CN104691042B - heat dissipation material - Google Patents

Abstract

A heat dissipating material comprising: and the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer are sequentially overlapped and attached. The fifth film layer comprises the following components in parts by mass: 20 to 40 parts of graphite, 20 to 30 parts of carbon fiber, 40 to 60 parts of polyamide, 10 to 20 parts of water-soluble silicate, 1 to 8 parts of hexagonal boron nitride, 2 to 5 parts of bismaleimide, 0.5 to 2 parts of silane coupling agent and 0.25 to 1 part of antioxidant. Above-mentioned heat radiation material sets up first rete, second rete, third rete, fourth rete and fifth rete through superposing in proper order, can obtain insulating nature good, the coefficient of expansion is low, coefficient of heat conductivity is big, the radiating effect is good and the advantage of matter light.

Description

heat dissipation material

technical field

The invention relates to the technical field of heat dissipation, in particular to a heat dissipation material.

Background technique

The rapid development of the LED industry has greatly stimulated the development of the upstream material industry and further promoted breakthroughs in the field of high-end materials. Among them, a large number of heat dissipation materials are used in LED lamps, including LED chip packaging components, LED optical lenses, light scattering components, high-efficiency heat dissipation components, light reflection and light diffusion plates, etc.

For a long time, poor heat dissipation will lead to problems such as power supply damage, accelerated light decay, and shortened lifespan. It has always been the top priority for improving the performance of LED lighting systems. The traditional three materials used for LED heat sinks include aluminum, plastic and ceramics. Each of the three has its own advantages and disadvantages, but they still cannot meet the requirements of good insulation, low expansion coefficient, and high thermal conductivity required by LED heat sink materials at the same time. , good cooling effect, light weight and good mechanical properties.

For example, Chinese patent 201310313412.6 discloses a magnesium alloy LED bulb radiator die-casting and its manufacturing method. It specifically discloses that the present invention provides a magnesium alloy LED bulb radiator die-casting. The composition of the die-casting is: Al1.7 ~2.5, Zn≤0.2, Mn≥0.2, Cu≤0.008, Fe≤0.004, Ni≤0.001, Si≤0.05 The sum of other impurities is 0.01, and the balance of Mg. At the same time, the invention provides a method for manufacturing a die-casting part of a magnesium alloy LED light bulb radiator. The effect of the present invention is that by using the magnesium alloy of this composition to manufacture the LED light bulb radiator, the LED lighting bulb has good heat dissipation performance, the weight is significantly reduced, the process is simple, and the dimensional accuracy is high. The results of the heat dissipation test show that the same test Under certain conditions, compared with the AZ31 magnesium alloy, the junction temperature of the magnesium alloy drops by 1-2°C, which is equivalent to extending the life of the LED by 4-16%, and slowing down the luminous flux attenuation by 1%-2%. The manufacturing cost of the LED lighting device and the user's use cost are reduced. However, the materials disclosed in the above-mentioned patents still have the defects of poor insulation, difficulty in passing safety regulations, and heavy quality.

As another example, Chinese patent 201110043870.3 discloses a heat-conducting thermosetting molding composite material and its use. Specifically, the present invention discloses a heat-conducting thermosetting molding compound material and its use. Its basic components and their weight percentages (1) Thermosetting matrix resin 15-65%; (2) Thermally conductive filler 20-80%, the thermal conductivity of the filler is greater than 1W/m.℃; (3) Other additives, such as tougheners, reinforcing agents, stabilizers agent etc. The invention also discloses that the above-mentioned heat-conducting thermosetting molding composite material is used to prepare LED lighting radiators, and its molding temperature can be controlled to be lower than 220°C, which is usually used for soldering, so that the assembly process of LED lamps and radiators can be compared with thermosetting materials. The molding process of the radiator is combined into one, and the substrate surface of the LED lamp or the heat-conducting metal bracket can be directly connected with the heat-conducting material. The molding mold and its auxiliary system have the characteristics of effective heat insulation, temperature control and easy cleaning, and can effectively The processing and manufacturing costs of the LED lamp are reduced, and the heat dissipation capacity of the LED radiator is improved, thereby reducing the operating temperature of the LED device. However, the materials disclosed in the above-mentioned patents still have the defects of low thermal conductivity and high expansion coefficient.

As another example, Chinese patent 03126663.0 discloses an improved 6063 aluminum alloy material. Specifically, the present invention discloses an improved 6063 aluminum alloy material. ~0.2% mixed rare earth elements La and Ce, wherein the addition amount of rare earth element La is 0.036~0.14%. The results of the application of rare earth elements in aluminum alloys show that adding an appropriate amount of rare earth elements in aluminum alloys can improve mechanical, physical and process properties, manifested as purification, strengthening and refinement, and the materials of the present invention can be used in semiconductors, air conditioners and condensing evaporator devices The heat sink made has good extrudability and electrical and thermal conductivity. However, the materials disclosed in the above patents still have the defects of poor insulation, not easy to pass safety regulations, unsatisfactory heat dissipation performance and heavy quality.

Contents of the invention

Based on this, it is necessary to provide a heat dissipation material with good insulation, low expansion coefficient, high thermal conductivity, good heat dissipation effect and light weight.

A heat dissipation material, comprising: a first film layer, a second film layer, a third film layer, a fourth film layer and a fifth film layer which are sequentially stacked and attached,

The first film layer includes the following components in parts by mass: 40 to 70 parts of silicon carbide, 13 to 55 parts of aluminum oxide, 2 to 15 parts of silicon dioxide, and 3 to 25 parts of binder , 2-20 parts of kaolin, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Xinyang clay, 0.5-2 parts of light calcium and 0.2-0.5 parts of rare earth oxides;

The second film layer includes the following components in parts by mass: 80 to 95 parts of graphene, 0.1 to 20 parts of carbon nanotubes and 0.1 to 20 parts of carbon nanofibers;

The third film layer includes the following components by mass: 93-97 parts of copper, 2-4.5 parts of aluminum, 0.1-0.3 parts of nickel, 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, 0.1-0.3 parts of titanium, 0.1-0.3 parts of chromium and 0.1-0.3 parts of niobium;

The fourth film layer includes the following components in parts by mass: 47-50 parts of copper, 49-52 parts of aluminum;

The fifth film layer includes the following components by mass: 20-40 parts of graphite, 20-30 parts of carbon fiber, 40-60 parts of polyamide, 10-20 parts of water-soluble silicate, hexagonal nitrogen 1-8 parts of boron chloride, 2-5 parts of bismaleimide, 0.5-2 parts of silane coupling agent, 0.25-1 part of antioxidant.

In one embodiment, the second film layer includes the following components in parts by mass: 85-90 parts of graphene, 5-15 parts of carbon nanotubes and 5-15 parts of carbon nanofibers.

In one of the embodiments, there are 90 parts of graphene, 10 parts of carbon nanotubes and 10 parts of carbon nanofibers.

In one embodiment, the first film layer includes the following components in parts by mass: 50-60 parts of silicon carbide, 30-50 parts of aluminum oxide, 10-15 parts of silicon dioxide, viscose 10-20 parts of binder, 15-20 parts of kaolin, 1-1.5 parts of magnesium oxide, 1-1.5 parts of Xinyang soil, 1-1.5 parts of light calcium and 0.3-0.4 parts of rare earth oxide.

In one embodiment, the first film layer includes the following components in parts by mass: 55 parts of silicon carbide, 40 parts of aluminum oxide, 13 parts of silicon dioxide, 15 parts of binder, 18 parts of kaolin, 1.5 parts of magnesium oxide, 1.5 parts of Xinyang soil, 1.5 parts of light calcium and 0.3 parts of rare earth oxide.

In one embodiment, the third film layer includes the following components in parts by mass: 94-96 parts of copper, 3-4 parts of aluminum, 0.2-0.3 parts of nickel, 0.5-1 part of vanadium, 0.2-0.3 parts of manganese, 0.2-0.3 parts of titanium, 0.2-0.3 parts of chromium, and 0.2-0.3 parts of niobium.

In one embodiment, the third film layer includes the following components by mass: 95 parts copper, 3.5 parts aluminum, 0.3 parts nickel, 0.8 parts vanadium, 0.2-0.3 parts manganese, 0.2-0.3 parts titanium 0.2 to 0.3 parts of chromium and 0.2 to 0.3 parts of niobium.

In one embodiment, the fifth film layer includes the following components by mass: 30-35 parts of graphite, 25-30 parts of carbon fiber, 45-50 parts of polyamide, 15 parts of water-soluble silicate 1-20 parts, 4-6 parts of hexagonal boron nitride, 3-4 parts of bismaleimide, 1-1.5 parts of silane coupling agent, 0.5-1 part of antioxidant.

In one of the embodiments, the fifth film layer includes the following components by mass: 35 parts of graphite, 28 parts of carbon fiber, 45 parts of polyamide, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, 3.5 parts of bismaleimide, 1.8 parts of silane coupling agent, and 0.7 parts of antioxidant.

In one embodiment, the thickness ratio of the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer is 1-1.5:8 ～12: 5～7: 6～10: 2～2.5.

The above-mentioned heat dissipation material can obtain good insulation, low expansion coefficient, large thermal conductivity, good heat dissipation effect and The advantage of light weight.

Description of drawings

1 is a schematic structural view of a heat dissipation material according to an embodiment of the present invention;

2 is a schematic diagram of a partial structure of a heat dissipation material according to another embodiment of the present invention;

3 is a schematic diagram of a partial structure of a heat dissipation material according to another embodiment of the present invention;

4 is a schematic structural view of a heat dissipation material according to another embodiment of the present invention;

Fig. 5 is a schematic structural diagram of an LED lamp according to an embodiment of the present invention.

detailed description

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

For example, the heat dissipation material in one embodiment of the present invention includes: a first film layer, a second film layer, a third film layer, a fourth film layer, and a fifth film layer that are sequentially stacked and attached, and the first film layer includes The following components by mass: 40-70 parts of silicon carbide, 13-55 parts of aluminum oxide, 2-15 parts of silicon dioxide, 3-25 parts of binder, 2-20 parts of kaolin , 0.5 to 2 parts of magnesium oxide, 0.5 to 2 parts of Xinyang soil, 0.5 to 2 parts of light calcium and 0.2 to 0.5 parts of rare earth oxide; the second film layer includes the following components in parts by mass: 80-95 parts of graphene, 0.1-20 parts of carbon nanotubes and 0.1-20 parts of carbon nanofibers; the third film layer includes the following components by mass: 93-97 parts of copper, 2 parts of aluminum ～4.5 parts, 0.1～0.3 parts of nickel, 0.2～1.2 parts of vanadium, 0.1～0.4 parts of manganese, 0.1～0.3 parts of titanium, 0.1～0.3 parts of chromium and 0.1～0.3 parts of niobium; the fifth The film layer includes the following components by mass: 20-40 parts of graphite, 20-30 parts of carbon fiber, 40-60 parts of polyamide, 10-20 parts of water-soluble silicate, and 1 part of hexagonal boron nitride ~8 parts, bismaleimide 2~5 parts, silane coupling agent 0.5~2 parts, antioxidant 0.25~1 part.

Please refer to FIG. 1 , which is a schematic structural diagram of a heat dissipation material 10 according to an embodiment of the present invention.

The heat dissipation material 10 includes: a first film layer 100 , a second film layer 200 , a third film layer 300 , a fourth film layer 400 and a fifth film layer 500 stacked in sequence, that is, the first film layer 100 , the second film layer 200, the third film layer 300, the fourth film layer 400 and the fifth film layer 500 are stacked and attached in sequence, that is to say, the second film layer 200 is attached to the first film layer 100, and the third film layer 300 is attached On the second film layer 200 , the fourth film layer 400 is pasted on the third film layer 300 , and the fifth film layer 500 is pasted on the fourth film layer 400 .

It should be noted that the first film layer is directly in contact with the heat source, for example, the first film layer is in contact with the LED light, that is, the LED light is directly installed on the first film layer, and for example, the first film layer is in contact with the LED lamp. A film layer is in contact with the substrate on which the LED lamp is installed. For another example, the LED lamp is located in the cavity surrounded by the first film layer to ensure that the heat generated by the LED lamp can be directly transferred to the first film layer. Of course, The position and structural relationship between the LED lamp and the first film layer are not limited to the above-mentioned situation, and the position and structural relationship between the first film layer and the LED lamp in the embodiment of the present invention can also adopt the same structure known to those skilled in the art. Other implementation manners of the effects are not repeated here.

For example, the present invention provides a heat dissipation material, wherein the first film layer has the advantages of good insulation effect, high thermal conductivity and low thermal expansion coefficient, so that when the heat of the LED lamp is directly transferred to the first film layer, the The above-mentioned first film layer can quickly and timely conduct away the heat accumulated in the vicinity of the LED lamp, so as to ensure the normal operation of the LED lamp. Secondly, because the distance between the first film layer and the LED lamp is the shortest, it bears the largest heat conduction load. When the thermal expansion coefficient of the first film layer is low, it can avoid Gaps are formed between the second film layers, and gaps are avoided in the first film layer itself, thereby avoiding the problem of lower thermal conductivity caused by the gaps and gaps being filled with air. Finally, since the distance between the first film layer and the LED lamp is the shortest, the problem of direct contact between electrical components and the first film layer is likely to occur. When the insulation effect of the first film layer is good, it can be avoided. The first film layer is energized, thereby improving the safety performance of the heat dissipation material, and the safety standard is relatively high.

For example, the first film layer according to an embodiment of the present invention includes the following components by mass: 40-70 parts of silicon carbide, 13-55 parts of aluminum oxide, 2-15 parts of silicon dioxide, 3-25 parts of binder, 2-20 parts of kaolin, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Xinyang clay, 0.5-2 parts of light calcium and 0.2-0.5 parts of rare earth oxide.

The above-mentioned first film layer uses silicon carbide as the main raw material, and mixes the rest of the raw materials that can be used to prepare ceramics, so that the above-mentioned first film layer has high thermal conductivity, good insulation performance, low thermal expansion coefficient and high heat resistance. In addition, the above-mentioned first film layer also has the advantages of easy production and low manufacturing cost.

Preferably, the first film layer in one embodiment of the present invention includes the following components by mass: 50-60 parts of silicon carbide, 30-50 parts of aluminum oxide, 10-15 parts of silicon dioxide, viscose 10-20 parts of binder, 15-20 parts of kaolin, 1-1.5 parts of magnesium oxide, 1-1.5 parts of Xinyang soil, 1-1.5 parts of light calcium and 0.3-0.4 parts of rare earth oxide.

Preferably, the first film layer according to an embodiment of the present invention includes the following components in parts by mass: 55 parts of silicon carbide, 40 parts of aluminum oxide, 13 parts of silicon dioxide, 15 parts of binder, 18 parts of kaolin, 1.5 parts of magnesium oxide, 1.5 parts of Xinyang soil, 1.5 parts of light calcium and 0.3 parts of rare earth oxide.

For example, the present invention also provides a method for preparing the first film layer in any of the above-mentioned embodiments, which includes the following steps: adding silicon carbide, aluminum oxide, silicon dioxide, binder, Kaolin, magnesia, Xinyang soil, light calcium and rare earth oxide are mixed; the above-mentioned first film layer is obtained after plasticizing, press molding, cooling and demoulding.

It should be noted that since the second film layer is directly attached to the first film layer, the first film layer will directly transfer the heat absorbed from the LED lamp to the second film layer, which means The second film layer is required to have a very high thermal conductivity, and the heat absorbed from the first film layer can be quickly transferred to the second film layer. In addition, the second film layer is also required to have Better heat dissipation performance, and lower thermal expansion coefficient.

For example, the present invention provides a heat dissipation material, wherein the second film layer has the advantages of high thermal conductivity, good heat dissipation performance and good mechanical properties, so that when the first film layer absorbs heat from the LED lamp directly transferred to the second film layer, then the heat absorbed by the first film layer can be quickly transferred to the second film layer, and in the process of heat conduction, based on the excellent The heat dissipation performance can also dissipate the heat on the second film layer to the outside air. Secondly, since the second film layer is still in a relatively short distance from the LED lamp, its own temperature will be relatively high. However, based on the lower thermal expansion coefficient of the second film layer, the second film layer can be avoided. A gap is formed between the second film layer and the third film layer to ensure the tightness of the two.

For example, the second film layer according to an embodiment of the present invention includes the following components in parts by mass: 80-95 parts of graphene, 0.1-20 parts of carbon nanotubes and 0.1-20 parts of carbon nanofibers.

By using graphene as the main raw material of the second film layer, its thermal conductivity is greatly improved, and the thermal conductivity is better. In addition, by adding carbon nanotubes and carbon fibers, heat dissipation channels can be formed, and the heat dissipation performance is also better.

What needs to be emphasized here is that since the above-mentioned second film layer uses graphene, a material with good conductive effect, in the present invention, the conductive layer is bonded to the first film layer to isolate the inside of the LED lamp. circuit components, thereby avoiding the direct electrification of the second film layer, thereby improving the safety performance of the heat dissipation material, and the safety standard is relatively high.

Preferably, the second film layer includes the following components in parts by mass: 85-90 parts of graphene, 5-15 parts of carbon nanotubes and 5-15 parts of carbon nanofibers.

Preferably, the second film layer includes the following components in parts by mass: 90 parts of graphene, 10 parts of carbon nanotubes and 10 parts of carbon nanofibers.

It should be noted that after the heat generated by the LED light passes through the first two layers, that is, the first film layer and the second film layer, part of the heat will be lost to the outside air. In addition, due to the high cost of the second film layer, the main reason is that the main raw material of the second film layer is graphene with relatively high production cost. Therefore, based on the heat transfer and When the heat dissipation burden is relatively small, the third film layer can use the most commonly used metal heat dissipation material in the market today, so as to achieve the effect of reducing cost and obtaining better heat transfer performance.

For example, the present invention provides a heat dissipation material, wherein the third film layer has the advantages of high thermal conductivity, good heat dissipation performance, good mechanical properties and low cost, so that when the heat of the second film layer is transferred to When the third film layer is used, the heat absorbed by the second film layer can be transferred to the third film layer more quickly, and in the process of heat transfer, the third film layer can also Transfer part of the heat directly to the outside air.

For example, the third film layer according to an embodiment of the present invention includes the following components in parts by mass: 93-97 parts of copper, 2-4.5 parts of aluminum, 0.1-0.3 parts of nickel, and 0.2-1.2 parts of vanadium , 0.1-0.4 parts of manganese, 0.1-0.3 parts of titanium, 0.1-0.3 parts of chromium and 0.1-0.3 parts of niobium.

The third film layer containing copper (Cu) can keep the thermal conductivity of the third film layer at a relatively high level. When the mass fraction of copper is 93-97 parts, the thermal conductivity of the third film layer can reach more than 380W/mK, and the heat transferred from the second film layer can be transferred away relatively quickly, and then uniformly dispersed on the overall structure of the third film layer, so as to prevent heat from accumulating at the contact position between the second film layer and the third film layer, resulting in local overheating. Moreover, the density of the third film layer is only 8.0kg/m ³ ~8.1kg/m ³ , which is much lower than that of pure copper, which can effectively reduce the weight of the third film layer and facilitate installation manufacturing, while also greatly reducing costs. In addition, the third film layer contains 2-4.5 parts by mass of aluminum, 0.1-0.3 parts of nickel, 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, 0.1-0.3 parts of Titanium, 0.1-0.3 parts of chromium, and 0.1-0.3 parts of niobium of vanadium. Compared with pure copper, the ductility, toughness, strength and high temperature resistance of the third film layer are greatly improved, and it is not easy to sinter.

In order to make the third film layer have better performance, for example, the third film layer contains 0.1-0.3 parts by mass of nickel (Ni), which can improve the high temperature resistance performance of the third film layer. As another example, the third film layer contains 0.2-1.2 parts by mass of vanadium (V), which can inhibit the grain growth of the third film layer and obtain a relatively uniform and fine grain structure, so as to reduce the size of the third film layer. brittleness, and improve the overall mechanical properties of the third film layer to increase toughness and strength. In another example, the third film layer contains 0.1-0.3 parts by mass of titanium (Ti), which can make the crystal grains of the third film layer finer, so as to improve the ductility of the third film layer; As another example, the third film layer also includes 1-2.5 parts by mass of silicon (Si). When the third film layer contains an appropriate amount of silicon, it can be used without affecting the thermal conductivity of the third film layer. Under the premise that the hardness and wear resistance of the third film layer are effectively improved. However, after many times of theoretical analysis and experimental evidence, it is found that when the mass of silicon in the third film layer is too much, for example, when the mass percentage exceeds 15 parts, black particles will be distributed on the surface of the third film layer, and the ductility will be reduced. It is not conducive to the production and molding of the third film layer.

Preferably, the third film layer includes the following components in parts by mass: 94 to 96 parts of copper, 3 to 4 parts of aluminum, 0.2 to 0.3 parts of nickel, 0.5 to 1 part of vanadium, and 0.2 to 0 parts of manganese 0.3 parts, 0.2 to 0.3 parts of titanium, 0.2 to 0.3 parts of chromium, and 0.2 to 0.3 parts of niobium.

Preferably, the third film layer includes the following components by mass: 95 parts copper, 3.5 parts aluminum, 0.3 parts nickel, 0.8 parts vanadium, 0.2-0.3 parts manganese, 0.2-0.3 parts titanium, 0.2 parts chromium 0.3 parts to 0.3 parts and 0.2 to 0.3 parts of niobium.

It should be noted that when the heat generated by the LED lamp passes through the first three layers, namely the first film layer, the second film layer and the third film layer, a relatively large part of the heat will be transferred. In addition, because the main raw material of the third film layer is copper, its mass is relatively heavy, therefore, based on the relatively small heat dissipation burden of the fourth film layer, the fourth film layer The layer can use materials with better heat dissipation effect, lighter weight and lower cost, so as to achieve the effect of reducing cost and weight, and obtaining better heat dissipation performance.

For example, the present invention provides a heat dissipation material, wherein the fourth film layer has the advantages of better heat dissipation effect, lighter weight and lower cost, so that when the heat of the third film layer transfers to the fourth film layer When the film layer is used, the fourth film layer can dissipate most of the heat in the air medium, so as to cooperate with the first film layer, the second film layer and the third film layer to complete the gradient heat transfer In this way, it can be aimed at different heat areas, that is, measured by the distance from the LED lamp, to achieve the effect of gradient transfer and dissipation of heat, which solves the problem of poor insulation, high cost, heavy mass, heat conduction and heat dissipation of traditional radiator materials. The problem of poor cooling effect.

For example, the fourth film layer according to an embodiment of the present invention includes the following components in parts by mass: 47-50 parts of copper, 49-52 parts of aluminum, 0.2-0.7 parts of magnesium, and 0.2-0.7 parts of iron , 0.2-0.5 parts of manganese, 0.1-0.3 parts of titanium, 0.05-0.1 parts of chromium and 0.1-0.3 parts of vanadium.

The above-mentioned fourth film layer contains 47-50 parts by mass of copper and 49-52 parts of aluminum, which can keep the thermal conductivity of the fourth film layer at 300W/mK-350W/mK, so as to ensure the The fourth film layer can quickly dissipate the heat transferred from the third film layer in the air medium, thereby preventing heat from accumulating on the fourth film layer and causing local overheating. Compared with the prior art, simply using expensive and high-quality copper, the above-mentioned fourth film layer not only has a good heat dissipation effect, can quickly dissipate heat into the air, but also has a lighter weight, which is convenient for installation and casting, Advantages of lower prices. At the same time, compared with the prior art, which simply adopts aluminum alloy with poor heat dissipation effect, the above-mentioned fourth film layer has better heat transfer performance. In addition, the fourth film layer contains 0.2-0.7 parts by mass of magnesium, 0.2-0.7 parts of iron, 0.2-0.5 parts of manganese, 0.1-0.3 parts of titanium, 0.05-0.1 parts of chromium and 0.1-0.3 part of vanadium improves the yield strength, tensile strength and high temperature resistance of the fourth film layer. For example, it is found through multiple experiments and theoretical analysis that the fourth film layer contains 0.2-0.7 parts by mass of magnesium, which can endow the fourth film layer with yield strength and tensile strength to a certain extent.

Preferably, the fourth film layer includes the following components by mass: 48-49 parts of copper, 50-52 parts of aluminum, 0.2-0.5 parts of magnesium, 0.2-0.5 parts of iron, 0.3-0.3 parts of manganese 0.5 parts, 0.2 to 0.3 parts of titanium, 0.05 to 0.08 parts of chromium, and 0.2 to 0.3 parts of vanadium.

Preferably, the fourth film layer includes the following components by mass: 48 parts copper, 51 parts aluminum, 0.3 parts magnesium, 0.3 parts iron, 0.4 parts manganese, 0.4 parts titanium, 0.08 parts chromium and 0.3 parts vanadium.

In order to further reduce the weight of the fourth film layer and obtain a better heat dissipation effect, for example, the present invention also provides an auxiliary fourth film layer, and the auxiliary fourth film layer is arranged at a distance from the fourth film layer One side of the third film layer.

For example, the auxiliary fourth film layer according to an embodiment of the present invention includes the following components in parts by mass: 88-93 parts of aluminum, 5.5-10.5 parts of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper 0.2 to 0.8 parts of iron, 0.2 to 0.5 parts of manganese, 0.05 to 0.3 parts of titanium, 0.05 to 0.1 parts of chromium, and 0.05 to 0.3 parts of vanadium.

The above-mentioned auxiliary fourth film layer contains 88-93 parts by mass of aluminum, which can keep the thermal conductivity of the auxiliary fourth film layer at 200W/mK-220W/mK, and has a better heat dissipation effect, which can satisfy the transfer of residual heat to The need for air medium, at the same time, its lighter weight, more convenient for transportation. In addition, the auxiliary fourth film layer contains 5.5-10.5 parts by mass of silicon, 0.3-0.7 parts of magnesium, 0.05-0.3 parts of copper, 0.2-0.8 parts of iron, and 0.2-0.5 parts of manganese , 0.05-0.3 parts of titanium, 0.05-0.1 parts of chromium and 0.05-0.3 parts of vanadium can greatly improve the heat dissipation performance of the auxiliary fourth film layer. For example, the auxiliary fourth film layer contains 5.5-10.5 parts by mass of silicon and 0.05-0.3 part of copper, which can ensure that the auxiliary fourth film layer has the advantages of good mechanical properties and light weight, and at the same time, it can further Improve the thermal performance of the auxiliary fourth film layer. For another example, the auxiliary fourth film layer also includes 0.3-0.6 parts by mass of lead (Pb). When the auxiliary fourth film layer contains 0.3-0.6 parts of lead, the tensile strength of the auxiliary fourth film layer can be improved. In this way, when the auxiliary fourth film layer is cast and punched into a sheet-like or film-like structure, it can be prevented from breaking due to excessive punching and pulling stress. As another example, the auxiliary fourth film layer also includes niobium (Nb) with a mass fraction of 0.02-0.04 parts. When the mass fraction of niobium is greater than 0.02 parts, the oxidation resistance of the auxiliary fourth film layer can be greatly improved. However, When the mass part of niobium is greater than 0.04 part, the magnetic properties of the auxiliary fourth film layer will increase sharply, which will affect other components in the LED lamp. As another example, the auxiliary fourth film layer also includes 0.02 to 0.03 parts by mass of germanium (Ge). When the mass part of germanium is greater than 0.02 parts, it will unexpectedly improve the heat dissipation performance of the auxiliary fourth film layer. However, when the mass proportion of germanium is too much, for example, when the mass fraction of germanium is greater than 2, the brittleness of the auxiliary fourth film layer will increase.

It should be noted that after the heat generated by the LED light passes through the first four layers, that is, the first film layer, the second film layer, the third film layer and the fourth film layer, a large part The heat has been lost to the outside air. Therefore, based on the fact that the heat dissipation burden of the fifth film layer is relatively small, and the temperature itself is low, and the influence caused by a large thermal expansion coefficient is minimal, the third film layer can use the most commonly used film in the market today. Plastic materials to achieve cost and weight reduction, as well as better surface protection performance.

For example, the present invention provides a heat dissipation material, wherein the fifth film layer has the advantages of good surface protection, light weight and low cost, so when the fifth film layer is located on the outermost surface of the heat dissipation material When layered, it can have better heat dissipation performance, better surface protection performance, lighter weight and lower cost.

For example, the fifth film layer according to an embodiment of the present invention includes the following components by mass: the fifth film layer comprises the following components by mass: 20-40 parts of graphite, 20-30 parts of carbon fiber 40 to 60 parts of polyamide, 10 to 20 parts of water-soluble silicate, 1 to 8 parts of hexagonal boron nitride, 2 to 5 parts of bismaleimide, 0.5 to 0.5 parts of silane coupling agent 2 parts, 0.25 to 1 part of antioxidant.

When the above-mentioned water-soluble silicate is mixed with graphite and carbon fiber, it can undergo copolymerization reaction with polyamide under high temperature conditions to form heat dissipation channels, thereby improving heat dissipation performance, and is lighter in weight than the hollow structure. In addition, due to the addition of carbon fiber, its surface protection performance and mechanical properties are better, for example, it is more resistant to oxidation, acid and alkali, and corrosion.

Preferably, the fifth film layer includes the following components by mass: 30-35 parts of graphite, 25-30 parts of carbon fiber, 45-50 parts of polyamide, and 15-20 parts of water-soluble silicate , 4-6 parts of hexagonal boron nitride, 3-4 parts of bismaleimide, 1-1.5 parts of silane coupling agent, 0.5-1 part of antioxidant.

Preferably, the fifth film layer includes the following components by mass: 35 parts of graphite, 28 parts of carbon fiber, 45 parts of polyamide, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, bismaleyl 3.5 parts of imine, 1.8 parts of silane coupling agent, and 0.7 parts of antioxidant.

In order to better optimize the heat conduction and heat dissipation paths of the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer, therefore, When cost, weight, heat conduction and heat dissipation effects, and surface protection performance are comprehensively considered, the second film layer, the third film layer, the fourth film layer and the fifth film layer according to an embodiment of the present invention The film layer thickness ratio is 1-1.5:8-12:5-7:6-10:2-2.5, so that the first film layer, the second film layer, the third film layer, The heat conduction and heat dissipation paths of the fourth film layer and the fifth film layer are more optimized.

In order to better fix the layers of the heat dissipation material, namely the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer together to improve structural stability, for example, as shown in Figure 2, the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer Cogs 110 and cogs 120 are arranged between two adjacent interfaces of the layers. When two adjacent layers are bonded together, the cogs 110 are embedded in the cogs 120, so that each of the heat dissipation materials Layer structure, i.e. the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer are better fixed together to improve structural stability . As another example, as shown in Figure 3, between the adjacent interfaces of the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer Buckles 210 and slots 220 are arranged between them. When the adjacent two-layer structures are bonded together, the buckles 210 are embedded in the slots 220, so that each layer structure of the heat dissipation material, that is, the first The film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer are better fixed together to further improve structural stability.

In order to further fix the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer together to further improve the structural stability and reduce the Little impact on the heat conduction and heat transfer performance of the heat sink material.

For example, referring to FIG. 4 , a first filling adhesive layer 600 is set between the first film layer 100 and the second film layer 200 , and a second filling adhesive layer 700 is set between the second film layer 200 and the third film layer 300 A third filling adhesive layer 800 is provided between the third film layer 300 and the fourth film layer 400 , and a fourth filling adhesive layer 900 is provided between the fourth film layer 400 and the fifth film layer 500 . It can be understood that there is a structure between two adjacent interfaces of the first film layer 100 , the second film layer 200 , the second film layer 200 , the third film layer 300 , the fourth film layer 400 and the fifth film layer 500 The small and large number of gaps is mainly due to the fact that the bonding surfaces of the above-mentioned layers of materials are not tight enough, and by setting the first filled adhesive layer 600, the second filled adhesive layer 700, and the third filled adhesive layer 800 and the fourth filling adhesive layer 900 can better fill these gaps, and also play the role of adhesion.

For example, the present invention provides the first filled adhesive layer according to an embodiment, which includes the following components in parts by mass: 300-1000 parts of nano-alumina particles, 5-30 parts of methyl vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin.

Preferably, the first filling and adhesive layer includes the following components in parts by mass: 800-1000 parts of nano-alumina particles, 20-30 parts of methyl vinyl silicone rubber, 40-50 parts of vinyl silicone oil , 80-100 parts of dimethyl silicone oil and 15-20 parts of MQ silicone resin.

Preferably, the first filling adhesive layer includes the following components in parts by mass: 900 parts of nano-alumina particles, 25 parts of methyl vinyl silicone rubber, 45 parts of vinyl silicone oil, 85 parts of dimethyl silicone oil and MQ 20 parts of silicone resin.

For example, the present invention provides the second filled adhesive layer according to an embodiment, which includes the following components in parts by mass: 200-800 parts of nano-alumina particles, 10-40 parts of methyl vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin;

Preferably, the second filling adhesive layer includes the following components in parts by mass: 500-700 parts of nano-alumina particles, 20-30 parts of methyl vinyl silicone rubber, and 30-40 parts of vinyl silicone oil , 50 to 80 parts of dimethyl silicone oil and 10 to 15 parts of MQ silicone resin.

Preferably, the second filling adhesive layer includes the following components by mass: 600 parts of nano-alumina particles, 15 parts of methyl vinyl silicone rubber, 35 parts of vinyl silicone oil, 65 parts of dimethyl silicone oil and MQ 15 parts of silicone resin.

For example, the present invention provides the third filled adhesive layer according to an embodiment, which includes the following components in parts by mass: 200-700 parts of nano-alumina particles, 10-40 parts of methyl vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin.

Preferably, the third filling adhesive layer includes the following components in parts by mass: 200-600 parts of nano-alumina particles, 20-40 parts of methyl vinyl silicone rubber, and 20-50 parts of vinyl silicone oil , 30 to 100 parts of dimethyl silicone oil and 5 to 10 parts of MQ silicone resin.

Preferably, the third filling adhesive layer includes the following components in parts by mass: 500 parts of nano-alumina particles, 25 parts of methyl vinyl silicone rubber, 25 parts of vinyl silicone oil, 30 parts of dimethyl silicone oil and MQ Silicone resin 8 parts.

For example, the present invention provides the fourth filled adhesive layer according to an embodiment, which includes the following components in parts by mass: 150-700 parts of nano-alumina particles, 15-45 parts of methyl vinyl silicone rubber, 10-50 parts of vinyl silicone oil, 10-100 parts of dimethyl silicone oil and 1-20 parts of MQ silicone resin.

Preferably, the fourth filling adhesive layer includes the following components in parts by mass: 150-450 parts of nano-alumina particles, 15-25 parts of methyl vinyl silicone rubber, and 10-25 parts of vinyl silicone oil , 80 to 100 parts of dimethyl silicone oil and 1 to 10 parts of MQ silicone resin.

Preferably, the fourth filling adhesive layer includes the following components in parts by mass: 250 parts of nano-alumina particles, 18 parts of methyl vinyl silicone rubber, 20 parts of vinyl silicone oil, 95 parts of dimethyl silicone oil and MQ Silicone resin 5 parts.

The first filled adhesive layer 600, the second filled adhesive layer 700, the third filled adhesive layer 800 and the fourth filled adhesive layer 900 all use silicone resin as the matrix material, and add nano Aluminum oxide particles. By adding heat-conducting powder nano-alumina into the silicone resin matrix, a filling adhesive material with strong adhesion and high thermal conductivity can be prepared, and the first film layer and the second film layer can be better made The film layer, the third film layer, the fourth film layer and the fifth film layer are fixed together to further improve structural stability.

When it needs to be emphasized, the content of nano-alumina particles in the first filled adhesive layer 600, the second filled adhesive layer 700, the third filled adhesive layer 800 and the fourth filled adhesive layer 900 decreases successively, because the heat load It also decreases sequentially from the first film layer, the second film layer, the third film layer, the fourth film layer to the fifth film layer, so that the effect of gradient heat conduction and heat dissipation can be better obtained.

In order to better adhere to the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer while avoiding increasing excessive thickness, and Reduce the impact on thermal conductivity and heat dissipation performance, for example, the thickness ratio of the first filled adhesive layer, the second filled adhesive layer, the third filled adhesive layer and the fourth filled adhesive layer is 1～ 1.5: 2-2.5: 3-3.5: 4-4.5, and for another example, the thickness ratio of the first filling adhesive layer to the first film layer is 1:50-80.

The above-mentioned heat dissipation material 10 can obtain good insulation, low expansion coefficient, thermal conductivity The advantages of large size, good heat dissipation effect and light weight.

As an example, the present invention also provides an LED lamp, which includes the heat dissipation material of any one of the above embodiments.

For example, referring to FIG. 5 , the LED lamp 20 includes a heat dissipation material 10 and an LED lamp 30 , the LED lamp 30 is disposed on the first film layer 100 , and the heat dissipation material 10 is disposed in a cylindrical structure.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A heat dissipation material, characterized in that it comprises: the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer which are stacked and attached in sequence, The first film layer includes the following components in parts by mass: 40 to 70 parts of silicon carbide, 13 to 55 parts of aluminum oxide, 2 to 15 parts of silicon dioxide, and 3 to 25 parts of binder , 2-20 parts of kaolin, 0.5-2 parts of magnesium oxide, 0.5-2 parts of Xinyang clay, 0.5-2 parts of light calcium and 0.2-0.5 parts of rare earth oxides; The second film layer includes the following components in parts by mass: 80 to 95 parts of graphene, 0.1 to 20 parts of carbon nanotubes and 0.1 to 20 parts of carbon nanofibers; The third film layer includes the following components by mass: 93-97 parts of copper, 2-4.5 parts of aluminum, 0.1-0.3 parts of nickel, 0.2-1.2 parts of vanadium, 0.1-0.4 parts of manganese, 0.1-0.3 parts of titanium, 0.1-0.3 parts of chromium and 0.1-0.3 parts of niobium; The fourth film layer includes the following components in parts by mass: 47-50 parts of copper, 49-52 parts of aluminum; The fifth film layer includes the following components by mass: 20-40 parts of graphite, 20-30 parts of carbon fiber, 40-60 parts of polyamide, 10-20 parts of water-soluble silicate, hexagonal nitrogen 1-8 parts of boron chloride, 2-5 parts of bismaleimide, 0.5-2 parts of silane coupling agent, 0.25-1 part of antioxidant. 2. The heat dissipation material according to claim 1, wherein the second film layer comprises the following components in parts by mass: 85 to 90 parts of graphene, 5 to 15 parts of carbon nanotubes and carbon nanofibers 5 to 15 copies. 3. The heat dissipation material according to claim 1, characterized in that 90 parts of graphene, 10 parts of carbon nanotubes and 10 parts of carbon nanofibers. 4. The heat dissipation material according to claim 1, wherein the first film layer comprises the following components by mass: 50-60 parts of silicon carbide, 30-50 parts of aluminum oxide, 2 10-15 parts of silicon oxide, 10-20 parts of binder, 15-20 parts of kaolin, 1-1.5 parts of magnesium oxide, 1-1.5 parts of Xinyang soil, 1-1.5 parts of light calcium and rare earth 0.3 to 0.4 parts of oxides. 5. The heat dissipation material according to claim 1, wherein the first film layer comprises the following components in parts by mass: 55 parts by mass of silicon carbide, 40 parts by aluminum oxide, 13 parts by silicon dioxide, viscose 15 parts of binder, 18 parts of kaolin, 1.5 parts of magnesium oxide, 1.5 parts of Xinyang soil, 1.5 parts of light calcium and 0.3 parts of rare earth oxide. 6. The heat dissipation material according to claim 1, wherein the third film layer comprises the following components by mass: 94-96 parts of copper, 3-4 parts of aluminum, 0.2-0.3 parts of nickel 0.5 to 1 part of vanadium, 0.2 to 0.3 parts of manganese, 0.2 to 0.3 parts of titanium, 0.2 to 0.3 parts of chromium, and 0.2 to 0.3 parts of niobium. 7. The heat dissipation material according to claim 1, wherein the third film layer comprises the following components by mass: 95 parts of copper, 3.5 parts of aluminum, 0.3 parts of nickel, 0.8 parts of vanadium, and 0.2 parts of manganese ~0.3 parts, titanium 0.2~0.3 parts, chromium 0.2~0.3 parts, and niobium 0.2~0.3 parts. 8. The heat dissipation material according to claim 1, wherein the fifth film layer comprises the following components by mass: 30-35 parts of graphite, 25-30 parts of carbon fiber, 45-30 parts of polyamide 50 parts, 15-20 parts of water-soluble silicate, 4-6 parts of hexagonal boron nitride, 3-4 parts of bismaleimide, 1-1.5 parts of silane coupling agent, 0.5 parts of antioxidant Part ~ 1 part. 9. The heat dissipation material according to claim 1, wherein the fifth film layer comprises the following components by mass: 35 parts of graphite, 28 parts of carbon fiber, 45 parts of polyamide, 18 parts of water-soluble silicate 5 parts of hexagonal boron nitride, 3.5 parts of bismaleimide, 1.8 parts of silane coupling agent, and 0.7 parts of antioxidant. 10. The heat dissipation material according to claim 1, wherein the first film layer, the second film layer, the third film layer, the fourth film layer and the fifth film layer The thickness ratio is 1-1.5:8-12:5-7:6-10:2-2.5.