CN105047654B - Stereo luminous filament, processing technology and LED light device - Google Patents

Abstract

The invention relates to a three-dimensional luminescent filament, a processing technology and an LED lighting device. It solves the problems of unreasonable existing designs and the like. The three-dimensional light-emitting filament includes a strip-shaped substrate made of transparent materials or light-transmitting materials. Soldering pads are respectively provided at both ends of the substrate, and at least two solder pads are provided on one side of the substrate. The curved conductive lines connected to each other and arranged in parallel with each other are provided with several LED flip chips on each curved conductive line, and the LED flip chips arranged on different curved conductive lines are located on the same straight line. structure. The processing technology of the three-dimensional luminous filament includes A, positioning, B, pre-bending, C, riveting, D, patch, E, packaging. The LED illuminating device includes a bearing base, on which at least one three-dimensional light-emitting filament is arranged. The invention has the advantages of uniform luminous brightness, improved production efficiency and long service life.

Description

Three-dimensional luminescent filament, processing technology and LED lighting device

technical field

The invention belongs to the technical field of lighting equipment, and in particular relates to a three-dimensional light-emitting filament, a processing technology and an LED lighting device.

Background technique

Traditional filaments are metal wires and mostly thin tungsten wires, and iridium or their alloys are also used. When electrified, they can directly emit light, generate heat, or emit electrons, ultraviolet rays, form high-energy electric fields, or generate high-energy rays to excite fluorescent substances, rare gases or Plasma is formed to produce visible light of various colors. Although the filament of this traditional structure has many advantages above, this filament also has the following defects at least: poor luminance and non-uniform luminance. For example, the Chinese patent document discloses an LED filament [application number: 201320674278.8], which includes: a substrate, a plurality of chips fixed on the substrate, and a protective layer surrounding the chip and the substrate; , the first gallium nitride, the light-emitting layer and the second gallium nitride, the material of the substrate is a light-transmitting material; if the substrate is made of a light-transmitting material, the light of the light-emitting layer can penetrate the substrate, and a 360° omnidirectional Uniform light emission; when the substrate is a light-transmitting material, there is no need to use a reflective layer or a patterned LED substrate, thus greatly simplifying the production process and reducing production costs. In addition, the Chinese patent literature also discloses an LED filament [application number: 201320859050.6], which includes: a U-shaped or straight strip-shaped substrate with a light-transmitting portion and pins, fixed on the strip-shaped substrate and The LED light-emitting chipset powered by the pins, and the fluorescent colloid wrapped around the strip-shaped substrate and the periphery of the LED light-emitting chipset. It is fixed on the area of the strip-shaped substrate without light transmission holes. In this way, since the light-transmitting part is provided on the substrate and the substrate is strip-shaped, the LED light-emitting chip can emit light through the light-transmitting part, thereby expanding the light-emitting angle of the LED filament and improving the light-emitting performance of the LED package product. In addition, because the fluorescent colloid is wrapped around the substrate and the LED light-emitting chipset, the molding process and accuracy of the fluorescent colloid are simplified, and the molding efficiency of the fluorescent colloid and the yield rate of LED packaging products are improved.

Although the above-mentioned schemes each have the above multiple advantages, these several schemes still have at least the following defects: uneven and poor luminance, the width of the filament is wide and the structure is complex, and secondly, the processing technology of the filament is complicated and difficult. less efficient.

Contents of the invention

The object of the present invention is to solve the above problems and provide a three-dimensional luminous filament with more reasonable design, uniform luminous brightness and narrow filament width.

The second object of the present invention is to solve the above problems and provide a process for processing three-dimensional luminescent filaments with simple process and high production efficiency.

The third object of the present invention is to solve the above problems and provide an LED lighting device with more reasonable design, uniform luminous brightness and simple structure.

In order to achieve the above object, the present invention adopts the following technical solutions: the three-dimensional light-emitting filament includes a long strip-shaped substrate made of transparent material or light-transmitting material, soldering pads are respectively arranged at both ends of the substrate, and on one side of the substrate There are at least two curved conductive lines whose two ends are respectively connected to the pads and arranged in parallel with each other, and a number of LED flip-chips are respectively arranged on each curved conductive line and are arranged on different curved conductive lines. The mounted chip is located on the same straight line, and a packaging structure is provided on the circumference of the substrate. The packaging structure packages the LED flip chip and when the LED flip chip is energized, the light emitted from the side of the substrate away from the LED flip chip to the packaging structure is More than 30% of the luminance emitted from the other side of the substrate to the encapsulation structure.

In the above-mentioned three-dimensional light-emitting filament, the packaging structure includes a first packaging layer that can respectively cover both sides of the substrate and package the LED flip chip provided on one side of the substrate. There is a second encapsulation layer on one side, and when the LED flip-chip is energized, the luminance emitted from the second encapsulation layer is more than 30% of the luminance emitted from the first encapsulation layer, from the first encapsulation layer and the second encapsulation layer The light emitted by the layers is all white light and the color temperature of the two is the same.

In the above three-dimensional light-emitting filament, the first encapsulation layer includes the following components in parts by mass: 8.5-10 parts of green fluorescent powder; 1.8-2.5 parts of red fluorescent powder; 35-40 parts of glue A; 17.5 parts of glue B. ~20 parts; the green fluorescent powder, red fluorescent powder, glue A and glue B are evenly mixed to form the first encapsulation layer.

In the above-mentioned three-dimensional light-emitting filament, the second encapsulation layer includes the following components in parts by mass: 2-2.3 parts of green fluorescent powder; 0.3-0.4 parts of red fluorescent powder; 35-40 parts of glue A; 17.5 parts of glue B. ~20 parts; the green fluorescent powder, red fluorescent powder, glue A and glue B are uniformly mixed to form the second encapsulation layer.

In the above-mentioned three-dimensional light-emitting filament, the LED flip chip is a blue light or purple light chip, and the wavelength of the chip is 365-470nm. The wavelength of the blue light chip is 440-460nm, and the wavelength of the purple light chip is 365-470nm.

In the above-mentioned three-dimensional light-emitting filament, the encapsulation structure and the substrate are connected to form a cylindrical structure after the encapsulation structure circumferentially encapsulates the substrate; or the encapsulation structure and the substrate enclose the substrate circumferentially. Connected to form a flat sheet-like structure.

In the above-mentioned three-dimensional light-emitting filament, the pads are arranged on one side of the substrate, and metal connectors electrically connected to the pads are respectively provided at both ends of the substrate.

In the above-mentioned three-dimensional luminescent filament, the metal connector is made of a plate, and the metal connector is any one of iron nickel-plated metal connectors, iron silver-plated metal connectors and copper silver-plated metal connectors kind.

In the above-mentioned three-dimensional light-emitting filament, one end of the metal connector is provided with a connection structure with an open positioning groove, and the two ends of the substrate are respectively inserted in the positioning groove, and the positioning groove communicates with the opening. The diameter of the position is smaller than the outer diameter of the substrate, and the packaging structure seals the opening of the positioning groove.

In the above-mentioned three-dimensional light-emitting filament, the connection structure includes symmetrically arranged bending and pressing parts respectively arranged on both sides of one end of the metal connector, and the above-mentioned opening is formed between the bending and pressing parts. The connection structure of the positioning groove.

In the above-mentioned three-dimensional light-emitting filament, the metal connector is further provided with a limiting structure for preventing the substrate from being excessively inserted into the positioning groove.

In the above-mentioned three-dimensional light-emitting filament, the position-limiting structure includes a forming protrusion arranged on one side of the metal connector and located at the outer end of the positioning groove; on the other side of the metal connector, there is a forming protrusion corresponding to the forming protrusion. sunken.

The processing technology of the three-dimensional light-emitting filament comprises the following steps:

A. Positioning: Fix at least two metal connectors that are arranged correspondingly in groups of two by two, and set symmetrically arranged bendable pressing parts on both sides of one end corresponding to the metal connectors that are arranged in groups of two by two. ;

B. Pre-bending: bend the two symmetrically arranged bendable pressing parts to the opposite side to form two symmetrically arranged pre-bending pressing parts, and form a The opening is an open tank;

C. Riveting: Insert the two ends of at least one strip-shaped substrate made of transparent material or light-transmitting material into the groove with an open opening. The pads are printed with at least two curved conductive lines arranged in parallel with each other between the two pads, and then the two pre-bent pressing parts are bent to the opposite side by means of riveting to form pressing parts respectively. The bending and pressing part on the substrate;

D. SMD: Each curved conductive line printed on each substrate is fixed with a number of LED flip-chips through conductive glue, and the LED flip-chips arranged on different curved conductive lines are located on the same straight line. Packaging semi-finished products;

E. Encapsulation: Fix the semi-finished product to be encapsulated in the molding cavity, and then inject the encapsulating glue mixed with phosphor powder into the forming cavity so that the circumference of the substrate is covered with the encapsulation structure, and the encapsulation structure wraps the LED flip chip Packaged and when the LED flip chip is energized, the luminance emitted from the side of the substrate away from the LED flip chip to the package structure is more than 30% of the luminance emitted to the package structure from the other side of the substrate. The emitted light in all directions is white light and the color temperature of the light in all directions is the same, that is, the finished three-dimensional luminescent filament is produced.

In the above-mentioned processing technology of the three-dimensional light-emitting filament, in the above-mentioned step A, the metal connectors are stamped and formed by sheet materials, and the corresponding metal connectors arranged in groups of two are respectively formed in the inner frame of the stamping surplus material On the side, on the inner side of the outer frame of the stamping surplus material, there are a plurality of metal connectors arranged correspondingly in groups of two.

In the above-mentioned processing technology of the three-dimensional light-emitting filament, in the above-mentioned step C, the above-mentioned substrates are respectively provided between a plurality of metal connectors that are arranged on the inner side of the outer frame of the stamping surplus material and are in groups of two, When preparing to bend the two pre-bent pressing parts to the opposite side by means of riveting, first place conductive glue on the metal connector and between the two pre-bending pressing parts, and then place the substrate The soldering pads at both ends are respectively placed on the conductive glue of the respective metal connectors, and the substrate forces excess conductive glue into the pre-bent pressing parts on both sides of the substrate under the action of external force.

In the above-mentioned processing technology of the three-dimensional light-emitting filament, an open positioning groove is formed between the two bending and pressing parts, the substrate is inserted into the positioning groove and the diameter of the opening of the positioning groove is smaller than the outer diameter of the substrate, when the The bending and pressing parts are respectively pressed on the substrate, and then the conductive adhesive is melted by reflow soldering and the bending and pressing parts are fixedly connected to the substrate.

In the above-mentioned processing technology of the three-dimensional luminous filament, in the above-mentioned step D, the substrates arranged inside the outer frame of the stamping surplus material are arranged at intervals, and each curved conductive circuit printed on each substrate is respectively fixed by conductive glue There are several LED flip-chips and the LED flip-chips arranged on different curved conductive lines are located on the same straight line, that is, a full-page unit to be packaged with several semi-finished products to be packaged is produced. The full-page to-be-packaged units can improve production efficiency and reduce production costs.

In the processing technology of the above-mentioned three-dimensional luminescent filament, in the above-mentioned step E, the full-page unit to be packaged with several semi-finished products to be packaged is fixed in the molding cavity, and then the packaging compound mixed with phosphor powder is injected into the molding cavity. Glue so that the circumference of each substrate is covered with a package structure, the package structure will package the LED flip chip and when the LED flip chip is powered on, the light emitted from the side of the substrate away from the LED flip chip to the package structure is from The other side of the substrate is emitted to more than 30% of the luminance of the package structure, that is, a number of three-dimensional luminous filaments are made on the outer frame of the stamped material, and then the outer frame of the stamped material is separated from the metal connector by punching, that is, one-time production A number of finished products of three-dimensional light-emitting filaments were obtained.

The LED lighting device includes a carrier base, on which at least one three-dimensional light-emitting filament is arranged, and each three-dimensional light-emitting filament includes a strip-shaped substrate made of a transparent material or a light-transmitting material, and at both ends of the substrate Welding pads are respectively provided, and at least two curved conductive lines with both ends connected to the pads and arranged in parallel with each other are provided on one side of the substrate, and a number of LED flip-chips are respectively arranged on each curved conductive line. The LED flip chips arranged on different curved conductive lines are located on the same straight line, and an encapsulation structure is provided in the circumferential direction of the substrate. The encapsulation structure encapsulates the LED flip chips and when the LED flip chips are energized, they are away from the substrate from the LED flip chips. The luminance emitted from one side of the chip to the package structure is more than 30% of the luminance emitted from the other side of the substrate to the package structure.

In the above-mentioned LED lighting device, the carrying base includes a lamp cap and a lampshade connected to the lamp cap. And three-dimensional light-emitting filaments electrically connected with lamp holders respectively.

Compared with the existing technology, the present invention has the following advantages: 1. The design is more reasonable, the luminous brightness is uniform and high, and the LED flip chips arranged on different curved conductive lines are located on the same straight line, which can further reduce the width of the substrate. The utility of the filament can be further improved. 2. The process is simple and can improve the uniformity of luminous brightness and improve the production efficiency. 3. The lighting device is simple in structure and uniform in brightness, high in brightness and strong in practicability, and secondly, small in size. 4. The structure is simple and easy to manufacture, and the service life is long.

Description of drawings

Fig. 1 is a schematic diagram of the filament structure provided by the present invention.

Fig. 2 is a schematic diagram of the unpackaged structure of the filament provided by the present invention.

Fig. 3 is a schematic diagram of the structure of the filament provided by the present invention without chip attachment.

FIG. 4 is a schematic diagram of the structure of FIG. 2 after the metal connector is removed.

Fig. 5 is a schematic diagram of the cross-sectional structure of the filament provided by the present invention.

FIG. 6 is a schematic diagram of a structure in which the substrate provided by the present invention is not connected to the metal connector.

FIG. 7 is a schematic diagram of the structure after the substrate provided by the present invention is connected to the metal connector.

Fig. 8 is a schematic structural view of the bendable pressing part of the metal connector provided by the present invention when it is not bent.

Fig. 9 is a structural schematic diagram of the pre-bent pressing part formed after the bendable pressing part is bent according to the present invention.

Fig. 10 is a schematic structural view of the pre-bent pressing part provided by the present invention after being riveted.

FIG. 11 is a schematic structural view of two ends of a substrate placed on metal connectors provided by the present invention.

FIG. 12 is a schematic structural diagram of FIG. 11 with the metal connector removed.

Fig. 13 is a schematic structural view of the integral molding of the stamping residual frame and the metal connector provided by the present invention.

FIG. 14 is a schematic diagram of the structure provided by the present invention after the substrate is placed on the metal connector.

Fig. 15 is a schematic structural diagram of the lighting device provided by the present invention.

Fig. 16 is a schematic structural diagram of Embodiment 2 provided by the present invention.

FIG. 17 is a schematic diagram of an enlarged cross-sectional view taken along the line A-A in FIG. 16 .

In the figure, substrate 1, pad 11, curved conductive circuit 12, LED flip chip 2, package structure 3, first package layer 31, second package layer 32, metal connector 4, connection structure 41, positioning groove 41a, Limiting structure 42, forming protrusion 42a, forming depression 42b, bendable pressing part 4a, bending pressing part 4b, pre-bending pressing part 4c, stamping residual material outer frame 5, bearing base 6, lamp cap 61 , lampshade 62, filament fixing frame 63, three-dimensional light-emitting filament a.

detailed description

The following are specific embodiments of the invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.

Embodiment one

As shown in Figures 1-4 and Figure 12, the three-dimensional light-emitting filament includes a strip-shaped substrate 1 made of transparent material or light-transmitting material. Soldering pads 11 are respectively provided at both ends of the substrate 1. There are at least two curved conductive lines 12 whose two ends are respectively connected to the pads 11 and arranged in parallel with each other, and a number of LED flip chips 2 are respectively arranged on each curved conductive line 12 and arranged on different curved lines. The LED flip chips 2 on the conductive circuit 12 are located on the same straight line, the LED flip chips 2 are blue light or purple light chips, and the wavelength of the chips is 365-470nm. When it is a blue light chip, the wavelength of the chip is 440-460nm. When it is a purple light chip, the wavelength of the chip is 365-470nm. The curved conductive lines 12 arranged in parallel combined with the structure in which the LED flip chips 2 arranged on different curved conductive lines 12 are located on the same straight line can greatly reduce the manufacturing cost, and at the same time, facilitate manufacturing and use control.

As shown in FIG. 1 and FIG. 5 , an encapsulation structure 3 is provided on the circumference of the substrate 1 . In an optimized solution, the encapsulation structure 3 and the substrate 1 are connected to form a cylindrical structure after the encapsulation structure 3 encapsulates the substrate 1 in the circumferential direction. The cylindrical structure has small volume and low manufacturing cost, so it is suitable for various lighting devices. The packaging structure 3 encapsulates the LED flip chip 2 and when the LED flip chip 2 is energized, the light emitted from the side of the substrate 1 away from the LED flip chip 2 to the packaging structure 3 is emitted from the other side of the substrate 1 to the packaging structure. 3. More than 30% of the luminosity. The structure can ensure uniformity of luminous brightness, thereby improving practicality. When the LED flip chip 2 is energized, the luminance emitted from the side of the substrate 1 away from the LED flip chip 2 to the package structure 3 is 30%-100% of the luminance emitted from the other side of the substrate 1 to the package structure 3 .

Specifically, the packaging structure 3 of this embodiment includes a first packaging layer 31 that can respectively cover both sides of the substrate 1 and package the LED flip chip 2 provided on one side of the substrate 1 . One side of the chip 2 is provided with a second encapsulation layer, and when the LED flip chip 2 is energized, the luminance emitted from the second encapsulation layer 32 is more than 30% of the luminance emitted from the first encapsulation layer 31. The light emitted from the encapsulation layer 31 and the second encapsulation layer 32 are both white light with the same color temperature. Further, the first encapsulation layer 31 here includes the following components in parts by mass: 8.5-10 parts of green phosphor; 1.8-2.5 parts of red phosphor; 35-40 parts of glue A; 17.5-20 parts of glue B; The above-mentioned green fluorescent powder, red fluorescent powder, glue A and glue B are uniformly mixed to form the first encapsulation layer 31 . The second encapsulation layer 32 includes the following components in parts by mass: 2-2.3 parts of green phosphor; 0.3-0.4 parts of red phosphor; 35-40 parts of glue A; 17.5-20 parts of glue B; , red phosphor, glue A and glue B are evenly mixed to form the second encapsulation layer 32 .

As an optimization solution, the first encapsulation layer 31 of this embodiment includes the following components in parts by mass: 10 parts of green phosphor; 2.5 parts of red phosphor; 40 parts of glue A; 20 parts of glue B; the green phosphor, Red fluorescent powder, glue A and glue B are evenly mixed to form the first encapsulation layer 31 . The second encapsulation layer 32 includes the following components in parts by mass: 2 parts of green phosphor; 0.3 part of red phosphor; 40 parts of A glue; 20 parts of B glue; the green phosphor, red phosphor, A glue and B glue is evenly mixed to form the second encapsulation layer 32 .

In order to facilitate installation, as shown in FIG. 1 and FIG. 6 , the pads 11 of this embodiment are provided on one side of the substrate 1 , and metal connectors 4 electrically connected to the pads 11 are respectively provided at both ends of the substrate 1 . The metal connector 4 is made of plate material, and the metal connector 4 is any one of iron-nickel-plated metal connectors, iron-silver-plated metal connectors and copper-silver-plated metal connectors.

Next, as shown in Fig. 2-3, Fig. 7 and Fig. 9-10, a connection structure 41 with an open positioning groove 41a is provided at one end of the metal connector 4, and the two ends of the substrate 1 are respectively inserted into the The aperture in the positioning groove 41 a and the opening where the positioning groove 41 a communicates with the opening is smaller than the outer diameter of the substrate 1 , and the packaging structure 3 seals the opening of the positioning groove 41 a. This structure can further prevent the opening of the positioning groove 41a from expanding outwards, prolonging the service life. The connection structure includes symmetrically arranged bending and pressing parts 4b respectively arranged on both sides of one end of the metal connector 4. The above-mentioned positioning groove 41a with an open opening is formed between the bending and pressing parts 4b, and the opening is open. The type of positioning groove 41a can ensure that the installation is in place, and can prevent the opposite ends of the two bending and pressing parts 4b from contacting, resulting in improper installation. This structure can ensure assembly efficiency, and at the same time, conductive glue is provided between the positioning groove 41a and the substrate 1 to enhance the conductive performance.

In addition, as shown in FIG. 2 and FIG. 6 , a limiting structure 42 for preventing the substrate 1 from being excessively inserted into the positioning groove 41 a is also provided on the metal connector 4 . The limiting structure 42 includes a formed protrusion 42a disposed on one side of the metal connector 4 and located at the outer end of the positioning groove 41a; and a formed recess 42b corresponding to the formed protrusion 42a is formed on the other side of the metal connector 4 . The structure can ensure the stability of assembly quality and avoid repeated rework.

The processing technology of the three-dimensional light-emitting filament comprises the following steps:

A. Positioning: As shown in Figure 8, fix at least two metal connectors 4 correspondingly arranged in groups of two by two, and symmetrical The bendable pressing part 4a is provided; when the bendable pressing part 4a is bent, the side of the metal connector 4 is used as the crease point;

B. Pre-bending: As shown in Figure 9, the two symmetrically arranged bendable pressing parts 4a are bent toward the opposite side to form two symmetrically arranged pre-bending pressing parts 4c, and the two pre-bent pressing parts 4c are formed. An open groove body is formed between the bent pressing parts 4c; the depth of the groove body is greater than the thickness of the substrate 1, which facilitates the insertion of the substrate 1;

C. Riveting: As shown in Figure 9, insert the two ends of at least one long substrate 1 made of transparent material or light-transmitting material into the groove with an open opening. One side and both ends of 1 are respectively provided with pads 11, and at least two curved conductive lines 12 arranged in parallel with each other are printed between the two pads 11, as shown in Fig. 3, Fig. 7 and Fig. 10, and in conjunction with Fig. 9 As shown, the two pre-bent pressing parts 4c are bent to the opposite side by riveting to form the bending pressing parts 4b respectively pressed on the substrate 1;

D. Patch: As shown in Figure 2, each curved conductive circuit 12 printed on each substrate 1 is respectively fixed with a number of LED flip chips 2 and LED flip chips 2 arranged on different curved conductive circuits 12 through conductive glue. Chip 2 is located on the same straight line, that is, a semi-finished product to be packaged is produced;

E. Encapsulation: As shown in Figure 1 and Figure 5, fix the semi-finished product to be encapsulated in the molding cavity, and then inject the encapsulating glue mixed with phosphor powder into the forming cavity so that the circumference of the substrate 1 is covered with the encapsulation structure 3 The packaging structure 3 encapsulates the LED flip chip 2 and when the LED flip chip 2 is energized, the light emitted from the side of the substrate 1 away from the LED flip chip 2 to the packaging structure 3 is emitted from the other side of the substrate 1 to the package. The luminance of the structure 3 is more than 30%, the light in all directions emitted from the encapsulation structure 3 arranged in the circumferential direction of the substrate 1 is all white light and the color temperature of the light in all directions is the same, that is, the finished three-dimensional light-emitting filament is produced.

In the above-mentioned step A, as shown in FIG. 13 , the metal connectors 4 are stamped and formed from sheet materials, and the metal connectors 4 correspondingly arranged in pairs are respectively formed on the inner side of the stamping surplus frame 5 , on the inner side of the stamping residual frame 5, a plurality of metal connectors 4 correspondingly arranged in groups of two are formed. This structure can improve production efficiency, that is, a plurality of metal connectors 4 can be manufactured at one time.

In the above-mentioned step C, as shown in Fig. 9 and Fig. 14 , the substrates 1 are respectively provided between a plurality of metal connectors 4 arranged in groups of two on the inner side of the stamping residual frame 5 , when preparing to bend the two pre-bent pressing parts 4c to the opposite side by means of riveting, first place conductive glue on the metal connector 4 and between the two pre-bending pressing parts 4c , as shown in Figure 9, the middle protrusion is conductive glue, and the two arrows indicate the flow direction of the conductive glue, and then the pads 11 at both ends of the substrate 1 are respectively placed on the conductive glue of the respective metal connectors 4 and the substrate 1 acts on the external force Force the excess conductive glue to enter the pre-bent pressing portions 4c on both sides of the substrate 1. The bending pressing portion 4b is L-shaped. An open positioning groove 41a is formed between the two bending and pressing parts 4b. The substrate 1 is inserted into the positioning groove 41a and the diameter of the opening of the positioning groove 41a is smaller than the outer diameter of the substrate 1. When the bending and pressing After the parts 4b are respectively pressed on the substrate 1, the conductive adhesive is melted by reflow soldering and the bent and pressed part 4b is fixedly connected with the substrate 1 . This structure can further enhance the conductivity and prevent the product from being unusable due to poor contact.

In the above-mentioned step D, as shown in FIG. 14 in conjunction with FIG. 2 , the substrates 1 arranged inside the stamping surplus frame 5 are arranged at intervals, and each curved conductive circuit 12 printed on each substrate 1 passes through the conductive circuit respectively. A plurality of LED flip-chips 2 are fixed by glue and the LED flip-chips 2 arranged on different curved conductive lines 12 are located on the same straight line, that is, a full-page unit to be packaged with several semi-finished products to be packaged is obtained. The full-page unit to be packaged can improve production efficiency and product quality stability, and avoid technical problems such as low production efficiency of a single unit.

In the above-mentioned step E, as shown in Figure 14 in combination with Figure 1, the full-page unit to be packaged with several semi-finished products to be packaged is fixed in the molding cavity, and then the packaging glue mixed with phosphor powder is injected into the molding cavity to thereby The circumferential direction of each substrate 1 is covered with an encapsulation structure 3. The encapsulation structure 3 encapsulates the LED flip chip 2 and emits from the substrate 1 away from the LED flip chip 2 to the encapsulation structure when the LED flip chip 2 is energized. The luminance of 3 is more than 30% of the luminance emitted from the other side of the substrate 1 to the package structure 3, that is, a number of three-dimensional luminescent filaments are made on the stamping surplus frame 5, and then the stamping surplus frame is formed by punching. 5 is separated from the metal connecting piece 4, that is, a plurality of three-dimensional light-emitting filament finished products are produced at one time.

As shown in Figures 1-7 and Figure 15, the lighting device includes a carrier base 6, on which at least one three-dimensional light-emitting filament a is arranged, and each three-dimensional light-emitting filament a is composed of a long strip and made of a transparent material. Or the substrate 1 made of light-transmitting materials is provided with pads 11 at both ends of the substrate 1, and at least two curved bends with both ends connected to the pads 11 and arranged in parallel with each other are provided on one side of the substrate 1. Conductive lines 12, a number of LED flip chips 2 are arranged on each curved conductive line 12, and the LED flip chips 2 arranged on different curved conductive lines 12 are located on the same straight line, and a package structure 3 is provided on the circumference of the substrate 1 The packaging structure 3 encapsulates the LED flip chip 2 and when the LED flip chip 2 is energized, the light emitted from the side of the substrate 1 away from the LED flip chip 2 to the packaging structure 3 is emitted from the other side of the substrate 1 to the package. 30% or more of the brightness of Structure 3.

The carrying base 6 includes a lamp cap 61 and a lampshade 62 connected to the lamp cap 61. The lamp cap 61 is provided with a filament holder 63 inserted into the lampshade 62. The filament holder 63 is provided with a number of uniformly distributed circles and respectively connected to the lampshade 62. The three-dimensional light-emitting filament a connected to the lamp base 61 . LED lighting devices include any one of bulb lamps, lamp tubes, and lawn lamps.

Embodiment two

As shown in Figures 16-17, the structure and principle of this embodiment are basically the same as those of Embodiment 1, and will not be repeated here. The difference is that the package structure 3 encloses the substrate 1 in the circumferential direction. 3 is connected with the substrate 1 to form a flat sheet structure.

Embodiment three

The structure and principle of this embodiment are basically the same as those of Embodiment 1, so they will not be repeated here. The difference is that the first encapsulation layer 31 includes the following components in parts by mass: 8.5 parts by mass of green phosphor powder; 8.5 parts by mass of red phosphor powder; 1.8 parts; 35-40 parts of glue A; 17.5-20 parts of glue B; the green phosphor, red phosphor, glue A and glue B are evenly mixed to form the first packaging layer 31 .

The second encapsulation layer 32 includes the following components in parts by mass: 2.3 parts of green phosphor; 0.4 part of red phosphor; 35-40 parts of glue A; 17.5-20 parts of glue B; , glue A and glue B are uniformly mixed to form the second encapsulation layer 32 .

The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which the present invention belongs can make various modifications or supplements to the described specific embodiments or adopt similar methods to replace them, but they will not deviate from the spirit of the present invention or go beyond the definition of the appended claims range.

Although the substrate 1, pad 11, curved conductive circuit 12, LED flip chip 2, package structure 3, first package layer 31, second package layer 32, metal connector 4, connection structure 41, Positioning groove 41a, limit structure 42, forming protrusion 42a, forming depression 42b, bendable pressing part 4a, bending pressing part 4b, pre-bending pressing part 4c, stamping surplus material outer frame 5, bearing base 6. Terms such as lamp holder 61, lampshade 62, filament fixing frame 63, three-dimensional light-emitting filament a, etc., but the possibility of using other terms is not excluded. These terms are used only for the purpose of describing and explaining the essence of the present invention more conveniently; interpreting them as any kind of additional limitation is against the spirit of the present invention.

Claims (19)

1. A three-dimensional light-emitting filament, characterized in that the filament comprises a strip-shaped substrate (1) made of transparent material or light-transmitting material, and soldering pads (11) are respectively provided at both ends of the substrate (1). ), one side of the substrate (1) is provided with at least two curved conductive lines (12) whose two ends are respectively connected to the pads (11) and arranged in parallel with each other, and each curved conductive line (12) is respectively A plurality of LED flip chips (2) are provided and the LED flip chips (2) arranged on different curved conductive lines (12) are located on the same straight line, and an encapsulation structure (3) is provided in the circumferential direction of the substrate (1), and the encapsulation structure (3) Encapsulate the LED flip-chip (2) and when the LED flip-chip (2) is energized, the light emitted from the side of the substrate (1) away from the LED flip-chip (2) to the package structure (3) It is more than 30% of the luminance emitted from the other side of the substrate (1) to the package structure (3); The packaging structure (3) includes a first packaging layer (31) capable of covering both sides of the substrate (1) and packaging the LED flip chip (2) arranged on one side of the substrate (1). (1) is provided with a second encapsulation layer on the side away from the LED flip-chip (2), and when the LED flip-chip (2) is energized, the brightness emitted from the second encapsulation layer (32) is the same as that from the first encapsulation The luminance emitted by the layer (31) is more than 30%, and the light emitted from the first encapsulation layer (31) and the second encapsulation layer (32) are all white light with the same color temperature. 2. The three-dimensional light-emitting filament according to claim 1, characterized in that, the first encapsulation layer (31) comprises the following components in parts by mass: 8.5-10 parts of green fluorescent powder; 1.8-2.5 parts of red fluorescent powder 35-40 parts of glue A; 17.5-20 parts of glue B; the green fluorescent powder, red fluorescent powder, glue A and glue B are uniformly mixed to form the first packaging layer (31). 3. The three-dimensional light-emitting filament according to claim 1, characterized in that, the second encapsulation layer (32) comprises the following components in parts by mass: 2-2.3 parts of green phosphor powder; 0.3-0.4 parts of red phosphor powder 35-40 parts of glue A; 17.5-20 parts of glue B; the green fluorescent powder, red fluorescent powder, glue A and glue B are uniformly mixed to form the second encapsulation layer (32). 4. The three-dimensional lighting filament according to claim 1, 2 or 3, characterized in that, the LED flip chip (2) is a blue or violet chip, and the wavelength of the chip is 365-470nm. 5. The three-dimensional luminescent filament according to claim 1, 2 or 3, characterized in that, after the encapsulation structure (3) encloses the substrate (1) circumferentially, the encapsulation structure (3) and the substrate (1) ) are connected to form a cylindrical structure; or the encapsulation structure (3) and the substrate (1) are connected to form a flat sheet structure after encapsulating the substrate (1) circumferentially. 6. The three-dimensional light-emitting filament according to claim 1, 2 or 3, characterized in that, the pads (11) are arranged on one side of the substrate (1), and the two ends of the substrate (1) are respectively provided with A metal connector (4) electrically connected to the pad (11). 7. The three-dimensional luminescent filament according to claim 6, characterized in that, the metal connector (4) is made of a plate, and the metal connector (4) is an iron-nickel-plated metal connector, iron-plated Any one of silver metal connectors and copper silver-plated metal connectors. 8. The three-dimensional light-emitting filament according to claim 7, characterized in that, one end of the metal connector (4) is provided with a connection structure (41) with an open positioning groove (41a), and the Both ends of the substrate (1) are respectively inserted in the positioning groove (41a), and the diameter of the connection between the positioning groove (41a) and the opening is smaller than the outer diameter of the substrate (1), and the packaging structure (3) will be positioned The opening of the groove (41a) is blocked. 9. The three-dimensional light-emitting filament according to claim 8, characterized in that, the connection structure includes symmetrically arranged bending and pressing parts (4b) respectively arranged on both sides of one end of the metal connector (4), the The above-mentioned positioning groove (41a) with an open opening is formed between the bending and pressing parts (4b). 10. The three-dimensional lighting filament according to claim 9, characterized in that, the metal connector (4) is further provided with a limit for preventing the substrate (1) from being excessively inserted into the positioning groove (41a). Bit structure (42). 11. The three-dimensional light-emitting filament according to claim 10, characterized in that, the limiting structure (42) includes a forming protrusion (42a) arranged on one side of the metal connector (4) and located at the outer end of the positioning groove (41a) ); on the other side of the metal connector (4) there is a molding depression (42b) corresponding to the molding protrusion (42a). 12. A processing technology for a three-dimensional luminous filament, characterized in that the processing technology includes the following steps: A. Positioning: Fix at least two metal connectors (4) correspondingly arranged in groups of two by two, and symmetrically arranged on both sides of one end of the metal connectors (4) correspondingly arranged in groups of two by two. The pressing part (4a) can be bent; B. Pre-bending: Bending the two symmetrically arranged bendable pressing parts (4a) to the opposite side to form two symmetrically arranged pre-bending pressing parts (4c), and the two pre-bending pressing parts (4c) An open groove body is formed between the pressing parts (4c); C. Riveting: Insert the two ends of at least one strip-shaped substrate (1) made of transparent material or light-transmitting material into the groove with an open opening, and insert the two ends of each substrate (1) Soldering pads (11) are respectively provided at both ends of one side, and at least two curved conductive lines (12) arranged in parallel with each other are printed between the two soldering pads (11), and then the two pre-bent wires (12) are made by riveting. bending the pressing part (4c) to the opposite side to form the bending pressing part (4b) respectively pressed on the substrate (1); D. SMD: Each curved conductive circuit (12) printed on each substrate (1) is respectively fixed with several LED flip chips (2) through conductive glue and LEDs arranged on different curved conductive circuits (12) The flip chip (2) is located on the same straight line, that is, the semi-finished product to be packaged is obtained; E. Encapsulation: Fix the semi-finished product to be encapsulated in the molding cavity, and then inject the encapsulating glue mixed with phosphor powder into the forming cavity so that the circumference of the substrate (1) is covered with the encapsulation structure (3), and the encapsulation structure (3) ) package the LED flip-chip (2) and when the LED flip-chip (2) is energized, the brightness emitted from the side of the substrate (1) away from the LED flip-chip (2) to the package structure (3) is from The other side of the substrate (1) emits more than 30% of the luminance of the encapsulation structure (3), the light in all directions emitted from the encapsulation structure (3) arranged in the circumferential direction of the substrate (1) is white light, and the color temperature of the light in each azimuth is The same, that is, the finished three-dimensional luminescent filament is obtained. 13. The processing technology of three-dimensional light-emitting filament according to claim 12, characterized in that, in the above-mentioned step A, the metal connectors (4) are stamped and formed by plates, and the metal connectors (4) correspondingly arranged in pairs The connectors (4) are respectively formed on the inner side of the stamping surplus frame (5), and a plurality of said two-by-two corresponding metal connectors ( 4). 14. The processing technology of the three-dimensional luminous filament according to claim 13, characterized in that, in the above-mentioned step C, a number of metals that are arranged on the inner side of the stamping surplus frame (5) and are in groups of two The above-mentioned substrates (1) are respectively arranged between the connectors (4). When the two pre-bending pressing parts (4c) are prepared to be bent to the opposite side by means of riveting, the metal connection Set the conductive glue on the part (4) and between the two pre-bent pressing parts (4c), and then place the pads (11) at both ends of the substrate (1) on the conductive glue of the respective metal connectors (4). and the base plate (1) forces excess conductive glue into the pre-bent pressing portions (4c) on both sides of the base plate (1) under the action of an external force. 15. The processing technology of three-dimensional luminous filament according to claim 14, characterized in that, an open positioning groove (41a) is formed between the two bending and pressing parts (4b), and the substrate (1) is inserted into the In the positioning groove (41a) and the aperture of the opening of the positioning groove (41a) is smaller than the outer diameter of the substrate (1), when the bending and pressing parts (4b) are pressed on the substrate (1) respectively, the conductive The glue melts and makes the bending pressing part (4b) and the substrate (1) fixedly connected. 16. The processing technology of the three-dimensional luminescent filament according to claim 14 or 15, characterized in that, in the above-mentioned D step, the substrates (1) arranged on the inside of the stamping residual frame (5) are arranged at intervals, Each curved conductive circuit (12) printed on each substrate (1) is respectively fixed with a plurality of LED flip chips (2) through conductive glue, and LED flip chips (2) arranged on different curved conductive circuits (12) ) are located on the same straight line, that is, a full-page unit to be packaged with several semi-finished products to be packaged is produced. 17. The processing technology of the three-dimensional luminous filament according to claim 16, characterized in that, in the above-mentioned E step, the full-page units to be packaged with some semi-finished products to be packaged are fixed in the molding cavity, and then supplied to the molding mold The encapsulation glue mixed with phosphor powder is injected into the cavity so that the circumferential direction of each substrate (1) is covered with the encapsulation structure (3), and the encapsulation structure (3) encapsulates the LED flip chip (2) and when the LED is inverted After the mounted chip (2) is energized, the brightness emitted from the side of the substrate (1) away from the LED flip chip (2) to the package structure (3) is equal to the brightness emitted from the other side of the substrate (1) to the package structure (3). More than 30%, that is, a number of three-dimensional luminous filaments are produced on the stamping surplus frame (5), and then the stamping surplus frame (5) is separated from the metal connector (4) by punching, that is, several Finished three-dimensional luminescent filament. 18. An LED lighting device made by using any one of claims 1-11 three-dimensional light-emitting filament, characterized in that the lighting device comprises a carrying base (6), on which at least one three-dimensional The luminous filaments (a), each three-dimensional luminous filament (a) respectively includes a strip-shaped substrate (1) made of a transparent material or a light-transmitting material, and solder pads ( 11), one side of the substrate (1) is provided with at least two curved conductive lines (12) whose two ends are respectively connected to the pads (11) and arranged in parallel with each other, on each curved conductive line (12) A plurality of LED flip-chips (2) are provided respectively, and the LED flip-chips (2) arranged on different curved conductive lines (12) are located on the same straight line, and a package structure (3) is provided on the circumference of the substrate (1), and the package The structure (3) encapsulates the LED flip chip (2) and emits light from the side of the substrate (1) away from the LED flip chip (2) to the packaging structure (3) when the LED flip chip (2) is energized. The luminance is more than 30% of the luminance emitted from the other surface of the substrate (1) to the encapsulation structure (3). 19. The LED lighting device according to claim 18, characterized in that, the carrying base (6) comprises a lamp cap (61) and a lampshade (62) connected to the lamp cap (61), and on the lamp cap (61) A filament holder (63) inserted into the lampshade (62) is provided, and the filament holder (63) is provided with a plurality of three-dimensional light-emitting filaments (a) that are evenly distributed around the circumference and are electrically connected to the lamp holder (61) respectively.