[go: up one dir, main page]

CN104914375B - The deviation correction method of flying probe tester - Google Patents

The deviation correction method of flying probe tester Download PDF

Info

Publication number
CN104914375B
CN104914375B CN201510235763.9A CN201510235763A CN104914375B CN 104914375 B CN104914375 B CN 104914375B CN 201510235763 A CN201510235763 A CN 201510235763A CN 104914375 B CN104914375 B CN 104914375B
Authority
CN
China
Prior art keywords
point
probe
center
marginal
length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510235763.9A
Other languages
Chinese (zh)
Other versions
CN104914375A (en
Inventor
黄韬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Xie Chen Electronic Science And Technology Co Ltd
Original Assignee
Nanjing Xie Chen Electronic Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Xie Chen Electronic Science And Technology Co Ltd filed Critical Nanjing Xie Chen Electronic Science And Technology Co Ltd
Priority to CN201510235763.9A priority Critical patent/CN104914375B/en
Publication of CN104914375A publication Critical patent/CN104914375A/en
Application granted granted Critical
Publication of CN104914375B publication Critical patent/CN104914375B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Tests Of Electronic Circuits (AREA)

Abstract

The invention discloses a kind of deviation correction method of flying probe tester, the cross Target Center of camera review is directed to the center o of one of test point of pcb board to be calibrated first;Probe is controlled to detect pcb board to be calibrated again, obtain probe contact pad t, control probe to search out marginal point a1, the marginal point a2 of both sides along X or Y-direction by initial point of the probe contact pad t, X or the central point a3 of Y-direction are searched out according to two marginal points of the X or Y-direction detected;Same mode searches out Y or the central point of X-direction, the center o of the test point of pcb board as to be calibrated, and the deviation between probe initial point t and the center o of test point is the real offset of probe and camera center;Control system is compensated after above-mentioned real offset, is tested.The real offset of probe and camera center can be determined before using the flying probe tester by above-mentioned deviation correction method, it is ensured that the test accuracy of flying probe tester.

Description

The deviation correction method of flying probe tester
Technical field
The invention belongs to the control field of flying probe tester, more particularly to a kind of deviation correction method of flying probe tester.
Background technology
Flying probe tester is for element arranges high density, the number of plies is more, wiring density is big, measuring point is apart from small pcb board (print Printed circuit board) a kind of instrument for being tested, the insulation of main measurement circuit plate and conduction value.Tester typically uses " true value Comparison and location method ", can in real time be monitored, it is ensured that the accuracy of test to test process and trouble point.Flying probe tester has Finer pitch, is not limited by grid, and test is flexible, the features such as speed is fast.
As shown in figure 1, the test arm of flying probe tester be arranged on support Y-axis sliding block on, can with Y-direction make on Lower motion, Y-axis, which is arranged in X-axis, can make the side-to-side movement of X-direction, and probe is arranged in Z axis guide rail, and probe can be in Z Moved forward and backward on direction of principal axis (as shown by the arrows in Figure 1), test machine is exactly to control X, Y, Z axis by the test software of host computer Motion, and then control probe to prick PCB each test point, complete the detection to pcb board.It can be seen that, the test of flying probe tester Accuracy depends primarily on test probe and the aligning accuracy of test point on pcb board, because the test point of pcb board is smaller, test Closer to the distance between point, the test point that control test probe is precisely directed to pcb board then turns into the technology of those skilled in the art Problem.
When the test software of host computer is detected according to PCB test data to PCB, it is necessary first to point to probe The test benchmark point of pcb board, from test benchmark point test PCB on all test points position, in order to ensure probe with The aligning accuracy of test benchmark point, is mounted with video camera on test arm, and exactitude position is carried out by cameras capture image, Such as Fig. 2, by the center of circle of the cross Target Center alignment fiducials point of video camera, and due to video camera and probe nothing on hardware configuration Method is set to coaxially, and the two has certain position offset, therefore can not accomplish that the shooting center of video camera and probe are had an acupuncture treatment Point overlaps test software automatic compensation for carrying out position skew in test, it is necessary to host computer;But the trueness error of structural member With the reason such as assembly technology, real offset and the default offset amount of probe and video camera have error, and this error will necessarily Have influence on the acupuncture treatment position of probe to influence measuring accuracy, probe can prick outside test point and cause to survey by mistake when serious, cause The test result of flying probe tester is inaccurate.
The content of the invention
Therefore, the technical problems to be solved by the invention are that the flying probe accuracy of existing flying probe tester is poor, And then a kind of flying probe tester deviation correction method for the deviation for being capable of correcting probe and camera center is provided.
In order to solve the above technical problems, the deviation correction method of the flying probe tester of the present invention, comprises the following steps,
(1) the cross Target Center of camera review is directed at the center o of one of test point of pcb board to be calibrated by;
(2) controls probe to detect pcb board to be calibrated, probe contact pad t is obtained, using the probe contact pad t as initial point Control probe searches out marginal point a1, the marginal point a2 of both sides along X or Y-direction, according to two edges of the X or Y-direction detected Point searches out the X or central point a3 of Y-direction;
(3) probe is controlled to search out both sides along Y or X-direction by starting point of the X or central point a3 of Y-direction Marginal point b1, marginal point b2, are searched out in the test point of pcb board to be calibrated according to two marginal points of the Y or X-direction detected Deviation between heart o, probe initial point t and the center o of test point is the real offset of probe and camera center;
(4) control system is compensated after above-mentioned real offset, is tested.
Control system is compensated after above-mentioned actual deviation value in step (4), and the cross Target Center of camera review is aligned The center o of another test point of pcb board to be calibrated, the test point area is less than the test point area of step (1), repeats to walk Suddenly more accurate real offset is obtained after (2) and step (3), control system is compensated after above-mentioned real offset, entered again Row test.
Marginal point is found in step (2) and step (3) in the following ways:Control probe is set along along X or Y-direction by first Fixed step size detects pcb board, until can't detect after electric signal, is returned along X or Y-direction by the second setting step-length, until examining again Electric signal is measured, probe and so on searches out the marginal point a1 or b1 of the side of probe initial point X or Y-direction, along X or Y side Continue to detect to by the 3rd setting step-length, until can't detect after electric signal, returned along X or Y-direction by the second setting step-length, directly To electric signal is detected again, probe and so on searches out the marginal point a2 or b2 of probe initial point X or Y-direction opposite side.
The first setting step-length is more than the second setting step-length.
The 3rd setting step-length is more than or equal to the first setting step-length.
In step (2) and step (3) according to X or the marginal point finding center point of Y-direction both sides in the following ways;According to Probe is calculated from marginal point a2 Huob2Zhi centers from marginal point a1 or the b1 step value being moved to used in marginal point a2 or b2 Point a3 or o distance, controls the probe to be moved to central point a3 or o from marginal point a2 or b2 by the 4th setting step-length.
The 4th setting step-length is set to distance/2 between the point of both sides of the edge.
The above-mentioned technical proposal of the present invention has advantages below compared with prior art:
(1) in the deviation correction method of flying probe tester of the invention, first by the cross Target Center of camera review It is directed at the test center o of pcb board to be calibrated;Control probe to detect pcb board again, probe contact pad t is obtained, with the probe test Point t is marginal point a1, the marginal point a2 that initial point control probe searches out both sides along X or Y-direction, according to the X detected or Y side X or the central point a3 of Y-direction are searched out to two marginal points;Institute is controlled by starting point of the X or central point a3 of Y-direction again Marginal point b1, marginal point b2 that probe searches out both sides along Y or X-direction are stated, according to two marginal points of the Y or X-direction detected The test dot center o of pcb board to be calibrated is searched out, so, the deviation between probe initial point t and test dot center o is to visit The real offset of pin and camera center, above-mentioned real offset is recorded to test software.Pass through above-mentioned offset correction Method can determine the real offset of probe and camera center before using the flying probe tester, it is to avoid existing default offset Amount has error to cause probe detecting location wrong with real offset, so that the problem of influenceing measuring accuracy.
(2) in the deviation correction method of flying probe tester of the invention, control probe is used to set step-length along X/Y directions Mobile mode finds marginal point, then finally gives by way of marginal point alignment point the test point of the pcb board to be calibrated Center o, whole process is quick, steady, and efficiency is higher, and the size of step-length can be set by control, improves correction rate And precision.
(3) in the deviation correction method of flying probe tester of the invention, probe is along along X or Y-direction by the first setting step-length Pcb board is detected, until can't detect after electric signal, is returned along X or Y-direction by the second setting step-length, until detecting electricity again Signal, searches out the marginal point of the side of probe initial point X or Y-direction, wherein the second setting step-length is less than the first setting step-length, The positional precision of marginal point can further be improved.
(4) in the deviation correction method of flying probe tester of the invention, after the marginal point for searching out side, along X or Y-direction Continue to detect opposite side marginal point by the 3rd setting step-length, because relatively far away from, the 3rd is set for distance between the marginal point of both sides Fixed step size is more than the first setting step-length, can improve the speed for finding marginal point.
(5) in the deviation correction method of flying probe tester of the invention, calculated according to the distance between both sides of the edge point Go out center position, control the probe to be moved to center position by the 4th setting step-length;The 4th setting step-length is set to Distance/2 between the point of both sides of the edge, make the step of probe one find the position of central point, further increase correction rate, improve spy The service life of pin.
Brief description of the drawings
In order that present disclosure is more likely to be clearly understood, specific embodiment and combination below according to the present invention Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of the test arm of the flying probe tester of the present invention;
Fig. 2 is that the image target of video camera aligns figure with the datum mark of pcb board to be tested;
Fig. 3 is probe in X direction by the schematic diagram of equidistant steps finding center point;
Fig. 4 is probe along schematic diagram of the Y-direction by equidistant steps finding center point.
Reference is expressed as in figure:1- main bodys, 2-Z axis rails, 3- video cameras, 31- camera lens, 4- probes dress Put, 41- probes.
Embodiment
Below with reference to accompanying drawing, the present invention is further elaborated using following examples.
Embodiment 1
Positive and reverse, and Y-direction positive and be reversely with camera review for the X-direction mentioned in the present invention Cross target is used as reference axis, positive and reverse, the positive negative direction correspondence Y-direction of Y-axis of the positive negative direction correspondence X-direction of X-axis It is positive and reverse.
Fig. 1 is the test arm of the flying probe tester of application deviation correction method of the present invention, and above-mentioned test arm includes master Body 1, is opened in the Z axis guide rail in main body 1, and the probe unit 4 being slidably mounted in Z axis guide rail, the probe dress Put 4 front ends and be provided with probe 41 along Z-direction, be fixed with video camera 3 on the downside of the main body, wherein, cam lens 31 are along Z axis Direction is set, it is seen that the center of cam lens 31 has position deviation with the position of probe 41.
The deviation correction method of flying probe tester of the present invention is to be used for correcting probe and the reality of camera lens center Border offset.The calibration method comprises the following steps,
First, as shown in Fig. 2 the cross Target Center of camera review to be aligned to the test dot center of pcb board to be calibrated o;
Secondly, control probe 41 detection pcb board, obtains probe contact pad t, using the probe contact pad t as initial point control Manufacturing probe 41 searches out the marginal point a1 of both sides, marginal point a2 in X direction, according to the X-direction detected two marginal points a1, a2 Obtain the X or central point a3 of Y-direction;
Specifically, as shown in figure 3, control system control probe 41 stretches out and pricked to pcb board, obtain after probe contact pad t, control System processed receives electric signal and controls probe to bounce back, and the first setting step-length of pressing forward of control probe 41 in X direction is detected Pcb board, until can't detect after electric signal, the second setting step-length of reversely pressing in X direction is moved, until detecting telecommunications again Number, it is considered as the marginal point a1 for the side for searching out probe initial point X-direction;The 3rd setting step-length of reversely pressing in X direction continues Detection, until can't detect after electric signal, forward direction in X direction is by the second setting step-length movement, until detecting telecommunications again Number, search out the marginal point a2 of probe initial point X-direction opposite side.
It can be selected as equidistant steps for the above-mentioned first setting step-length, it is also an option that be degression type step-length, with Improve correction efficiency.Above-mentioned standard is equally well suited for use in the second step-length and the 3rd step-length.In addition, the second setting step-length is less than first Setting step-length makes marginal point a1 position more accurate.3rd setting step-length, which is more than the first setting step-length, improves correction efficiency.
It is further preferred that in order that marginal point a1 and marginal point a2 are more accurate, can also repeatedly come and go finer Step-length is found.
Distance/2 between center position, i.e. two edges point are calculated according to marginal point a1, a2 of the reverse both sides of X, controlled Make the probe and be moved to center position by the 4th setting step-length.
As a kind of embodiment, the 4th setting step-length is set to distance/2 between the point of both sides of the edge, and this mode can So that the step of probe one detects center position, calibration speed is improved;In other embodiment, can also by by a2 points with The distance of central point is divided into after some 4th setting step-lengths, and control probe is moved to the central point a3 by the 4th setting step-length.
After the central point a3 for obtaining the X-direction, the probe is controlled to be searched out along Y-direction by starting point of central point a3 Marginal point b1, the marginal point b2 of both sides, the test point of pcb board to be calibrated is searched out according to two marginal points of the Y-direction detected Deviation between center o, probe initial point t and test dot center o is the real offset of probe and camera center.
Specifically, as shown in figure 4, control system controls probe 41 to be stretched again after being moved along Y-direction by the first setting step-length Go out to detect pcb board, until can't detect after electric signal, the reverse movement by the second setting step-length along Y-direction, until detecting again To electric signal, the marginal point b1 of probe initial point Y-direction is now searched out, is continued by the 3rd setting step-length detection, until finding To the marginal point b2 of probe initial point Y-direction opposite side;In being calculated according to the Y-direction detected two marginal points b1, b2 Distance/2 between heart point position, i.e. two edges point, control the probe to be moved to center position by the 4th setting step-length, find To the test dot center o of pcb board to be calibrated, the deviation between probe initial point t and test dot center o is probe and video camera The real offset at center, the real offset is recorded to control system, when probe 41 starts test, by compensating the skew Amount makes probe 41 test pcb board exactly.
Embodiment 2
The present embodiment increases following process the step of embodiment 1 on the basis of (4):It is inclined that control system compensates above-mentioned reality After difference, the cross Target Center of camera review is directed to the center o of another test point of pcb board to be calibrated, the survey Pilot area is less than the test point area of step (1), repeat step (2) and step (3), and carrying out detection by smaller step-length seeks More accurate real offset is obtained after finding test dot center o, control system is compensated after above-mentioned real offset, entered again Row test.Error can further be reduced to minimum value by increasing above-mentioned steps, it is ensured that video camera loci is actual with probe Acupuncture treatment point height is overlapped, it is ensured that testing precision.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or Among changing still in the protection domain of the invention.

Claims (7)

1. a kind of deviation correction method of flying probe tester, it is characterised in that:Comprise the following steps,
(1), the cross Target Center of camera review is aligned to the center o of one of test point of pcb board to be calibrated;
(2)Control probe detects pcb board to be calibrated, obtains probe contact pad t, is controlled by initial point of the probe contact pad t Probe searches out the marginal point a1 of both sides, marginal point a2 along X or Y-direction, is sought according to two marginal points of the X or Y-direction detected Find the X or central point a3 of Y-direction;
(3)The probe is controlled to search out the edge of both sides along Y or X-direction by starting point of the X or central point a3 of Y-direction Point b1, marginal point b2, the center of the test point of pcb board to be calibrated is searched out according to two marginal points of the Y or X-direction detected Deviation between o, probe initial point t and the center o of test point is the real offset of probe and camera center;
(4)Control system is compensated after above-mentioned real offset, is tested.
2. the deviation correction method of flying probe tester according to claim 1, it is characterised in that:Step(4)Middle control system After the above-mentioned actual deviation value of system compensation, the cross Target Center of camera review is directed to another test of pcb board to be calibrated The center o of point, the test point area is less than step(1)Test point area, repeat step(2)And step(3)After obtain more For accurate real offset, control system is compensated after above-mentioned real offset, tested again.
3. the deviation correction method of flying probe tester according to claim 1 or 2, it is characterised in that:Step(2)And step (3)Middle searching marginal point is in the following ways:Control probe along along X or Y-direction by the first setting step-length detection pcb board, until It can't detect after electric signal, returned along X or Y-direction by the second setting step-length, until detecting electric signal again, probe is so past The marginal point a1 or b1 of the side of probe initial point X or Y-direction are searched out again, continue to visit by the 3rd setting step-length along X or Y-direction Survey, until can't detect after electric signal, return, until detecting electric signal again, visited by the second setting step-length along X or Y-direction Pin and so on searches out the marginal point a2 or b2 of probe initial point X or Y-direction opposite side.
4. the deviation correction method of flying probe tester according to claim 3, it is characterised in that:The first setting step-length More than the second setting step-length.
5. the deviation correction method of flying probe tester according to claim 3, it is characterised in that:The 3rd setting step-length More than or equal to the first setting step-length.
6. the deviation correction method of flying probe tester according to claim 1, it is characterised in that:Step(2)And step(3) It is middle according to X or the marginal point finding center point of Y-direction both sides in the following ways;It is moved to according to probe from marginal point a1 or b1 Step value used in marginal point a2 or b2 calculates the distance from marginal point a2 or b2 to central point a3 or o, controls described visit Pin is moved to central point a3 or o by the 4th setting step-length from marginal point a2 or b2.
7. the deviation correction method of flying probe tester according to claim 6, it is characterised in that:The 4th setting step-length It is set to distance/2 between the point of both sides of the edge.
CN201510235763.9A 2015-05-11 2015-05-11 The deviation correction method of flying probe tester Active CN104914375B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510235763.9A CN104914375B (en) 2015-05-11 2015-05-11 The deviation correction method of flying probe tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510235763.9A CN104914375B (en) 2015-05-11 2015-05-11 The deviation correction method of flying probe tester

Publications (2)

Publication Number Publication Date
CN104914375A CN104914375A (en) 2015-09-16
CN104914375B true CN104914375B (en) 2017-08-25

Family

ID=54083610

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510235763.9A Active CN104914375B (en) 2015-05-11 2015-05-11 The deviation correction method of flying probe tester

Country Status (1)

Country Link
CN (1) CN104914375B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105223389B (en) * 2015-09-28 2018-02-02 大族激光科技产业集团股份有限公司 A kind of alignment method of flying probe tester
CN105785257B (en) * 2016-04-13 2019-06-14 大族激光科技产业集团股份有限公司 A kind of bearing calibration of flying probe tester
CN106017317B (en) * 2016-05-13 2019-02-12 中国航空工业集团公司西安飞机设计研究所 A kind of airborne antenna installation accuracy detection method and detection device
CN106771979B (en) * 2016-12-30 2019-07-02 南京协辰电子科技有限公司 A kind of calibration method of double probe flying probe devices
CN107271886B (en) * 2017-07-12 2019-12-27 深圳市迈创力科技有限公司 Rapid alignment method of flying probe testing machine
CN107607852B (en) * 2017-08-07 2019-09-17 大族激光科技产业集团股份有限公司 The bearing calibration of the control method and positioning accuracy of the kinematic axis of flying probe tester
CN107462824B (en) * 2017-08-07 2019-09-17 大族激光科技产业集团股份有限公司 The compensation method of the control method and positioning accuracy of the kinematic axis of flying probe tester
CN110736911B (en) * 2018-07-18 2022-01-25 深圳市大族数控科技股份有限公司 Flying probe testing method, flying probe testing device, flying probe testing apparatus, and storage medium
CN108983460B (en) * 2018-08-17 2021-08-03 苏州凌云视界智能设备有限责任公司 Positioning precision compensation system and method of probe crimping device
CN110187255B (en) * 2019-04-15 2021-10-15 上海华力集成电路制造有限公司 Method for determining overdrive amount during probe test program establishment
CN112116662A (en) * 2019-06-20 2020-12-22 上海炬佑智能科技有限公司 Camera is rectified and is used equipment
CN110333470B (en) * 2019-07-18 2022-06-28 深圳橙子自动化有限公司 Device mounting calibration method for flying probe test
CN110333469B (en) * 2019-07-18 2021-10-29 深圳橙子自动化有限公司 A target point calculation method for flying probe test
CN110686847B (en) * 2019-10-16 2021-09-28 深圳同兴达科技股份有限公司 Automatic steel ball impact testing method
CN114236197A (en) * 2021-12-21 2022-03-25 深圳市阳晶电子科技有限公司 Mobile probe type testing machine and testing method thereof
CN115267491B (en) * 2022-07-11 2024-12-31 苏州亿来升光电科技有限公司 A fast testing and correction method for a thread needle testing machine
CN118914618B (en) * 2024-10-10 2024-12-31 南通暄旭正电子科技有限公司 Flying probe tester testing method and system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6483103A (en) * 1987-09-25 1989-03-28 Niigata Engineering Co Ltd Method for correcting position coordinates of workpiece
JPH02197144A (en) * 1989-01-26 1990-08-03 Tokyo Electron Ltd Alignment of semiconductor wafer to chip
US5321351A (en) * 1990-05-25 1994-06-14 Everett Charles Technologies, Inc. Test fixture alignment system
KR20070116514A (en) * 2006-06-05 2007-12-10 양 전자시스템 주식회사 Probe inspection device for flat panel display device and probe inspection method using same
CN102478385A (en) * 2010-11-26 2012-05-30 京隆科技(苏州)有限公司 Probe card detection method and system
CN102590566A (en) * 2012-03-16 2012-07-18 苏州工业园区世纪福科技有限公司 Automatic alignment method for electronic product testing clamp
CN103743318A (en) * 2013-12-30 2014-04-23 深圳市华星光电技术有限公司 Method and device for correcting coordinates of probe film thickness measuring machine
CN104457539A (en) * 2014-11-05 2015-03-25 深圳市大族激光科技股份有限公司 Computing method of probe lifting heights of test probes of flying-probe tester

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6483103A (en) * 1987-09-25 1989-03-28 Niigata Engineering Co Ltd Method for correcting position coordinates of workpiece
JPH02197144A (en) * 1989-01-26 1990-08-03 Tokyo Electron Ltd Alignment of semiconductor wafer to chip
US5321351A (en) * 1990-05-25 1994-06-14 Everett Charles Technologies, Inc. Test fixture alignment system
KR20070116514A (en) * 2006-06-05 2007-12-10 양 전자시스템 주식회사 Probe inspection device for flat panel display device and probe inspection method using same
CN102478385A (en) * 2010-11-26 2012-05-30 京隆科技(苏州)有限公司 Probe card detection method and system
CN102590566A (en) * 2012-03-16 2012-07-18 苏州工业园区世纪福科技有限公司 Automatic alignment method for electronic product testing clamp
CN103743318A (en) * 2013-12-30 2014-04-23 深圳市华星光电技术有限公司 Method and device for correcting coordinates of probe film thickness measuring machine
CN104457539A (en) * 2014-11-05 2015-03-25 深圳市大族激光科技股份有限公司 Computing method of probe lifting heights of test probes of flying-probe tester

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
摄像机标定方法简述;李鹏 等;《传感器世界》;20070331;第21-24页 *

Also Published As

Publication number Publication date
CN104914375A (en) 2015-09-16

Similar Documents

Publication Publication Date Title
CN104914375B (en) The deviation correction method of flying probe tester
KR100881237B1 (en) Method for detecting probe tip position, storage medium and probe device recording the method
CN106796263B (en) Electrical test system with vision guide alignment
CN105223389B (en) A kind of alignment method of flying probe tester
TWI464817B (en) An alignment method, a needle position detecting device, and a probe device
KR100754543B1 (en) Probe apparatus
CN102590566B (en) Automatic alignment method for electronic product testing clamp
CN101361005A (en) Method and device for testing unequipped circuit boards
CN105241399A (en) Method of measuring dynamic flatness of precision positioning platform
CN111146103B (en) Wafer detection method and detection equipment
CN114441942A (en) Flying probe testing method, system, equipment and storage medium for PCB
CN105705955B (en) Electrical detection device
CN113740571A (en) Array testing device capable of realizing automatic precise control of single probe block
CN219533326U (en) Capacitive detection device
KR101183101B1 (en) Method of die bonding for flip chip
CN114460442B (en) High-precision needle drop compensation method and device for flying needle test and storage medium
JP6422349B2 (en) Measuring apparatus and alignment method
CN111386469B (en) Substrate inspection device, inspection position correction method, information generation method and information generation system
JPH11251379A (en) Wafer probing device
CN101527275A (en) Wafer back positioning system
CN114236197A (en) Mobile probe type testing machine and testing method thereof
JP3248136B1 (en) Probe method and probe device
JP2002057196A (en) Method and device for probe
CN105334446A (en) Method for aligning workpiece to tool in electrical testing
US20040249595A1 (en) Method of calibrating a component placement machine, device suitable for carrying out such a method, and calibration component suitable for use in such a method or device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant