CN103943756A - LED module COB packaging technology and structure - Google Patents
LED module COB packaging technology and structure Download PDFInfo
- Publication number
- CN103943756A CN103943756A CN201410151652.5A CN201410151652A CN103943756A CN 103943756 A CN103943756 A CN 103943756A CN 201410151652 A CN201410151652 A CN 201410151652A CN 103943756 A CN103943756 A CN 103943756A
- Authority
- CN
- China
- Prior art keywords
- led module
- cob packaging
- substrate
- glue
- module cob
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012536 packaging technology Methods 0.000 title description 22
- 239000003292 glue Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000002347 injection Methods 0.000 claims abstract description 14
- 239000007924 injection Substances 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 238000001746 injection moulding Methods 0.000 claims abstract description 3
- 238000012858 packaging process Methods 0.000 claims abstract 10
- 239000000084 colloidal system Substances 0.000 claims description 19
- 238000011282 treatment Methods 0.000 claims description 9
- 238000007791 dehumidification Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 23
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000565 sealant Substances 0.000 abstract 2
- 239000013078 crystal Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 206010073753 Fear of injection Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0362—Manufacture or treatment of packages of encapsulations
Landscapes
- Led Device Packages (AREA)
Abstract
本发明公开了一种LED模块COB封装工艺包括步骤：S1、在设置有注胶孔的基板上进行固晶焊线；S2、将所述基板固定至注胶底模上；S3、通过精准注胶针头向所述注胶孔进行注胶；S4、待胶体凝固后，对所述基板进行离模成型。本发明改进了传统的COB封装工艺的围坝和封胶环节，剔除了围坝工艺，直接使用模具注胶成型，在封胶环节效率相对于传统模式效率提升3到5倍，所以不论在生产效率、还是在生产良率上相比于传统COB封装工艺都有很大的提升。本发明还提供了一种由本工艺制作的一种LED模块COB封装结构。
The invention discloses a LED module COB packaging process, which includes steps: S1, performing crystal bonding and wire bonding on a substrate provided with a glue injection hole; S2, fixing the substrate to a bottom mold for glue injection; S3, through precise injection The glue needle injects glue into the glue injection hole; S4, after the glue is solidified, the substrate is released from the mold. The present invention improves the dam and sealant link of the traditional COB packaging process, eliminates the dam process, directly uses mold injection molding, and improves the efficiency of the sealant link by 3 to 5 times compared with the traditional mode, so no matter in production Compared with the traditional COB packaging process, the efficiency and production yield have been greatly improved. The invention also provides an LED module COB packaging structure manufactured by the process.
Description
Technical field
The present invention relates to LED module encapsulation technology field, relate in particular a kind of LED module COB packaging technology and structure.
Background technology
Existing LED main flow is packaged with SMD (surface attaching type, Surface Mounted Devices) encapsulation mode and COB (chip on board encapsulation, Chip on Board) encapsulation mode, SMD packaging thermal resistance is large, and poor radiation, there is glare problem, when application end, device need to be attached on fixing substrate, can only be applied to the less demanding lighting field of properties of product.COB encapsulation is packaged with certain performance boost and cost advantage with respect to SMD, and cost performance is more outstanding, has rejected support concept, without Reflow Soldering, without paster operation, has also avoided the glare problem in application simultaneously.
Current existing main flow COB packaging technology is as follows: first at the substrate surface of die bond bonding wire not, along die bond bonding wire edges of regions, use box dam glue box dam, the object of box dam is for fluorescent colloid in follow-up sealing process does not outflow, and plays a grade glue effect; Next fixing luminescence chip, is used metal wire welding chip, finally seals fluorescent glue.This packaging technology is the main flow encapsulation of current industry COB method, and technique is more loaded down with trivial details, and box dam and sealing adhesive process automaticity are very low at present, drop into manpower comparing more, and yields controls more difficultly, so the manufacturing cost of COB is relatively high.
In sum, how providing a kind of can enhance productivity and COB packaging technology and the structure of yields is the problem that those skilled in the art need solution badly.
Summary of the invention
In view of this, the invention provides a kind of LED module COB packaging technology, comprise step:
S1, on the substrate of hole for injecting glue, carry out die bond bonding wire being provided with;
S2, described substrate is fixed on injecting glue bed die;
S3, by accurate injecting glue syringe needle, to described hole for injecting glue, carry out injecting glue;
S4, after colloid solidification, described substrate is carried out from mold forming.
Preferably, in above-mentioned LED module COB packaging technology, after completing described S1 step, also comprise that step S11 carries out dehumidification treatments by described die bond bonding wire substrate.
Preferably, in above-mentioned LED module COB packaging technology, after completing described S2 step, also comprise that step S21 is fastened on described die bond bonding wire substrate on described injecting glue bed die by fixed sleeve part.
Preferably, in above-mentioned LED module COB packaging technology, after completing described S3 step, also comprise that step S31 heats the base plate of described injecting glue bed die.
Preferably, in above-mentioned LED module COB packaging technology, the surface of the described injecting glue bed die in described S2 is sprayed with separation agent.
Preferably, in above-mentioned LED module COB packaging technology, the time for the treatment of colloid solidification in described S4 is 1-3 minute.
Preferably, in above-mentioned LED module COB packaging technology, described dehumidification treatments is baking processing.
The present invention also provides a kind of LED module COB encapsulating structure, comprising:
Be provided with the substrate of hole for injecting glue:
Be arranged at the light source on described substrate;
Be arranged on described substrate and provide the line layer of line for described light source;
Cover the fluorescent colloid of described light source.
Preferably, in above-mentioned LED module COB encapsulating structure, the number of described hole for injecting glue is 2.
Preferably, in above-mentioned LED module COB encapsulating structure, described fluorescent colloid is the mixture of fluorescent material and glue.
Known via above-mentioned technical scheme, compared with prior art, the present invention openly provides a kind of LED module COB packaging technology, the present invention is without box dam, first on substrate, carry out die bond bonding wire, then die bond bonding wire substrate is after overbaking dehumidifying, be fixed on injecting glue bed die, fixing firm and solid by fixed sleeve part, with preventing from cementing leakage, injecting glue bed die is sprayed and is coated with release agent so that prevent cannot be from mould at material loading front surface, dehumidifying is in hot briquetting, to produce bubble for fear of injection molding colloid, use accurate injecting glue syringe needle align substrates back side hole for injecting glue injecting glue, injecting glue base plate Automatic-heating after injecting glue completes, colloid solidification after 1～3 minute, final substrate is from mold forming.
The present invention is by using the COB technique of injection molded encapsulated moulding, box dam and the sealing link of traditional COB packaging technology have been improved, rejected box dam technique, directly use the moulding of mould injecting glue, in sealing Link Efficiency with respect to 3 to 5 times of traditional mode improved efficiencies, no matter so in production efficiency, or producing on yield and all have greatly improved than traditional C OB packaging technology, allow LED module COB encapsulation step major step towards inexpensive direction.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skills, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 accompanying drawing is LED module COB encapsulating structure schematic diagram of the present invention;
Fig. 2 accompanying drawing is the S1 step of LED module COB packaging technology of the present invention;
Fig. 3 accompanying drawing is the S2 step of LED module COB packaging technology of the present invention;
Fig. 4 accompanying drawing is the S3 step of LED module COB packaging technology of the present invention;
Fig. 5 accompanying drawing is the S4 step of LED module COB packaging technology of the present invention;
In Fig. 1-Fig. 4: 11 is that substrate, 12 is that hole for injecting glue, 13 is that line layer, 14 is that light source, 15 is fluorescent colloid; 21 is injecting glue bed die; 22 is injecting glue syringe needle.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Please refer to Fig. 2-Fig. 5:
The embodiment of the invention discloses a kind of LED module COB packaging technology, comprise step:
S1, carry out die bond bonding wire being provided with on the substrate 11 of hole for injecting glue 12;
S2, substrate 11 is fixed on injecting glue bed die;
S3, by accurate injecting glue syringe needle 22, to hole for injecting glue 12, carry out injecting glue;
S4, after colloid solidification, substrate 11 is carried out from mold forming.
The present invention is by using the COB technique of injection molded encapsulated moulding, box dam and the sealing link of traditional COB packaging technology have been improved, rejected box dam technique, directly use the hole for injecting glue 12 injecting glue moulding at accurate injecting glue syringe needle 22 align substrates 11 back sides, in sealing Link Efficiency with respect to 3 to 5 times of traditional mode improved efficiencies, and the simplification of operation is more conducive to control product defect rate, improve yields.
In order further to optimize technique scheme, the present embodiment, after completing described S1 step, also comprises that step S11 carries out dehumidification treatments by die bond bonding wire substrate 11.Dehumidification treatments is for fear of colloid, in heating process, to produce bubble, the more effective yields that improved of this processing step.
In order further to optimize technique scheme, the present embodiment also comprises that step S21 is fastened on die bond bonding wire substrate 11 on described injecting glue bed die 21 by fixed sleeve part.Using fixed sleeve part fastening is further in order to prevent Lou glue phenomenon in injecting glue process.
In order further to optimize technique scheme, the present embodiment, after completing described S3 step, also comprises that step S31 heats the base plate of described injecting glue bed die 21.This heating process can be base plate Automatic-heating.In a word, heating can make colloid follow effectively evenly to solidify, and then improves yields.
In order further to optimize technique scheme, the surface of the described injecting glue bed die 21 in described S2 is sprayed with separation agent.After spraying separation agent, in the step from mold forming, will prevent from pasting tension, cannot be from the phenomenon of film, and then improve yields.
In order further to optimize technique scheme, the time for the treatment of colloid solidification in described S4 is 1-3 minute.Colloid can solidify completely in this time period, be also conducive to finishing operation from film.
In order further to optimize technique scheme, described dehumidification treatments is baking processing.In dehumidifying operation, baking is the most simple and efficient, and lower than other dehumanization method costs.
The present invention also provides a kind of LED module COB encapsulating structure of being made by technique of the present invention, comprising:
Be provided with the substrate 11 of hole for injecting glue 12:
Be arranged at the light source 14 on substrate 11;
Be arranged on substrate 11 and provide the line layer 13 of line for light source 14;
Cover the fluorescent colloid 15 of light source 14.
This COB encapsulating structure, because chip is directly to encapsulate on substrate, has saved the supporting structure layer in SMD, so corresponding thermal resistance is low, thermal diffusivity is good, and encapsulation and application cost and SMD are also lower.And cost is also lower, and be also more to simplify than traditional COB encapsulation production process, cost also reduces.
In order further to optimize technique scheme, the number of hole for injecting glue 12 is 2.2 hole for injecting glue 12 can make the fluorescent colloid forming in injecting glue process evenly spread, and there will not be textural anomaly; And efficiency is also improved.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is the difference with other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part partly illustrates referring to method.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the present invention.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410151652.5A CN103943756A (en) | 2014-04-15 | 2014-04-15 | LED module COB packaging technology and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410151652.5A CN103943756A (en) | 2014-04-15 | 2014-04-15 | LED module COB packaging technology and structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103943756A true CN103943756A (en) | 2014-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410151652.5A Pending CN103943756A (en) | 2014-04-15 | 2014-04-15 | LED module COB packaging technology and structure |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789194A (en) * | 2014-12-26 | 2016-07-20 | 深圳市斯迈得半导体有限公司 | Bran-new COB light source packaging device and technology |
| CN106102399A (en) * | 2016-08-22 | 2016-11-09 | 华景传感科技（无锡）有限公司 | A kind of sealing structure of vacuum pump electronic controller |
| CN106784244A (en) * | 2016-12-27 | 2017-05-31 | 惠州市华瑞光源科技有限公司 | The preparation method of LED light bar, LED light bar and LED area light source module |
| CN109509826A (en) * | 2018-11-22 | 2019-03-22 | 深圳市新光台显示应用有限公司 | The COB packaging method and LED encapsulation module of LED |
| CN113193096A (en) * | 2021-04-29 | 2021-07-30 | 苏州东岩电子科技有限公司 | Low-cost LED light-emitting device and preparation method thereof |
| CN113210223A (en) * | 2021-04-25 | 2021-08-06 | 华天科技（西安）有限公司 | Process method for filling glue in closed cavity of temperature sensor |
| CN114326192A (en) * | 2021-12-29 | 2022-04-12 | 深圳市晶惠迪电子有限公司 | Manufacturing method of FSTN COG liquid crystal display screen with wide viewing angle |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789194A (en) * | 2014-12-26 | 2016-07-20 | 深圳市斯迈得半导体有限公司 | Bran-new COB light source packaging device and technology |
| CN106102399A (en) * | 2016-08-22 | 2016-11-09 | 华景传感科技（无锡）有限公司 | A kind of sealing structure of vacuum pump electronic controller |
| CN106784244A (en) * | 2016-12-27 | 2017-05-31 | 惠州市华瑞光源科技有限公司 | The preparation method of LED light bar, LED light bar and LED area light source module |
| CN109509826A (en) * | 2018-11-22 | 2019-03-22 | 深圳市新光台显示应用有限公司 | The COB packaging method and LED encapsulation module of LED |
| CN113210223A (en) * | 2021-04-25 | 2021-08-06 | 华天科技（西安）有限公司 | Process method for filling glue in closed cavity of temperature sensor |
| CN113193096A (en) * | 2021-04-29 | 2021-07-30 | 苏州东岩电子科技有限公司 | Low-cost LED light-emitting device and preparation method thereof |
| CN113193096B (en) * | 2021-04-29 | 2022-09-16 | 吴冬梅 | A low-cost preparation method of LED light-emitting device and LED light-emitting device |
| CN114326192A (en) * | 2021-12-29 | 2022-04-12 | 深圳市晶惠迪电子有限公司 | Manufacturing method of FSTN COG liquid crystal display screen with wide viewing angle |
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Application publication date: 20140723 |
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