CN104696761B - LED heat dissipation lamp - Google Patents

Abstract

An LED heat dissipating luminaire comprising: the LED lamp comprises a heat dissipation column, a lamp cap, a substrate, a plurality of heat dissipation arc pieces and an LED lamp. The lamp holder is arranged at the first end of the heat dissipation column. The substrate is arranged at the second end of the heat dissipation column. The heat dissipation column is provided with a plurality of heat dissipation grooves, the heat dissipation grooves are connected with the first end and the second end, and a plurality of heat dissipation holes are formed in each heat dissipation groove. The radiating arc pieces are radially arranged at the edge of the substrate, the concave curved surface and the convex curved surface are respectively arranged on the two side surfaces of the radiating arc pieces, and the radiating arc pieces are gradually bent towards the axis close to the radiating column from one end to the other end on the substrate. The LED lamp is arranged on the convex curved surface. According to the LED heat dissipation lamp, the heat dissipation column, the substrate and the heat dissipation arc pieces are arranged, and the heat dissipation cavity is formed by the heat dissipation arc pieces and the substrate in a surrounding mode, so that the heat dissipation effect can be greatly improved. In addition, the LED lamp is arranged on the radiating arc piece, so that the light emitting direction is more uniform.

Description

LED cooling lamps

technical field

The invention relates to the technical field of heat dissipation, in particular to an LED heat dissipation lamp.

Background technique

The rapid development of the LED industry has greatly stimulated the development of the upstream material industry and further promoted breakthroughs in the field of high-end materials. Among them, a large number of heat dissipation materials are used in LED lamps, including LED chip packaging components, LED optical lenses, light scattering components, high-efficiency heat dissipation components, light reflection and light diffusion plates, etc.

For a long time, poor heat dissipation will lead to problems such as power supply damage, accelerated light decay, and shortened lifespan. It has always been the top priority for improving the performance of LED lighting systems.

For example, Chinese patent 201110178768.4 discloses an LED radiator and LED lamp, specifically discloses that the present invention is applicable to the technical field of radiator production for lighting lamps, and provides an LED radiator and LED lamp. The LED radiator includes an aluminum basic body, the aluminum basic body has a middle part of a hollow part, and a plurality of cooling ribs are distributed on the surface; copper parts are also embedded in the aluminum basic body. The LED lamp includes a lamp housing, an LED light source arranged in the lamp housing, an aluminum substrate on which the LED light source is installed, and a radiator fixedly connected to the aluminum substrate, and the radiator is for dissipating heat from the above-mentioned LED. device. The LED radiator and LED lamps provided by the present invention adopt copper parts with higher thermal conductivity to be embedded in the traditional aluminum-based heat sink, so that the heat dissipation effect of the radiator is greatly improved without increasing the area and volume of the heat sink. Thus, the lifespan of the LED in the lamp is guaranteed.

As another example, Chinese patent 201310061315.2 discloses a high heat dissipation LED lamp, and specifically discloses that the present invention discloses that the present invention discloses an LED lamp. The LED lamp comprises an outer casing, an LED light source board, and a heat dissipation heat pipe. The outer casing is connected to the heat dissipation heat pipe, and the heat dissipation heat pipe is connected to the bottom surface of the LED light source board. The bottom surface of the LED light source board conducts the circuit heat of the LED light source board outward. The LED lamp of the present invention adopts the mode of heat transfer and heat dissipation of the heat pipe, has high heat dissipation efficiency, effectively reduces the continuous rise of the temperature inside the LED lamp, and prolongs the service life of the LED lamp.

As another example, Chinese patent 201310215665.X discloses a heat sink and an LED lamp, specifically discloses that the present invention relates to the technical field of heat dissipation of an LED lamp, and discloses a heat sink and an LED lamp. The heat dissipation plate is a metal heat dissipation plate, and the metal heat dissipation plate has a plurality of raised heat dissipation grids arranged at intervals. The beneficial effects of the present invention are as follows: by adopting a plurality of heat dissipation grids arranged at intervals to dissipate the heat generated by the LED lamp lighting, the heat dissipation area of the heat dissipation plate is increased, the temperature rise of the LED is reduced, and the temperature rise of the LED is improved. The service life of lamps.

However, the LED lamp disclosed in the above-mentioned patent still has the defect of poor heat dissipation effect, which leads to problems such as power supply damage, accelerated light decay, and shortened lifespan of the LED lamp.

Contents of the invention

Based on this, it is necessary to provide an LED heat dissipation lamp with better heat dissipation effect.

An LED heat dissipation lamp, comprising: a heat dissipation column, a lamp holder, a base plate, a plurality of heat dissipation arcs and an LED lamp,

The lamp head is arranged at the first end of the heat dissipation column;

The substrate is disposed at the second end of the heat dissipation column;

The heat dissipation column is provided with a plurality of heat dissipation grooves, the heat dissipation grooves are connected with the first end and the second end, and each heat dissipation groove is provided with a plurality of heat dissipation holes;

A plurality of the heat dissipation arcs are arranged radially on the edge of the substrate, and the two sides of the heat dissipation arcs are respectively provided with concave curved surfaces and convex curved surfaces, and the heat dissipation arcs are arranged from one end on the substrate to the other. One end gradually bends towards the axis of the cooling column;

The LED lamp is arranged on the convex curved surface.

In one of the embodiments, the heat dissipation holes are circular.

In one of the embodiments, the heat dissipation holes are square.

In one of the embodiments, the distance between two adjacent heat dissipation holes is equal.

In one of the embodiments, the heat dissipation arc includes an insulating layer, a heat conduction layer, a heat transfer layer, a heat dissipation layer and a protection layer which are stacked in sequence.

In one embodiment, the insulating layer includes the following components in parts by mass: 40-70 parts of silicon carbide, 13-55 parts of aluminum oxide and 2-15 parts of silicon dioxide.

In one embodiment, the insulating layer further includes the following components in parts by mass: 3-25 parts of binder, 2-20 parts of kaolin, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Dongyang soil 2 parts, 0.5 to 2 parts of light calcium and 0.2 to 0.5 parts of rare earth oxide.

In one embodiment, the heat transfer layer includes the following components in parts by mass: 93-97 parts of copper, 2-4.5 parts of aluminum and 0.1-0.3 parts of nickel.

In one embodiment, the heat transfer layer further includes the following components in parts by mass: 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, 0.1-0.3 parts of titanium, 0.1-0.3 parts of chromium and 0.1 to 0.3 parts of niobium.

In one of the embodiments, the protective layer includes the following components by mass: 20-40 parts of graphite, 20-30 parts of carbon fiber, 40-60 parts of polyamide, 10-40 parts of water-soluble silicate 20 servings.

The above-mentioned LED heat dissipation lamp can greatly improve the heat dissipation effect by providing a heat dissipation column, a base plate and a plurality of heat dissipation arcs, and the plurality of heat dissipation arcs and the base plate form a heat dissipation cavity. In addition, the LED lights installed on the cooling arc can make the light emitting direction more uniform.

Description of drawings

1 is a schematic structural view of an LED heat dissipation lamp according to an embodiment of the present invention;

FIG. 2 is a structural schematic diagram of another angle of the LED heat dissipation lamp shown in FIG. 1;

3 is a schematic structural view of an LED heat dissipation lamp according to another embodiment of the present invention;

4 is a schematic structural view of an LED heat dissipation lamp according to another embodiment of the present invention;

5 is a schematic structural view of an LED heat dissipation lamp according to another embodiment of the present invention;

6 is a schematic structural view of an LED heat dissipation lamp according to another embodiment of the present invention;

Fig. 7 is a schematic structural view of a heat dissipation arc of an LED heat dissipation lamp according to an embodiment of the present invention;

FIG. 8 is a schematic structural view of a heat dissipation arc of an LED heat dissipation lamp according to another embodiment of the present invention.

detailed description

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

For example, an LED heat dissipation lamp includes: a heat dissipation column, a lamp holder, a substrate, a plurality of heat dissipation arcs and an LED lamp, the lamp holder is arranged at the first end of the heat dissipation column; the substrate is arranged at the first end of the heat dissipation column The second end; the heat dissipation column is provided with a plurality of heat dissipation grooves, the heat dissipation grooves are connected with the first end and the second end, and each heat dissipation groove is provided with a plurality of heat dissipation holes; A plurality of the heat dissipation arcs are arranged radially on the edge of the substrate, and the two sides of the heat dissipation arcs are respectively provided with concave curved surfaces and convex curved surfaces, and the heat dissipation arcs are arranged from one end on the substrate to the other. One end gradually bends towards the axis of the cooling column with a gentle transition; the LED lamp is arranged on the convex curved surface.

Please refer to FIG. 1 , which is a schematic structural diagram of an LED heat dissipation lamp 10 according to an embodiment of the present invention.

The LED heat dissipation lamp 10 includes: a heat dissipation column 100 , a lamp holder 200 , a substrate 300 , a plurality of heat dissipation arcs 400 and an LED lamp 500 . Both the lamp holder 200 and the base plate 300 are disposed on the heat dissipation column 100 , a plurality of heat dissipation arcs 400 are disposed on the base plate 300 , and the LED lamp 500 is disposed on the heat dissipation arcs 400 .

Please refer to FIG. 1 , the heat dissipation column 100 is a cylindrical structure, and the heat dissipation column 100 has a structure with small ends and a thick middle. The cooling column 100 also has a first end 110 and a second end 120 , and the end surfaces of the first end 110 and the second end 120 are set as planes to improve flatness, so that the lamp holder 200 and the substrate 300 can be better installed.

Please refer to FIG. 1 , the lamp cap 200 is disposed on the first end 110 of the heat dissipation column 100 . For example, the lamp holder 200 can be installed in a lamp socket on the ceiling or wall, so as to provide electric energy for the normal operation of the LED cooling lamp 10 .

Please refer to FIG. 1 , the substrate 300 is disposed on the second end 120 of the heat dissipation column 100 . For example, the substrate 300 is a disk-shaped structure.

Please refer to FIG. 1 and FIG. 2 together. A plurality of heat dissipation arcs 400 are arranged radially on the edge of the substrate 300. In this way, the plurality of heat dissipation arcs 400 and the substrate 300 can form a heat dissipation cavity 600. The heat dissipation cavity 600 can The heat dissipation fins 400 can better transfer heat to the air medium in the heat dissipation chamber 600 , thereby increasing the degree of convective heat transfer. For example, there are four cooling arcs 400. Of course, the cooling arcs 400 are not limited to four. According to the actual situation, the cooling arcs 400 can be adjusted according to the number of LED lamps and the heat dissipation load.

In order to better optimize the installation structure of the heat dissipation arcs 400 and improve the heat dissipation effect, please refer to FIG. Spaces are provided between the fins 400, so that the installation structure of the heat dissipation arc fins 400 can be better optimized and the heat dissipation effect can be improved.

Please refer to FIG. 1 , the two sides of the heat dissipation arc 400 are respectively provided with a concave curved surface 410 and a convex curved surface 420 , and the heat dissipation arc 400 gradually bends toward the axis of the heat dissipation column 100 from one end to the other end on the base plate 300 , and Smooth transition.

In order to better improve the heat dissipation performance of the heat dissipation fins 400 , for example, please refer to FIG. 2 , the cross-sectional area of the heat dissipation fins 400 located close to the substrate 300 is larger than the cross-sectional area of the heat dissipation fins 400 located away from the substrate 300 . That is to say, the heat transfer cross-sectional area of the heat dissipation arc 400 located close to the substrate 300 is larger than the heat transfer cross-sectional area of the heat dissipation arc 400 located away from the substrate 300, according to the heat conduction formula:

$\frac{\mathrm{<span\; class="notranslate">\; Q</span>}}{\mathrm{<span\; class="notranslate">\; T</span>}}<span\; class="notranslate">\; =</span>\frac{\mathrm{<span\; class="notranslate">\; kA</span>}<span\; class="notranslate">\; (</span>\mathrm{<span\; class="notranslate">\; Thot</span>}<span\; class="notranslate">\; -</span>\mathrm{<span\; class="notranslate">\; Tcold</span>}<span\; class="notranslate">\; )</span>}{\mathrm{<span\; class="notranslate">\; D.</span>}}<span\; class="notranslate">\; ,</span>$

Among them, define Q as the heat transfer per unit time, define k as the thermal conductivity, define A as the heat transfer cross-sectional area, define T as the temperature, and define D as the thickness of the heat conduction layer.

Since the heat transfer quantity Q per unit time is proportional to the heat transfer cross-sectional area A, therefore, the larger the heat transfer cross-sectional area A of the heat dissipation arc 400 located close to the substrate 300, the greater the heat transfer amount within a certain period of time, which can be The better the heat transfer to the substrate 300 , and then to the heat dissipation column 100 , the better the heat dissipation performance. Thus, by optimizing the structure of the heat dissipation fins 400 , the cross-sectional area of the heat dissipation fins 400 located close to the substrate 300 is larger than the cross-sectional area of the heat dissipation fins 400 located far away from the substrate 300 , which can better improve the heat dissipation performance.

Please refer to FIG. 1 and FIG. 2 together. The LED lamp 500 is disposed on the convex curved surface 420 of the heat dissipation arc 400 . It can be understood that since the heat dissipation arc 400 gradually bends from one end on the base plate 300 to the other end towards the axis of the heat dissipation column 100, the light emitted by the LED lamp 500 installed on the convex curved surface 420 can be larger. Interference from other components can be avoided as much as possible, and based on the reflection and scattering effects of the convex curved surface 420, the light emission direction of the LED lamp 500 can be made more uniform and the brightness higher.

In order to further improve the heat dissipation performance of the LED heat dissipation lamp, for example, referring to FIG. 3, the LED heat dissipation lamp 10 is also provided with a heat dissipation bubble 700. The outer surface of the outer surface is opposed to the concave curved surface 410; as another example, the coolant is filled in the cooling bubble 700; as another example, the material of the coolant is light water, heavy water, liquid ammonia or chlorofluorocarbon. The 700 can quickly transfer the heat accumulated on the heat dissipation arc 400 to the heat dissipation bubble 700, thereby further improving the heat dissipation performance of the LED heat dissipation lamp.

In order to further improve the heat dissipation performance of the LED heat dissipation lamp, for example, please refer to FIG. 4 , the LED heat dissipation lamp 10 is also provided with a heat dissipation column 800, and the two ends of the heat dissipation column 800 are respectively arranged on the concave curved surface 410 and the substrate 300; The heat dissipation column 800 is provided with a plurality of ventilation holes 810. By setting the heat dissipation column 800, the heat accumulated on the heat dissipation arc 400 can be quickly transferred to the heat dissipation column 800, and the ventilation holes 810 can also improve the degree of convective heat transfer. In this way, The heat dissipation performance of the LED heat dissipation lamp can be further improved.

In order to further improve the heat dissipation performance of the LED heat dissipation lamp, for example, referring to FIG. 5 , the heat dissipation column 100 is provided with a plurality of heat dissipation grooves 130, and the heat dissipation grooves 130 are connected to the first end 110 and the second end 120; Each heat dissipation groove 130 is provided with a plurality of heat dissipation holes 131. When the heat of the LED lamp 500 is transferred to the heat dissipation column 100, the heat dissipation grooves 130 and the heat dissipation holes 131 can increase the heat dissipation surface area, thereby further improving the heat dissipation of the LED heat dissipation lamp. cooling performance. In another example, the heat dissipation holes are circular; in another example, the heat dissipation holes are square; in another example, the distance between two adjacent heat dissipation holes is equal.

In order to enable the LED heat dissipation lamps to be installed at lower positions such as tables, cabinets and workbenches without affecting the normal light emitting direction of the LED heat dissipation lamps, for example, please refer to FIG. One end to the other end of the 300 gradually bends away from the axis of the heat dissipation column 100, and the transition is gentle. The LED lamp 500 is arranged on the concave surface 410, so that the concave surface 410 can reflect the light beam emitted by the LED lamp 500 to the heat dissipation arc. The bottom of the sheet 400, so that the LED heat dissipation lamp can be installed at a lower position such as a table, a cabinet, and a workbench, without affecting the normal light emitting direction of the LED heat dissipation lamp.

The above-mentioned LED heat dissipation lamp 10 can greatly improve the heat dissipation effect by setting the heat dissipation column 100 , the base plate 300 and a plurality of heat dissipation arcs 400 , and the plurality of heat dissipation arcs 400 and the base plate 300 form a heat dissipation cavity 600 . In addition, the installation of the LED lamp 500 on the heat dissipation arc 400 can make the light emitting direction more uniform.

In order to further make the heat dissipation arc of the LED heat dissipation lamp have the advantages of good insulation, low expansion coefficient, large thermal conductivity, good heat dissipation effect and light weight.

For another example, please refer to FIG. 7 , which is a schematic structural diagram of the heat dissipation arc 10 a of the LED heat dissipation lamp according to an embodiment of the present invention. For example, the heat dissipation fin 10a includes: an insulating layer 100a, a heat conduction layer 200a, a heat transfer layer 300a, a heat dissipation layer 400a, and a protective layer 500a stacked in sequence, that is, the insulation layer 100a, the heat conduction layer 200a, the heat transfer layer 300a, and the heat dissipation layer 400a and the protective layer 500a in sequence, that is, the heat conduction layer 200a is attached to the insulating layer 100a, the heat transfer layer 300a is attached to the heat conduction layer 200a, the heat dissipation layer 400a is attached to the heat transfer layer 300a, and the protective layer 500a is pasted on the heat dissipation layer 400a.

It should be noted that the insulating layer is directly in contact with the heat source, for example, the insulating layer is in contact with the LED lamp, that is, the LED lamp is directly installed on the insulating layer, so as to ensure that the LED lamp emits light. The heat can be transferred directly to the insulating layer.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the insulating layer of the heat dissipation arc has the advantages of good insulation effect, high thermal conductivity and low thermal expansion coefficient, so that when the heat of the LED lamp is directly transferred When reaching the insulating layer, the insulating layer can quickly and timely conduct away the heat accumulated in the vicinity of the LED lamp, so as to ensure the normal operation of the LED lamp. Secondly, since the distance between the insulating layer and the LED lamp is the shortest, it bears the largest heat conduction load. When the thermal expansion coefficient of the insulating layer is low, the gap between the insulating layer and the heat conducting layer can be avoided. The generation of gaps and the avoidance of gaps in the insulating layer itself can further avoid the problem of lower thermal conductivity caused by the gaps and gaps being filled with air. Finally, because the LED lamp is directly installed on the insulating layer, it is easy to cause the problem that the electrical components directly contact the insulating layer. When the insulating effect of the insulating layer is good, the insulating layer can be prevented from being energized, thereby improving the performance of the insulating layer. The safety performance of the above-mentioned heat dissipation arc is relatively high.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the insulating layer of the heat dissipation arc includes the following components in parts by mass: 40 parts to 70 parts of silicon carbide, 13 parts to 70 parts of aluminum oxide 55 parts, 2-15 parts of silicon dioxide, 3-25 parts of binder, 2-20 parts of kaolin, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Dongyang clay, 0.5-2 parts of light calcium 2 parts and 0.2 to 0.5 parts of rare earth oxides.

The above-mentioned insulating layer uses silicon carbide as the main raw material and mixes the rest of the raw materials that can be used to prepare ceramics, so that the above-mentioned insulating layer has the advantages of high thermal conductivity, good insulation performance, low thermal expansion coefficient and good heat resistance. In addition, the above insulating layer also has the advantages of easy production and low manufacturing cost.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the insulating layer of the heat dissipation arc includes the following components in parts by mass: 50 to 60 parts by mass of silicon carbide, 30 to 50 parts by aluminum oxide 10-15 parts of silicon dioxide, 10-20 parts of binder, 15-20 parts of kaolin, 1-1.5 parts of magnesium oxide, 1-1.5 parts of Dongyang soil, 1-1.5 parts of light calcium and 0.3 to 0.4 parts of rare earth oxides.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the insulating layer of the heat dissipation arc includes the following components in parts by mass: 55 parts by mass of silicon carbide, 40 parts by aluminum oxide, 13 parts by mass of silicon dioxide 15 parts, 15 parts of binder, 18 parts of kaolin, 1.5 parts of magnesium oxide, 1.5 parts of Dongyang soil, 1.5 parts of light calcium and 0.3 parts of rare earth oxide.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the method for preparing the insulating layer of the heat dissipation arc includes the following steps: adding silicon carbide, aluminum oxide, silicon dioxide, Binder, kaolin, magnesium oxide, Dongyang clay, light calcium and rare earth oxide are mixed; the above insulating layer is obtained after plasticizing, press molding, cooling and demoulding.

It should be noted that, since the above-mentioned heat-conducting layer is directly bonded to the insulating layer, the insulating layer will directly transfer the heat absorbed from the LED lamp to the heat-conducting layer, which requires the heat-conducting layer to have The extremely high thermal conductivity can quickly transfer the heat absorbed from the insulating layer to the heat conduction layer. In addition, the heat conduction layer is also required to have better heat dissipation performance and a lower thermal expansion coefficient.

For example, in the LED heat dissipation lamp according to one embodiment of the present invention, the heat conduction layer of the heat dissipation arc has the advantages of high thermal conductivity, good heat dissipation performance and good mechanical properties, so when the insulating layer will be removed from The heat absorbed by the LED lamp is directly transferred to the heat conduction layer, then the heat absorbed by the insulating layer can be quickly transferred to the heat conduction layer, and in the process of heat conduction, based on the excellent heat conduction layer The heat dissipation performance can also dissipate the heat on the heat conduction layer to the outside air. Secondly, since the heat conduction layer is still relatively close to the LED lamp, its own temperature will be relatively high. However, based on the low thermal expansion coefficient of the heat conduction layer, it is possible to prevent the heat conduction layer from contacting the LED lamp. A gap is formed between the heat transfer layers to ensure the tightness of the two bonding.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat conduction layer of the heat dissipation arc includes the following components in parts by mass: 80 to 95 parts of graphene, 0.1 to 20 parts of carbon nanotubes and 0.1 to 20 parts of carbon nanofibers.

By using graphene as the main raw material of the above-mentioned heat conduction layer, its heat conductivity coefficient has been greatly improved, and the heat conduction effect is better. In addition, by adding carbon nanotubes and carbon fibers, heat dissipation channels can be formed, and the heat dissipation performance is also better.

What needs to be emphasized here is that, since the above-mentioned thermal conduction layer adopts graphene, a material with good conduction effect, the present invention adheres the conduction layer to the insulating layer so as to isolate the internal heat of the LED heat dissipation lamp. Circuit elements, so as to avoid the direct electrification of the heat conduction layer, thereby improving the safety performance of the heat dissipation arc, and the safety standard is relatively high.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat conduction layer of the heat dissipation arc includes the following components in parts by mass: 85 to 90 parts of graphene, 5 to 15 parts of carbon nanotubes and 5-15 parts of carbon nanofiber.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat conduction layer of the heat dissipation arc includes the following components in parts by mass: 90 parts by mass of graphene, 10 parts by carbon nanotube and 10 parts by mass of carbon nanofiber.

It should be noted that, after passing through the first two layers, that is, the insulating layer and the heat conducting layer, part of the heat generated by the LED light will be lost to the outside air. In addition, due to the high cost of the heat conduction layer, the main reason is that the main raw material of the heat conduction layer is graphene, which has a relatively high production cost. Therefore, the heat transfer and heat dissipation burden based on the heat transfer layer is relatively small. In some cases, the heat transfer layer can use the most commonly used metal heat dissipation material in the market today, so as to achieve the effect of reducing cost and obtaining better heat transfer performance.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat transfer layer of the heat dissipation arc has the advantages of high thermal conductivity, good heat dissipation performance, good mechanical performance, and low cost. When the heat of the heat-conducting layer is transferred to the heat-transfer layer, the heat absorbed by the heat-conducting layer can be transferred to the heat-transfer layer more quickly, and in the process of heat transfer, the heat-transfer layer It is also possible to transfer part of the heat directly to the outside air.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat transfer layer of the heat dissipation arc includes the following components in parts by mass: 93 to 97 parts of copper, 2 to 4.5 parts of aluminum, 0.1-0.3 parts of nickel, 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, 0.1-0.3 parts of titanium, 0.1-0.3 parts of chromium, and 0.1-0.3 parts of niobium.

The heat transfer layer containing copper (Cu) can maintain the thermal conductivity of the heat transfer layer at a relatively high level. When the mass part of copper is 93 to 97 parts, the thermal conductivity of the heat transfer layer can reach more than 380W/mK, and the heat transferred from the heat transfer layer can be quickly transferred away, and then evenly dispersed On the overall structure of the heat transfer layer, heat is prevented from accumulating at the contact position between the heat transfer layer and the heat transfer layer, resulting in local overheating. Moreover, the density of the heat transfer layer is only 8.0kg/m ³ to 8.1kg/m ³ , which is much smaller than that of pure copper, which can effectively reduce the weight of the heat transfer layer and is more convenient for installation and manufacture. At the same time, the cost is also greatly reduced. In addition, the heat transfer layer contains 2-4.5 parts by mass of aluminum, 0.1-0.3 parts of nickel, 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, 0.1-0.3 parts of titanium , 0.1-0.3 parts of chromium and 0.1-0.3 parts of niobium of vanadium. Compared with pure copper, the ductility, toughness, strength and high temperature resistance of the heat transfer layer are greatly improved, and it is not easy to sinter.

In order to make the heat transfer layer have better performance, for example, the heat transfer layer contains 0.1-0.3 parts by mass of nickel (Ni), which can improve the high temperature resistance of the heat transfer layer. As another example, the heat transfer layer contains 0.2-1.2 parts by mass of vanadium (V), which can inhibit the grain growth of the heat transfer layer and obtain a relatively uniform and fine grain structure, so as to reduce the brittleness of the heat transfer layer. Improve the overall mechanical properties of the heat transfer layer to increase toughness and strength. As another example, the heat transfer layer contains 0.1-0.3 parts by mass of titanium (Ti), which can make the grains of the heat transfer layer finer, so as to improve the ductility of the heat transfer layer; as another example, The heat transfer layer also includes 1 to 2.5 parts by mass of silicon (Si). When the heat transfer layer contains an appropriate amount of silicon, the thermal conductivity of the heat transfer layer can be effectively improved without affecting the thermal conductivity of the heat transfer layer. The hardness and wear resistance of the heat transfer layer. However, after many times of theoretical analysis and experimental evidence, it is found that when the mass of silicon in the heat transfer layer is too much, for example, when the mass percentage exceeds 15 parts, black particles will be distributed on the surface of the heat transfer layer, and the ductility will be reduced, which is not conducive to Production molding of the heat transfer layer.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat transfer layer of the heat dissipation arc includes the following components in parts by mass: 94 to 96 parts of copper, 3 to 4 parts of aluminum , 0.2 to 0.3 parts of nickel, 0.5 to 1 part of vanadium, 0.2 to 0.3 parts of manganese, 0.2 to 0.3 parts of titanium, 0.2 to 0.3 parts of chromium and 0.2 to 0.3 parts of niobium.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat transfer layer of the heat dissipation arc includes the following components in parts by mass: 95 parts by mass of copper, 3.5 parts of aluminum, 0.3 parts of nickel, vanadium 0.8 parts, 0.2 to 0.3 parts of manganese, 0.2 to 0.3 parts of titanium, 0.2 to 0.3 parts of chromium, and 0.2 to 0.3 parts of niobium.

It should be noted that when the heat generated by the LED lamp passes through the first three layers, namely the insulating layer, the heat conduction layer and the heat transfer layer respectively, a relatively large part of the heat will be lost in the transfer. In the air medium, in addition, since the main raw material of the heat transfer layer is copper, its quality is relatively heavy, therefore, based on the relatively small heat dissipation burden of the heat dissipation layer, the heat dissipation effect of the heat dissipation layer can be better, Lighter weight, lower cost materials to achieve cost and weight reduction, as well as better thermal performance.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat dissipation layer of the heat dissipation arc has the advantages of better heat dissipation effect, lighter weight and lower cost, so when the heat transfer layer When the heat is transferred to the heat dissipation layer, the heat dissipation layer can dissipate most of the heat in the air medium, so as to cooperate with the insulation layer, the heat conduction layer and the heat transfer layer to complete the effect of gradient heat transfer , in this way, the effect of gradient heat transfer and dissipation can be achieved for different heat areas, that is, measured by the distance from the LED lamp, which solves the problem of poor insulation, high cost, heavy weight, heat conduction and heat dissipation of traditional heat sink materials. The problem of poor heat dissipation.

For example, in the LED heat dissipation lamp according to one embodiment of the present invention, the heat dissipation layer of the heat dissipation arc includes the following components in parts by mass: 47-50 parts of copper, 49-52 parts of aluminum, magnesium 0.2 to 0.7 parts, 0.2 to 0.7 parts of iron, 0.2 to 0.5 parts of manganese, 0.1 to 0.3 parts of titanium, 0.05 to 0.1 parts of chromium, and 0.1 to 0.3 parts of vanadium.

The above-mentioned heat dissipation layer contains 47-50 parts by mass of copper and 49-52 parts of aluminum, which can keep the thermal conductivity of the heat dissipation layer at 300W/mK-350W/mK, so as to ensure that the heat dissipation layer can be used by The heat transferred from the heat transfer layer is quickly dissipated in the air medium, thereby preventing heat from accumulating on the heat dissipation layer and causing local overheating. Compared with the prior art, simply using expensive and high-quality copper, the above-mentioned heat dissipation layer not only has a good heat dissipation effect, can quickly dissipate heat into the air, but also has the advantages of light weight, easy installation and casting, and low price. Inexpensive advantage. At the same time, compared with the prior art, simply using aluminum alloy with poor heat dissipation effect, the above heat dissipation layer has better heat transfer performance. In addition, the heat dissipation layer contains 0.2-0.7 parts by mass of magnesium, 0.2-0.7 parts of iron, 0.2-0.5 parts of manganese, 0.1-0.3 parts of titanium, 0.05-0.1 parts of chromium and 0.1 parts ~0.3 vanadium improves the yield strength, tensile strength and high temperature resistance of the heat dissipation layer. For example, it has been found through multiple experiments and theoretical analysis that the heat dissipation layer contains 0.2-0.7 parts by mass of magnesium, which can impart yield strength and tensile strength to the heat dissipation layer to a certain extent.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat dissipation layer of the heat dissipation arc includes the following components in parts by mass: 48 to 49 parts of copper, 50 to 52 parts of aluminum, 0.2-0.5 parts of magnesium, 0.2-0.5 parts of iron, 0.3-0.5 parts of manganese, 0.2-0.3 parts of titanium, 0.05-0.08 parts of chromium and 0.2-0.3 parts of vanadium.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the heat dissipation layer of the heat dissipation arc includes the following components in parts by mass: 48 parts of copper, 51 parts of aluminum, 0.3 parts of magnesium, and 0.3 parts of iron 0.4 parts of manganese, 0.4 parts of titanium, 0.08 parts of chromium and 0.3 parts of vanadium.

In order to further reduce the weight of the heat dissipation layer and obtain a better heat dissipation effect, for example, the present invention further provides an auxiliary heat dissipation layer, and the auxiliary heat dissipation layer is disposed on a side of the heat dissipation layer away from the heat transfer layer.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the auxiliary heat dissipation layer of the heat dissipation arc includes the following components in parts by mass: 88-93 parts of aluminum, 5.5-10.5 parts of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper, 0.2-0.8 parts of iron, 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, 0.05-0.1 parts of chromium, and 0.05-0.3 parts of vanadium.

The above-mentioned auxiliary heat dissipation layer contains 88 to 93 parts by mass of aluminum, which can keep the thermal conductivity of the auxiliary heat dissipation layer at 200W/mK to 220W/mK, and the heat dissipation effect is better, which can meet the requirements of transferring the remaining heat to the air medium. It is required, at the same time, that its mass is lighter and easier to transport. In addition, the auxiliary heat dissipation layer contains 5.5-10.5 parts by mass of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper, 0.2-0.8 parts of iron, 0.2-0.5 parts of manganese, 0.05 1-0.3 part of titanium, 0.05-0.1 part of chromium and 0.05-0.3 part of vanadium can greatly improve the heat dissipation performance of the auxiliary heat dissipation layer. For example, the auxiliary heat dissipation layer contains 5.5-10.5 parts by mass of silicon and 0.05-0.3 parts of copper, which can ensure that the auxiliary heat dissipation layer has the advantages of good mechanical properties and light weight, and can further improve the auxiliary heat dissipation layer. cooling performance. As another example, the auxiliary heat dissipation layer also includes 0.3 to 0.6 parts of lead (Pb) by mass. When the auxiliary heat dissipation layer contains 0.3 to 0.6 parts of lead, the tensile strength of the auxiliary heat dissipation layer can be improved. When the auxiliary heat dissipation layer is cast and punched into a sheet-like or film-like structure, it is broken due to excessive punching and pulling stress. As another example, the auxiliary heat dissipation layer also includes niobium (Nb) with a mass fraction of 0.02 to 0.04 parts. When the mass fraction of niobium is greater than 0.02, the oxidation resistance of the auxiliary heat dissipation layer can be greatly improved. However, when the mass of niobium When the part is greater than 0.04 part, the magnetic properties of the auxiliary heat dissipation layer will increase sharply, which will affect other components in the LED heat dissipation lamp. For another example, the auxiliary heat dissipation layer also includes germanium (Ge) with a mass fraction of 0.02 to 0.03 parts. When the mass fraction of germanium is greater than 0.02 parts, it will have an unexpected effect on the improvement of the heat dissipation performance of the auxiliary heat dissipation layer. However, , when the mass proportion of germanium is too much, for example, when the mass fraction of germanium is greater than 2, the brittleness of the auxiliary heat dissipation layer will increase.

It should be noted that after passing through the first four layers of the heat generated by the LED light, that is, the insulating layer, the heat conduction layer, the heat transfer layer and the heat dissipation layer, a large part of the heat has been dissipated. into the outside air. Therefore, based on the fact that the heat dissipation burden of the protective layer is relatively small, and the temperature itself is low, the influence of a large thermal expansion coefficient is minimal, and the heat transfer layer can use the most commonly used plastic material in the market today. , in order to reduce cost and weight, and obtain better surface protection performance.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the protective layer of the heat dissipation arc has the advantages of good surface protection performance, light weight and low cost. In this way, when the protective layer is located on the When the outermost layer of the heat dissipation arc is used, it can have better heat dissipation performance, better surface protection performance, lighter weight and lower cost.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the protective layer of the heat dissipation arc includes the following components in parts by mass: the protective layer includes the following components in parts by mass: graphite 20 20-30 parts of carbon fiber, 40-60 parts of polyamide, 10-20 parts of water-soluble silicate, 1-8 parts of hexagonal boron nitride, 2-2 parts of bismaleimide 5 parts, 0.5 to 2 parts of silane coupling agent, 0.25 to 1 part of antioxidant.

When the above-mentioned water-soluble silicate is mixed with graphite and carbon fiber, it can undergo copolymerization reaction with polyamide under high temperature conditions to form heat dissipation channels, thereby improving heat dissipation performance, and is lighter in weight than the hollow structure. In addition, due to the addition of carbon fiber, its surface protection performance and mechanical properties are better, for example, it is more resistant to oxidation, acid and alkali, and corrosion.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the protective layer of the heat dissipation arc includes the following components in parts by mass: 30-35 parts of graphite, 25-30 parts of carbon fiber, 45-50 parts of polyamide, 15-20 parts of water-soluble silicate, 4-6 parts of hexagonal boron nitride, 3-4 parts of bismaleimide, 1-1.5 parts of silane coupling agent , 0.5 to 1 part of antioxidant.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the protective layer of the heat dissipation arc includes the following components in parts by mass: 35 parts by mass of graphite, 28 parts by carbon fiber, 45 parts by polyamide, water soluble 18 parts of permanent silicate, 5 parts of hexagonal boron nitride, 3.5 parts of bismaleimide, 1.8 parts of silane coupling agent, and 0.7 parts of antioxidant.

In order to better optimize the heat conduction and heat dissipation pathways of the insulating layer, the heat conduction layer, the heat transfer layer, the heat dissipation layer and the protective layer, therefore, comprehensively consider cost, weight, heat conduction and heat dissipation Effect, and in the case of surface protection performance, the thickness ratio of the heat conduction layer, the heat transfer layer, the heat dissipation layer, and the protective layer in one embodiment of the present invention is 1 to 1.5:8 to 12:5 to 7 : 6-10: 2-2.5. In this way, the heat conduction and heat dissipation paths of the insulating layer, the heat conduction layer, the heat transfer layer, the heat dissipation layer and the protective layer can be optimized.

In order to further fix the insulating layer, the heat conduction layer, the heat transfer layer, the heat dissipation layer and the protective layer together to further improve the structural stability and reduce the heat dissipation of the LED heat dissipation lamp The influence of arc sheet thermal conductivity and heat transfer performance.

For example, referring to FIG. 8, a first filling adhesive layer 600a is set between the insulating layer 100a and the heat conducting layer 200a, a second filling adhesive layer 700a is set between the heat conducting layer 200a and the heat transfer layer 300a, and the heat transfer layer 300a and the heat dissipation A third filled adhesive layer 800a is disposed between the layers 400a, and a fourth filled adhesive layer 900a is disposed between the heat dissipation layer 400a and the protective layer 500a. It can be understood that there are small and large number of gaps between the adjacent interfaces of the insulating layer 100a, the heat conduction layer 200a, the heat conduction layer 200a, the heat transfer layer 300a, the heat dissipation layer 400a and the protective layer 500a. The reason is mainly Because the bonding surfaces of the above-mentioned layers of materials are not tight enough, by setting the first filled adhesive layer 600a, the second filled adhesive layer 700a, the third filled adhesive layer 800a and the fourth filled adhesive layer 900a can be more It fills these gaps well and also acts as a bond.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the first filling and adhesive layer of the heat dissipation arc includes the following components in parts by mass: 300 parts to 1000 parts of nano-alumina particles, A 5-30 parts of base vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin.

Preferably, the LED heat dissipation lamp according to an embodiment of the present invention, wherein, the first filled adhesive layer of the heat dissipation arc includes the following components in parts by mass: 800 parts to 1000 parts of nano-alumina particles, 20-30 parts of methyl vinyl silicone rubber, 40-50 parts of vinyl silicone oil, 80-100 parts of dimethyl silicone oil and 15-20 parts of MQ silicone resin.

Preferably, the LED heat dissipation lamp according to an embodiment of the present invention, wherein, the first filled adhesive layer of the heat dissipation arc includes the following components in parts by mass: 900 parts by mass of nano-alumina particles, 900 parts by mass of methyl vinyl 25 parts of base silicone rubber, 45 parts of vinyl silicone oil, 85 parts of dimethyl silicone oil and 20 parts of MQ silicone resin.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the second filling and adhesive layer of the heat dissipation arc includes the following components in parts by mass: 200 to 800 parts of nano-alumina particles, and 10-40 parts of base vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin;

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the second filling and adhesive layer of the heat dissipation arc includes the following components in parts by mass: 500 parts to 700 parts of nano-alumina particles, 20-30 parts of methyl vinyl silicone rubber, 30-40 parts of vinyl silicone oil, 50-80 parts of dimethyl silicone oil and 10-15 parts of MQ silicone resin.

Preferably, the LED heat dissipation lamp according to an embodiment of the present invention, wherein, the second filling adhesive layer of the heat dissipation arc includes the following components in parts by mass: 600 parts by mass of nano-alumina particles, methyl vinyl 15 parts of base silicone rubber, 35 parts of vinyl silicone oil, 65 parts of dimethyl silicone oil and 15 parts of MQ silicone resin.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the third filling adhesive layer of the heat dissipation arc includes the following components in parts by mass: 200 to 700 parts of nano-alumina particles, and 10-40 parts of base vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the third filling and adhesive layer of the heat dissipation arc includes the following components in parts by mass: 200 parts to 600 parts of nano-alumina particles, 20-40 parts of methyl vinyl silicone rubber, 20-50 parts of vinyl silicone oil, 30-100 parts of dimethyl silicone oil and 5-10 parts of MQ silicone resin.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the third filling and adhesive layer of the heat dissipation arc includes the following components in parts by mass: 500 parts by mass of nano-alumina particles, 500 parts by mass of methyl vinyl 25 parts of base silicone rubber, 25 parts of vinyl silicone oil, 30 parts of dimethyl silicone oil and 8 parts of MQ silicone resin.

For example, in the LED heat dissipation lamp according to an embodiment of the present invention, the fourth filling adhesive layer of the heat dissipation arc includes the following components in parts by mass: 150 parts to 700 parts of nano-alumina particles, 15-45 parts of vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin.

Preferably, in the LED heat dissipation lamp according to an embodiment of the present invention, the fourth filling and adhesive layer of the heat dissipation arc includes the following components in parts by mass: 150 parts to 450 parts of nano-alumina particles, 15-25 parts of methyl vinyl silicone rubber, 10-25 parts of vinyl silicone oil, 80-100 parts of dimethyl silicone oil and 1-10 parts of MQ silicone resin.

Preferably, the LED heat dissipation lamp according to an embodiment of the present invention, wherein, the fourth filled adhesive layer of the heat dissipation arc includes the following components in parts by mass: 250 parts by mass of nano-alumina particles, 250 parts by mass of methyl vinyl 18 parts of base silicone rubber, 20 parts of vinyl silicone oil, 95 parts of dimethyl silicone oil and 5 parts of MQ silicone resin.

The first filled adhesive layer 600a, the second filled adhesive layer 700a, the third filled adhesive layer 800a and the fourth filled adhesive layer 900a all use silicone resin as the matrix material, and add nano alumina particles. By adding heat-conducting powder nano-alumina into the silicone resin matrix, a filling adhesive material with strong adhesion and high thermal conductivity can be prepared, and the insulating layer, the heat-conducting layer, and the The heat transfer layer, the heat dissipation layer and the protective layer are fixed together to further improve the structural stability.

When it needs to be emphasized, the content of nano-alumina particles in the first filled adhesive layer 600a, the second filled adhesive layer 700a, the third filled adhesive layer 800a and the fourth filled adhesive layer 900a decreases successively, because the heat load It also decreases in order from the insulating layer, heat conduction layer, heat transfer layer, heat dissipation layer to the protective layer, so that the effect of gradient heat conduction and heat dissipation can be better obtained.

In order to better adhere to the insulating layer, the heat conduction layer, the heat transfer layer, the heat dissipation layer and the protective layer, while avoiding increasing the excessive thickness, and reducing the impact on heat conduction and heat dissipation performance, For example, the thickness ratio of the first filled adhesive layer, the second filled adhesive layer, the third filled adhesive layer and the fourth filled adhesive layer is 1-1.5:2-2.5:3-3.5 : 4-4.5, and for another example, the thickness ratio of the first filled adhesive layer to the insulating layer is 1:50-80.

The heat dissipation arc sheet 10a of the LED heat dissipation lamp can obtain good insulation, low expansion coefficient, large thermal conductivity, and heat dissipation by sequentially stacking the insulating layer 100a, the heat conduction layer 200a, the heat transfer layer 300a, the heat dissipation layer 400a, and the protective layer 500a. The advantages of good effect and light weight. In addition, when the heat dissipation arc 10a is applied to the LED heat dissipation lamp, the LED heat dissipation lamp can also obtain good insulation, low expansion coefficient, large thermal conductivity, good heat dissipation effect and The advantage of light weight.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (4)

1. A kind of LED heat dissipation lamp, it is characterized in that, comprises: heat dissipation column, lamp cap, substrate, a plurality of heat dissipation arc slices and LED lamp, The lamp head is arranged at the first end of the heat dissipation column; The substrate is disposed at the second end of the heat dissipation column; The heat dissipation column is provided with a plurality of heat dissipation grooves, the heat dissipation grooves are connected with the first end and the second end, and each heat dissipation groove is provided with a plurality of heat dissipation holes; A plurality of the heat dissipation arcs are arranged radially on the edge of the substrate, and the two sides of the heat dissipation arcs are respectively provided with concave curved surfaces and convex curved surfaces, and the heat dissipation arcs are arranged from one end on the substrate to the other. One end gradually bends towards the axis of the cooling column; The LED lights are arranged on the convex curved surface; Wherein, the heat dissipation arc includes an insulating layer, a heat conduction layer, a heat transfer layer, a heat dissipation layer and a protective layer stacked in sequence, the heat conduction layer is attached to the insulation layer, and the heat transfer layer is attached to the On the heat conduction layer, the heat dissipation layer is attached to the heat transfer layer, and the protective layer is attached to the heat dissipation layer; The insulating layer includes the following components by mass: 40-70 parts of silicon carbide, 13-55 parts of aluminum oxide, 2-15 parts of silicon dioxide, 3-25 parts of binder, kaolin 2-20 parts, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Dongyang soil, 0.5-2 parts of light calcium and 0.2-0.5 parts of rare earth oxides; The heat conduction layer includes the following components in parts by mass: 80-95 parts of graphene, 0.1-20 parts of carbon nanotubes and 0.1-20 parts of carbon nanofibers; The heat transfer layer includes the following components by mass: 93-97 parts of copper, 2-4.5 parts of aluminum, 0.1-0.3 parts of nickel, 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, titanium 0.1 to 0.3 parts, 0.1 to 0.3 parts of chromium and 0.1 to 0.3 parts of niobium; The heat dissipation layer includes the following components in parts by mass: 47-50 parts of copper, 49-52 parts of aluminum, 0.2-0.7 parts of magnesium, 0.2-0.7 parts of iron, 0.2-0.5 parts of manganese, 0.1 parts of titanium 0.3 parts to 0.3 parts, 0.05 to 0.1 parts to chromium and 0.1 to 0.3 parts to vanadium; It also includes an auxiliary heat dissipation layer, the auxiliary heat dissipation layer is arranged on the side of the heat dissipation layer away from the heat transfer layer, and the auxiliary heat dissipation layer includes the following components in parts by mass: 88 to 93 parts of aluminum, 5.5 to 10.5 parts of silicon, 0.3 to 0.7 parts of magnesium, 0.05 to 0.3 parts of copper, 0.2 to 0.8 parts of iron, 0.2 to 0.5 parts of manganese, 0.05 to 0.3 parts of titanium, 0.05 to 0.1 parts of chromium, and vanadium 0.05 to 0.3 parts; The protective layer includes the following components by mass: 20-40 parts of graphite, 20-30 parts of carbon fiber, 40-60 parts of polyamide, 10-20 parts of water-soluble silicate, hexagonal boron nitride 1-8 parts, 2-5 parts of bismaleimide, 0.5-2 parts of silane coupling agent, 0.25-1 part of antioxidant. 2. The LED heat dissipation lamp according to claim 1, wherein the heat dissipation hole is circular. 3. The LED heat dissipation lamp according to claim 1, wherein the heat dissipation holes are square. 4. The LED heat dissipation lamp according to claim 1, wherein the distance between two adjacent heat dissipation holes is equal.