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CN104201276B - Peripherally light-emitting strip-shaped light source - Google Patents

Peripherally light-emitting strip-shaped light source Download PDF

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Publication number
CN104201276B
CN104201276B CN201410401704.XA CN201410401704A CN104201276B CN 104201276 B CN104201276 B CN 104201276B CN 201410401704 A CN201410401704 A CN 201410401704A CN 104201276 B CN104201276 B CN 104201276B
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substrate
led unit
light source
strip
light
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CN104201276A (en
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廖志勇
王闽
黄黎帆
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Xiamen City Superlite Lighting Co., Ltd.
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XIAMEN HANFENG OPTOELECTRONICS TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8582Means for heat extraction or cooling characterised by their shape

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明涉及一种周面发光的条状光源。LED灯丝灯中,作为光源的灯丝由LED单元和基片以及封装体构成,基片上开孔后,光线虽能够到达基片的背面,但是散热面积却减少,出现透光和散热的矛盾。本发明的透光孔三面环绕LED单元,透光效果好,基片上的舌片部承载LED单元,舌片部的三面都是透光孔,热量只能通过连接部传导到框架部,不能聚积在LED单元的周围,LED单元的散热面积取决于框架部的大小和透光孔的大小无关。本发明光源不仅发光均匀,而且散热效果好,并利于生产。

The invention relates to a strip light source emitting light on the surrounding surface. In LED filament lamps, the filament as a light source is composed of an LED unit, a substrate, and a package. After opening holes in the substrate, although the light can reach the back of the substrate, the heat dissipation area is reduced, and there is a contradiction between light transmission and heat dissipation. The light transmission hole of the present invention surrounds the LED unit on three sides, and the light transmission effect is good. The tongue part on the substrate carries the LED unit. The three sides of the tongue part are light transmission holes. The heat can only be transmitted to the frame part through the connection part and cannot be accumulated. Around the LED unit, the heat dissipation area of the LED unit depends on the size of the frame portion and has nothing to do with the size of the light transmission hole. The light source of the invention not only emits light evenly, but also has good heat dissipation effect and is beneficial to production.

Description

一种周面发光的条状光源A strip-shaped light source emitting around the surface

技术领域 technical field

本发明涉及LED灯光照明技术,尤其涉及一种周面发光的条状光源。 The invention relates to LED lighting technology, in particular to a strip-shaped light source emitting light on the surrounding surface.

背景技术 Background technique

低碳、绿色、节能的环保生活方式已经成为人们追求和践行的目标,用LED照明取代传统白炽灯和日光灯正成为主流。随着多年的发展。LED照明技术出现了一个将LED单元组合制成条状灯芯,并配以透光灯泡,做成酷似白炽灯的光源,称为LED灯丝灯。 A low-carbon, green, energy-saving and environmentally-friendly lifestyle has become the goal that people pursue and practice, and replacing traditional incandescent and fluorescent lamps with LED lighting is becoming the mainstream. With years of development. LED lighting technology has emerged a combination of LED units to make a strip wick, and with a light-transmitting bulb, to make a light source that resembles an incandescent lamp, called an LED filament lamp.

LED灯丝灯的发光体是长条状灯芯,灯芯由多个LED单元和基片以及封装体组成。为了便于生产,LED单元多排列在基片的同一面,光线不能到达LED单元的背面,制得的LED灯芯发出光很不均匀。为解决这一问题,有人在基片上开设透光孔,实现灯芯周面发光的效果。 The illuminant of the LED filament lamp is a strip-shaped wick, and the wick is composed of a plurality of LED units, a substrate, and a package. In order to facilitate production, the LED units are mostly arranged on the same side of the substrate, the light cannot reach the back of the LED unit, and the light emitted by the manufactured LED wick is very uneven. In order to solve this problem, some people set up light-transmitting holes on the substrate to realize the effect of luminescence around the wick.

LED单元的实际光源是内部LED芯片(即发光半导体),LED芯片的发热量非常高,需要借由连接到LED芯片以及基片的散热体将热量带走,当基片开设透光孔后,光线虽然能狗透光透光孔到达LED单元的背面,当却不可避免地减少了基片的面积,降低了散热效果。所以,为了兼顾基片的散热效果,基片上的透光孔不宜过大。 The actual light source of the LED unit is the internal LED chip (that is, a light-emitting semiconductor). The heat generated by the LED chip is very high. It needs to be taken away by the heat sink connected to the LED chip and the substrate. When the substrate is opened with a light-transmitting hole, Although the light can reach the back of the LED unit through the light-transmitting hole, it inevitably reduces the area of the substrate and reduces the heat dissipation effect. Therefore, in order to take into account the heat dissipation effect of the substrate, the light transmission hole on the substrate should not be too large.

有鉴于此,本发明提出一种周面发光的条状光源,以解决透光孔大小和散热效果相矛盾的问题。 In view of this, the present invention proposes a strip-shaped light source that emits light around the surface to solve the problem of the conflict between the size of the light-transmitting hole and the heat dissipation effect.

发明内容 Contents of the invention

本发明的目的在于提供一种周面发光的条状光源,不仅周面发光均匀,而且LED单元产生的热量效果好,并利于生产。 The purpose of the present invention is to provide a strip-shaped light source that emits light on the peripheral surface, which not only emits light uniformly on the peripheral surface, but also has good heat generated by the LED unit, and is convenient for production.

为了达成本发明的上述目的,本发明的提供两套技术方案,分别如下。 In order to achieve the above object of the present invention, the present invention provides two sets of technical solutions, respectively as follows.

本发明的第一套技术方案如下。 The first technical scheme of the present invention is as follows.

一种周面发光的条状光源,由LED单元、基片和封装体组成,LED单元之间或LED单元和基片之间构成电路回路,能驱动LED单元发光,其特征在于:所述LED单元具有散热体,所述基片是一种金属片;所述基片上具有一个透光孔,所述透光孔将基片分割为框架部和舌片部;所述框架部的轴线和所述舌片部的轴线形成夹角,所述LED单元的散热体连接所述舌片部,LED单元的第一侧面和第二侧面以及第三侧面被透光孔环绕;所述封装体包覆LED单元和基片,所述封装体内具有荧光材料,能将LED单元发出的点光散射到四周并透过透光孔由LED单元的背面发射出。 A strip-shaped light source emitting light on the surrounding surface, which is composed of an LED unit, a substrate and a package body. A circuit loop is formed between the LED units or between the LED unit and the substrate, which can drive the LED unit to emit light. It is characterized in that: the LED unit There is a radiator, the substrate is a metal sheet; there is a light-transmitting hole on the substrate, and the light-transmitting hole divides the substrate into a frame part and a tongue part; the axis of the frame part and the The axis of the tongue part forms an included angle, the heat sink of the LED unit is connected to the tongue part, the first side, the second side and the third side of the LED unit are surrounded by light-transmitting holes; the package wraps the LED The unit and the substrate have fluorescent materials in the package, which can scatter the point light emitted by the LED unit to the surroundings and emit it from the back of the LED unit through the light-transmitting hole.

在某些实施例中,LED单元的轴线和基片轴线之间形成30度~90度的夹角。 In some embodiments, the axis of the LED unit and the axis of the substrate form an included angle of 30 degrees to 90 degrees.

在某些实施例中,LED单元的轴线和基片轴线之间形成45度的夹角。 In some embodiments, an angle of 45 degrees is formed between the axis of the LED unit and the axis of the substrate.

在某些实施例中,所述基片的材料是铜基材料或铝基材料,进一步包括铜镀银材料。 In some embodiments, the material of the substrate is a copper-based material or an aluminum-based material, further including a silver-plated copper material.

本发明的第二套技术方案如下。 The second technical solution of the present invention is as follows.

一种周面发光的条状光源,由LED单元、基片和封装体组成,LED单元之间或LED单元和基片之间构成电路回路,能驱动LED单元发光,其特征在于:所述基片是金属片并由主体和分支构成,所述分支连接所述主体并由主体向外延伸;所述分支由主体向外延伸的方向是所述分支的轴向,所述主体的大尺寸方向是所述主体的轴向;所述分支的轴向和所述主体的轴向之间形成一个大于0度且小于等于90度的夹角;所述LED单元具有散热体,所述散热体和所述基片的分支连接;所述封装体包覆LED单元和基片,所述封装体内具有荧光材料,能将LED单元发出的点光散射到四周并透过所述分支之间的空隙由LED单元的背面发射出。 A strip-shaped light source emitting light on the surrounding surface, which is composed of an LED unit, a substrate and a package, and a circuit loop is formed between the LED units or between the LED unit and the substrate, which can drive the LED unit to emit light, and is characterized in that: the substrate It is a metal sheet and consists of a main body and a branch. The branch is connected to the main body and extends outward from the main body; the direction in which the branch extends outward from the main body is the axial direction of the branch, and the major dimension direction of the main body is The axial direction of the main body; an angle greater than 0 degrees and less than or equal to 90 degrees is formed between the axial direction of the branch and the axial direction of the main body; the LED unit has a radiator, and the radiator and the The branch connection of the substrate; the package body wraps the LED unit and the substrate, and the package body has a fluorescent material, which can scatter the point light emitted by the LED unit to the surroundings and pass through the gap between the branches by the LED The back of the unit emits out.

在某些实施例中,两个并行排列的基片组成一对基片组,在所述基片组内基片的分支嵌入另一基片分支之间的空隙中。 In some embodiments, two parallel arrays of substrates form a pair of substrate groups in which the branches of a substrate are embedded in the spaces between the branches of another substrate.

在某些实施例中,封装体包覆多个基片组。 In some embodiments, the package encloses multiple groups of chips.

在某些实施例中,并排的基片之用连接件连接,连接件包括套接件或胶结件或铆接件或焊接件或螺纹连接件。 In some embodiments, the side-by-side substrates are connected by a connecting piece, and the connecting piece includes a socket piece or a glue piece or a riveting piece or a welding piece or a threaded piece.

在某些实施例中,所述基片的材料是铜基材料或铝基材料,进一步包括铜镀银材料。 In some embodiments, the material of the substrate is a copper-based material or an aluminum-based material, further including a silver-plated copper material.

在某些实施例中,所述分支的轴向和所述主体的轴向之间形成的夹角为30度或45度或60度或75度。 In some embodiments, the angle formed between the axial direction of the branch and the axial direction of the main body is 30 degrees or 45 degrees or 60 degrees or 75 degrees.

本发明的有益效果包括,和现有技术相比,在本发明的第一套技术方案中,LED单元的第一侧面和第二侧面以及第三侧面被透光孔环绕,透光率远远高于现有技术仅仅在LED单元之间开设透光孔的方案。本发明第一套技术方案的透光孔将基片分割为框架部和舌片部位,舌片部位三面是透光孔,仅有一面和框架不连接而形成连接部,LED单元产生的热量只能通过连接部传导到框架部上,不会聚积在LED单元的周围,散热的面积取决于框架部的面积,增加框架部的面积不会导致透光孔的面积减少,消除了现有技术的矛盾。并且,通过改变舌片部和框架部之间的夹角可以改变连接部的大小,以适应不同散热要求。 The beneficial effects of the present invention include that, compared with the prior art, in the first set of technical solutions of the present invention, the first side, the second side and the third side of the LED unit are surrounded by light-transmitting holes, and the light transmittance is much higher. It is higher than the solution in the prior art that only provides light-transmitting holes between the LED units. The light transmission hole of the first technical solution of the present invention divides the substrate into a frame part and a tongue part. The three sides of the tongue part are light transmission holes, and only one side is not connected to the frame to form a connection part. It can be conducted to the frame part through the connection part, and will not accumulate around the LED unit. The area of heat dissipation depends on the area of the frame part. Increasing the area of the frame part will not lead to a decrease in the area of the light-transmitting hole, which eliminates the problem of the prior art. contradiction. Moreover, by changing the angle between the tongue part and the frame part, the size of the connecting part can be changed to meet different heat dissipation requirements.

和现有技术相比,本发明的第二套技术方案不仅具有本发明第一套技术方案的有益效果,而且还能通过组合不同的基片组,通过调节基片组合内各个基片的位置得到多种透光间隙,能适应多种发光亮度的LED单元,便于生产多种规格的条状光源(灯芯),并保证周面发光的均匀性。 Compared with the prior art, the second set of technical solutions of the present invention not only has the beneficial effects of the first set of technical solutions of the present invention, but also can adjust the position of each substrate in the combination of substrates by combining different substrate groups. A variety of light-transmitting gaps can be obtained, and LED units that can adapt to a variety of luminous luminances are obtained, which facilitates the production of strip light sources (wicks) of various specifications, and ensures uniformity of luminous light on the surrounding surface.

附图说明 Description of drawings

图1是本发明第一套方案实施例一的立体示意图; Fig. 1 is a three-dimensional schematic diagram of Embodiment 1 of the first set of solutions of the present invention;

图2是本发明第一套方案实施例一的俯视图; Fig. 2 is a top view of Embodiment 1 of the first solution of the present invention;

图3a是本发明第二套方案实施例一的第一种分支延伸图; Fig. 3a is the first branch extension diagram of Embodiment 1 of the second solution of the present invention;

图3b是本发明第二套方案实施例一的第二种分支延伸图; Fig. 3b is a second branch extension diagram of Embodiment 1 of the second solution of the present invention;

图3c是本发明第二套方案实施例一的第三种分支延伸图; Fig. 3c is a third branch extension diagram of Embodiment 1 of the second solution of the present invention;

图4是本发明第二套方案夹角变换示意图; Fig. 4 is a schematic diagram of angle transformation of the second set of schemes of the present invention;

图5是本发明第二套方案实施例二的俯视图; Fig. 5 is a top view of Embodiment 2 of the second set of solutions of the present invention;

图6是本发明第二套方案实施例三的俯视图; Fig. 6 is a top view of Embodiment 3 of the second set of solutions of the present invention;

图7a是本发明第二套方案实施例四的一个组合的立体图; Fig. 7a is a perspective view of a combination of Embodiment 4 of the second set of solutions of the present invention;

图7b是本发明第二套方案实施例四的另一个组合的立体图; Fig. 7b is a perspective view of another combination of Embodiment 4 of the second set of solutions of the present invention;

图7c是本发明第二套方案实施例四的又一个组合的立体图。 Fig. 7c is a perspective view of another combination of Embodiment 4 of the second solution of the present invention.

具体实施方式 Detailed ways

第一套方案 The first plan

实施例一 Embodiment one

如图1和图2所示,本实施例的一种周面发光的条状光源,由LED单元100、基片200以及封装体300组成,LED单元100之间通过导线400构成串联电路回路,该电路回路驱动各个LED单元100发光。在某些实施例中,基片200也可是是电路回路的一部分,电路回路更不限于串联形式,可以是现有技术的任何一种形式。 As shown in Fig. 1 and Fig. 2, a strip-shaped light source emitting light around the surface of this embodiment is composed of LED units 100, a substrate 200 and a package body 300, and a series circuit circuit is formed between the LED units 100 through wires 400, The circuit loop drives each LED unit 100 to emit light. In some embodiments, the substrate 200 may also be a part of a circuit loop, and the circuit loop is not limited to a series connection, and may be any form in the prior art.

本实施例的LED单元100具有发光半导体、电极和散热体,属于现有结构,散热体连接发光半导体并处于LED单元100的底部。在某些实施例中,基片200是由铜基或铝基材料制成,本实施例基片200由铜镀银材料制成。本实施例基片200上具有透光孔201,透光孔201将基片200分割为框架部202和舌片部203,LED单元100的散热体连接到舌片部203,舌片部203将热量传导到框架部202。框架部202的轴线204和舌片部203的轴线206形成夹角A;在某些实施例中,夹角A在30°~90°之间;不同大小的夹角A会影响舌片部203和框架不202之间的连接部207的大小,根据不同的散热要求,可以通过选择夹角A的大小满足散热要求,本实施例的夹角A为45°(度)。 The LED unit 100 of this embodiment has a light-emitting semiconductor, electrodes and a heat sink, which belongs to the existing structure. The heat sink is connected to the light-emitting semiconductor and is located at the bottom of the LED unit 100 . In some embodiments, the substrate 200 is made of a copper-based or aluminum-based material, and in this embodiment the substrate 200 is made of a copper-plated silver material. In this embodiment, the substrate 200 has a light transmission hole 201, and the light transmission hole 201 divides the substrate 200 into a frame part 202 and a tongue part 203. The radiator of the LED unit 100 is connected to the tongue part 203, and the tongue part 203 Heat is conducted to the frame portion 202 . The axis 204 of the frame part 202 and the axis 206 of the tongue part 203 form an included angle A; in some embodiments, the included angle A is between 30° and 90°; different sizes of the included angle A will affect the angle A of the tongue part 203 The size of the connecting portion 207 with the frame 202 can meet the heat dissipation requirements by selecting the size of the included angle A according to different heat dissipation requirements. The included angle A in this embodiment is 45° (degrees).

本实施例中,LED单元100的第一侧面101、第二侧面102以及第三侧面103均被透光孔201环绕。封装体300包覆LED单元100和基片200,封装体300内具有常规荧光材料结构,为了便于理解,图1和图2中略去关于荧光材料的示意。荧光材料能将LED单元100发出的点光散射到四周,散射到四周的光线中有一部分将折返向基片,并能穿透透光孔201到达LED单元的背面,使得本实施例的条状光源的周面都有光线射出。 In this embodiment, the first side 101 , the second side 102 and the third side 103 of the LED unit 100 are all surrounded by the light-transmitting hole 201 . The package body 300 covers the LED unit 100 and the substrate 200 , and the package body 300 has a conventional fluorescent material structure. For ease of understanding, illustrations of the fluorescent material are omitted in FIGS. 1 and 2 . The fluorescent material can scatter the point light emitted by the LED unit 100 to the surroundings, and some of the light scattered to the surroundings will turn back to the substrate, and can penetrate the light-transmitting hole 201 to reach the back of the LED unit, so that the strip-shaped light of this embodiment Light is emitted from the periphery of the light source.

本实施例的周面发光的条状光源的透光孔201环绕LED单元100的第一侧面101、第二侧面102以及第三侧面103,增加了光线折向透光孔201的几率,透射出的光线更加均匀。各个舌片203的热量通过连接部207集中到框架部202,使热量能够迅速离开LED单元100,同时透光孔201将LED单元100的三个侧面(第一侧面101、第二侧面102、第三侧面103)环绕,热量无法包围所述三个侧面,LED单元100的周边是无热的透光孔201而不是具有热量的基片200,LED单元100在本实施例中的工作温度和现有技术相比,能得到有效降低。通过本实施例的阐述,本发明仅需调整夹角A的大小即可适应不同散热要求的LED单元,即可以适应不同功率的LED单元,并能满足多种规格要求。 The light transmission hole 201 of the strip-shaped light source emitting light on the peripheral surface of this embodiment surrounds the first side 101, the second side 102 and the third side 103 of the LED unit 100, which increases the probability of the light being bent to the light transmission hole 201 and transmits out The light is more uniform. The heat of each tongue piece 203 is concentrated to the frame part 202 through the connection part 207, so that the heat can leave the LED unit 100 quickly, and at the same time, the light-transmitting hole 201 connects the three sides of the LED unit 100 (the first side 101, the second side 102, the second side 100). Surrounded by three sides 103), the heat cannot surround the three sides, and the periphery of the LED unit 100 is a non-heated light-transmitting hole 201 instead of a substrate 200 with heat. The operating temperature and current of the LED unit 100 in this embodiment Compared with existing technologies, it can be effectively reduced. Through the description of this embodiment, the present invention only needs to adjust the size of the included angle A to adapt to LED units with different heat dissipation requirements, that is, to adapt to LED units with different powers, and to meet various specification requirements.

第二套方案 Second set of plans

实施例一 Embodiment one

如图3a,图3b,图3c所示,本实施例的一种周面发光的条状光源,由LED单元100、基片200和封装体300组成,LED单元100之间通过导线400构成串联电路回路,该电路回路驱动各个LED单元100发光。在某些实施例中,基片200也可是是电路回路的一部分,电路回路更不限于串联形式,可以是现有技术的任何一种形式;可以说电路本身不属于本发明的的要点,因此在附图中,除了图3a示意了一种常见的电路回路形式外,其它附图中均略去电路回路的示意。 As shown in Fig. 3a, Fig. 3b, and Fig. 3c, a strip-shaped light source emitting around the surface of this embodiment is composed of LED units 100, substrates 200 and packages 300, and the LED units 100 are connected in series through wires 400. A circuit loop, the circuit loop drives each LED unit 100 to emit light. In some embodiments, the substrate 200 can also be a part of the circuit loop, and the circuit loop is not limited to the series form, and can be any form of the prior art; it can be said that the circuit itself does not belong to the gist of the present invention, so In the accompanying drawings, except for Fig. 3a which illustrates a common circuit loop form, the illustration of the circuit loop is omitted in other drawings.

本实施例的基片200由金属材料制成,包括铜基材料和铝基材料,优选为铜镀银材料。基片200由主体500和分支502构成,分支502连接主体500并向外延伸。分支502向外延伸的方向是分支502的轴向503;主体500的最大尺寸的方向是主体500的轴向501,分支轴向503和主体轴向501之间形成一个大于0度且小于等于90度的夹角B。 The substrate 200 in this embodiment is made of metal materials, including copper-based materials and aluminum-based materials, preferably silver-plated copper materials. The substrate 200 is composed of a main body 500 and branches 502, and the branches 502 are connected to the main body 500 and extend outward. The direction in which the branch 502 extends outward is the axial direction 503 of the branch 502; the direction of the largest dimension of the main body 500 is the axial direction 501 of the main body 500, and the angle between the branch axial direction 503 and the main body axis 501 is greater than 0 degrees and less than or equal to 90 degrees. angle B in degrees.

本实施例的LED单元100具有发光半导体、电极和散热体,属于现有结构,散热体连接发光半导体并处于LED单元100的底部;LED单元100通过散热体连接分支502,将热量迅速传导到主体500上。 The LED unit 100 of this embodiment has a light-emitting semiconductor, an electrode and a heat sink, which belongs to the existing structure. The heat sink is connected to the light-emitting semiconductor and is located at the bottom of the LED unit 100; the LED unit 100 is connected to the branch 502 through the heat sink, and the heat is quickly conducted to the main body. 500 on.

本实施例的封装体300包覆LED单元100和基片200,封装体300内具有荧光材料,属于现有结构,为了便于理解,附图中略去荧光材料。荧光材料能将LED单元100发出的点光散射到四周,散射到四周的光线中有一部分将折返向基片,并由分支502之间的空隙从到LED单元的背面射出,使得本实施例的条状光源的周面均能发光。 The package body 300 of this embodiment covers the LED unit 100 and the substrate 200. The package body 300 has a fluorescent material inside, which belongs to the existing structure. For ease of understanding, the fluorescent material is omitted in the drawings. The fluorescent material can scatter the point light emitted by the LED unit 100 to the surroundings, and part of the light scattered to the surroundings will turn back to the substrate and be emitted from the back of the LED unit through the gap between the branches 502, so that the light of this embodiment The peripheral surface of the strip light source can emit light.

如图4所示,夹角B选优为30°或45°或60°或75°。当夹角B为75°时,分支502和主体500之间的连接部505比夹角B为30°时的连接部504小。大的连接部适于发热多的LED单元,小的连接部适于发热量相对较小的LED单元;本实施例可以通过调整夹角B的大小来控制连接部的大小,以满足不同的散热需求,适应多种功率的LED单元。 As shown in Figure 4, the included angle B is preferably 30° or 45° or 60° or 75°. When the included angle B is 75°, the connecting portion 505 between the branch 502 and the main body 500 is smaller than the connecting portion 504 when the included angle B is 30°. The large connection part is suitable for LED units that generate a lot of heat, and the small connection part is suitable for LED units with relatively small heat generation; in this embodiment, the size of the connection part can be controlled by adjusting the size of the included angle B to meet different heat dissipation requirements. Demand, suitable for LED units of various powers.

实施例二 Embodiment two

如图5所示,基片a和基片b平行排列,基片a和基片b均由封装体包覆成一体,图5中略去对封装体以及处于封装体内荧光材料的示意。基片a的分支嵌入到基片b的分支之间的间隙中,基片b的分支嵌入到基片a的分支之间的间隙中,构成一对基片组,基片组内的各个分支构成如同本发明第一套即使方案中的透光孔201的结构。 As shown in FIG. 5 , the substrate a and the substrate b are arranged in parallel, and both the substrate a and the substrate b are integrally covered by the package body. The illustration of the package body and the fluorescent material in the package body is omitted in FIG. 5 . The branches of substrate a are embedded in the gaps between the branches of substrate b, and the branches of substrate b are embedded in the gaps between the branches of substrate a, forming a pair of substrate groups. Each branch in the substrate group It constitutes a structure similar to the light transmission hole 201 in the first solution of the present invention.

在现有技术以及本发明的第一套技术方案中,要保证不同亮度的LED单元组成的条状光源发出的光线不论是在LED单元的正面还是在LED单元的背面都趋于一致的要求,就必须针对不同亮度的LED单元采用不同大小的透光孔和不同厚度的封装体(荧光层)。 In the prior art and the first set of technical solutions of the present invention, it is necessary to ensure that the light emitted by the strip light source composed of LED units with different brightness tends to be consistent whether it is on the front of the LED unit or on the back of the LED unit. It is necessary to use different sizes of light-transmitting holes and packages (fluorescent layers) of different thicknesses for LED units with different brightness.

相比于现有技术以及本发明的的第一套技术方案,本发明的第二套技术方案组成的基片组可以透过图如5图所示的方式,上下或左右调整基片的位置,以调节分支之间的空间大小,以获得不同大小的透光间隙,以适应不同封装厚度或不同发光亮度的LED单元的场合,本套技术方案能很便利地适应多种规格需求。 Compared with the prior art and the first technical solution of the present invention, the substrate group composed of the second technical solution of the present invention can adjust the position of the substrate up and down or left and right through the method shown in Figure 5 , to adjust the size of the space between the branches to obtain different sizes of light-transmitting gaps, so as to adapt to the occasions of LED units with different packaging thicknesses or different luminances. This set of technical solutions can easily meet the requirements of various specifications.

实施例三 Embodiment three

作为本套技术方案的延伸,封装体内能包覆多个基片组。如图6所示,基片c,基片e,基片d并行排列,构成两对基片组;条状连接件d通过胶接将它们连接为一体。在某些实施例中,连接件d可以被套接件或胶接件或铆接件或焊接件或螺纹连接件等取代。 As an extension of this set of technical solutions, multiple substrate groups can be wrapped in the packaging body. As shown in Fig. 6, the substrate c, the substrate e, and the substrate d are arranged in parallel to form two pairs of substrate groups; the strip connector d connects them as a whole through adhesive bonding. In some embodiments, the connecting piece d can be replaced by a socket piece, an adhesive piece, a riveting piece, a welding piece, or a threaded piece.

在如6中,通过调整基片c,基片d,基片e到不同的位置,可以调节各个分支之间的间隙大小,以适应不同发光亮度和封装体厚度的需求。 In example 6, by adjusting the substrate c, substrate d, and substrate e to different positions, the size of the gap between each branch can be adjusted to meet the requirements of different luminous brightness and package thickness.

实施例四 Embodiment four

如图7a,图7b,图7c所示,通过前述实施例的阐述,说明本发明可以通过选择不同大小的夹角B以及调节基片组内透光间隙的大小组合出多种实施,以适应不同散热要求和不同的透光要求。图7a中,夹角B为45°并结合图3a和图3b的基片组合成基片组;图7b中,夹角B为75°并结合图3a和图3b的基片组合成基片组;图7c中,夹角B为45°并结合图3a和图3c的基片组合成基片组。 As shown in Figure 7a, Figure 7b, and Figure 7c, through the elaboration of the foregoing embodiments, it is illustrated that the present invention can be combined into various implementations by selecting different sizes of included angles B and adjusting the size of the light-transmitting gap in the substrate group to adapt to Different heat dissipation requirements and different light transmission requirements. In Fig. 7a, the included angle B is 45° and combined with the substrates of Fig. 3a and Fig. 3b to form a substrate group; in Fig. 7b, the included angle B is 75° and combined with the substrates of Fig. 3a and Fig. 3b to form a substrate Group; in Fig. 7c, the included angle B is 45° and the substrates in Fig. 3a and Fig. 3c are combined to form a substrate group.

上述实施例仅是为了便于理解本发明的举例,并非是对本发明的限制。本领域技术人员在上述实施例的基础上所做出的修饰性修改和替换均不脱离本发明的保护范围。本发明的保护范围以权利要求书为准。 The above-mentioned embodiments are only examples for facilitating understanding of the present invention, and are not intended to limit the present invention. Modifications and substitutions made by those skilled in the art on the basis of the above embodiments do not depart from the protection scope of the present invention. The protection scope of the present invention shall be determined by the claims.

Claims (10)

1. the strip-shaped light source of a side face luminescence, be made up of LED unit, substrate and packaging body, forming circuit loop between LED unit or between LED unit and substrate, can driving LED unit luminous, it is characterized in that: described LED unit has radiator, described substrate is a kind of sheet metal; Described substrate has a loophole, substrate is divided into frame section and tongue piece portion by described loophole; The axis of the axis of described frame section and described tongue piece portion forms angle, and the radiator of described LED unit connects described tongue piece portion, the first side of LED unit and the second side and the 3rd side by loophole around; Described packaging body coats LED unit and substrate, have fluorescent material in described packaging body, and the some light scattering that LED unit can be sent is to surrounding and go out through the back side emitter of loophole by LED unit.
2. the strip-shaped light source of a kind of side face luminescence as claimed in claim 1, is characterized in that: the angle forming 30 degree ~ 90 degree between the axis of LED unit and substrate axis.
3. the strip-shaped light source of a kind of side face luminescence as claimed in claim 2, is characterized in that: the angle forming 45 degree between the axis of LED unit and substrate axis.
4. the strip-shaped light source of a kind of side face luminescence as claimed in claim 1, is characterized in that: the material of described substrate is copper-based material or alumina-base material.
5. the strip-shaped light source of a side face luminescence, be made up of LED unit, substrate and packaging body, forming circuit loop between LED unit or between LED unit and substrate, energy driving LED unit is luminous, it is characterized in that: described substrate is sheet metal and is made up of main body and branch, and described branch connects described main body and stretched out by main body; Described branch is the axis of described branch by the outward extending direction of main body, and the large scale direction of described main body is the axis of described main body; Form one between the axis of described branch and the axial direction of described main body be greater than 0 degree and be less than or equal to the angle of 90 degree; Described LED unit has radiator, and described radiator is connected with the branch of described substrate; Described packaging body coats LED unit and substrate, have fluorescent material in described packaging body, and the some light scattering that LED unit can be sent is to surrounding and go out through the back side emitter of the space between described branch by LED unit.
6. the strip-shaped light source of a kind of side face luminescence as claimed in claim 5, is characterized in that: the substrate of two parallel arranged partners substrate group, and in described substrate group, the branch of substrate embeds in the space between another substrate branch.
7. the strip-shaped light source of a kind of side face luminescence as claimed in claim 6, rises and is characterised in that: the multiple substrate group of packaging body coats.
8. the strip-shaped light source of a kind of side face luminescence as claimed in claim 7, is characterized in that: connect with connector between substrate, and connector comprises Coupling or cementing or riveting parts or weldment or threaded connector.
9. the strip-shaped light source of a kind of side face luminescence according to any one of claim 5 to 7, is characterized in that: the material of described substrate is copper-based material or alumina-base material.
10. the strip-shaped light source of a kind of side face luminescence as claimed in claim 5, is characterized in that: the angle formed between the axis of described branch and the axial direction of described main body is 30 degree or 45 degree or 60 degree or 75 degree.
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