CN104914375B - The deviation correction method of flying probe tester - Google Patents
The deviation correction method of flying probe tester Download PDFInfo
- Publication number
- CN104914375B CN104914375B CN201510235763.9A CN201510235763A CN104914375B CN 104914375 B CN104914375 B CN 104914375B CN 201510235763 A CN201510235763 A CN 201510235763A CN 104914375 B CN104914375 B CN 104914375B
- Authority
- CN
- China
- Prior art keywords
- point
- probe
- center
- marginal
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000012937 correction Methods 0.000 title claims abstract description 26
- 238000012360 testing method Methods 0.000 claims abstract description 59
- 238000012552 review Methods 0.000 claims abstract description 9
- 238000001514 detection method Methods 0.000 claims description 6
- 238000001467 acupuncture Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of deviation correction method of flying probe tester, the cross Target Center of camera review is directed to the center o of one of test point of pcb board to be calibrated first;Probe is controlled to detect pcb board to be calibrated again, obtain probe contact pad t, control probe to search out marginal point a1, the marginal point a2 of both sides along X or Y-direction by initial point of the probe contact pad t, X or the central point a3 of Y-direction are searched out according to two marginal points of the X or Y-direction detected;Same mode searches out Y or the central point of X-direction, the center o of the test point of pcb board as to be calibrated, and the deviation between probe initial point t and the center o of test point is the real offset of probe and camera center;Control system is compensated after above-mentioned real offset, is tested.The real offset of probe and camera center can be determined before using the flying probe tester by above-mentioned deviation correction method, it is ensured that the test accuracy of flying probe tester.
Description
Technical field
The invention belongs to the control field of flying probe tester, more particularly to a kind of deviation correction method of flying probe tester.
Background technology
Flying probe tester is for element arranges high density, the number of plies is more, wiring density is big, measuring point is apart from small pcb board (print
Printed circuit board) a kind of instrument for being tested, the insulation of main measurement circuit plate and conduction value.Tester typically uses " true value
Comparison and location method ", can in real time be monitored, it is ensured that the accuracy of test to test process and trouble point.Flying probe tester has
Finer pitch, is not limited by grid, and test is flexible, the features such as speed is fast.
As shown in figure 1, the test arm of flying probe tester be arranged on support Y-axis sliding block on, can with Y-direction make on
Lower motion, Y-axis, which is arranged in X-axis, can make the side-to-side movement of X-direction, and probe is arranged in Z axis guide rail, and probe can be in Z
Moved forward and backward on direction of principal axis (as shown by the arrows in Figure 1), test machine is exactly to control X, Y, Z axis by the test software of host computer
Motion, and then control probe to prick PCB each test point, complete the detection to pcb board.It can be seen that, the test of flying probe tester
Accuracy depends primarily on test probe and the aligning accuracy of test point on pcb board, because the test point of pcb board is smaller, test
Closer to the distance between point, the test point that control test probe is precisely directed to pcb board then turns into the technology of those skilled in the art
Problem.
When the test software of host computer is detected according to PCB test data to PCB, it is necessary first to point to probe
The test benchmark point of pcb board, from test benchmark point test PCB on all test points position, in order to ensure probe with
The aligning accuracy of test benchmark point, is mounted with video camera on test arm, and exactitude position is carried out by cameras capture image,
Such as Fig. 2, by the center of circle of the cross Target Center alignment fiducials point of video camera, and due to video camera and probe nothing on hardware configuration
Method is set to coaxially, and the two has certain position offset, therefore can not accomplish that the shooting center of video camera and probe are had an acupuncture treatment
Point overlaps test software automatic compensation for carrying out position skew in test, it is necessary to host computer;But the trueness error of structural member
With the reason such as assembly technology, real offset and the default offset amount of probe and video camera have error, and this error will necessarily
Have influence on the acupuncture treatment position of probe to influence measuring accuracy, probe can prick outside test point and cause to survey by mistake when serious, cause
The test result of flying probe tester is inaccurate.
The content of the invention
Therefore, the technical problems to be solved by the invention are that the flying probe accuracy of existing flying probe tester is poor,
And then a kind of flying probe tester deviation correction method for the deviation for being capable of correcting probe and camera center is provided.
In order to solve the above technical problems, the deviation correction method of the flying probe tester of the present invention, comprises the following steps,
(1) the cross Target Center of camera review is directed at the center o of one of test point of pcb board to be calibrated by;
(2) controls probe to detect pcb board to be calibrated, probe contact pad t is obtained, using the probe contact pad t as initial point
Control probe searches out marginal point a1, the marginal point a2 of both sides along X or Y-direction, according to two edges of the X or Y-direction detected
Point searches out the X or central point a3 of Y-direction;
(3) probe is controlled to search out both sides along Y or X-direction by starting point of the X or central point a3 of Y-direction
Marginal point b1, marginal point b2, are searched out in the test point of pcb board to be calibrated according to two marginal points of the Y or X-direction detected
Deviation between heart o, probe initial point t and the center o of test point is the real offset of probe and camera center;
(4) control system is compensated after above-mentioned real offset, is tested.
Control system is compensated after above-mentioned actual deviation value in step (4), and the cross Target Center of camera review is aligned
The center o of another test point of pcb board to be calibrated, the test point area is less than the test point area of step (1), repeats to walk
Suddenly more accurate real offset is obtained after (2) and step (3), control system is compensated after above-mentioned real offset, entered again
Row test.
Marginal point is found in step (2) and step (3) in the following ways:Control probe is set along along X or Y-direction by first
Fixed step size detects pcb board, until can't detect after electric signal, is returned along X or Y-direction by the second setting step-length, until examining again
Electric signal is measured, probe and so on searches out the marginal point a1 or b1 of the side of probe initial point X or Y-direction, along X or Y side
Continue to detect to by the 3rd setting step-length, until can't detect after electric signal, returned along X or Y-direction by the second setting step-length, directly
To electric signal is detected again, probe and so on searches out the marginal point a2 or b2 of probe initial point X or Y-direction opposite side.
The first setting step-length is more than the second setting step-length.
The 3rd setting step-length is more than or equal to the first setting step-length.
In step (2) and step (3) according to X or the marginal point finding center point of Y-direction both sides in the following ways;According to
Probe is calculated from marginal point a2 Huob2Zhi centers from marginal point a1 or the b1 step value being moved to used in marginal point a2 or b2
Point a3 or o distance, controls the probe to be moved to central point a3 or o from marginal point a2 or b2 by the 4th setting step-length.
The 4th setting step-length is set to distance/2 between the point of both sides of the edge.
The above-mentioned technical proposal of the present invention has advantages below compared with prior art:
(1) in the deviation correction method of flying probe tester of the invention, first by the cross Target Center of camera review
It is directed at the test center o of pcb board to be calibrated;Control probe to detect pcb board again, probe contact pad t is obtained, with the probe test
Point t is marginal point a1, the marginal point a2 that initial point control probe searches out both sides along X or Y-direction, according to the X detected or Y side
X or the central point a3 of Y-direction are searched out to two marginal points;Institute is controlled by starting point of the X or central point a3 of Y-direction again
Marginal point b1, marginal point b2 that probe searches out both sides along Y or X-direction are stated, according to two marginal points of the Y or X-direction detected
The test dot center o of pcb board to be calibrated is searched out, so, the deviation between probe initial point t and test dot center o is to visit
The real offset of pin and camera center, above-mentioned real offset is recorded to test software.Pass through above-mentioned offset correction
Method can determine the real offset of probe and camera center before using the flying probe tester, it is to avoid existing default offset
Amount has error to cause probe detecting location wrong with real offset, so that the problem of influenceing measuring accuracy.
(2) in the deviation correction method of flying probe tester of the invention, control probe is used to set step-length along X/Y directions
Mobile mode finds marginal point, then finally gives by way of marginal point alignment point the test point of the pcb board to be calibrated
Center o, whole process is quick, steady, and efficiency is higher, and the size of step-length can be set by control, improves correction rate
And precision.
(3) in the deviation correction method of flying probe tester of the invention, probe is along along X or Y-direction by the first setting step-length
Pcb board is detected, until can't detect after electric signal, is returned along X or Y-direction by the second setting step-length, until detecting electricity again
Signal, searches out the marginal point of the side of probe initial point X or Y-direction, wherein the second setting step-length is less than the first setting step-length,
The positional precision of marginal point can further be improved.
(4) in the deviation correction method of flying probe tester of the invention, after the marginal point for searching out side, along X or Y-direction
Continue to detect opposite side marginal point by the 3rd setting step-length, because relatively far away from, the 3rd is set for distance between the marginal point of both sides
Fixed step size is more than the first setting step-length, can improve the speed for finding marginal point.
(5) in the deviation correction method of flying probe tester of the invention, calculated according to the distance between both sides of the edge point
Go out center position, control the probe to be moved to center position by the 4th setting step-length;The 4th setting step-length is set to
Distance/2 between the point of both sides of the edge, make the step of probe one find the position of central point, further increase correction rate, improve spy
The service life of pin.
Brief description of the drawings
In order that present disclosure is more likely to be clearly understood, specific embodiment and combination below according to the present invention
Accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of the test arm of the flying probe tester of the present invention;
Fig. 2 is that the image target of video camera aligns figure with the datum mark of pcb board to be tested;
Fig. 3 is probe in X direction by the schematic diagram of equidistant steps finding center point;
Fig. 4 is probe along schematic diagram of the Y-direction by equidistant steps finding center point.
Reference is expressed as in figure:1- main bodys, 2-Z axis rails, 3- video cameras, 31- camera lens, 4- probes dress
Put, 41- probes.
Embodiment
Below with reference to accompanying drawing, the present invention is further elaborated using following examples.
Embodiment 1
Positive and reverse, and Y-direction positive and be reversely with camera review for the X-direction mentioned in the present invention
Cross target is used as reference axis, positive and reverse, the positive negative direction correspondence Y-direction of Y-axis of the positive negative direction correspondence X-direction of X-axis
It is positive and reverse.
Fig. 1 is the test arm of the flying probe tester of application deviation correction method of the present invention, and above-mentioned test arm includes master
Body 1, is opened in the Z axis guide rail in main body 1, and the probe unit 4 being slidably mounted in Z axis guide rail, the probe dress
Put 4 front ends and be provided with probe 41 along Z-direction, be fixed with video camera 3 on the downside of the main body, wherein, cam lens 31 are along Z axis
Direction is set, it is seen that the center of cam lens 31 has position deviation with the position of probe 41.
The deviation correction method of flying probe tester of the present invention is to be used for correcting probe and the reality of camera lens center
Border offset.The calibration method comprises the following steps,
First, as shown in Fig. 2 the cross Target Center of camera review to be aligned to the test dot center of pcb board to be calibrated
o;
Secondly, control probe 41 detection pcb board, obtains probe contact pad t, using the probe contact pad t as initial point control
Manufacturing probe 41 searches out the marginal point a1 of both sides, marginal point a2 in X direction, according to the X-direction detected two marginal points a1, a2
Obtain the X or central point a3 of Y-direction;
Specifically, as shown in figure 3, control system control probe 41 stretches out and pricked to pcb board, obtain after probe contact pad t, control
System processed receives electric signal and controls probe to bounce back, and the first setting step-length of pressing forward of control probe 41 in X direction is detected
Pcb board, until can't detect after electric signal, the second setting step-length of reversely pressing in X direction is moved, until detecting telecommunications again
Number, it is considered as the marginal point a1 for the side for searching out probe initial point X-direction;The 3rd setting step-length of reversely pressing in X direction continues
Detection, until can't detect after electric signal, forward direction in X direction is by the second setting step-length movement, until detecting telecommunications again
Number, search out the marginal point a2 of probe initial point X-direction opposite side.
It can be selected as equidistant steps for the above-mentioned first setting step-length, it is also an option that be degression type step-length, with
Improve correction efficiency.Above-mentioned standard is equally well suited for use in the second step-length and the 3rd step-length.In addition, the second setting step-length is less than first
Setting step-length makes marginal point a1 position more accurate.3rd setting step-length, which is more than the first setting step-length, improves correction efficiency.
It is further preferred that in order that marginal point a1 and marginal point a2 are more accurate, can also repeatedly come and go finer
Step-length is found.
Distance/2 between center position, i.e. two edges point are calculated according to marginal point a1, a2 of the reverse both sides of X, controlled
Make the probe and be moved to center position by the 4th setting step-length.
As a kind of embodiment, the 4th setting step-length is set to distance/2 between the point of both sides of the edge, and this mode can
So that the step of probe one detects center position, calibration speed is improved;In other embodiment, can also by by a2 points with
The distance of central point is divided into after some 4th setting step-lengths, and control probe is moved to the central point a3 by the 4th setting step-length.
After the central point a3 for obtaining the X-direction, the probe is controlled to be searched out along Y-direction by starting point of central point a3
Marginal point b1, the marginal point b2 of both sides, the test point of pcb board to be calibrated is searched out according to two marginal points of the Y-direction detected
Deviation between center o, probe initial point t and test dot center o is the real offset of probe and camera center.
Specifically, as shown in figure 4, control system controls probe 41 to be stretched again after being moved along Y-direction by the first setting step-length
Go out to detect pcb board, until can't detect after electric signal, the reverse movement by the second setting step-length along Y-direction, until detecting again
To electric signal, the marginal point b1 of probe initial point Y-direction is now searched out, is continued by the 3rd setting step-length detection, until finding
To the marginal point b2 of probe initial point Y-direction opposite side;In being calculated according to the Y-direction detected two marginal points b1, b2
Distance/2 between heart point position, i.e. two edges point, control the probe to be moved to center position by the 4th setting step-length, find
To the test dot center o of pcb board to be calibrated, the deviation between probe initial point t and test dot center o is probe and video camera
The real offset at center, the real offset is recorded to control system, when probe 41 starts test, by compensating the skew
Amount makes probe 41 test pcb board exactly.
Embodiment 2
The present embodiment increases following process the step of embodiment 1 on the basis of (4):It is inclined that control system compensates above-mentioned reality
After difference, the cross Target Center of camera review is directed to the center o of another test point of pcb board to be calibrated, the survey
Pilot area is less than the test point area of step (1), repeat step (2) and step (3), and carrying out detection by smaller step-length seeks
More accurate real offset is obtained after finding test dot center o, control system is compensated after above-mentioned real offset, entered again
Row test.Error can further be reduced to minimum value by increasing above-mentioned steps, it is ensured that video camera loci is actual with probe
Acupuncture treatment point height is overlapped, it is ensured that testing precision.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (7)
1. a kind of deviation correction method of flying probe tester, it is characterised in that:Comprise the following steps,
(1), the cross Target Center of camera review is aligned to the center o of one of test point of pcb board to be calibrated;
(2)Control probe detects pcb board to be calibrated, obtains probe contact pad t, is controlled by initial point of the probe contact pad t
Probe searches out the marginal point a1 of both sides, marginal point a2 along X or Y-direction, is sought according to two marginal points of the X or Y-direction detected
Find the X or central point a3 of Y-direction;
(3)The probe is controlled to search out the edge of both sides along Y or X-direction by starting point of the X or central point a3 of Y-direction
Point b1, marginal point b2, the center of the test point of pcb board to be calibrated is searched out according to two marginal points of the Y or X-direction detected
Deviation between o, probe initial point t and the center o of test point is the real offset of probe and camera center;
(4)Control system is compensated after above-mentioned real offset, is tested.
2. the deviation correction method of flying probe tester according to claim 1, it is characterised in that:Step(4)Middle control system
After the above-mentioned actual deviation value of system compensation, the cross Target Center of camera review is directed to another test of pcb board to be calibrated
The center o of point, the test point area is less than step(1)Test point area, repeat step(2)And step(3)After obtain more
For accurate real offset, control system is compensated after above-mentioned real offset, tested again.
3. the deviation correction method of flying probe tester according to claim 1 or 2, it is characterised in that:Step(2)And step
(3)Middle searching marginal point is in the following ways:Control probe along along X or Y-direction by the first setting step-length detection pcb board, until
It can't detect after electric signal, returned along X or Y-direction by the second setting step-length, until detecting electric signal again, probe is so past
The marginal point a1 or b1 of the side of probe initial point X or Y-direction are searched out again, continue to visit by the 3rd setting step-length along X or Y-direction
Survey, until can't detect after electric signal, return, until detecting electric signal again, visited by the second setting step-length along X or Y-direction
Pin and so on searches out the marginal point a2 or b2 of probe initial point X or Y-direction opposite side.
4. the deviation correction method of flying probe tester according to claim 3, it is characterised in that:The first setting step-length
More than the second setting step-length.
5. the deviation correction method of flying probe tester according to claim 3, it is characterised in that:The 3rd setting step-length
More than or equal to the first setting step-length.
6. the deviation correction method of flying probe tester according to claim 1, it is characterised in that:Step(2)And step(3)
It is middle according to X or the marginal point finding center point of Y-direction both sides in the following ways;It is moved to according to probe from marginal point a1 or b1
Step value used in marginal point a2 or b2 calculates the distance from marginal point a2 or b2 to central point a3 or o, controls described visit
Pin is moved to central point a3 or o by the 4th setting step-length from marginal point a2 or b2.
7. the deviation correction method of flying probe tester according to claim 6, it is characterised in that:The 4th setting step-length
It is set to distance/2 between the point of both sides of the edge.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510235763.9A CN104914375B (en) | 2015-05-11 | 2015-05-11 | The deviation correction method of flying probe tester |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510235763.9A CN104914375B (en) | 2015-05-11 | 2015-05-11 | The deviation correction method of flying probe tester |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104914375A CN104914375A (en) | 2015-09-16 |
CN104914375B true CN104914375B (en) | 2017-08-25 |
Family
ID=54083610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510235763.9A Active CN104914375B (en) | 2015-05-11 | 2015-05-11 | The deviation correction method of flying probe tester |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104914375B (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105223389B (en) * | 2015-09-28 | 2018-02-02 | 大族激光科技产业集团股份有限公司 | A kind of alignment method of flying probe tester |
CN105785257B (en) * | 2016-04-13 | 2019-06-14 | 大族激光科技产业集团股份有限公司 | A kind of bearing calibration of flying probe tester |
CN106017317B (en) * | 2016-05-13 | 2019-02-12 | 中国航空工业集团公司西安飞机设计研究所 | A kind of airborne antenna installation accuracy detection method and detection device |
CN106771979B (en) * | 2016-12-30 | 2019-07-02 | 南京协辰电子科技有限公司 | A kind of calibration method of double probe flying probe devices |
CN107271886B (en) * | 2017-07-12 | 2019-12-27 | 深圳市迈创力科技有限公司 | Rapid alignment method of flying probe testing machine |
CN107607852B (en) * | 2017-08-07 | 2019-09-17 | 大族激光科技产业集团股份有限公司 | The bearing calibration of the control method and positioning accuracy of the kinematic axis of flying probe tester |
CN107462824B (en) * | 2017-08-07 | 2019-09-17 | 大族激光科技产业集团股份有限公司 | The compensation method of the control method and positioning accuracy of the kinematic axis of flying probe tester |
CN110736911B (en) * | 2018-07-18 | 2022-01-25 | 深圳市大族数控科技股份有限公司 | Flying probe testing method, flying probe testing device, flying probe testing apparatus, and storage medium |
CN108983460B (en) * | 2018-08-17 | 2021-08-03 | 苏州凌云视界智能设备有限责任公司 | Positioning precision compensation system and method of probe crimping device |
CN110187255B (en) * | 2019-04-15 | 2021-10-15 | 上海华力集成电路制造有限公司 | Method for determining overdrive amount during probe test program establishment |
CN112116662A (en) * | 2019-06-20 | 2020-12-22 | 上海炬佑智能科技有限公司 | Camera is rectified and is used equipment |
CN110333470B (en) * | 2019-07-18 | 2022-06-28 | 深圳橙子自动化有限公司 | Device mounting calibration method for flying probe test |
CN110333469B (en) * | 2019-07-18 | 2021-10-29 | 深圳橙子自动化有限公司 | A target point calculation method for flying probe test |
CN110686847B (en) * | 2019-10-16 | 2021-09-28 | 深圳同兴达科技股份有限公司 | Automatic steel ball impact testing method |
CN114236197A (en) * | 2021-12-21 | 2022-03-25 | 深圳市阳晶电子科技有限公司 | Mobile probe type testing machine and testing method thereof |
CN115267491B (en) * | 2022-07-11 | 2024-12-31 | 苏州亿来升光电科技有限公司 | A fast testing and correction method for a thread needle testing machine |
CN118914618B (en) * | 2024-10-10 | 2024-12-31 | 南通暄旭正电子科技有限公司 | Flying probe tester testing method and system |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6483103A (en) * | 1987-09-25 | 1989-03-28 | Niigata Engineering Co Ltd | Method for correcting position coordinates of workpiece |
JPH02197144A (en) * | 1989-01-26 | 1990-08-03 | Tokyo Electron Ltd | Alignment of semiconductor wafer to chip |
US5321351A (en) * | 1990-05-25 | 1994-06-14 | Everett Charles Technologies, Inc. | Test fixture alignment system |
KR20070116514A (en) * | 2006-06-05 | 2007-12-10 | 양 전자시스템 주식회사 | Probe inspection device for flat panel display device and probe inspection method using same |
CN102478385A (en) * | 2010-11-26 | 2012-05-30 | 京隆科技(苏州)有限公司 | Probe card detection method and system |
CN102590566A (en) * | 2012-03-16 | 2012-07-18 | 苏州工业园区世纪福科技有限公司 | Automatic alignment method for electronic product testing clamp |
CN103743318A (en) * | 2013-12-30 | 2014-04-23 | 深圳市华星光电技术有限公司 | Method and device for correcting coordinates of probe film thickness measuring machine |
CN104457539A (en) * | 2014-11-05 | 2015-03-25 | 深圳市大族激光科技股份有限公司 | Computing method of probe lifting heights of test probes of flying-probe tester |
-
2015
- 2015-05-11 CN CN201510235763.9A patent/CN104914375B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6483103A (en) * | 1987-09-25 | 1989-03-28 | Niigata Engineering Co Ltd | Method for correcting position coordinates of workpiece |
JPH02197144A (en) * | 1989-01-26 | 1990-08-03 | Tokyo Electron Ltd | Alignment of semiconductor wafer to chip |
US5321351A (en) * | 1990-05-25 | 1994-06-14 | Everett Charles Technologies, Inc. | Test fixture alignment system |
KR20070116514A (en) * | 2006-06-05 | 2007-12-10 | 양 전자시스템 주식회사 | Probe inspection device for flat panel display device and probe inspection method using same |
CN102478385A (en) * | 2010-11-26 | 2012-05-30 | 京隆科技(苏州)有限公司 | Probe card detection method and system |
CN102590566A (en) * | 2012-03-16 | 2012-07-18 | 苏州工业园区世纪福科技有限公司 | Automatic alignment method for electronic product testing clamp |
CN103743318A (en) * | 2013-12-30 | 2014-04-23 | 深圳市华星光电技术有限公司 | Method and device for correcting coordinates of probe film thickness measuring machine |
CN104457539A (en) * | 2014-11-05 | 2015-03-25 | 深圳市大族激光科技股份有限公司 | Computing method of probe lifting heights of test probes of flying-probe tester |
Non-Patent Citations (1)
Title |
---|
摄像机标定方法简述;李鹏 等;《传感器世界》;20070331;第21-24页 * |
Also Published As
Publication number | Publication date |
---|---|
CN104914375A (en) | 2015-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104914375B (en) | The deviation correction method of flying probe tester | |
KR100881237B1 (en) | Method for detecting probe tip position, storage medium and probe device recording the method | |
CN106796263B (en) | Electrical test system with vision guide alignment | |
CN105223389B (en) | A kind of alignment method of flying probe tester | |
TWI464817B (en) | An alignment method, a needle position detecting device, and a probe device | |
KR100754543B1 (en) | Probe apparatus | |
CN102590566B (en) | Automatic alignment method for electronic product testing clamp | |
CN101361005A (en) | Method and device for testing unequipped circuit boards | |
CN105241399A (en) | Method of measuring dynamic flatness of precision positioning platform | |
CN111146103B (en) | Wafer detection method and detection equipment | |
CN114441942A (en) | Flying probe testing method, system, equipment and storage medium for PCB | |
CN105705955B (en) | Electrical detection device | |
CN113740571A (en) | Array testing device capable of realizing automatic precise control of single probe block | |
CN219533326U (en) | Capacitive detection device | |
KR101183101B1 (en) | Method of die bonding for flip chip | |
CN114460442B (en) | High-precision needle drop compensation method and device for flying needle test and storage medium | |
JP6422349B2 (en) | Measuring apparatus and alignment method | |
CN111386469B (en) | Substrate inspection device, inspection position correction method, information generation method and information generation system | |
JPH11251379A (en) | Wafer probing device | |
CN101527275A (en) | Wafer back positioning system | |
CN114236197A (en) | Mobile probe type testing machine and testing method thereof | |
JP3248136B1 (en) | Probe method and probe device | |
JP2002057196A (en) | Method and device for probe | |
CN105334446A (en) | Method for aligning workpiece to tool in electrical testing | |
US20040249595A1 (en) | Method of calibrating a component placement machine, device suitable for carrying out such a method, and calibration component suitable for use in such a method or device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |