CN104896336B - Led lamp tube - Google Patents
Led lamp tube Download PDFInfo
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- CN104896336B CN104896336B CN201510319911.5A CN201510319911A CN104896336B CN 104896336 B CN104896336 B CN 104896336B CN 201510319911 A CN201510319911 A CN 201510319911A CN 104896336 B CN104896336 B CN 104896336B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
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Abstract
Description
技术领域technical field
本发明涉及照明技术领域,特别是涉及一种LED灯管。The invention relates to the technical field of lighting, in particular to an LED lamp tube.
背景技术Background technique
LED(Light Emitting Diode,发光二极管)能直接高效地将电能转化成可见光,并且拥有长达数万小时~十万小时的使用寿命。采用LED为光源的灯具称为LED灯具,其以质优、耐用、节能等优点而被称为最常用的照明灯具。随着LED灯具技术近年飞速发展,LED灯具产品已经基本取代原来的荧光灯具。LED (Light Emitting Diode, Light Emitting Diode) can directly and efficiently convert electrical energy into visible light, and has a service life of tens of thousands to one hundred thousand hours. Lamps that use LEDs as light sources are called LED lamps, which are known as the most commonly used lighting lamps for their high quality, durability, and energy-saving advantages. With the rapid development of LED lighting technology in recent years, LED lighting products have basically replaced the original fluorescent lighting.
LED的基本结构是一个半导体的P—N结,当电流流过LED元件时,P—N结的温度将上升,而P—N结区的温度称为LED的结温,通常由于元件芯片均具有很小的尺寸,因此,也把LED芯片的温度称为LED芯片的结温。The basic structure of the LED is a P-N junction of a semiconductor. When the current flows through the LED element, the temperature of the P-N junction will rise, and the temperature of the P-N junction area is called the junction temperature of the LED. It has a very small size, so the temperature of the LED chip is also called the junction temperature of the LED chip.
目前,LED灯管自身存在的一个弊端是,LED灯管光效受LED灯管的结温的影响较大,较高的芯片结温将导致光效出现明显下降,并会影响到LED灯管的使用寿命。由于LED灯在发光时,其自身的温度会不断升高,在持续的照明工作中,如果LED灯产生的热量不能及时发散出去,将会造成LED灯的损坏,影响LED灯的使用寿命。因此,解决LED灯的散热问题对于提升LED灯的性能至关重要。At present, one disadvantage of the LED lamp itself is that the light effect of the LED lamp is greatly affected by the junction temperature of the LED lamp. service life. Since the temperature of the LED lamp will continue to rise when it is emitting light, if the heat generated by the LED lamp cannot be dissipated in time during continuous lighting work, it will cause damage to the LED lamp and affect the service life of the LED lamp. Therefore, solving the heat dissipation problem of LED lamps is very important for improving the performance of LED lamps.
然而,现有的LED灯管依然存在散热性能较差的问题,尤其是采用较大功率的LED灯作为光源时,其发热问题越发明显。此外,现有的LED灯管依然存在整体结构不够牢靠的问题。However, the existing LED lamp tubes still have the problem of poor heat dissipation performance, especially when a relatively high-power LED lamp is used as a light source, the heat generation problem becomes more and more obvious. In addition, the existing LED light tube still has the problem that the overall structure is not strong enough.
发明内容Contents of the invention
基于此,有必要提供一种散热性能较好和整体结构较牢靠的LED灯管。Based on this, it is necessary to provide an LED lamp tube with better heat dissipation performance and a more reliable overall structure.
一种LED灯管,包括:An LED light tube, comprising:
灯头,Lamp holder,
外盖,s,
灯罩,所述灯罩为筒形结构,所述灯罩的两端分别与所述灯头及所述外盖连接,所述灯罩的内侧壁开设有滑槽;A lampshade, the lampshade is a cylindrical structure, the two ends of the lampshade are respectively connected with the lamp holder and the outer cover, and the inner wall of the lampshade is provided with a chute;
散热组件,所述散热组件包括散热板及散热筒,所述散热板的两端分别与所述灯头及所述外盖连接,所述散热板具有第一侧面及第二侧面,所述散热筒设置于所述第一侧面,所述散热筒为空心结构,所述散热筒远离所述第一侧面设置有两个凸块,所述散热板的侧边边缘滑动设置于所述滑槽;A heat dissipation assembly, the heat dissipation assembly includes a heat dissipation plate and a heat dissipation cylinder, the two ends of the heat dissipation plate are connected to the lamp cap and the outer cover respectively, the heat dissipation plate has a first side and a second side, and the heat dissipation cylinder It is arranged on the first side, the heat dissipation cylinder is a hollow structure, and the heat dissipation cylinder is provided with two protrusions away from the first side, and the side edge of the heat dissipation plate is slidably arranged on the slide groove;
散热件,所述散热件包括抵持板及两个散热翼板,两个所述散热翼板分别与所述抵持板的两端连接,所述抵持板与所述散热筒抵持,所述抵持板远离所述散热筒的一侧面与所述灯罩抵持,所述抵持板向一侧凸出形成抵持部,所述抵持部与所述散热筒抵持且位于两个所述凸块之间;A heat sink, the heat sink includes a resisting plate and two heat dissipation fins, the two heat dissipation fins are respectively connected to both ends of the resisting plate, the resisting plate is resisted by the heat sink, The side of the resisting plate away from the heat dissipation cylinder is resisted against the lampshade, and the resisting plate protrudes to one side to form a resisting portion, and the resisting portion is resisted by the heat dissipation cylinder and is located on both sides. between the bumps;
LED灯,所述LED灯设置于所述散热板的所述第二侧面;LED lights, the LED lights are arranged on the second side of the heat sink;
绝缘筒,所述绝缘筒容置于所述散热筒内;an insulating cylinder, the insulating cylinder is accommodated in the heat dissipation cylinder;
电路组件,所述电路组件容置于所述绝缘筒内。The circuit assembly is accommodated in the insulating cylinder.
在其中一个实施例中,所述抵持部与所述凸块之间设置有间隔。In one of the embodiments, there is a space between the resisting portion and the bump.
在其中一个实施例中,还设置填充块,所述填充块分别与所述绝缘筒的外侧壁及所述散热筒的内侧壁抵持。In one of the embodiments, a filling block is also provided, and the filling block is respectively opposed to the outer wall of the insulating cylinder and the inner wall of the heat dissipation cylinder.
在其中一个实施例中,设置若干所述填充块。In one of the embodiments, several filling blocks are provided.
在其中一个实施例中,若干所述填充块均匀分布于所述绝缘筒的外侧壁及所述散热筒的内侧壁之间。In one embodiment, several of the filling blocks are evenly distributed between the outer wall of the insulating cylinder and the inner wall of the heat dissipation cylinder.
在其中一个实施例中,所述填充块的材质为绝缘材料。In one of the embodiments, the filling block is made of insulating material.
在其中一个实施例中,所述填充块的材质为橡胶。In one embodiment, the filling block is made of rubber.
上述LED灯管通过设置相互抵持的散热组件和散热件,并将LED灯安装于散热组件,散热组件和散热件协同散热,可以极大地提高LED灯管散热性能。此外,上述LED灯管还具有整体结构较牢靠的优点。The above-mentioned LED lamp tube can greatly improve the heat dissipation performance of the LED lamp tube by setting the heat dissipation assembly and the heat dissipation piece against each other, and installing the LED lamp on the heat dissipation assembly, and the heat dissipation assembly and the heat dissipation piece cooperate to dissipate heat. In addition, the above-mentioned LED lamp tube also has the advantage of a relatively solid overall structure.
附图说明Description of drawings
图1为本发明一实施方式的LED灯管的结构示意图;Fig. 1 is a schematic structural view of an LED lamp tube according to an embodiment of the present invention;
图2为图1所示的LED灯管的另一角度的结构示意图;Fig. 2 is a structural schematic diagram of another angle of the LED lamp shown in Fig. 1;
图3为本发明另一实施方式的LED灯管的结构示意图;Fig. 3 is a schematic structural diagram of an LED lamp tube according to another embodiment of the present invention;
图4为本发明另一实施方式的LED灯管的结构示意图;Fig. 4 is a schematic structural diagram of an LED lamp tube according to another embodiment of the present invention;
图5为本发明另一实施方式的LED灯管的结构示意图;Fig. 5 is a schematic structural diagram of an LED lamp tube according to another embodiment of the present invention;
图6为本发明另一实施方式的LED灯管的结构示意图。Fig. 6 is a schematic structural diagram of an LED lamp tube according to another embodiment of the present invention.
具体实施方式detailed description
为了便于理解本发明,下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施方式。但是,本发明可以以许多不同的形式来实现,并不限于本文所描述的实施方式。相反地,提供这些实施方式的目的是使对本发明的公开内容理解的更加透彻全面。In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
需要说明的是,当元件被称为“固定于”另一个元件,它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件,它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的,并不表示是唯一的实施方式。It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.
除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的,不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
请参阅图1及图2,LED灯管10包括:灯头100、外盖200、灯罩300、散热组件400、散热件500、LED灯600、绝缘筒700及电路组件800。灯头100、外盖200设置于灯罩300的两端,散热组件400、散热件500、LED灯600、绝缘筒700及电路组件800均容置于灯罩300内。Please refer to FIG. 1 and FIG. 2 , the LED lamp tube 10 includes: a lamp base 100 , an outer cover 200 , a lampshade 300 , a heat dissipation component 400 , a heat dissipation element 500 , an LED lamp 600 , an insulating cylinder 700 and a circuit assembly 800 . The lamp holder 100 and the outer cover 200 are disposed at both ends of the lampshade 300 , and the heat dissipation assembly 400 , the heat dissipation element 500 , the LED lamp 600 , the insulating tube 700 and the circuit assembly 800 are all accommodated in the lampshade 300 .
请参阅图1,灯罩300的两端分别与灯头100及外盖200连接,即所述灯罩的一端与所述灯头连接,另一端与所述外盖连接。请一并参阅图2,灯罩300为筒形结构,灯罩300的内侧壁开设有滑槽310。例如,所述灯头用于安装在外部的灯座上;又如,所述灯头设置有插针,所述插针用于与外部的灯座电连接,以给所述LED灯的正常工作提供电源。Please refer to FIG. 1 , the two ends of the lampshade 300 are respectively connected with the lamp base 100 and the outer cover 200 , that is, one end of the lamp shade is connected with the lamp base, and the other end is connected with the outer cover. Please also refer to FIG. 2 , the lampshade 300 is a cylindrical structure, and the inner wall of the lampshade 300 is provided with a chute 310 . For example, the lamp cap is used to be installed on an external lamp holder; as another example, the lamp cap is provided with pins, and the pins are used for electrical connection with the external lamp socket, so as to provide the normal operation of the LED lamp. power supply.
请参阅图2,散热组件400包括散热板410及散热筒420,散热板410的两端分别与灯头100及外盖200连接,即所述散热板的一端与所述灯头连接,另一端与所述外盖连接。散热板410具有第一侧面411及第二侧面412,散热筒420设置于第一侧面411。例如,散热筒420为空心结构;又如,散热筒420为空心方筒状结构;又如,灯罩300为空心方筒状结构;优选的,如图2所示,其边缘具有弧形角。Please refer to FIG. 2 , the heat dissipation assembly 400 includes a heat dissipation plate 410 and a heat dissipation cylinder 420. above cover connection. The cooling plate 410 has a first side 411 and a second side 412 , and the cooling cylinder 420 is disposed on the first side 411 . For example, the heat dissipation tube 420 is a hollow structure; as another example, the heat dissipation tube 420 is a hollow square tube structure; as another example, the lampshade 300 is a hollow square tube structure; preferably, as shown in FIG. 2 , its edges have curved corners.
请参阅图2,散热板410的侧边边缘滑动设置于滑槽310,当需要将散热组件400安装到灯罩300内时,将散热板410的侧边边缘沿着滑槽310滑入至灯罩300内时即可,如此,可以极大地提高安装操作的便捷性,且可以使散热组件400更牢靠地固定于灯罩300内。Please refer to FIG. 2 , the side edges of the heat dissipation plate 410 are slidably arranged in the chute 310 , and when the heat dissipation assembly 400 needs to be installed in the lampshade 300 , slide the side edges of the heat dissipation plate 410 into the lampshade 300 along the chute 310 In this way, the convenience of the installation operation can be greatly improved, and the heat dissipation assembly 400 can be more firmly fixed in the lampshade 300 .
为了进一步提高安装操作的便捷性,以及使散热组件更牢靠地固定于灯罩内,例如,所述灯罩为方形筒状结构,请参阅图2,所述灯罩相对的两个内侧壁分别开设有两个所述滑槽,所述散热板的两个侧边边缘分别滑动设置于两个所述滑槽,如此,可以进一步提高安装操作的便捷性,以及使散热组件更牢靠地固定于灯罩内。In order to further improve the convenience of installation and operation, and to make the heat dissipation assembly more firmly fixed in the lampshade, for example, the lampshade is a square cylindrical structure, please refer to Figure 2. The two side edges of the heat dissipation plate are respectively slidably arranged in the two slide grooves. In this way, the convenience of installation operation can be further improved, and the heat dissipation assembly can be more firmly fixed in the lampshade.
请参阅图2,散热件500包括抵持板510及两个散热翼板520,两个散热翼板520分别与抵持板510的两端连接。抵持板510与散热筒420抵持,如此,散热筒420吸收的热量可以快速且及时地传递至抵持板510,之后,抵持板510吸收的热量再通过散热翼板520从而扩散至整个散热件500,从而可以有效地提高散热表面积。Please refer to FIG. 2 , the heat sink 500 includes a resisting plate 510 and two cooling fins 520 , and the two cooling fins 520 are respectively connected to two ends of the resisting plate 510 . The abutting plate 510 is in contact with the cooling cylinder 420, so that the heat absorbed by the cooling cylinder 420 can be quickly and timely transferred to the abutting plate 510, and then the heat absorbed by the abutting plate 510 is then diffused to the entire The heat dissipation element 500 can effectively increase the heat dissipation surface area.
请参阅图2,抵持板510远离散热筒420的一侧面与灯罩300抵持,散热翼板520与灯罩300抵持。如此,散热件500可以对散热筒420起到更好地固定支撑作用。Please refer to FIG. 2 , a side of the resisting plate 510 away from the heat sink 420 is resisted against the lampshade 300 , and the heat dissipation fin 520 is resisted against the lampshade 300 . In this way, the heat sink 500 can better fix and support the heat sink 420 .
请参阅图2,LED灯600设置于散热板410的第二侧面412。LED灯600工作时发光产生的热量可以传递至散热板410,之后,再由散热板410传递至散热筒420,最后,再由散热筒420传递至散热件500,在热量传递的过程中,散热板410、散热筒420和散热件500均会向空气介质中散失热量。这样,可以优化散热路径,且可以增加散热表面积。Please refer to FIG. 2 , the LED lamp 600 is disposed on the second side 412 of the heat sink 410 . The heat generated by the light emitted by the LED lamp 600 during operation can be transferred to the heat sink 410, and then transferred to the heat sink 420 by the heat sink 410, and finally, transferred to the heat sink 500 by the heat sink 420. During the process of heat transfer, heat dissipation The plate 410 , the heat sink 420 and the heat sink 500 all dissipate heat into the air medium. In this way, the heat dissipation path can be optimized and the heat dissipation surface area can be increased.
请参阅图2,绝缘筒700容置于散热筒420内,电路组件800容置于绝缘筒700内,这样,可以使电路组件800容置于绝缘筒700内,以避免电路组件800与散热筒420接触,发生漏电的问题,从而提高所述LED灯管的安全性能。Please refer to Fig. 2, the insulating cylinder 700 is accommodated in the heat dissipation cylinder 420, and the circuit assembly 800 is accommodated in the insulation cylinder 700, so that the circuit assembly 800 can be accommodated in the insulation cylinder 700 to avoid the circuit assembly 800 from contacting the heat dissipation cylinder. 420 contacts, the problem of electric leakage occurs, thereby improving the safety performance of the LED lamp tube.
为了进一步提高LED灯管的安全性能,例如,请参阅图3,绝缘筒700的内侧壁设置有若干支撑柱710,电路组件800与支撑柱710的端部抵持;又如,所述支撑柱为圆柱状结构;又如,所述支撑柱与所述电路组件抵持的端部为半球形结构;又如,所述支撑柱的材质为绝缘材料;又如,所述支撑柱的材质为橡胶;又如,设置若干支撑柱;又如,若干所述支撑柱均匀分布于所述散热筒的内侧壁,通过所述支撑柱可以更好地支撑固定所述电路组件,进而可以进一步提高LED灯管的安全性能。In order to further improve the safety performance of the LED lamp tube, for example, please refer to FIG. 3 , the inner wall of the insulating cylinder 700 is provided with a number of support columns 710, and the circuit assembly 800 is opposed to the ends of the support columns 710; as another example, the support columns It is a cylindrical structure; as another example, the end of the support column and the circuit assembly is a hemispherical structure; as another example, the material of the support column is insulating material; as another example, the material of the support column is Rubber; as another example, several support columns are set; as another example, several support columns are evenly distributed on the inner wall of the heat dissipation tube, and the circuit components can be better supported and fixed by the support columns, thereby further improving the LED performance. The safety performance of the lamp tube.
为了进一步使所述LED灯管的整体结构更加牢靠,例如,请参阅图2,散热筒420远离第一侧面411设置有两个凸块421,抵持板510向一侧凸出形成抵持部511,抵持部511与散热筒420抵持且位于两个凸块421之间;又如,抵持部511与凸块421之间设置有间隔;又如,还设置填充块422,填充块422分别与绝缘筒700的外侧壁及散热筒420的内侧壁抵持;又如,设置若干所述填充块;又如,若干所述填充块均匀分布于所述绝缘筒的外侧壁及所述散热筒的内侧壁之间;又如,所述填充块的材质为绝缘材料;又如,所述填充块的材质为橡胶,如此,可以进一步使所述LED灯管的整体结构更加牢靠。In order to further make the overall structure of the LED light tube more reliable, for example, please refer to FIG. 2 , the cooling cylinder 420 is provided with two protrusions 421 away from the first side 411, and the abutment plate 510 protrudes to one side to form an abutment portion. 511, the abutment portion 511 is abutted against the cooling tube 420 and is located between the two bumps 421; as another example, there is a gap between the abutment portion 511 and the bumps 421; as another example, a filling block 422 is also provided, the filling block 422 respectively against the outer side wall of the insulating tube 700 and the inner side wall of the heat dissipation tube 420; as another example, a number of filling blocks are provided; as another example, a number of filling blocks are evenly distributed on the outer side wall of the insulating tube and the inner side wall of the heat dissipation tube 420; Between the inner side walls of the cooling tube; as another example, the material of the filling block is insulating material; as another example, the material of the filling block is rubber, so that the overall structure of the LED light tube can be further made more reliable.
为了提高所述LED灯管的安装操作的简单便捷性,例如,请参阅图2,灯罩300的内侧壁还设置有弹性扣330,以及开设有限位槽340,滑槽310位于弹性扣330及限位槽340之间,散热板410的第一侧面411及第二侧面412上分别设置有卡槽411a及限位条412a,限位条412a滑动设置于限位槽340,弹性扣330的部分嵌置于卡槽411a内,这样,灯罩300的弹性扣330和限位槽340可以分别对散热板410的卡槽411a和限位条412a起到限位导向作用,从而可以提高所述LED灯管的安装操作的简单便捷性。In order to improve the simplicity and convenience of the installation and operation of the LED lamp tube, for example, please refer to FIG. Between the position slots 340, the first side 411 and the second side 412 of the cooling plate 410 are respectively provided with a card slot 411a and a limit bar 412a, the limit bar 412a is slidably arranged in the limit slot 340, and a part of the elastic buckle 330 is embedded. Placed in the card slot 411a, so that the elastic buckle 330 and the limit groove 340 of the lampshade 300 can respectively play a position-limiting and guiding role for the card slot 411a and the limit bar 412a of the heat sink 410, so that the LED lamp tube can be improved. Ease of installation and operation.
为了进一步提高所述LED灯管的安装操作的简单便捷性,例如,所述滑槽为条形结构;又如,所述限位槽为条形结构;又如,所述弹性扣具有半圆形的横截面;又如,所述弹性扣设置有凸起,所述凸起嵌置于所述卡槽;又如,设置若干所述凸起;又如,若干所述凸起间隔分布于所述弹性扣,如此,可以进一步提高所述LED灯管的安装操作的简单便捷性。In order to further improve the simplicity and convenience of the installation and operation of the LED lamp tube, for example, the chute is a bar-shaped structure; as another example, the limiting groove is a bar-shaped structure; as another example, the elastic buckle has a semicircular shape Shaped cross section; as another example, the elastic buckle is provided with a protrusion, and the protrusion is embedded in the card slot; as another example, several protrusions are provided; as another example, several protrusions are distributed at intervals The elastic buckle, in this way, can further improve the simplicity and convenience of the installation operation of the LED light tube.
为了进一步提高所述LED灯管的散热性能,例如,请参阅图4,散热翼板520与灯罩300的内侧壁抵持,散热翼板520还设置有散热片521,散热片521穿过灯罩300并部分露置于灯罩300外;又如,所述散热片为具有矩形平面的薄片状结构;又如,所述散热片为具有矩形弧面的薄片状结构;又如,设置若干所述散热片;又如,若干所述散热片间隔分布于所述散热翼板;又如,若干所述散热片均匀分布于所述散热翼板,如此,所述散热翼板通过设置所述散热片,可以有效地增加散热表面积,且通过所述散热片伸出所述灯罩外,有利于将所述灯罩内的热量传递至外部的空气介质中,从而可以进一步提高所述LED灯管的散热性能。In order to further improve the heat dissipation performance of the LED lamp tube, for example, please refer to FIG. and partially exposed outside the lampshade 300; as another example, the heat sink is a sheet-like structure with a rectangular plane; as another example, the heat sink is a sheet-like structure with a rectangular arc surface; as another example, several heat sinks are provided fins; as another example, several of the heat dissipation fins are distributed on the heat dissipation fins at intervals; as another example, a number of the heat dissipation fins are evenly distributed on the heat dissipation fins, so that the heat dissipation fins are provided with the heat dissipation fins, The heat dissipation surface area can be effectively increased, and the heat dissipation fins extend out of the lampshade, which is beneficial to transfer the heat in the lampshade to the external air medium, thereby further improving the heat dissipation performance of the LED lamp tube.
为了进一步提高所述LED灯管的散热性能,例如,请参阅图6,灯罩300开设有若干散热孔350,散热翼板520与灯罩300的内侧壁抵持,并且散热翼板520通过散热孔350与外界连通,请一并参阅图5,散热翼板520设置有与散热筒420连接的若干散热柱522;又如,所述散热柱为空心结构;又如,所述散热柱为圆形柱状结构;又如,所述散热孔为圆形孔;又如,所述圆形孔的直径为5mm~10mm;又如,所述圆形孔的直径为8mm~9mm;又如,所述圆形孔的直径为8.5mm,如此,可以进一步提高所述LED灯管的散热性能。In order to further improve the heat dissipation performance of the LED lamp tube, for example, please refer to FIG. It communicates with the outside world, please refer to Fig. 5 together, the heat dissipation fin 520 is provided with a number of heat dissipation columns 522 connected with the heat dissipation tube 420; as another example, the heat dissipation column is a hollow structure; as another example, the heat dissipation column is circular columnar structure; as another example, the heat dissipation hole is a circular hole; as another example, the diameter of the circular hole is 5 mm to 10 mm; as another example, the diameter of the circular hole is 8 mm to 9 mm; as another example, the circular hole The diameter of the shaped hole is 8.5 mm, so that the heat dissipation performance of the LED lamp tube can be further improved.
上述LED灯管10通过设置相互抵持的散热组件400和散热件500,并将LED灯600安装于散热组件400,散热组件400和散热件500协同散热,可以极大地提高LED灯管10散热性能。The above-mentioned LED lamp tube 10 can greatly improve the heat dissipation performance of the LED lamp tube 10 by setting the heat dissipation assembly 400 and the heat dissipation member 500 against each other, and installing the LED lamp 600 on the heat dissipation assembly 400, and the heat dissipation assembly 400 and the heat dissipation member 500 cooperate to dissipate heat. .
为了进一步提高所述LED灯管的散热性能,例如,所述散热组件及所述散热件均采用散热合金制备得到,所述散热合金包括依次叠加设置的吸热层、导热层和散热层;又如,所述吸热层、所述导热层和所述散热层的材质相同或者相异设置;又如,所述LED灯设置于所述吸热层;又如,所述吸热层、所述导热层和所述散热层的热传导性能依次递减,形成了热传导性能梯度,从而进一步优化了所述散热合金的散热路径,极大地提高了散热组件及所述散热件的散热性能,进而提高了所述LED灯管的散热性能,如此,能够满足发热量大的所述LED灯管的散热需求。In order to further improve the heat dissipation performance of the LED lamp tube, for example, the heat dissipation assembly and the heat dissipation element are prepared by using a heat dissipation alloy, and the heat dissipation alloy includes a heat absorption layer, a heat conduction layer and a heat dissipation layer arranged in sequence; For example, the materials of the heat absorption layer, the heat conduction layer and the heat dissipation layer are the same or different; as another example, the LED lamp is arranged on the heat absorption layer; as another example, the heat absorption layer, the heat dissipation layer The heat conduction performance of the heat conduction layer and the heat dissipation layer decreases successively, forming a gradient of heat conduction performance, thereby further optimizing the heat dissipation path of the heat dissipation alloy, greatly improving the heat dissipation performance of the heat dissipation assembly and the heat dissipation element, and further improving the The heat dissipation performance of the LED lamp tube, in this way, can meet the heat dissipation requirement of the LED lamp tube with a large calorific value.
例如,本发明一实施方式的LED灯管,其中,所述散热合金的所述吸热层,其包括如下质量份的各组分:For example, in the LED lamp tube according to one embodiment of the present invention, the heat absorbing layer of the heat dissipation alloy includes the following components in parts by mass:
铜90份~92份、铝2份~4.5份、镁1份~2.5份、镍0.5份~0.8份、铁0.1份~0.3份、钒1.5份~4.5份、锰0.1份~0.4份、钛0.5份~0.8份、铬0.5份~0.8份、钒0.5份~0.8份、硅0.8份~15份和0.5份~2份石墨烯。90-92 parts of copper, 2-4.5 parts of aluminum, 1-2.5 parts of magnesium, 0.5-0.8 parts of nickel, 0.1-0.3 parts of iron, 1.5-4.5 parts of vanadium, 0.1-0.4 parts of manganese, titanium 0.5-0.8 parts, 0.5-0.8 parts of chromium, 0.5-0.8 parts of vanadium, 0.8-15 parts of silicon and 0.5-2 parts of graphene.
首先,上述吸热层含有90份~92份的铜(Cu)可以使吸热层的具有较好的吸热能。当铜的质量份为90份~92份时,吸热层的热传导系数可以达到365W/mK以上,可以快速地将LED灯产生的热量吸走,进而使热量均匀地分散在吸热层整体的结构上,以防止热量在LED灯与吸热层之间的接触位置上积累,造成局部过热现象的产生。而且,吸热层的密度小于纯铜的密度,这样可以有效地减轻吸热层的重量,更利于安装制造,同时也极大地降低了成本。其中,热传导系数的定义为:每单位长度、每K,可以传送多少W的能量,单位为W/mK,其中“W”指热功率单位,“m”代表长度单位米,而“K”为绝对温度单位,该数值越大说明吸热性能越好。此外,通过添加0.5份~2份的石墨烯,可以有效地提高其热传导系数,进而提高所述吸热层的吸热性能。Firstly, the above-mentioned heat absorbing layer contains 90-92 parts of copper (Cu), which can make the heat absorbing layer have better heat absorbing energy. When the mass part of copper is 90-92 parts, the thermal conductivity of the heat-absorbing layer can reach more than 365W/mK, which can quickly absorb the heat generated by the LED lamp, and then evenly disperse the heat in the whole heat-absorbing layer. Structurally, to prevent heat from accumulating at the contact position between the LED lamp and the heat absorbing layer, resulting in local overheating. Moreover, the density of the heat absorbing layer is lower than that of pure copper, which can effectively reduce the weight of the heat absorbing layer, which is more convenient for installation and manufacturing, and also greatly reduces the cost. Among them, the definition of thermal conductivity is: per unit length, per K, how many W of energy can be transmitted, the unit is W/mK, where "W" refers to the thermal power unit, "m" represents the length unit meter, and "K" is The absolute temperature unit, the larger the value, the better the heat absorption performance. In addition, by adding 0.5-2 parts of graphene, the thermal conductivity can be effectively improved, thereby improving the heat-absorbing performance of the heat-absorbing layer.
其次,吸热层含有质量份为2份~4.5份的铝、镁1份~2.5份、0.5份~0.8份的镍、0.1份~0.3份的铁、1.5份~4.5份的钒、0.1份~0.4份的锰、0.5份~0.8份的钛、0.5份~0.8份的铬以及的钒0.5份~0.8份的钒。相对于纯铜材质,吸热层的延展性能、韧性、强度以及耐高温性能均大大得到改善,且不易烧结;这样,在将LED灯安装到吸热层上时,就可以防止LED灯产生的高温对吸热层造成损坏,并且,具有较好的延展性能、韧性以及强度也可以防止吸热层在安装所述LED灯时受到过大应力而导致变形。其中,吸热层含有质量份为0.5份~0.8份的镍(Ni),可以提高吸热层的耐高温性能。又如,吸热层含有质量份为1.5份~4.5份的钒(V)可以抑制吸热层晶粒长大,获得较均匀细小的晶粒组织,以减小吸热层的脆性,改善吸热层整体的力学性能,以提高韧性和强度。又如,吸热层含有质量份为0.5份~0.8份的钛(Ti),可以使得吸热层的晶粒微细化,以提高吸热层的延展性能。Secondly, the heat absorbing layer contains 2-4.5 parts by mass of aluminum, 1-2.5 parts of magnesium, 0.5-0.8 parts of nickel, 0.1-0.3 parts of iron, 1.5-4.5 parts of vanadium, 0.1 parts -0.4 parts manganese, 0.5-0.8 parts titanium, 0.5-0.8 parts chromium, and 0.5-0.8 parts vanadium. Compared with the pure copper material, the ductility, toughness, strength and high temperature resistance of the heat absorbing layer are greatly improved, and it is not easy to sinter; in this way, when the LED lamp is installed on the heat absorbing layer, it can prevent the LED lamp from burning. High temperature will cause damage to the heat absorbing layer, and having good ductility, toughness and strength can also prevent the heat absorbing layer from being deformed due to excessive stress when the LED lamp is installed. Wherein, the heat absorbing layer contains 0.5-0.8 parts by mass of nickel (Ni), which can improve the high temperature resistance of the heat absorbing layer. As another example, the heat absorbing layer contains 1.5 to 4.5 parts by mass of vanadium (V), which can inhibit the grain growth of the heat absorbing layer and obtain a more uniform and fine grain structure, so as to reduce the brittleness of the heat absorbing layer and improve the heat absorbing layer. Mechanical properties of the thermal layer as a whole to improve toughness and strength. In another example, the heat absorbing layer contains 0.5-0.8 parts by mass of titanium (Ti), which can make the crystal grains of the heat absorbing layer finer, so as to improve the ductility of the heat absorbing layer.
最后,吸热层还包括质量份为0.8份~15份的硅(Si),当吸热层含有适量的硅时,可以在不影响吸热层吸热性能的前提下,有效提升吸热层的硬度与耐磨度。但是,经多次理论分析和实验佐证发现,当吸热层中硅的质量太多,例如质量百分比超过15份以上时,会使吸热层的外表分布黑色粒子,且延展性能降低,不利于吸热层的生产成型。Finally, the heat absorbing layer also includes 0.8-15 parts by mass of silicon (Si). When the heat absorbing layer contains an appropriate amount of silicon, the heat absorbing layer can be effectively improved without affecting the heat absorbing performance of the heat absorbing layer. hardness and wear resistance. However, after many times of theoretical analysis and experimental evidence, it is found that when the mass of silicon in the heat-absorbing layer is too much, for example, when the mass percentage exceeds 15 parts, black particles will be distributed on the surface of the heat-absorbing layer, and the ductility will be reduced, which is not conducive to Production molding of the heat absorbing layer.
例如,本发明一实施方式的LED灯管,其中,所述散热合金的所述导热层,其包括如下质量份的各组分:For example, in the LED lamp tube according to one embodiment of the present invention, the heat conduction layer of the heat dissipation alloy includes the following components in parts by mass:
铜60份~65份、铝55份~60份、镁0.8份~1.2份、锰0.2份~0.5份、钛0.05份~0.3份、铬0.05份~0.1份、钒0.05份~0.3份、硅0.3份~0.5份和0.1份~0.3份石墨烯。60-65 parts of copper, 55-60 parts of aluminum, 0.8-1.2 parts of magnesium, 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, 0.05-0.1 parts of chromium, 0.05-0.3 parts of vanadium, silicon 0.3-0.5 parts and 0.1-0.3 parts of graphene.
首先,上述导热层含有质量份为60份~65份的铜以及55份~60份的铝,可以使得导热层的热传导系数保持在320W/mK~345W/mK,以保证导热层可以将由吸热层吸收的所述LED灯产生的热量快速地传递给散热层,进而防止热量在导热层上堆积,造成局部过热现象产生。相对于现有技术,单纯地采用价格较昂贵且质量较大的铜,上述导热层既可以保证快速将吸热层的热量传递给散热层,又具有质量较轻、便于安装铸造、价格较低廉的优点。同时,相对于现有技术,单纯地采用散热效果较差的铝合金,上述导热层具有更佳的传热性能。First of all, the above-mentioned heat conducting layer contains 60-65 parts by mass of copper and 55-60 parts of aluminum, which can keep the thermal conductivity of the heat-conducting layer at 320W/mK-345W/mK, so as to ensure that the heat-conducting layer can absorb heat The heat generated by the LED lamp absorbed by the layer is quickly transferred to the heat dissipation layer, thereby preventing heat from accumulating on the heat conduction layer and causing local overheating. Compared with the prior art, simply using expensive and high-quality copper, the above-mentioned heat-conducting layer can not only ensure the rapid transfer of heat from the heat-absorbing layer to the heat-dissipating layer, but also has the advantages of light weight, easy installation and casting, and relatively low price. The advantages. At the same time, compared with the prior art, simply using aluminum alloy with poor heat dissipation effect, the above-mentioned heat conduction layer has better heat transfer performance.
其次,通过加入0.1份~0.3份的石墨烯,可以极大地提高所述导热层的导热性能,更好地将从吸热层传递过来的热量传递给散热层。Secondly, by adding 0.1-0.3 parts of graphene, the thermal conductivity of the heat-conducting layer can be greatly improved, and the heat transferred from the heat-absorbing layer can be better transferred to the heat-dissipating layer.
最后,导热层含有质量份为0.8份~1.2份的镁、0.2份~0.5份的锰、0.05份~0.3份的钛、0.05份~0.1份的铬、0.05份~0.3份的钒和0.3份~0.5份的硅,从而改善了导热层的机械性能和耐高温性能,如,机械性能包括但不局限于屈服强度、抗拉强度。例如,导热层含有质量份为0.8份~1.2份的镁,可以在一定程度上赋予导热层屈服强度和抗拉强度,由于散热合金在制造过程中,需要将吸热层、导热层以及散热层整体冲压一体成型,这就需要散热层具有较强的屈服强度,以防止散热层在加工过程中受到过大冲压应力产生不可逆形变,进而确保散热合金的正常散热性能。当镁的相对质量过低时,如,质量份小于0.8份时,不能充分确保导热层的屈服强度满足要求,然而,当镁的相对质量过高时,例如质量份大于1.2份时,又会使得导热层的延展性能和导热性能急速下降。例如,导热层含有质量份为0.2份~0.8份的铁,可以赋予导热层较高的耐高温性能和耐高温机械性能,利于导热层的加工铸造。Finally, the heat conducting layer contains 0.8-1.2 parts by mass of magnesium, 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, 0.05-0.1 parts of chromium, 0.05-0.3 parts of vanadium and 0.3 parts ~0.5 parts of silicon, thereby improving the mechanical properties and high temperature resistance properties of the heat conducting layer, for example, the mechanical properties include but not limited to yield strength and tensile strength. For example, the heat-conducting layer contains 0.8-1.2 parts by mass of magnesium, which can impart yield strength and tensile strength to the heat-conducting layer to a certain extent, because the heat-absorbing layer, heat-conducting layer and heat-dissipating layer need to be combined in the manufacturing process of the heat-dissipating alloy. The overall stamping is integrally formed, which requires the heat dissipation layer to have a strong yield strength to prevent the heat dissipation layer from being irreversibly deformed by excessive stamping stress during processing, thereby ensuring the normal heat dissipation performance of the heat dissipation alloy. When the relative mass of magnesium is too low, such as when the mass part is less than 0.8 parts, the yield strength of the heat conducting layer cannot be fully guaranteed to meet the requirements; however, when the relative mass of magnesium is too high, such as when the mass part is greater than 1.2 parts, it will be The ductility and thermal conductivity of the heat-conducting layer drop rapidly. For example, the heat-conducting layer contains 0.2-0.8 parts by mass of iron, which can endow the heat-conducting layer with higher high-temperature resistance and high-temperature-resistant mechanical properties, which is beneficial to the processing and casting of the heat-conducting layer.
例如,本发明一实施方式的LED灯管,其中,所述散热合金的所述散热层,其包括如下质量份的各组分:For example, in the LED lamp tube according to one embodiment of the present invention, the heat dissipation layer of the heat dissipation alloy includes the following components in parts by mass:
铝88份~93份、硅5.5份~10.5份、镁0.3份~0.7份、铜0.05份~0.3份、铁0.2份~0.8份、锰0.2份~0.5份、钛0.05份~0.3份、铬0.05份~0.1份、钒0.05份~0.3份和5份~15份石墨烯。88-93 parts of aluminum, 5.5-10.5 parts of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper, 0.2-0.8 parts of iron, 0.2-0.5 parts of manganese, 0.05-0.3 parts of titanium, chromium 0.05 to 0.1 parts, 0.05 to 0.3 parts of vanadium and 5 to 15 parts of graphene.
首先,上述散热层含有质量份为88份~93份的铝,可以使得散热层的热传导系数保持在200W/mK~220W/mK,当LED灯产生的热量经过吸热层以及导热层部分散热后,剩余的热量再通过导热层传递给散热层时,散热层可以确保将这些剩余的热量被均匀持续地散走,进而防止热量在散热层上堆积,造成局部过热现象。First of all, the heat dissipation layer contains 88-93 parts by mass of aluminum, which can keep the thermal conductivity of the heat dissipation layer at 200W/mK-220W/mK. When the heat generated by the LED lamp passes through the heat absorption layer and the heat conduction layer after partial heat dissipation When the remaining heat is transferred to the heat dissipation layer through the heat conduction layer, the heat dissipation layer can ensure that the remaining heat is dissipated evenly and continuously, thereby preventing heat from accumulating on the heat dissipation layer and causing local overheating.
其次,通过加入5份~15份的石墨烯,可以有效地提高所述散热层的散热性能,进而可以将从所述导热层传递而来的热量快速地散失到外界的空气介质中。Secondly, by adding 5-15 parts of graphene, the heat dissipation performance of the heat dissipation layer can be effectively improved, and the heat transferred from the heat conduction layer can be quickly dissipated into the external air medium.
最后,散热层含有质量份为5.5份~10.5份的硅、0.3份~0.7份的镁、0.05份~0.3份的铜、0.2份~0.8份的铁、0.2份~0.5份的锰、0.05份~0.3份的钛、0.05份~0.1份的铬以及0.05份~0.3份的钒,可以极大地改善散热层的散热性能。例如,散热层含有质量份为5.5份~10.5份的硅和0.05份~0.3份的铜,可以确保散热层具有良好机械性能和质量较轻的优点,同时,还可以进一步改善散热层的热传导性能,进一步确保散热层可以将经由吸热层以及导热层传递后的剩余热量均匀持续地散走,进而防止热量在散热层上堆积,造成局部过热现象。Finally, the heat dissipation layer contains 5.5-10.5 parts by mass of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper, 0.2-0.8 parts of iron, 0.2-0.5 parts of manganese, 0.05 parts of ~0.3 parts of titanium, 0.05~0.1 parts of chromium and 0.05~0.3 parts of vanadium can greatly improve the heat dissipation performance of the heat dissipation layer. For example, the heat dissipation layer contains 5.5-10.5 parts by mass of silicon and 0.05-0.3 parts of copper, which can ensure that the heat dissipation layer has the advantages of good mechanical properties and light weight, and at the same time, can further improve the thermal conductivity of the heat dissipation layer , to further ensure that the heat dissipation layer can evenly and continuously dissipate the remaining heat transferred through the heat absorption layer and the heat conduction layer, thereby preventing heat from accumulating on the heat dissipation layer and causing local overheating.
为了进一步提高所述散热层的抗拉强度,例如,所述散热层还包括质量份为0.8份~1.2份的铅(Pb),当散热层含有0.8份~1.2份的铅可以改善散热层的抗拉强度,这样,可以防止当将散热层被铸造冲压成散热鳍片,即片状结构时,由于受到过大的冲压拉扯应力而断裂。In order to further improve the tensile strength of the heat dissipation layer, for example, the heat dissipation layer further includes 0.8 to 1.2 parts by mass of lead (Pb). When the heat dissipation layer contains 0.8 to 1.2 parts of lead, the heat dissipation layer can be improved. Tensile strength, in this way, can prevent the heat dissipation layer from breaking due to excessive stamping and pulling stress when it is cast and stamped into heat dissipation fins, that is, a sheet structure.
为了进一步提高所述散热层的抗高温氧化性能,例如,所述散热层还包括质量份为0.05份~0.08份的铌(Nb),当铌的质量份大于0.05份时,可以极大地提高散热层的抗氧化性能,可以理解,散热层作为LED路灯散热器中与外界空气接触面积最大的部件,其对抗高温氧化性能要求较高。然而,当铌的质量份大于0.08份时,会导致散热层的磁性急剧增加,会对LED灯管中的其他部件产生影响。In order to further improve the high-temperature oxidation resistance of the heat dissipation layer, for example, the heat dissipation layer further includes niobium (Nb) with a mass fraction of 0.05-0.08. When the mass fraction of niobium is greater than 0.05, the heat dissipation can be greatly improved The anti-oxidation performance of the layer, it can be understood that the heat dissipation layer, as the part with the largest contact area with the outside air in the LED street light radiator, has high requirements for high-temperature oxidation resistance. However, when the mass fraction of niobium is greater than 0.08, the magnetic properties of the heat dissipation layer will increase sharply, which will affect other components in the LED lamp tube.
为了进一步提高所述散热层的散热性能,例如,散热层还包括质量份为0.05份~0.2份的锗(Ge),当锗的质量份大于0.05份时,会对散热层的散热性能的提高起到较好的效果,然而,当锗的质量占比过多,例如锗的质量份大于0.2份时,又会使散热层的脆度增加。In order to further improve the heat dissipation performance of the heat dissipation layer, for example, the heat dissipation layer also includes germanium (Ge) with a mass part of 0.05 to 0.2 parts. When the mass part of germanium is greater than 0.05 parts, the heat dissipation performance of the heat dissipation layer will be improved. However, when the mass proportion of germanium is too much, for example, when the mass fraction of germanium is greater than 0.2, the brittleness of the heat dissipation layer will increase.
上述散热合金通过依次叠加设置所述吸热层、所述导热层和所述散热层,且所述吸热层、所述导热层和所述散热层的热传导性能依次递减,形成了热传导性能梯度,相较于纯铜材质来说,在确保散热性能的前提下,重量大为降低;相较于市场上大量存在的铝合金来说,散热性能大为增强。The above-mentioned heat-dissipating alloy is sequentially stacked with the heat-absorbing layer, the heat-conducting layer, and the heat-dissipating layer, and the heat-conducting properties of the heat-absorbing layer, the heat-conducting layer, and the heat-dissipating layer decrease successively, forming a gradient of heat conduction performance , Compared with pure copper material, under the premise of ensuring the heat dissipation performance, the weight is greatly reduced; compared with the aluminum alloy that exists in large quantities in the market, the heat dissipation performance is greatly enhanced.
需要说明的是,本发明的其他实施例还包括,上述各实施例中的技术特征相互结合所形成的,能够实施的LED灯管。It should be noted that other embodiments of the present invention also include LED lamp tubes formed by combining the technical features of the above-mentioned embodiments.
以上所述实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。The technical features of the above-mentioned embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.
以上所述实施方式仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.
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