CN104928733A - Plating solution formula of plating rhenium-iridium alloy on copper basal body and electroplating method - Google Patents
Plating solution formula of plating rhenium-iridium alloy on copper basal body and electroplating method Download PDFInfo
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- 238000007747 plating Methods 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 36
- 239000010949 copper Substances 0.000 title claims abstract description 36
- YEWLVPDHCCERJH-UHFFFAOYSA-N [Re].[Ir] Chemical compound [Re].[Ir] YEWLVPDHCCERJH-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 229910000575 Ir alloy Inorganic materials 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000009713 electroplating Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 24
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000008367 deionised water Substances 0.000 claims abstract description 17
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 17
- 230000008021 deposition Effects 0.000 claims abstract description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims abstract description 7
- 108010010803 Gelatin Proteins 0.000 claims abstract description 7
- 229920000159 gelatin Polymers 0.000 claims abstract description 7
- 239000008273 gelatin Substances 0.000 claims abstract description 7
- 235000019322 gelatine Nutrition 0.000 claims abstract description 7
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 7
- DANYXEHCMQHDNX-UHFFFAOYSA-K trichloroiridium Chemical compound Cl[Ir](Cl)Cl DANYXEHCMQHDNX-UHFFFAOYSA-K 0.000 claims abstract description 7
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 claims abstract description 7
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 claims abstract description 7
- 235000012141 vanillin Nutrition 0.000 claims abstract description 7
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims abstract description 6
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 claims abstract description 6
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims abstract description 6
- 229910021638 Iridium(III) chloride Inorganic materials 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000000243 solution Substances 0.000 claims description 21
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 18
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 4
- 239000003599 detergent Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 235000021110 pickles Nutrition 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- -1 Alkyl sodium sulfate Chemical compound 0.000 claims 1
- 229910052938 sodium sulfate Inorganic materials 0.000 claims 1
- 235000011152 sodium sulphate Nutrition 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052702 rhenium Inorganic materials 0.000 description 4
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QHMLGYJOGFXZOP-UHFFFAOYSA-N [Ni]N Chemical compound [Ni]N QHMLGYJOGFXZOP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013386 optimize process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Electroplating And Plating Baths Therefor (AREA)
Abstract
本发明公开了一种在铜基体镀铼铱合金的镀液配方和配置方法以及在铜基体上镀铼铱合金的方法，镀液配方为明胶0～5g/L，香兰素0～3mM，十二烷基硫酸钠0～2mM，柠檬酸30～400mM，氨基磺酸镍5～50mM，高铼酸铵30～50mM，三氯化铱10～50mM，氢氧化钠3～5M，镀液pH＝2.0-5.0；镀液配置方法包括按照配方量倒入去离子水中溶解，加热至70～80℃溶解2小时以上，等冷却至室温后，利用pH仪测镀液所需的pH值，通过加入配比量的氢氧化钠调试镀液pH值；镀铼铱合金的方法包括铜基体表面预处理，镀液温度60～70℃，电流密度50～60mA/cm2，打开电源，沉积时间30～60分钟。本发明通过改进镀铼铱合金溶液配方、优化镀铼铱合金工艺，使电镀铼铱合金均匀致密且具有较强的附着力。The invention discloses a plating solution formula and configuration method for plating a rhenium-iridium alloy on a copper substrate and a method for plating a rhenium-iridium alloy on a copper substrate. The plating solution formula is gelatin 0-5g/L, vanillin 0-3mM, Sodium lauryl sulfate 0-2mM, citric acid 30-400mM, nickel sulfamate 5-50mM, ammonium perrhenate 30-50mM, iridium trichloride 10-50mM, sodium hydroxide 3-5M, bath pH =2.0-5.0; the plating solution configuration method includes pouring into deionized water to dissolve according to the formula amount, heating to 70-80°C and dissolving for more than 2 hours, and after cooling to room temperature, use a pH meter to measure the required pH value of the plating solution, and pass Add a proportioned amount of sodium hydroxide to adjust the pH value of the plating solution; the method of rhenium-iridium alloy plating includes surface pretreatment of the copper substrate, the temperature of the plating solution is 60-70°C, the current density is 50-60mA/cm 2 , the power is turned on, and the deposition time is 30 ~60 minutes. The invention improves the rhenium-iridium alloy plating solution formula and optimizes the rhenium-iridium alloy plating process, so that the rhenium-iridium alloy plating is uniform and compact and has strong adhesion.
Description
技术领域technical field
本发明属于金属表面处理的技术领域，具体涉及一种在铜基体上镀铼铱合金技术领域。The invention belongs to the technical field of metal surface treatment, in particular to the technical field of rhenium-iridium alloy plating on a copper substrate.
背景技术Background technique
难熔金属铼具有高熔点、耐磨损、抗腐蚀和良好的高温力学性能，然而铼在高温有氧环境中易被氧化。可通过高温抗氧化涂层和掺杂抗氧化元素来有效的改善铼的高温抗氧化性能。铱具有高熔点、高强度、极好的化学稳定性和低氧渗透率，是高温下热强度和热稳定性能最优良的金属，是唯一拥有强抗氧化性同时具有极高熔点的金属，也是唯一能在1600℃以上空气中仍具有良好机械力学性能的金属。美国研制的Ir/Re液体火箭发动机燃烧室已在空间飞行器的推进系统2200℃温度下使用。The refractory metal rhenium has high melting point, wear resistance, corrosion resistance and good high-temperature mechanical properties, but rhenium is easily oxidized in a high-temperature aerobic environment. The high-temperature oxidation resistance of rhenium can be effectively improved by high-temperature anti-oxidation coating and doping with anti-oxidation elements. Iridium has high melting point, high strength, excellent chemical stability and low oxygen permeability. It is the metal with the best thermal strength and thermal stability at high temperature. It is the only metal with strong oxidation resistance and extremely high melting point. The only metal that can still have good mechanical properties in air above 1600°C. The Ir/Re liquid rocket engine combustor developed by the United States has been used in the propulsion system of space vehicles at a temperature of 2200 ° C.
另一种途径是掺杂铱来改善铼的高温抗氧化性能，铼铱合金涂层已被应用于较多应用领域中，由于它具有较高的硬度、高弹性和韧性、较好的化学稳定性。国内外文献和公开的专利中报道了物理气相沉积技术制备铼铱合金薄膜，可用于精密磨具表面，改善脱模性能和延长磨具的使用寿命。不过物理气相沉积设备昂贵，成分分布不均匀和不易控制等因素。本发明采用电镀技术制备铼铱合金，因为电镀技术具有低成本、设备简单、沉积温度低、镀液无毒性、厚度成分微观结构可控、高纯度和致密性等优点；且通过改进铼铱合金配方和优化电镀工艺，制备出优良的铼铱合金。Another way is to dope iridium to improve the high-temperature oxidation resistance of rhenium. Rhenium-iridium alloy coating has been used in many application fields because of its high hardness, high elasticity and toughness, and good chemical stability. sex. Domestic and foreign literature and published patents have reported that rhenium-iridium alloy thin films are prepared by physical vapor deposition technology, which can be used on the surface of precision abrasive tools to improve mold release performance and prolong the service life of abrasive tools. However, physical vapor deposition equipment is expensive, and the components are unevenly distributed and difficult to control. The present invention uses electroplating technology to prepare rhenium-iridium alloy, because the electroplating technology has the advantages of low cost, simple equipment, low deposition temperature, non-toxic plating solution, controllable microstructure of thickness composition, high purity and compactness; and by improving the rhenium-iridium alloy Formula and optimize the electroplating process to prepare excellent rhenium-iridium alloy.
本发明公开了一种镀铼铱合金的镀液配方，其特征在于：明胶1～5g/L，香兰素0.5～3mM，十二烷基硫酸钠0.5～2mM，柠檬酸30～400mM，氨基磺酸镍5～50mM，高铼酸铵30～50mM，三氯化铱10～50mM，氢氧化钠3～5M，镀液pH＝2.0-5.0；所述镀液的配置方法为：按照配方量称取明胶、香兰素、十二烷基硫酸钠、柠檬酸、氨基磺酸镍、高铼酸铵和三氯化铱粉末，倒入1/3体积的去离子水中溶解，同时需要磁力搅拌器加热70-80℃溶解2小时以上，等冷却至室温后，再加入剩余体积的去离子水，同时利用pH仪测镀液所需的pH值，通过加入配比量的氢氧化钠调试镀液pH值。The invention discloses a plating solution formula for rhenium-iridium alloy plating, which is characterized in that: gelatin 1-5g/L, vanillin 0.5-3mM, sodium lauryl sulfate 0.5-2mM, citric acid 30-400mM, amino Nickel sulfonate 5-50mM, ammonium perrhenate 30-50mM, iridium trichloride 10-50mM, sodium hydroxide 3-5M, plating solution pH=2.0-5.0; the configuration method of the plating solution is: according to the formula quantity Weigh gelatin, vanillin, sodium lauryl sulfate, citric acid, nickel sulfamate, ammonium perrhenate and iridium trichloride powder, pour into 1/3 volume of deionized water to dissolve, and need magnetic stirring at the same time Heat the device at 70-80°C to dissolve for more than 2 hours. After cooling to room temperature, add the remaining volume of deionized water. At the same time, use a pH meter to measure the pH value of the plating solution, and adjust the plating by adding a proportion of sodium hydroxide. Liquid pH.
本发明还提供了一种镀铼铱合金的电镀方法，其特征在于：The present invention also provides an electroplating method for rhenium-iridium alloy plating, characterized in that:
步骤1：将铜基体表面放入洗涤剂中充分去油，然后使用乙酸、盐酸和水按照体积比1:3:3的混合酸对铜基体表面进行酸洗30-60秒，其中乙酸和盐酸浓度约30～40％，再使用去离子水冲洗铜基体干净，最后使用超净纸擦净基体表面的水溶液；Step 1: Put the surface of the copper substrate into the detergent to fully remove the oil, and then use acetic acid, hydrochloric acid and water to pickle the surface of the copper substrate for 30-60 seconds according to the mixed acid of 1:3:3 by volume, wherein the acetic acid and hydrochloric acid The concentration is about 30-40%, then rinse the copper substrate with deionized water, and finally use ultra-clean paper to wipe off the aqueous solution on the surface of the substrate;
步骤2：在铜基体上进行镀铼铱合金，将铜基体与电镀电源的阴极相连放入电解槽内，同时将铂电极与电镀电源的阳极相连放入电解槽内，镀液温度60～70℃，电流密度50～60mA/cm2，打开电源，沉积时间30～60分钟；Step 2: Plating the rhenium-iridium alloy on the copper substrate, connecting the copper substrate with the cathode of the electroplating power supply and putting it into the electrolytic tank, and at the same time connecting the platinum electrode with the anode of the electroplating power supply and putting it into the electrolytic tank, the temperature of the plating solution is 60-70 ℃, current density 50-60mA/cm 2 , power on, deposition time 30-60 minutes;
步骤3：从电解槽中取出铜基体，先使用去离子水冲洗铜基体，在使用吹风机吹干。Step 3: Take out the copper substrate from the electrolytic tank, first rinse the copper substrate with deionized water, and then dry it with a hair dryer.
本发明的优点在于：(1)无毒无污染；(2)优化工艺，成本低廉；(3)可应用于形状复杂的可导电基体表面沉积铼铱合金；(4)低温沉积；(6)可以获得附着力强的、致密的和连续的铼铱镀层。The advantages of the present invention are: (1) non-toxic and pollution-free; (2) optimized process, low cost; (3) applicable to the deposition of rhenium-iridium alloy on the surface of conductive substrates with complex shapes; (4) low-temperature deposition; (6) Strong adhesion, dense and continuous rhenium-iridium coatings can be obtained.
具体实施方式：Detailed ways:
实施例1Example 1
制备电镀铼铱合金的镀液：按照配方量称取明胶2g/L、香兰素1mM、十二烷基硫酸钠1.2mM、柠檬酸340mM、氨基磺酸镍7mM、高铼酸铵35mM和三氯化铱20mM，倒入去离子水中溶解，并在磁力搅拌器下加热70-80℃溶解3小时，冷却至室温后，微量添加剩余体积水，同时通过添加5M氢氧化钠来调节pH值至5.0。Prepare the plating solution for electroplating rhenium-iridium alloy: weigh gelatin 2g/L, vanillin 1mM, sodium lauryl sulfate 1.2mM, citric acid 340mM, nickel sulfamate 7mM, ammonium perrhenate 35mM and three Iridium chloride 20mM, poured into deionized water to dissolve, and heated under a magnetic stirrer at 70-80°C for 3 hours, cooled to room temperature, added the remaining volume of water in a small amount, and adjusted the pH value by adding 5M sodium hydroxide to 5.0.
铜基体表面预处理的酸溶液：乙酸、盐酸和去离子水体积比1:3:3。Acid solution for surface pretreatment of copper substrate: volume ratio of acetic acid, hydrochloric acid and deionized water is 1:3:3.
使用铜导线焊接在铜基体零件上，首先将铜基体零件在洗涤剂下充分去油，然后浸在酸洗液中酸洗40秒，随后用去离子水冲洗铜基体零件。Use copper wires to weld on copper base parts. Firstly, fully degrease the copper base parts under detergent, then soak them in pickling solution for 40 seconds, and then rinse the copper base parts with deionized water.
将铜基体与电镀电源的阴极相连放入电解槽内，同时将铂电极与电镀电源的阳极相连放入电解槽内，镀液温度调节至70℃，电流密度50mA/cm2，打开电源，沉积时间30分钟。沉积结束后，从电解槽中取出铜基体，先使用去离子水冲洗铜基体，在使用吹风机吹干。Connect the copper substrate to the cathode of the electroplating power supply and put it into the electrolytic tank. At the same time, connect the platinum electrode to the anode of the electroplating power supply and put it into the electrolytic tank. Adjust the temperature of the plating solution to 70°C and the current density to 50mA/ cm2 . Time 30 minutes. After the deposition, the copper substrate was taken out from the electrolytic bath, rinsed with deionized water, and then dried with a hair dryer.
实施例2Example 2
制备电镀铼铱合金的镀液：按照配方量称取明胶0g/L、香兰素0mM、十二烷基硫酸钠1mM、柠檬酸34mM、氨基磺酸镍8mM、高铼酸铵35mM和三氯化铱35mM，倒入去离子水中溶解，并在磁力搅拌器下加热70-80℃溶解2.5小时，冷却至室温后，微量添加剩余体积水，同时通过添加3M氢氧化钠来调节pH值至2.5。Prepare the plating solution for electroplating rhenium-iridium alloy: weigh gelatin 0g/L, vanillin 0mM, sodium lauryl sulfate 1mM, citric acid 34mM, nickel sulfamate 8mM, ammonium perrhenate 35mM and trichloride Iridium 35mM, poured into deionized water to dissolve, and heated under a magnetic stirrer at 70-80°C to dissolve for 2.5 hours, after cooling to room temperature, add the remaining volume of water in a small amount, and at the same time adjust the pH value to 2.5 by adding 3M sodium hydroxide .
铜基体表面预处理的酸溶液：乙酸、盐酸和去离子水体积比1:3:3。Acid solution for surface pretreatment of copper substrate: volume ratio of acetic acid, hydrochloric acid and deionized water is 1:3:3.
使用铜导线焊接在铜基体零件上，首先将铜基体零件在洗涤剂下充分去油，然后浸在酸洗液中酸洗40秒，随后用去离子水冲洗铜基体零件。Use copper wires to weld on copper base parts. First, fully degrease the copper base parts under detergent, then soak them in pickling solution for 40 seconds, and then rinse the copper base parts with deionized water.
将铜基体与电镀电源的阴极相连放入电解槽内，同时将铂电极与电镀电源的阳极相连放入电解槽内，镀液温度调节至70℃，电流密度50mA/cm2，打开电源，沉积时间30分钟。沉积结束后，从电解槽中取出铜基体，先使用去离子水冲洗铜基体，在使用吹风机吹干。Connect the copper substrate to the cathode of the electroplating power supply and put it into the electrolytic tank. At the same time, connect the platinum electrode to the anode of the electroplating power supply and put it into the electrolytic tank. Adjust the temperature of the plating solution to 70°C and the current density to 50mA/ cm2 . Time 30 minutes. After the deposition, the copper substrate was taken out from the electrolytic bath, rinsed with deionized water, and then dried with a hair dryer.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107699928A (en) * | 2016-12-01 | 2018-02-16 | 中国人民解放军国防科学技术大学 | The preparation method of black rhenium coating |
| CN108103537A (en) * | 2017-12-08 | 2018-06-01 | 常州大学 | A kind of acidic bath formula of surface of glass die rhenium iridium alloy coating and preparation method thereof |
| CN110552029A (en) * | 2019-10-24 | 2019-12-10 | 徐州市国艺铝合金包装箱有限公司 | Surface electroplating solution suitable for aluminum alloy |
| CN113549963A (en) * | 2021-07-23 | 2021-10-26 | 南昌大学 | Additive for electroplating rhenium coating on tungsten and its alloy substrate and preparation method thereof |
-
2015
- 2015-05-13 CN CN201510243942.7A patent/CN104928733B/en active Active
Non-Patent Citations (2)
| Title |
|---|
| A.NAOR ET AL: "Electrodeposition of rhenium-nickel alloys from aqueous solutions", 《ELECTROCHIMICA ACTA》 * |
| MAAYAN COHEN SAGIV: "Incorporation of iridium into electrodeposited rhenium–nickel alloys", 《ELECTROCHIMICA ACTA》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107699928A (en) * | 2016-12-01 | 2018-02-16 | 中国人民解放军国防科学技术大学 | The preparation method of black rhenium coating |
| CN107699928B (en) * | 2016-12-01 | 2019-05-17 | 中国人民解放军国防科学技术大学 | The preparation method of black rhenium coating |
| CN108103537A (en) * | 2017-12-08 | 2018-06-01 | 常州大学 | A kind of acidic bath formula of surface of glass die rhenium iridium alloy coating and preparation method thereof |
| CN110552029A (en) * | 2019-10-24 | 2019-12-10 | 徐州市国艺铝合金包装箱有限公司 | Surface electroplating solution suitable for aluminum alloy |
| CN113549963A (en) * | 2021-07-23 | 2021-10-26 | 南昌大学 | Additive for electroplating rhenium coating on tungsten and its alloy substrate and preparation method thereof |
| CN113549963B (en) * | 2021-07-23 | 2023-02-03 | 南昌大学 | Additive for plating rhenium coating on tungsten and tungsten alloy matrix and preparation method thereof |
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|---|---|
| CN104928733B (en) | 2018-04-27 |
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