CN104914375A - Error correction method of flying probe tester - Google Patents
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Abstract
The invention discloses an error correction method of a flying probe tester. The method comprises the steps that the center of a cross target of a camera image is pointed to the center o of one test point of a PCB board to be calibrated; a probe is controlled to detect the PCB board to acquire a probe test point t; the probe test point t is taken as an initial point, and the probe is controlled to search an edge point a1 and an edge point a2 on both sides along X or Y direction; according to two detected edge points in X or Y direction, a center point a3 in X or Y direction is searched; the center point in X or Y direction is searched in the same manner, and the center point is the center o of the test point of the PCB board to be calibrated; the deviation between the probe initial point t and the center o of the test point is the actual offset of the probe to the camera center; and after a control system compensates the actual offset, a test is carried out. According to the error correction method, the actual offset of the probe to the camera center can be determined before the flying probe tester is used, and the test accuracy of the flying probe tester is ensured.
Description
Technical field
The invention belongs to the control field of flying probe tester, particularly a kind of deviation correction method of flying probe tester.
Background technology
Flying probe tester be for arrangements of elements high density, the number of plies is many, wiring density is large, measuring point carries out a kind of instrument of testing apart from little pcb board (printed circuit board (PCB)), the insulation of main measurement circuit plate and conduction value.Tester generally adopts " true value comparison and location method ", can monitor in real time test process and trouble spot, ensures the accuracy of test.Flying probe tester has finer pitch, does not limit by grid, and test is flexible, the features such as speed is fast.
As shown in Figure 1, the test arm of flying probe tester is arranged on the slide block of the Y-axis of support, Y-direction can be moved up and down, Y-axis is arranged on side-to-side movement X-axis can being made X-direction, and probe is arranged on Z axis guide rail, probe can seesaw (as shown by the arrows in Figure 1) in the Z-axis direction, and test machine is exactly control X, Y, Z axis motion by the testing software of host computer, and then control each test point that PCB pricked by probe, complete the detection to pcb board.Visible, the test accuracy of flying probe tester depends primarily on the aligning accuracy of test point on test probe and pcb board, because the test point of pcb board is less, close together between test point, controls the technical barrier that test point that test probe aims at pcb board exactly then becomes those skilled in the art.
When the test data of the testing software foundation PCB of host computer detects PCB, first test benchmark point probe being pointed to pcb board is needed, from the position of all test points on test benchmark point test PCB, in order to ensure the aligning accuracy of probe and test benchmark point, test arm has been installed video camera, exactitude position is carried out by cameras capture image, as Fig. 2, by the center of circle of the cross pinwheel alignment fiducials point of video camera, and cannot be set to coaxial on hardware configuration due to video camera and probe, there is certain position offset in the two, therefore cannot accomplish to have an acupuncture treatment with probe in the shooting center of video camera a little to overlap, the testing software of host computer is needed automatically to carry out the compensation of position skew when testing, but the reasons such as the trueness error of structural member and assembly technology, real offset and the default offset amount of probe and video camera have error, this error will inevitably have influence on the acupuncture treatment position of probe thus affect measuring accuracy, time serious, probe can be pricked outside test point and cause survey by mistake, causes the test result of flying probe tester inaccurate.
Summary of the invention
For this reason, technical matters to be solved by this invention is that the flying probe accuracy of existing flying probe tester is poor, so provide a kind of can the flying probe tester deviation correction method of deviation at correcting probe and video camera center.
For solving the problems of the technologies described above, the deviation correction method of flying probe tester of the present invention, comprises the following steps,
(1). the cross pinwheel of camera review is aimed at the center o of one of them test point of pcb board to be calibrated;
(2). control probe and detect pcb board to be calibrated, obtain probe contact pad t, control for initial point probe to search out both sides marginal point a1, marginal point a2 along X or Y-direction with described probe contact pad t, search out the central point a3 of X or Y-direction according to the X detected or Y-direction two marginal points;
(3) with the central point a3 of described X or Y-direction for starting point controls described probe to search out both sides marginal point b1, marginal point b2 along Y or X-direction, search out the center o of the test point of pcb board to be calibrated according to the Y detected or X-direction two marginal points, the deviation between the center o of probe initial point t and test point is the real offset at probe and video camera center;
(4), after control system compensates above-mentioned real offset, test.
After in step (4), control system compensates above-mentioned actual deviation value, the cross pinwheel of camera review is aimed at the center o of another test point of pcb board to be calibrated, described test point area is less than the test point area of step (1), real offset more is accurately obtained after repeating step (2) and step (3), control system is tested after again compensating above-mentioned real offset.
Marginal point is found in the following ways: control probe and set step-length detection pcb board along on X or Y-direction by first in step (2) and step (3), until after can't detect electric signal, return along X or Y-direction by the second setting step-length, until again electric signal detected, probe searches out marginal point a1 or b1 of the side of probe initial point X or Y-direction and so forth, detection is continued by the 3rd setting step-length along X or Y-direction, until after can't detect electric signal, return along X or Y-direction by the second setting step-length, until again electric signal detected, probe searches out marginal point a2 or b2 of probe initial point X or Y-direction opposite side and so forth.
Described first setting step-length is greater than the second setting step-length.
Described 3rd setting step-length is more than or equal to the first setting step-length.
In step (2) and step (3) according to the marginal point finding center point of X or Y-direction both sides in the following ways; Move to marginal point a2 or b2 step value used according to probe from marginal point a1 or b1 and calculate distance from marginal point a2 or b2 to central point a3 or o, control described probe and move to central point a3 or o by the 4th setting step-length from marginal point a2 or b2.
Described 4th setting step-length is set to spacing/2 of both sides of the edge point.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1), in the deviation correction method of flying probe tester of the present invention, first the cross pinwheel of camera review is aimed at the test center o of pcb board to be calibrated; Control probe detection pcb board again, obtain probe contact pad t, control for initial point probe to search out both sides marginal point a1, marginal point a2 along X or Y-direction with described probe contact pad t, search out the central point a3 of X or Y-direction according to the X detected or Y-direction two marginal points; Again with the central point a3 of described X or Y-direction for starting point controls described probe to search out both sides marginal point b1, marginal point b2 along Y or X-direction, the test point center o of pcb board to be calibrated is searched out according to the Y detected or X-direction two marginal points, like this, deviation between probe initial point t and test point center o is the real offset at probe and video camera center, above-mentioned real offset is recorded in testing software.The real offset at probe and video camera center can be measured by above-mentioned deviation correction method before using this flying probe tester, avoid existing default offset amount and real offset to have error to cause probe detecting location wrong, thus affect the problem of measuring accuracy.
(2) in the deviation correction method of flying probe tester of the present invention, control probe is adopted to find marginal point to set step-length along the mode of X/Y direction movement, the test point center o of this pcb board to be calibrated is finally obtained again by the mode of marginal point alignment point, whole process fast, steadily, efficiency is higher, and by controlling the size of setting step-length, correction rate and precision can be improved.
(3) in the deviation correction method of flying probe tester of the present invention, probe detects pcb board along on X or Y-direction by the first setting step-length, until after can't detect electric signal, return along X or Y-direction by the second setting step-length, until again electric signal detected, search out the marginal point of the side of probe initial point X or Y-direction, wherein the second setting step-length is less than the first setting step-length, can improve the positional precision of marginal point further.
(4) in the deviation correction method of flying probe tester of the present invention, after searching out the marginal point of side, detection opposite side marginal point is continued by the 3rd setting step-length along X or Y-direction, because the spacing of the marginal point of both sides is relatively far away, 3rd setting step-length is greater than the first setting step-length, the speed finding marginal point can be improved.
(5) in the deviation correction method of flying probe tester of the present invention, calculate center position according to the distance between the point of both sides of the edge, control described probe and move to center position by the 4th setting step-length; Described 4th setting step-length is set to spacing/2 of both sides of the edge point, makes probe one step find the position of central point, further increases correction rate, improve the serviceable life of probe.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of the test arm of flying probe tester of the present invention;
Fig. 2 is that the image target of video camera and the reference point of pcb board to be tested align figure;
Fig. 3 is that probe is in X direction by the schematic diagram of equidistant steps will finding center point;
Fig. 4 is probe along the schematic diagram of Y-direction by equidistant steps will finding center point.
In figure, Reference numeral is expressed as: 1-main body, 2-Z axis guide rail, 3-video camera, 31-camera lens, 4-probe unit, 41-probe.
Embodiment
Below with reference to accompanying drawing, following examples are used to be further elaborated the present invention.
embodiment 1
The forward of the X-direction mentioned in the present invention and oppositely, and the forward of Y-direction and be oppositely using the cross target of camera review as coordinate axis, the forward of the corresponding X-direction of positive negative direction of X-axis and oppositely, the forward of the corresponding Y-direction of positive negative direction of Y-axis and oppositely.
Fig. 1 is the test arm of the flying probe tester applying deviation correction method of the present invention, above-mentioned test arm comprises main body 1, be opened in the Z axis guide rail in main body 1, and the probe unit 4 be installed on movably on Z axis guide rail, described probe unit 4 front end edge Z-direction is provided with probe 42, and the downside of described main body is fixed with camera 3, wherein, cam lens 31 is arranged along Z-direction, and the center of visible cam lens 31 and the position of probe 42 have position deviation.
Namely the deviation correction method of flying probe tester of the present invention is used for the real offset of correcting probe and camera lens center.This calibration steps comprises the following steps,
First, as shown in Figure 2, the cross pinwheel of camera review is aimed at the test point center o of pcb board to be calibrated;
Secondly, control probe 41 and detect pcb board, obtain probe contact pad t, control for initial point marginal point a1, the marginal point a2 that probe 41 searches out both sides in X direction with described probe contact pad t, obtain the central point a3 of X or Y-direction according to the X-direction detected two marginal points a1, a2;
Particularly, as shown in Figure 3, control system controls probe 42 and stretches out bundle to pcb board, after obtaining probe contact pad t, control system receives electric signal and controls probe retraction, controls probe 41 the first setting step-length of pressing forward in X direction and detects pcb board, until after can't detect electric signal, in X direction reverse by second setting step-length move, until again electric signal detected, be considered as the marginal point a1 of the side searching out probe initial point X-direction; Oppositely detecting by the 3rd setting step-length continuation in X direction, until after can't detect electric signal, forward in X direction moves by the second setting step-length, until again electric signal detected, searches out the marginal point a2 of probe initial point X-direction opposite side.
Can equidistant steps will be chosen as above-mentioned first setting step-length, degression type step-length can also be chosen as, to improve correction efficiency.What above-mentioned standard was same is applicable to the second step-length and the 3rd step-length.In addition, the second setting step-length is less than the first setting step-length and makes the position of marginal point a1 more accurate.3rd setting step-length is greater than the first setting step-length makes correction efficiency improve.
Preferred further, in order to make marginal point a1 and marginal point a2 more accurate, can also repeatedly come and go meticulousr step-length and finding.
Marginal point a1, a2 according to the reverse both sides of X calculate center position, i.e. spacing/2 of two edges point, control described probe and move to center position by the 4th setting step-length.
As a kind of embodiment, described 4th setting step-length is set to spacing/2 of both sides of the edge point, and this mode can make probe one step detect center position, improves calibration speed; In other embodiments, after step-length can also being set by the distance of a2 point and central point being divided into the some 4th, controlling probe and moving to described central point a3 by the 4th setting step-length.
After obtaining the central point a3 of described X-direction, with central point a3 for starting point controls described probe to search out both sides marginal point b1, marginal point b2 along Y-direction, search out the test point center o of pcb board to be calibrated according to the Y-direction detected two marginal points, the deviation between probe initial point t and test point center o is the real offset at probe and video camera center.
Particularly, as shown in Figure 4, control system controls probe 42 and again stretch out detection pcb board after Y-direction moves by the first setting step-length, until after can't detect electric signal, by the second setting step-length along the reverse movement of Y-direction, until again electric signal detected, now search out the marginal point b1 of probe initial point Y-direction, continue by the 3rd setting step-length detection, until search out the marginal point b2 of probe initial point Y-direction opposite side; Center position is calculated according to the Y-direction detected two marginal points b1, b2, i.e. spacing/2 of two edges point, control described probe and move to center position by the 4th setting step-length, search out the test point center o of pcb board to be calibrated, deviation between probe initial point t and test point center o is the real offset at probe and video camera center, this real offset is recorded to control system, when probe 42 starts to test, probe 42 is made to test pcb board exactly by compensating this side-play amount.
embodiment 2
The present embodiment increases following process on the basis of the step (4) of embodiment 1: after control system compensates above-mentioned actual deviation value, the cross pinwheel of camera review is aimed at the center o of another test point of pcb board to be calibrated, described test point area is less than the test point area of step (1), repeat step (2) and step (3), undertaken obtaining real offset more accurately after detection searches out test point center o by less step-length, control system is tested after again compensating above-mentioned real offset.Error can be reduced further to minimum value by increasing above-mentioned steps, ensureing that video camera loci a little highly overlaps with actual acupuncture treatment of probe, ensureing testing precision.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain of the invention.
Claims (7)
1. a deviation correction method for flying probe tester, is characterized in that: comprise the following steps,
(1). the cross pinwheel of camera review is aimed at the center o of one of them test point of pcb board to be calibrated;
(2). control probe and detect pcb board to be calibrated, obtain probe contact pad t, control for initial point probe to search out both sides marginal point a1, marginal point a2 along X or Y-direction with described probe contact pad t, search out the central point a3 of X or Y-direction according to the X detected or Y-direction two marginal points;
(3) with the central point a3 of described X or Y-direction for starting point controls described probe to search out both sides marginal point b1, marginal point b2 along Y or X-direction, search out the center o of the test point of pcb board to be calibrated according to the Y detected or X-direction two marginal points, the deviation between the center o of probe initial point t and test point is the real offset at probe and video camera center;
(4), after control system compensates above-mentioned real offset, test.
2. the deviation correction method of flying probe tester according to claim 1, it is characterized in that: after in step (4), control system compensates above-mentioned actual deviation value, the cross pinwheel of camera review is aimed at the center o of another test point of pcb board to be calibrated, described test point area is less than the test point area of step (1), real offset more is accurately obtained after repeating step (2) and step (3), control system is tested after again compensating above-mentioned real offset.
3. the deviation correction method of flying probe tester according to claim 1 and 2, it is characterized in that: in step (2) and step (3), find marginal point in the following ways: control probe and detect pcb board along on X or Y-direction by the first setting step-length, until after can't detect electric signal, return along X or Y-direction by the second setting step-length, until again electric signal detected, probe searches out marginal point a1 or b1 of the side of probe initial point X or Y-direction and so forth, detection is continued by the 3rd setting step-length along X or Y-direction, until after can't detect electric signal, return along X or Y-direction by the second setting step-length, until again electric signal detected, probe searches out marginal point a2 or b2 of probe initial point X or Y-direction opposite side and so forth.
4. the deviation correction method of flying probe tester according to claim 3, is characterized in that: described first setting step-length is greater than the second setting step-length.
5. the deviation correction method of flying probe tester according to claim 3, is characterized in that: described 3rd setting step-length is more than or equal to the first setting step-length.
6. the deviation correction method of flying probe tester according to claim 1, is characterized in that: in step (2) and step (3) according to the marginal point finding center point of X or Y-direction both sides in the following ways; Move to marginal point a2 or b2 step value used according to probe from marginal point a1 or b1 and calculate distance from marginal point a2 or b2 to central point a3 or o, control described probe and move to central point a3 or o by the 4th setting step-length from marginal point a2 or b2.
7. the deviation correction method of flying probe tester according to claim 6, is characterized in that: described 4th setting step-length is set to spacing/2 of both sides of the edge point.
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