-72%. The method can be used in the field of ceramic/metal brazing connections.
Description
技术领域technical field
本发明涉及基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法。The invention relates to a ceramic/metal connection method based on Ni-B/Ti transient liquid-phase in-situ reaction.
背景技术Background technique
陶瓷具有密度低、强度高、耐磨、耐高温、耐腐蚀等诸多优异性能,是军事装备、原子能、化工和汽车等工业领域非常有前途的结构材料。但是由于陶瓷不具有可滑移的位错系统,它的硬度高、脆性大、不易加工成型。为了解决这一问题,工业中常将陶瓷与金属进行连接,将二者制备成复合构件,以发挥陶瓷和金属各自优异的性能。焊接是连接陶瓷和金属最常用的方法,它通过加热或加压的方式,使被焊材料形成原子间的扩散和结合。目前常用的陶瓷/金属焊接方法包括钎焊、扩散焊、自蔓延反应连接、瞬时液相(TLP)扩散连接、激光/电子束焊接等。但无论哪种连接方式,均需要考虑因陶瓷、金属物理性质的不同所带来的残余应力问题。近些年来,研究者主要通过焊接中间层的成分设计和工艺优化来改善接头的性能,其中最具代表性的就是复合钎料法。该方法以活性Ag-Cu-Ti钎料为基体,混入一定比例的陶瓷颗粒、难熔金属颗粒或短纤维等作为第二相增强体。利用增强体自身高模量、低热膨胀系数等特性对焊缝中间层的物理性质进行调节,减少焊缝与陶瓷界面的热膨胀系数差值,进而缓解异种材料接头的残余应力。复合钎料法是一种简单实用的方法,但它在实际应用中也存在一些问题:首先,活性钎料与增强相的机械混合方式会造成增强相在焊缝内部分布不均匀,易团聚;其次,增强相与活性钎料发生复杂化学反应,易生成脆性金属间化合物,对接头性能不利;再次,增强相的加入会降低活性钎料的流动性和润湿性,容易在焊缝内部产生孔洞、未焊合等缺陷。Ceramics have many excellent properties such as low density, high strength, wear resistance, high temperature resistance, and corrosion resistance. They are very promising structural materials in industrial fields such as military equipment, atomic energy, chemical industry, and automobiles. However, since ceramics do not have a dislocation system that can slip, it has high hardness, high brittleness, and is not easy to process and shape. In order to solve this problem, ceramics and metals are often connected in the industry, and the two are prepared into composite components to exert the excellent properties of ceramics and metals. Welding is the most commonly used method to connect ceramics and metals. It uses heat or pressure to make the materials to be welded form interatomic diffusion and bonding. Currently commonly used ceramic/metal welding methods include brazing, diffusion welding, self-propagating reaction joining, transient liquid phase (TLP) diffusion joining, laser/electron beam welding, etc. However, regardless of the connection method, it is necessary to consider the residual stress caused by the different physical properties of ceramics and metals. In recent years, researchers have mainly improved the performance of the joint through the composition design and process optimization of the welding intermediate layer, the most representative of which is the composite solder method. In this method, the active Ag-Cu-Ti solder is used as a matrix, and a certain proportion of ceramic particles, refractory metal particles or short fibers are mixed in as the second phase reinforcement. The physical properties of the middle layer of the weld are adjusted by using the high modulus and low thermal expansion coefficient of the reinforcement itself to reduce the difference in thermal expansion coefficient between the weld and the ceramic interface, thereby relieving the residual stress of the joint of dissimilar materials. The composite solder method is a simple and practical method, but it also has some problems in practical application: First, the mechanical mixing of the active solder and the reinforcing phase will cause the reinforcing phase to be unevenly distributed inside the weld and easy to agglomerate; Secondly, the complex chemical reaction between the reinforcing phase and the active solder is easy to form brittle intermetallic compounds, which is not good for the performance of the joint; thirdly, the addition of the reinforcing phase will reduce the fluidity and wettability of the active solder, and it is easy to produce Holes, lack of welding and other defects.
发明内容Contents of the invention
针对上述背景技术存在的不足之处,本发明公开基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法。Aiming at the shortcomings of the above-mentioned background technology, the present invention discloses a ceramic/metal connection method based on Ni-B/Ti instantaneous liquid-phase in-situ reaction.
本发明方法采用两层Ti中间层箔片和一层Ni/Ni-B复合箔片为焊接中间层,两种Ti中间层箔片厚度分别为钛箔①:10μm~50μm和钛箔②:50~150μm,初始Ni中间层箔片的厚度为50~100μm,焊接过程按以下步骤进行:The method of the present invention adopts two layers of Ti intermediate layer foil and one layer of Ni/Ni-B composite foil as the welding intermediate layer, and the thicknesses of the two kinds of Ti intermediate layer foils are titanium foil ①: 10 μm to 50 μm and titanium foil ②: 50 ~150μm, the thickness of the initial Ni interlayer foil is 50~100μm, and the welding process is carried out according to the following steps:
一、对金属基体采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对陶瓷基体采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Use 800#, 1000#, 1200#, 1500# sandpaper to polish the surface of the metal substrate, then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use; Ultrasonic cleaning for 5 minutes, dry for later use;
二、取Ti、Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti、Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为20%~45%的HNO3和余量的水组成;2. Take the Ti and Ni interlayer foils, first immerse them in acetone solution and ultrasonically clean them for 5 minutes, then soak them in the deoxidation film solution for 10-15 minutes for deoxidation film treatment, then take out the Ti and Ni interlayer foils and wash them with clean water Rinse well and dry for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5%, HNO3 with a mass percentage of 20% to 45%, and the remainder of water;
三、取厚度为50μm~100μm步骤二处理的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积1μm~5μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为3wt.%~6wt.%;3. Take the Ni intermediate layer foil with a thickness of 50 μm to 100 μm in step 2, immerse it in an acetone solution and ultrasonically clean it for 5 minutes, and then deposit a Ni-B amorphous alloy layer with a thickness of 1 μm to 5 μm on one side of the Ni intermediate layer foil to obtain Ni/Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 3wt.%~6wt.% ;
四、取步骤一处理的陶瓷、金属、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装成待焊件,组装顺序为:金属/Ti中间层箔片/Ni/Ni-B复合箔片/Ti中间层箔片/陶瓷;将待焊件置于真空扩散焊炉中,施加5~10MPa压力,并抽真空至5×10-4~1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至950~1000℃,保温5~30min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti中间层箔片的总厚度与不包含Ni-B非晶合金层的Ni中间层箔片厚度的厚度比例为1:(1.0~2.5)。4. Take the ceramics and metals processed in step 1, the Ti intermediate layer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 and assemble them into pieces to be welded in a stacked manner. The assembly sequence is: metal/Ni-B composite foil Ti interlayer foil/Ni/Ni-B composite foil/Ti interlayer foil/ceramics; place the parts to be welded in a vacuum diffusion welding furnace, apply a pressure of 5-10MPa, and evacuate to 5×10 -4 ~1×10 -3 Pa, then heat up the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, hold for 5 minutes, then raise the temperature to 950-1000°C at a speed of 10°C/min, hold for 5-30 minutes, and then Cool down to 300°C at a rate of 5°C/min, and finally the weldment is cooled to room temperature with the furnace to complete the ceramic/metal connection based on Ni-B/Ti instantaneous liquid phase in-situ reaction; among them, Ni/Ni-B The Ni-B amorphous alloy layer of the composite foil is close to the ceramic side, and the thickness ratio of the total thickness of the two Ti interlayer foils to the Ni interlayer foil thickness not including the Ni-B amorphous alloy layer is 1:( 1.0~2.5).
本发明包含以下有益效果:The present invention comprises following beneficial effect:
本发明的方法原理:焊接中间层存在Ti/Ni和Ti/Ni-B两种反应界面,当温度高于942℃,两界面通过Ti-Ni接触反应产生共晶瞬时液相。对于Ti/Ni-B反应界面,B原子随Ni的溶解逐步均匀地进入液相,与Ti发生如下反应:The principle of the method of the present invention: there are two reaction interfaces of Ti/Ni and Ti/Ni-B in the welding intermediate layer, and when the temperature is higher than 942°C, the two interfaces generate eutectic transient liquid phase through Ti-Ni contact reaction. For the Ti/Ni-B reaction interface, B atoms gradually and uniformly enter the liquid phase with the dissolution of Ni, and react with Ti as follows:
Ti+B→TiB ΔrG=-163200+5.9TJ/molTi+B→TiB Δ r G=-163200+5.9TJ/mol
TiB为细针状陶瓷晶须,具有较高的模量和较低的热膨胀系数。其作为增强体可有效调节焊缝整体的热膨胀系数,降低接头应力。由于生成TiB增强体的反应是在焊接过程中原位产生,这样就避免了复合钎料法中出现的增强体混合不均匀以及易团聚的问题,改善了接头组织和力学性能。此外,本发明中TiB原位反应仅出现在焊缝瞬时液相区内,由于原位反应速率和Ni-B层的溶解速率以及Ni-B层B含量紧密相关,可以通过连接工艺控制和Ni-B层成分控制精确调节TiB生长。TiB is a fine acicular ceramic whisker with high modulus and low coefficient of thermal expansion. As a reinforcement, it can effectively adjust the overall thermal expansion coefficient of the weld and reduce joint stress. Since the reaction to generate TiB reinforcement is generated in situ during the welding process, the problems of uneven mixing and easy agglomeration of reinforcements in the composite solder method are avoided, and the joint structure and mechanical properties are improved. In addition, the in-situ reaction of TiB in the present invention only occurs in the instantaneous liquid phase region of the weld. Since the in-situ reaction rate is closely related to the dissolution rate of the Ni-B layer and the B content of the Ni-B layer, it can be controlled by the connection process and Ni -B layer composition control to precisely tune TiB growth.
试验表明,使用本发明的方法连接GH99合金和Al2O3陶瓷,制备的GH99/Ti/(Ni/Ni-B)/Ti/Al2O3接头抗剪强度可达92~136MPa,比未采用原位反应的GH99/Ti/Ni/Ti/Al2O3接头强度提高43%~72%。Tests show that, using the method of the present invention to connect GH99 alloy and Al 2 O 3 ceramics, the shear strength of the prepared GH99/Ti/(Ni/Ni-B)/Ti/Al 2 O 3 joint can reach 92-136 MPa, which is higher than that of the previous The joint strength of GH99/Ti/Ni/Ti/Al 2 O 3 using in-situ reaction is increased by 43%-72%.
现有专利(申请号:201010215105.公开号:CN101863677A)也提出了一种原位自生TiB晶须提高陶瓷钎焊接头强度的方法。本发明与现有专利的不同在于,本发明采用了电镀或化学镀的方法制备Ni-B非晶合金层,以Ni-B非晶合金层作为原位反应的硼源。本发明的方法能够使TiB生成位置和生成密度可控,进而有利于提高接头性能。本发明制备的接头与对比文件制备的接头相比,抗剪强度提高了约20%~40%。The existing patent (Application No.: 201010215105. Publication No.: CN101863677A) also proposes a method for in-situ self-generated TiB whiskers to improve the strength of ceramic brazed joints. The difference between the present invention and the existing patents is that the present invention adopts the method of electroplating or chemical plating to prepare the Ni-B amorphous alloy layer, and uses the Ni-B amorphous alloy layer as the boron source for in-situ reaction. The method of the invention can control the generation position and density of TiB, which is beneficial to improve the performance of the joint. Compared with the joint prepared by the reference document, the shear strength of the joint prepared by the invention is increased by about 20% to 40%.
附图说明Description of drawings
图1为本发明的陶瓷/金属待焊件组装方式示意图。Fig. 1 is a schematic diagram of the assembly method of the ceramic/metal parts to be welded according to the present invention.
具体实施方式detailed description
具体实施方式一:本实施方式的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它是按照以下步骤进行:Specific embodiment one: The ceramic/metal connection method based on Ni-B/Ti instantaneous liquid phase in situ reaction of the present embodiment, it is to carry out according to the following steps:
一、对金属基体采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对陶瓷基体采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Use 800#, 1000#, 1200#, 1500# sandpaper to polish the surface of the metal substrate, then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use; Ultrasonic cleaning for 5 minutes, dry for later use;
二、取Ti、Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti、Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为20%~45%的HNO3和余量的水组成;2. Take the Ti and Ni interlayer foils, first immerse them in acetone solution and ultrasonically clean them for 5 minutes, then soak them in the deoxidation film solution for 10-15 minutes for deoxidation film treatment, then take out the Ti and Ni interlayer foils and wash them with clean water Rinse well and dry for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5%, HNO3 with a mass percentage of 20% to 45%, and the remainder of water;
三、取厚度为50μm~100μm步骤二处理的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积1μm~5μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为3wt.%~6wt.%;3. Take the Ni intermediate layer foil with a thickness of 50 μm to 100 μm in step 2, immerse it in an acetone solution and ultrasonically clean it for 5 minutes, and then deposit a Ni-B amorphous alloy layer with a thickness of 1 μm to 5 μm on one side of the Ni intermediate layer foil to obtain Ni/Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 3wt.%~6wt.% ;
四、取步骤一处理的陶瓷、金属、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装成待焊件,组装顺序为:金属/Ti中间层箔片/Ni/Ni-B复合箔片/Ti中间层箔片/陶瓷;将待焊件置于真空扩散焊炉中,施加5~10MPa压力,并抽真空至5×10-4~1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至950~1000℃,保温5~30min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti中间层箔片的总厚度与不包含Ni-B非晶合金层的Ni中间层箔片厚度的厚度比例为1:(1.0~2.5)。4. Take the ceramics and metals processed in step 1, the Ti intermediate layer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 and assemble them into pieces to be welded in a stacked manner. The assembly sequence is: metal/Ni-B composite foil Ti interlayer foil/Ni/Ni-B composite foil/Ti interlayer foil/ceramics; place the parts to be welded in a vacuum diffusion welding furnace, apply a pressure of 5-10MPa, and evacuate to 5×10 -4 ~1×10 -3 Pa, then heat up the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, hold for 5 minutes, then raise the temperature to 950-1000°C at a speed of 10°C/min, hold for 5-30 minutes, and then Cool down to 300°C at a rate of 5°C/min, and finally the weldment is cooled to room temperature with the furnace to complete the ceramic/metal connection based on Ni-B/Ti instantaneous liquid phase in-situ reaction; among them, Ni/Ni-B The Ni-B amorphous alloy layer of the composite foil is close to the ceramic side, and the thickness ratio of the total thickness of the two-layer Ti interlayer foil to the Ni interlayer foil thickness not including the Ni-B amorphous alloy layer is 1:( 1.0~2.5).
具体实施方式二:本实施方式与具体实施方式一不同的是:步骤三中所述的在Ni中间层箔片一侧的表面沉积Ni-B非晶合金层是指采用化学镀镍硼合金法或电镀镍硼合金法进行沉积。其它与具体实施方式一相同。Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the Ni-B amorphous alloy layer deposited on the surface of the Ni intermediate layer foil side described in step 3 refers to the use of electroless nickel-boron alloy plating method Or electroplating nickel-boron alloy method for deposition. Others are the same as in the first embodiment.
具体实施方式三:本实施方式与具体实施方式一不同的是:所述的化学镀镍硼合金法的条件为:化学镀溶液含有浓度为5g/L的NiCl·6H2O、浓度为7g/L的NaC2H3O2、浓度为1g/L的C2H10BN和浓度为10~50mg/L的PbCl2;化学镀溶液pH为4,化学镀溶液温度为59~81℃,化学沉积时间为5~30min。其它与具体实施方式一相同。Specific embodiment three: the difference between this embodiment and specific embodiment one is: the conditions of the electroless nickel-boron alloy plating method are: the electroless plating solution contains NiCl·6H 2 O with a concentration of 5 g/L, and a concentration of 7 g/L L of NaC 2 H 3 O 2 , C 2 H 10 BN with a concentration of 1g/L and PbCl 2 with a concentration of 10-50mg/L; the pH of the electroless plating solution is 4, the temperature of the electroless plating solution is 59-81°C, and the chemical The deposition time is 5-30 minutes. Others are the same as in the first embodiment.
具体实施方式四:本实施方式与具体实施方式一不同的是:所述的化学镀镍硼合金法的条件为:化学镀溶液含有浓度为5g/L的NiCl·6H2O、浓度为7g/L的NaC2H3O2、浓度为1g/L的C2H10BN和浓度为10~50mg/L的PbCl2;化学镀溶液pH为4,化学镀溶液温度为65~80℃,化学沉积时间为5~20min。其它与具体实施方式一相同。Embodiment 4: The difference between this embodiment and Embodiment 1 is that the conditions of the electroless nickel-boron alloy plating method are: the electroless plating solution contains NiCl·6H 2 O with a concentration of 5 g/L, and a concentration of 7 g/L. L of NaC 2 H 3 O 2 , C 2 H 10 BN with a concentration of 1g/L and PbCl 2 with a concentration of 10-50mg/L; the pH of the electroless plating solution is 4, the temperature of the electroless plating solution is 65-80°C, and the chemical The deposition time is 5-20 minutes. Others are the same as in the first embodiment.
具体实施方式五:本实施方式与具体实施方式一不同的是:所述的电镀镍硼合金法的条件为:电镀溶液含有浓度为240g/L的NiSO4·6H2O、浓度为5g/L的NiCl·6H2O、浓度为30g/L的H3BO3和浓度为3g/L的C2H10BN;电镀溶液液pH为3.5,电镀溶液温度为44~46℃,电流密度为0.5~1.5A/dm2,电镀时间为10~60min。其它与具体实施方式一相同。Embodiment 5: The difference between this embodiment and Embodiment 1 is that the conditions of the electroplating nickel-boron alloy method are: the electroplating solution contains NiSO 4 ·6H 2 O with a concentration of 240g/L and a concentration of 5g/L NiCl·6H 2 O, H 3 BO 3 with a concentration of 30g/L and C 2 H 10 BN with a concentration of 3g/L; the pH of the electroplating solution is 3.5, the temperature of the electroplating solution is 44-46°C, and the current density is 0.5 ~1.5A/dm 2 , the electroplating time is 10~60min. Others are the same as in the first embodiment.
具体实施方式六:本实施方式与具体实施方式一不同的是:所述的电镀镍硼合金法的条件为:电镀溶液含有浓度为240g/L的NiSO4·6H2O、浓度为5g/L的NiCl·6H2O、浓度为30g/L的H3BO3和浓度为3g/L的C2H10BN;电镀溶液液pH为3.5,电镀溶液温度为45~46℃,电流密度为0.8~1.2A/dm2,电镀时间为10~50min。其它与具体实施方式一相同。Embodiment 6: The difference between this embodiment and Embodiment 1 is that the conditions of the electroplating nickel-boron alloy method are: the electroplating solution contains NiSO 4 ·6H 2 O with a concentration of 240g/L and a concentration of 5g/L NiCl·6H 2 O, H 3 BO 3 with a concentration of 30g/L and C 2 H 10 BN with a concentration of 3g/L; the pH of the electroplating solution is 3.5, the temperature of the electroplating solution is 45-46°C, and the current density is 0.8 ~1.2A/dm 2 , the electroplating time is 10~50min. Others are the same as in the first embodiment.
具体实施方式七:本实施方式与具体实施方式一不同的是:所述的除氧化膜溶液是由质量百分含量为2%~4%的HF、质量百分含量为20%~40%的HNO3和余量的水组成。其它与具体实施方式一相同。Embodiment 7: The difference between this embodiment and Embodiment 1 is that the solution for removing the oxide film is composed of HF with a mass percentage of 2% to 4%, and HF with a mass percentage of 20% to 40%. HNO 3 and the balance of water. Others are the same as in the first embodiment.
具体实施方式八:本实施方式与具体实施方式一不同的是:所述的Ni-B非晶合金层的B含量为3wt.%~5wt.%。其它与具体实施方式一相同。Embodiment 8: This embodiment is different from Embodiment 1 in that: the B content of the Ni—B amorphous alloy layer is 3wt.%˜5wt.%. Others are the same as in the first embodiment.
具体实施方式九:本实施方式与具体实施方式一不同的是:所述的Ni-B非晶合金层的B含量为4wt.%。其它与具体实施方式一相同。Embodiment 9: This embodiment is different from Embodiment 1 in that: the B content of the Ni-B amorphous alloy layer is 4wt.%. Others are the same as in the first embodiment.
具体实施方式十:本实施方式与具体实施方式一不同的是:步骤四中将待焊件置于真空扩散焊炉中,施加5~10MPa压力,并抽真空至5×10-4~1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至980~1000℃,保温5~20min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温。其它与具体实施方式一相同。Embodiment 10: The difference between this embodiment and Embodiment 1 is that in step 4, place the workpiece to be welded in a vacuum diffusion welding furnace, apply a pressure of 5 to 10 MPa, and evacuate to 5×10 -4 to 1× 10 -3 Pa, then raise the temperature of the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, keep it for 5 minutes, then raise the temperature to 980-1000°C at a speed of 10°C/min, hold it for 5-20 minutes, and then heat it at 5°C /min speed down to 300 ℃, and finally the weldment is cooled to room temperature with the furnace. Others are the same as in the first embodiment.
具体实施方式十一:本实施方式与具体实施方式一不同的是:步骤四中组装的待焊件中靠近陶瓷一侧的Ti中间层箔片厚度为50~150μm;靠近金属一侧的Ti中间层箔片厚度为10~50μm。其它与具体实施方式一相同。Embodiment 11: The difference between this embodiment and Embodiment 1 is that the thickness of the Ti interlayer foil on the side near the ceramic in the assembly to be welded in step 4 is 50-150 μm; the thickness of the Ti interlayer foil near the metal side is The thickness of the layer foil is 10-50 μm. Others are the same as in the first embodiment.
具体实施方式十二:本实施方式与具体实施方式一不同的是:步骤四中组装的待焊件中靠近陶瓷一侧的Ti中间层箔片厚度为50~120μm;靠近金属一侧的Ti中间层箔片厚度为20~50μm。其它与具体实施方式一相同。Embodiment 12: This embodiment differs from Embodiment 1 in that: the thickness of the Ti interlayer foil on the ceramic side of the piece to be welded in step 4 is 50-120 μm; the thickness of the Ti interlayer foil on the metal side is The thickness of the layer foil is 20-50 μm. Others are the same as in the first embodiment.
具体实施方式十三:本实施方式与具体实施方式一不同的是:步骤四中组装的待焊件中靠近陶瓷一侧的Ti中间层箔片厚度为50~100μm;靠近金属一侧的Ti中间层箔片厚度为30~50μm。其它与具体实施方式一相同。Specific Embodiment Thirteen: The difference between this embodiment and specific embodiment 1 is that the thickness of the Ti interlayer foil on the side near the ceramic in the assembly to be welded in step 4 is 50-100 μm; the thickness of the Ti interlayer foil near the metal side Layer foil thickness is 30 ~ 50μm. Others are the same as in the first embodiment.
具体实施方式十四:本实施方式与具体实施方式一不同的是:步骤三中取厚度为60μm~100μm步骤二处理的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积1μm~4μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片。其它与具体实施方式一相同。Embodiment 14: The difference between this embodiment and Embodiment 1 is that in step 3, take the Ni interlayer foil with a thickness of 60 μm to 100 μm in step 2, immerse it in an acetone solution and ultrasonically clean it for 5 minutes, and then clean it on the Ni interlayer A Ni-B amorphous alloy layer with a thickness of 1 μm to 4 μm is deposited on one side of the foil to obtain a Ni/Ni-B composite foil. Others are the same as in the first embodiment.
具体实施方式十五:本实施方式与具体实施方式一不同的是:步骤三中取厚度为60μm~80μm步骤二处理的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积1μm~3μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片。其它与具体实施方式一相同。Embodiment 15: The difference between this embodiment and Embodiment 1 is that in Step 3, take the Ni interlayer foil with a thickness of 60 μm to 80 μm and process it in Step 2, immerse it in an acetone solution and ultrasonically clean it for 5 minutes, and then clean it on the Ni interlayer A Ni-B amorphous alloy layer with a thickness of 1 μm to 3 μm is deposited on one side of the foil to obtain a Ni/Ni-B composite foil. Others are the same as in the first embodiment.
具体实施方式十六:本实施方式与具体实施方式一不同的是:步骤三中取厚度为70μm步骤二处理的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积2μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片。其它与具体实施方式一相同。Embodiment 16: The difference between this embodiment and Embodiment 1 is that in step 3, take the Ni interlayer foil with a thickness of 70 μm and process in step 2, immerse it in acetone solution and ultrasonically clean it for 5 minutes, and then clean it on the Ni interlayer foil Deposit a Ni-B amorphous alloy layer with a thickness of 2 μm on one side to obtain a Ni/Ni-B composite foil. Others are the same as in the first embodiment.
本发明内容不仅限于上述各实施方式的内容,其中一个或几个具体实施方式的组合同样也可以实现发明的目的。The content of the present invention is not limited to the content of the above-mentioned embodiments, and a combination of one or several specific embodiments can also achieve the purpose of the invention.
通过以下实施例验证本发明有益效果:Verify the beneficial effects of the present invention by the following examples:
实施例1Example 1
本实施例的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它是按照以下步骤进行:The ceramic/metal connection method based on Ni-B/Ti transient liquid phase in situ reaction of this embodiment is carried out according to the following steps:
一、对待焊材料GH99合金、Al2O3陶瓷以及焊接中间层材料50μm厚Ti箔、50μm厚Ni箔进行表面化学清理;对GH99合金采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对Al2O3陶瓷采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Chemically clean the surface of GH99 alloy, Al 2 O 3 ceramics and welding intermediate layer materials 50μm thick Ti foil and 50μm thick Ni foil; use 800#, 1000#, 1200#, 1500# sandpaper to polish the surface of GH99 alloy , then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry for later use; for Al 2 O 3 ceramics, use 1200# and 1500# diamond discs to polish the surface, immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry for later use;
二、取Ti中间层箔片和Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti中间层箔片和Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为45%的HNO3和余量的水组成;2. Take the Ti intermediate layer foil and the Ni intermediate layer foil, first immerse them in acetone solution for ultrasonic cleaning for 5 minutes, then soak them in the deoxidizing film solution for 10-15 minutes for deoxidizing film treatment, and then take out the Ti intermediate layer foil and the Ni intermediate layer foil are rinsed with clear water, and dried for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5 %, HNO with a mass percentage of 45% and the remainder water composition;
三、在步骤二处理后的厚度为50μm的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积2μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为5wt.%;Three, the Ni interlayer foil of 50 μm in thickness after step two treatment is immersed in an acetone solution and ultrasonically cleaned for 5 minutes, and then deposits a 2 μm thick Ni-B amorphous alloy layer on one side of the Ni interlayer foil to obtain Ni/ Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 5wt.%;
四、取步骤一处理的Al2O3陶瓷、GH99合金、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装待焊件,组装顺序为:GH99/Ti(50μm)/(Ni/Ni-B)/Ti(50μm)/Al2O3;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti箔片的总厚度与Ni中间层箔片(不包含Ni-B非晶合金层的厚度)的厚度比例为1.0:2.0;将待焊件置于真空扩散焊炉中,施加5MPa压力,并抽真空至1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至980℃,保温5min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接。4. Take the Al 2 O 3 ceramics processed in step 1, GH99 alloy, the Ti interlayer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 to assemble the parts to be welded in a stacked manner, the assembly sequence It is: GH99/Ti(50μm)/(Ni/Ni-B)/Ti(50μm)/Al 2 O 3 ; wherein, the Ni-B amorphous alloy layer of the Ni/Ni-B composite foil is close to the ceramic side, The ratio of the total thickness of the two layers of Ti foil to the thickness of the Ni intermediate layer foil (not including the thickness of the Ni-B amorphous alloy layer) is 1.0:2.0; place the workpiece to be welded in a vacuum diffusion welding furnace and apply a pressure of 5 MPa , and evacuate to 1×10 -3 Pa, then raise the temperature of the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, keep it for 5 minutes, then raise the temperature to 980°C at a speed of 10°C/min, hold it for 5 minutes, and then The temperature was lowered to 300°C at a rate of 5°C/min, and finally the welded piece was cooled to room temperature with the furnace to complete the ceramic/metal connection based on Ni-B/Ti instantaneous liquid phase in-situ reaction.
本实施例的化学沉积条件为:The chemical deposition condition of the present embodiment is:
化学镀溶液含有浓度为5g/L的NiCl·6H2O、浓度为7g/L的NaC2H3O2、浓度为1g/L的C2H10BN和浓度为10~50mg/L的PbCl2;化学镀溶液pH为4,化学镀溶液温度为60℃,化学沉积时间为10min。The electroless plating solution contains NiCl·6H 2 O with a concentration of 5g/L, NaC 2 H 3 O 2 with a concentration of 7g/L, C 2 H 10 BN with a concentration of 1g/L and PbCl with a concentration of 10-50mg/L 2 ; The pH of the electroless plating solution is 4, the temperature of the electroless plating solution is 60° C., and the electroless deposition time is 10 minutes.
本实施例方法连接GH99合金和Al2O3陶瓷,制备的GH99/Ti/(Ni/Ni-B)/Ti/Al2O3接头抗剪强度可达92~128MPa,比未采用原位反应的GH99/Ti/Ni/Ti/Al2O3接头强度提高43%~57%。The method in this example connects GH99 alloy and Al 2 O 3 ceramics, and the shear strength of the prepared GH99/Ti/(Ni/Ni-B)/Ti/Al 2 O 3 joint can reach 92-128 MPa, which is higher than that without in-situ reaction GH99/Ti/Ni/Ti/Al 2 O 3 joint strength increased by 43% to 57%.
实施例2Example 2
本实施例的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它是按照以下步骤进行:The ceramic/metal connection method based on Ni-B/Ti transient liquid phase in situ reaction of this embodiment is carried out according to the following steps:
一、对待焊材料GH99合金、Al2O3陶瓷以及焊接中间层材料50μm厚Ti箔、50μm厚Ni箔进行表面化学清理;对GH99合金采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对Al2O3陶瓷采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Chemically clean the surface of GH99 alloy, Al 2 O 3 ceramics and welding intermediate layer materials 50μm thick Ti foil and 50μm thick Ni foil; use 800#, 1000#, 1200#, 1500# sandpaper to polish the surface of GH99 alloy , then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry for later use; for Al 2 O 3 ceramics, use 1200# and 1500# diamond discs to polish the surface, immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry for later use;
二、取Ti中间层箔片和Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti中间层箔片和Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为45%的HNO3和余量的水组成;2. Take the Ti intermediate layer foil and the Ni intermediate layer foil, first immerse them in acetone solution for ultrasonic cleaning for 5 minutes, then soak them in the deoxidizing film solution for 10-15 minutes for deoxidizing film treatment, and then take out the Ti intermediate layer foil and the Ni intermediate layer foil are rinsed with clear water, and dried for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5 %, HNO with a mass percentage of 45% and the remainder water composition;
三、在步骤二处理后的厚度为50μm的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积3μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为5wt.%;Three, the Ni interlayer foil of 50 μm in thickness after step 2 treatment is immersed in an acetone solution and ultrasonically cleaned for 5 min, and then deposited a 3 μm thick Ni-B amorphous alloy layer on one side of the Ni interlayer foil to obtain Ni/ Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 5wt.%;
四、取步骤一处理的Al2O3陶瓷、GH99合金、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装待焊件,组装顺序为:GH99/Ti(50μm)/(Ni/Ni-B)/Ti(50μm)/Al2O3;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti箔片的总厚度与Ni中间层箔片(不包含Ni-B非晶合金层的厚度)的厚度比例为1.0:2.0;将待焊件置于真空扩散焊炉中,施加5MPa压力,并抽真空至1×10- 3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至980℃,保温5min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接。4. Take the Al 2 O 3 ceramics processed in step 1, GH99 alloy, the Ti interlayer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 to assemble the parts to be welded in a stacked manner, the assembly sequence It is: GH99/Ti(50μm)/(Ni/Ni-B)/Ti(50μm)/Al 2 O 3 ; wherein, the Ni-B amorphous alloy layer of the Ni/Ni-B composite foil is close to the ceramic side, The ratio of the total thickness of the two layers of Ti foil to the thickness of the Ni intermediate layer foil (not including the thickness of the Ni-B amorphous alloy layer) is 1.0:2.0; place the workpiece to be welded in a vacuum diffusion welding furnace and apply a pressure of 5 MPa , and evacuate to 1×10 - 3 Pa, then raise the temperature of the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, keep it for 5 minutes, then raise the temperature to 980°C at a speed of 10°C/min, hold it for 5 minutes, and then The temperature was lowered to 300°C at a rate of 5°C/min, and finally the welded piece was cooled to room temperature with the furnace to complete the ceramic/metal connection based on Ni-B/Ti instantaneous liquid phase in-situ reaction.
本实施例的电沉积条件为:电镀溶液含有浓度为240g/L的NiSO4·6H2O、浓度为5g/L的NiCl·6H2O、浓度为30g/L的H3BO3和浓度为3g/L的C2H10BN;电镀溶液pH为3.5,电镀溶液温度为45℃,电流密度为1A/dm2,电镀时间为10min。The electrodeposition conditions of this embodiment are: the electroplating solution contains NiSO 4 6H 2 O with a concentration of 240g/L, NiCl 6H 2 O with a concentration of 5g/L, H 3 BO 3 with a concentration of 30g/L and a concentration of 3g/L of C 2 H 10 BN; the pH of the electroplating solution is 3.5, the temperature of the electroplating solution is 45°C, the current density is 1A/dm 2 , and the electroplating time is 10min.
本实施例方法连接GH99合金和Al2O3陶瓷,制备的GH99/Ti/(Ni/Ni-B)/Ti/Al2O3接头抗剪强度可达93~120MPa,比未采用原位反应的GH99/Ti/Ni/Ti/Al2O3接头强度提高43%~55%。The method in this example connects GH99 alloy and Al 2 O 3 ceramics, and the shear strength of the prepared GH99/Ti/(Ni/Ni-B)/Ti/Al 2 O 3 joint can reach 93-120 MPa, which is higher than that without in-situ reaction GH99/Ti/Ni/Ti/Al 2 O 3 joint strength increased by 43% to 55%.
实施例3Example 3
本实施例的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它是按照以下步骤进行:The ceramic/metal connection method based on Ni-B/Ti transient liquid phase in situ reaction of this embodiment is carried out according to the following steps:
一、对待焊材料GH99合金、Al2O3陶瓷以及焊接中间层材料20μm厚Ti箔、100μm厚Ti箔、80μm厚Ni箔进行表面化学清理;对GH99合金采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对Al2O3陶瓷采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Surface chemical cleaning of GH99 alloy, Al 2 O 3 ceramics and welding intermediate layer materials 20μm thick Ti foil, 100μm thick Ti foil, and 80μm thick Ni foil; use 800#, 1000#, 1200#, Polish the surface with 1500# sandpaper, then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use; for Al 2 O 3 ceramics, use 1200# and 1500# diamond discs to polish the surface, immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use;
二、取Ti中间层箔片和Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti中间层箔片和Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为45%的HNO3和余量的水组成;2. Take the Ti intermediate layer foil and the Ni intermediate layer foil, first immerse them in acetone solution for ultrasonic cleaning for 5 minutes, then soak them in the deoxidizing film solution for 10-15 minutes for deoxidizing film treatment, and then take out the Ti intermediate layer foil and the Ni intermediate layer foil are rinsed with clear water, and dried for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5 %, HNO with a mass percentage of 45% and the remainder water composition;
三、在步骤二处理后的厚度为80μm的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积2μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为5wt.%;Three, the Ni interlayer foil of 80 μm in thickness after step 2 treatment is immersed in an acetone solution and ultrasonically cleaned for 5 min, and then deposited a 2 μm thick Ni-B amorphous alloy layer on one side of the Ni interlayer foil to obtain Ni/ Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 5wt.%;
四、取步骤一处理的Al2O3陶瓷、GH99合金、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装待焊件,组装顺序为:GH99/Ti(20μm)/(Ni/Ni-B)/Ti(100μm)/Al2O3;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti中间层箔片的总厚度与Ni中间层箔片(不包含Ni-B非晶合金层的厚度)的厚度比例为1.0:1.5;将待焊件置于真空扩散焊炉中,施加5MPa压力,并抽真空至1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至980℃,保温5min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接。4. Take the Al 2 O 3 ceramics processed in step 1, GH99 alloy, the Ti interlayer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 to assemble the parts to be welded in a stacked manner, the assembly sequence It is: GH99/Ti(20μm)/(Ni/Ni-B)/Ti(100μm)/Al 2 O 3 ; wherein, the Ni-B amorphous alloy layer of the Ni/Ni-B composite foil is close to the ceramic side, The ratio of the total thickness of the two-layer Ti intermediate layer foil to the thickness of the Ni intermediate layer foil (not including the thickness of the Ni-B amorphous alloy layer) is 1.0:1.5; the parts to be welded are placed in a vacuum diffusion welding furnace and applied 5MPa pressure, and evacuate to 1×10 -3 Pa, then raise the temperature of the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, keep it for 5min, then raise the temperature to 980°C at a speed of 10°C/min, and keep it for 5min , and then cooled down to 300°C at a rate of 5°C/min, and finally the weldment was cooled to room temperature with the furnace, and the ceramic/metal connection based on Ni-B/Ti instantaneous liquid phase in-situ reaction was completed.
本实施例的化学沉积条件为:The chemical deposition condition of the present embodiment is:
化学镀溶液含有浓度为5g/L的NiCl·6H2O、浓度为7g/L的NaC2H3O2、浓度为1g/L的C2H10BN和浓度为10~50mg/L的PbCl2;化学镀溶液pH为4,化学镀溶液温度为60℃,化学沉积时间为10min。The electroless plating solution contains NiCl·6H 2 O with a concentration of 5g/L, NaC 2 H 3 O 2 with a concentration of 7g/L, C 2 H 10 BN with a concentration of 1g/L and PbCl with a concentration of 10-50mg/L 2 ; The pH of the electroless plating solution is 4, the temperature of the electroless plating solution is 60° C., and the electroless deposition time is 10 minutes.
本实施例方法连接GH99合金和Al2O3陶瓷,制备的GH99/Ti/(Ni/Ni-B)/Ti/Al2O3接头抗剪强度可达95~136MPa,比未采用原位反应的GH99/Ti/Ni/Ti/Al2O3接头强度提高45%~72%。The method in this example connects GH99 alloy and Al 2 O 3 ceramics, and the shear strength of the prepared GH99/Ti/(Ni/Ni-B)/Ti/Al 2 O 3 joint can reach 95-136 MPa, which is higher than that without in-situ reaction GH99/Ti/Ni/Ti/Al 2 O 3 joint strength increased by 45% to 72%.
实施例4Example 4
本实施例的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它是按照以下步骤进行:The ceramic/metal connection method based on Ni-B/Ti transient liquid phase in situ reaction of this embodiment is carried out according to the following steps:
一、对待焊材料GH99合金、Al2O3陶瓷以及焊接中间层材料20μm厚Ti箔、100μm厚Ti箔、80μm厚Ni箔进行表面化学清理;对GH99合金采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对Al2O3陶瓷采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Surface chemical cleaning of GH99 alloy, Al 2 O 3 ceramics and welding intermediate layer materials 20μm thick Ti foil, 100μm thick Ti foil, and 80μm thick Ni foil; use 800#, 1000#, 1200#, Polish the surface with 1500# sandpaper, then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use; for Al 2 O 3 ceramics, use 1200# and 1500# diamond discs to polish the surface, immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use;
二、取Ti中间层箔片和Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti中间层箔片和Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为45%的HNO3和余量的水组成;2. Take the Ti intermediate layer foil and the Ni intermediate layer foil, first immerse them in acetone solution for ultrasonic cleaning for 5 minutes, then soak them in the deoxidizing film solution for 10-15 minutes for deoxidizing film treatment, and then take out the Ti intermediate layer foil and the Ni intermediate layer foil are rinsed with clear water, and dried for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5 %, HNO with a mass percentage of 45% and the remainder water composition;
三、在步骤二处理后的厚度为80μm的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积2μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为5wt.%;Three, the Ni interlayer foil of 80 μm in thickness after step 2 treatment is immersed in an acetone solution and ultrasonically cleaned for 5 min, and then deposited a 2 μm thick Ni-B amorphous alloy layer on one side of the Ni interlayer foil to obtain Ni/ Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 5wt.%;
四、取步骤一处理的Al2O3陶瓷、GH99合金、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装待焊件,组装顺序为:GH99/Ti(20μm)/(Ni/Ni-B)/Ti(100μm)/Al2O3;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti箔片的总厚度与Ni中间层箔片(不包含Ni-B非晶合金层的厚度)的厚度比例为1.0:1.5;将待焊件置于真空扩散焊炉中,施加5MPa压力,并抽真空至1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至1000℃,保温15min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接。4. Take the Al 2 O 3 ceramics processed in step 1, GH99 alloy, the Ti interlayer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 to assemble the parts to be welded in a stacked manner, the assembly sequence It is: GH99/Ti(20μm)/(Ni/Ni-B)/Ti(100μm)/Al 2 O 3 ; wherein, the Ni-B amorphous alloy layer of the Ni/Ni-B composite foil is close to the ceramic side, The ratio of the total thickness of the two layers of Ti foil to the thickness of the Ni intermediate layer foil (not including the thickness of the Ni-B amorphous alloy layer) is 1.0:1.5; place the workpiece to be welded in a vacuum diffusion welding furnace and apply a pressure of 5 MPa , and evacuate to 1×10 -3 Pa, then raise the temperature of the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, keep it for 5 minutes, then raise the temperature to 1000°C at a speed of 10°C/min, hold it for 15 minutes, and then The temperature was lowered to 300°C at a rate of 5°C/min, and finally the welded piece was cooled to room temperature with the furnace to complete the ceramic/metal connection based on Ni-B/Ti instantaneous liquid phase in-situ reaction.
本实施例的化学沉积条件为:The chemical deposition condition of the present embodiment is:
化学镀溶液含有浓度为5g/L的NiCl·6H2O、浓度为7g/L的NaC2H3O2、浓度为1g/L的C2H10BN和浓度为10~50mg/L的PbCl2;化学镀溶液pH为4,化学镀溶液温度为60℃,化学沉积时间为10min。The electroless plating solution contains NiCl·6H 2 O with a concentration of 5g/L, NaC 2 H 3 O 2 with a concentration of 7g/L, C 2 H 10 BN with a concentration of 1g/L and PbCl with a concentration of 10-50mg/L 2 ; The pH of the electroless plating solution is 4, the temperature of the electroless plating solution is 60° C., and the electroless deposition time is 10 minutes.
本实施例方法连接GH99合金和Al2O3陶瓷,制备的GH99/Ti/(Ni/Ni-B)/Ti/Al2O3接头抗剪强度可达98~132MPa,比未采用原位反应的GH99/Ti/Ni/Ti/Al2O3接头强度提高48%~70%。The method in this example connects GH99 alloy and Al 2 O 3 ceramics, and the shear strength of the prepared GH99/Ti/(Ni/Ni-B)/Ti/Al 2 O 3 joint can reach 98-132 MPa, which is higher than that without in-situ reaction GH99/Ti/Ni/Ti/Al 2 O 3 joint strength increased by 48% to 70%.
实施例5Example 5
本实施例的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接方法,它是按照以下步骤进行:The ceramic/metal connection method based on Ni-B/Ti transient liquid phase in situ reaction of this embodiment is carried out according to the following steps:
一、对待焊材料金属Nb、SiC陶瓷以及焊接中间层材料20μm厚Ti箔、100μm厚Ti箔、80μm厚Ni箔进行表面化学清理;对金属Nb采用800#、1000#、1200#、1500#砂纸打磨表面,然后浸入丙酮溶液超声清洗5min,晾干备用;对SiC陶瓷采用1200#和1500#金刚石磨盘打磨表面,浸入丙酮溶液超声清洗5min,晾干备用;1. Surface chemical cleaning of metal Nb, SiC ceramics and welding intermediate layer materials 20μm thick Ti foil, 100μm thick Ti foil, and 80μm thick Ni foil; use 800#, 1000#, 1200#, 1500# sandpaper for metal Nb Polish the surface, then immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use; for SiC ceramics, use 1200# and 1500# diamond discs to polish the surface, immerse in acetone solution for ultrasonic cleaning for 5 minutes, and dry it for later use;
二、取Ti中间层箔片和Ni中间层箔片,首先将其浸入丙酮溶液中超声清洗5min,之后放入除氧化膜溶液浸泡10~15min进行除氧化膜处理,然后取出Ti中间层箔片和Ni中间层箔片用清水冲洗干净,晾干备用;所述的除氧化膜溶液是由质量百分含量为2%~5%的HF、质量百分含量为45%的HNO3和余量的水组成;2. Take the Ti intermediate layer foil and the Ni intermediate layer foil, first immerse them in acetone solution for ultrasonic cleaning for 5 minutes, then soak them in the deoxidizing film solution for 10-15 minutes for deoxidizing film treatment, and then take out the Ti intermediate layer foil and the Ni intermediate layer foil are rinsed with clear water, and dried for later use; the deoxidized film solution is composed of HF with a mass percentage of 2% to 5 %, HNO with a mass percentage of 45% and the remainder water composition;
三、在步骤二处理后的厚度为80μm的Ni中间层箔片,浸入丙酮溶液中超声清洗5min,之后在Ni中间层箔片一侧沉积2μm厚的Ni-B非晶合金层,得Ni/Ni-B复合箔片;然后对Ni/Ni-B复合箔片采用清水清洗,晾干备用;其中,所述的Ni-B非晶合金层的B含量为5wt.%;Three, the Ni interlayer foil of 80 μm in thickness after step 2 treatment is immersed in an acetone solution and ultrasonically cleaned for 5 min, and then deposited a 2 μm thick Ni-B amorphous alloy layer on one side of the Ni interlayer foil to obtain Ni/ Ni-B composite foil; then wash the Ni/Ni-B composite foil with clear water and dry it for later use; wherein, the B content of the Ni-B amorphous alloy layer is 5wt.%;
四、取步骤一处理的SiC陶瓷、金属Nb、步骤二处理后的Ti中间层箔片以及步骤三得到的Ni/Ni-B复合箔片以叠放方式组装待焊件,组装顺序为:Nb/Ti(20μm)/(Ni/Ni-B)/Ti(100μm)/SiC;其中,Ni/Ni-B复合箔片的Ni-B非晶合金层靠近陶瓷一侧,两层Ti箔片的总厚度与Ni中间层箔片(不包含Ni-B非晶合金层的厚度)的厚度比例为1.0:1.5;将待焊件置于真空扩散焊炉中,施加5MPa压力,并抽真空至1×10-3Pa,然后将真空扩散焊炉以30℃/min的速度升温至900℃,保温5min,再以10℃/min的速度升温至1000℃,保温15min,再以5℃/min的速度降温至300℃,最后焊接件随炉冷却至室温,完成所述的基于Ni-B/Ti瞬时液相原位反应的陶瓷/金属连接。4. Take the SiC ceramics processed in step 1, metal Nb, the Ti intermediate layer foil processed in step 2, and the Ni/Ni-B composite foil obtained in step 3 to assemble the parts to be welded in a stacked manner. The assembly sequence is: Nb /Ti(20μm)/(Ni/Ni-B)/Ti(100μm)/SiC; Among them, the Ni-B amorphous alloy layer of the Ni/Ni-B composite foil is close to the ceramic side, and the two-layer Ti foil The ratio of the total thickness to the thickness of the Ni intermediate layer foil (not including the thickness of the Ni-B amorphous alloy layer) is 1.0:1.5; place the workpiece to be welded in a vacuum diffusion welding furnace, apply a pressure of 5 MPa, and evacuate to 1 ×10 -3 Pa, then raise the temperature of the vacuum diffusion welding furnace to 900°C at a speed of 30°C/min, keep it for 5 minutes, then raise it to 1000°C at a speed of 10°C/min, hold it for 15 minutes, and then heat it at a speed of 5°C/min The temperature is lowered to 300° C., and finally the welded part is cooled to room temperature with the furnace to complete the ceramic/metal connection based on the Ni-B/Ti instantaneous liquid phase in-situ reaction.
本实施例的化学沉积条件为:The chemical deposition condition of the present embodiment is:
化学镀溶液含有浓度为5g/L的NiCl·6H2O、浓度为7g/L的NaC2H3O2、浓度为1g/L的C2H10BN和浓度为10~50mg/L的PbCl2;化学镀溶液pH为4,化学镀溶液温度为60℃,化学沉积时间为10min。The electroless plating solution contains NiCl·6H 2 O with a concentration of 5g/L, NaC 2 H 3 O 2 with a concentration of 7g/L, C 2 H 10 BN with a concentration of 1g/L and PbCl with a concentration of 10-50mg/L 2 ; The pH of the electroless plating solution is 4, the temperature of the electroless plating solution is 60° C., and the electroless deposition time is 10 minutes.
本实施例方法连接金属Nb和SiC陶瓷,制备的Nb/Ti/(Ni/Ni-B)/Ti/SiC接头抗剪强度可达82~130MPa,比未采用原位反应的Nb/Ti/Ni/Ti/SiC接头强度提高35%~56%。The method of this embodiment connects metal Nb and SiC ceramics, and the shear strength of the prepared Nb/Ti/(Ni/Ni-B)/Ti/SiC joint can reach 82-130 MPa, which is higher than that of Nb/Ti/Ni without in-situ reaction. /Ti/SiC joint strength increased by 35% to 56%.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101333116A (en) * | 2008-07-30 | 2008-12-31 | 哈尔滨工业大学 | Brazing welding method of ceramics and ceramic matrix composite materials and titanium alloys |
CN101863677A (en) * | 2010-07-01 | 2010-10-20 | 哈尔滨工业大学 | A method of in-situ self-generated TiB whiskers to improve the strength of ceramic brazed joints |
CN103990880A (en) * | 2014-06-06 | 2014-08-20 | 哈尔滨工业大学 | Non-metallic material and metal material brazing method capable of forming interpenetrating network structure brazing seams |
-
2015
- 2015-10-13 CN CN201510656797.5A patent/CN105254321B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101333116A (en) * | 2008-07-30 | 2008-12-31 | 哈尔滨工业大学 | Brazing welding method of ceramics and ceramic matrix composite materials and titanium alloys |
CN101863677A (en) * | 2010-07-01 | 2010-10-20 | 哈尔滨工业大学 | A method of in-situ self-generated TiB whiskers to improve the strength of ceramic brazed joints |
CN103990880A (en) * | 2014-06-06 | 2014-08-20 | 哈尔滨工业大学 | Non-metallic material and metal material brazing method capable of forming interpenetrating network structure brazing seams |
Non-Patent Citations (1)
Title |
---|
"Microstructure and mechanical properties of ZrB2–SiC joints fabricated by a contact-reactive brazing technique with Ti and Ni interlayers";Weiqi Yang et al.;《Ceramics International》;20131227;第40卷;第7253-7260页 * |
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