CN113193096B - A low-cost preparation method of LED light-emitting device and LED light-emitting device - Google Patents

Abstract

The present application provides a low-cost preparation method of an LED light-emitting device and the LED light-emitting device, including: mounting LED particles or LED chips on a substrate to obtain a substrate with the LED particles or LED chips pasted, wherein the interior of the substrate is There is a flow channel for pouring glue into the concave part of the mold for forming the lens; the substrate with the LED particles or LED chips pasted on the mold is pressed upside down, and the LED particles or LED chips are located in the concave part of the mold, There is a gap between the LED particles or the LED chip and the recessed part of the mold; the flow channel of the substrate is filled with curing glue, and the flow channel is filled with curing glue in the recessed part of the mold. After the curing glue is cured, the curing glue The direct compression molding lens is fixed with the LED particles or LED chips and the substrate.

Description

A low-cost preparation method of LED light-emitting device and LED light-emitting device

technical field

The present invention relates to the technical field of display devices, and more particularly, to a low-cost preparation method of an LED light-emitting device and an LED light-emitting device thereof.

Background technique

The direct type backlight module of the display device generally includes from bottom to top: backplane, LED backlight source, diffuser plate, and other optical films. The LED backlight source includes a plurality of LED light-emitting devices. LED light-emitting devices include: LED strips, Miniled backlight panels, etc. Since the direct-lit backlight module uses the light emitted by the LED backlight to directly illuminate the screen, that is, the light is directly scattered, so the required light mixing height is relatively high. As a result, the thickness of the direct type backlight module is larger than that of the edge type backlight module, and it has been difficult to achieve thinning. LED light-emitting devices are generally composed of substrates, LED particles or LED chips. In order to pursue the thinning of direct-type backlight modules, LED light-emitting devices will mount lenses on top of LED particles. The traditional process of mounting lenses is to use SMT patches. The method of attaching the lens to the top of the LED particles requires high process requirements and low production efficiency.

The prior art proposes an LED light-emitting device with high production efficiency. As described in the invention patent CN112259660A, S1, the LED particles or LED chips are mounted on the substrate of the LED light-emitting device; The concave part is filled with curing glue; S3, the substrate after step S1 is inverted and pressed onto the lens mold plate after step S2, and the position of the LED particles or LED chips corresponds to the position about the middle of the concave part of the lens insert; S4, The substrate and the lens mold plate pressed together after step S3 are cured. After the cured adhesive is cured, the cured adhesive, LED particles or LED chips, and the substrate are fixed together. After the mold is opened, an LED light-emitting device is obtained. However, if the lenses of the entire LED light-emitting device are all molded at one time, the cost of the mold is high, and the existing machine cannot be used for processing due to its large size, which increases the cost of purchasing a new machine. Therefore, in the prior art processing method, the lens on an LED lamp board is not formed at one time, but is formed in batches. The size of the mold is small, and it can be processed by the existing machine, although the time cost is slightly increased, but Reduced tooling costs and the cost of purchasing new machines. And in order to increase the glue pouring efficiency, multiple glue pouring concave parts in the mold are connected by a hot runner, glue is poured from the center point of the hot runner, and the cured glue flows into the concave part through the runners connected to the center point. However, after the glue-filled mold is pressed with the substrate, the cured glue on the flow channel will flow onto the substrate to form a raised glue channel fixed to the upper surface of the substrate, which will be applied to the LED light board. The reflective sheet has an impact, so in the manufacturing process of the LED light panel, the action of cutting the glue channel is performed, and the glue channel is not easy to remove, which greatly increases the time cost and process cost.

In view of this, the present invention provides a low-cost preparation method of an LED light-emitting device and an LED light-emitting device thereof. The cured glue in the flow channel will not form a convex glue channel on the surface of the substrate, and the process of cutting the glue channel on the substrate is not required. work, reducing time costs and process costs.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a low-cost preparation method of an LED light-emitting device and the LED light-emitting device thereof, the cured glue in the flow channel will not form a convex glue channel on the surface of the substrate, and the process of cutting the glue channel on the substrate is not required. work, reducing time costs and process costs.

One aspect of the present application provides a method for preparing a low-cost LED light-emitting device, comprising the steps of:

S1, mounting the LED particles or LED chips on a substrate to obtain a substrate on which the LED particles or LED chips are attached, and the substrate has a flow channel for pouring glue into the concave part of the mold for forming a lens;

S2, place and press the substrate with the LED particles or LED chips pasted on the mold, the LED particles or LED chips are located in the concave part of the mold, and the LED particles or LED chips are located in the concave part of the mold. There is a gap between;

S3, the flow channel of the substrate is filled with curing glue, the flow channel is filled with curing glue on the concave part of the mold, and after the curing glue is cured, the cured glue directly press-molded the lens and the LED particles or the LED chip and the substrate. together.

In some embodiments, one of the runners of the substrate is capable of potting one or more of the recessed portions of the mold.

Further preferably, one flow channel of the base plate is capable of filling a plurality of concave parts of the mold with glue.

In some embodiments, the substrate has one or more flow channels, the shapes of the plurality of flow channels are the same or different, the flow channels include glue points and branch channels, and one flow channel has one or more flow channels For glue dots, a runner has one or more branches.

Further, the glue filling point is arranged on the lower panel of the substrate, the branch channel is a groove arranged inside the substrate, one end of the branch channel is connected with the glue filling point, and the other end is arranged on the LED particles or LEDs. At the gap between the chip and the recessed part of the mold.

Further, the shape of a runner is related to the number of concave parts of the mold connected to the runner, and the shape of the runner is different if the number of the concave parts of the mold connected to the runner is different.

Further, one flow channel is filled with glue to form two lenses, the flow channel is "one" or "I" type, and one glue filling point is set at the center point of the flow channel.

Further, one runner is filled with glue to form 3 lenses, the runner is "Y" shaped, and one glue point is set at the center point of the Y runner.

Further, one runner is filled with glue to form 4 lenses, the runner is in an "X" shape, and one glue point is set at the center point of the X runner.

Further, the number of lenses formed by pouring glue into one flow channel is more than four, the flow channel is composed of two or more parallel branches and a branch perpendicular to the parallel branch, and there are one or more glue pouring points.

Further, the depth of the branch channel is 0.8-1.2 mm, and the width of the branch channel is 1.8-2.2 mm.

Further, when the mold is opened, the glue filling point of the flow channel is automatically cut off.

In some embodiments, the number of recessed portions of a mold is the same or different from the number of LED particles or LED chips of the LED lighting device.

Further preferably, the number of recessed parts of a mold is different from the number of LED particles or LED chips of the LED light-emitting device, and the number of recessed parts of a mold is 1/60- of the number of LED particles or LED chips of the LED light-emitting device. 1/2.

Further, during production, the substrate above the mold can be periodically moved, and an LED light-emitting device can be formed by multiple injection molding.

In some embodiments, the shape of the lens directly molded by curing glue is: M-shape (double-peak overlapping shape), dome shape, semicircle, quadruple-peak overlapping shape, donut shape, circle One of arc, microprism, microlens or microwave guide structure.

In some embodiments, the substrate is one of a PCB substrate, an FPC substrate, a glass substrate, a polyimide substrate, a transparent polyimide substrate, and a polyester resin substrate.

In some embodiments, there are multiple LED particles or LED chips, which are uniformly distributed in rows and columns. The LED particles include LED chips and brackets. The LED chips include: blue LED chips, red LED chips, and green LED chips. One or more of chips, blue-green light LED chips, yellow light LED chips, orange light LED chips, and amber light LED chips.

In another aspect of the present application, an LED light-emitting device is provided, comprising: a substrate, LED particles or LED chips, and a lens, wherein the LED particles or LED chips are mounted on the substrate, and the lens is above the LED particles or LED chips , the lens is directly molded by curing glue, and it is characterized in that the inside of the substrate has a flow channel, and the flow channel is used to fill the recessed part of the mold with glue to form the lens, and the flow channel of the substrate is filled with In order to cure the glue, the flow channel is connected with one or more lenses.

In some embodiments, the substrate has one or more flow channels, and the shapes of the flow channels are the same or different.

Further, one of the flow channels of the substrate is capable of filling one or more concave parts of the mold with glue. Preferably, one flow channel of the base plate is capable of filling a plurality of concave parts of the mold with glue.

In some embodiments, the flow channel includes a gluing point and a branch channel, one flow channel has one or more gluing points, and one flow channel has one or more branch channels.

Further, the glue filling point is arranged on the lower panel of the substrate, the branch channel is arranged inside the substrate, one end of the branch channel is connected with the glue filling point, and the other end is connected with the lens.

Further, the shape of a flow channel is related to the number of lenses connected to the flow channel.

Further, one flow channel is connected with two lenses, the flow channel is of "one" or "I" type, and one glue filling point is set at the center point of the flow channel.

Further, one runner is connected with 3 lenses, the runner is "Y" type, and a glue point is set at the center point of the Y runner.

Further, one flow channel is connected with 4 lenses, the flow channel is "X" type, and a glue point is set at the center point of the X flow channel.

Further, one flow channel is connected with more than 4 lenses, the flow channel is composed of two or more parallel branches and a branch perpendicular to the parallel branch, and there are one or more glue filling points.

Further, the depth of the branch channel is 0.8-1.2 mm, and the width of the branch channel is 1.8-2.2 mm.

In some embodiments, the shape of the lens directly molded by curing glue is: M-shape (double-peak overlapping shape), dome shape, semicircle, quadruple-peak overlapping shape, donut shape, circle One of arc, microprism, microlens or microwave guide structure.

In some embodiments, the substrate is one of a PCB substrate, an FPC substrate, a glass substrate, a polyimide substrate, a transparent polyimide substrate, and a polyester resin substrate.

In some embodiments, there are multiple LED particles or LED chips, which are uniformly distributed in rows and columns. The LED particles include LED chips and brackets. The LED chips include: blue LED chips, red LED chips, and green LED chips. One or more of chips, blue-green light LED chips, yellow light LED chips, orange light LED chips, and amber light LED chips.

Description of drawings

FIG. 1 is a schematic structural diagram of step S2 of the preparation method of the low-cost LED light-emitting device of the present application when it is ready to be pressed.

FIG. 2 is a schematic structural diagram of a "one" type flow channel of the application.

FIG. 3 is a schematic structural diagram of a "Y"-shaped flow channel of the present application.

FIG. 4 is a schematic structural diagram of an "X"-shaped flow channel of the present application.

FIG. 5 is a schematic structural diagram of another flow channel of the present application.

FIG. 6 is a schematic structural diagram of a substrate of the present application.

Detailed ways

The following examples are described to assist the understanding of the present application, and the examples are not and should not be construed in any way to limit the scope of protection of the present application.

In the following description, those skilled in the art will recognize that, throughout this discussion, components may be described as separate functional units (which may include sub-units), but those skilled in the art will recognize that various components or Parts thereof may be divided into separate components, or may be integrated together (including within a single system or component).

Also, connections between components or systems are not intended to be limited to direct connections. Rather, data between these components may be modified, reformatted, or otherwise changed by intervening components. Additionally, additional or fewer connections may be used. It should also be noted that the terms "coupled," "connected," or "input" "fixed" should be understood to include direct connection, indirect connection or fixation through one or more intermediaries.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "side", "vertical", "horizontal", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship of the application product in use or customary knowledge, and is only for the convenience of describing the application and simplifying the description. Rather than indicating or implying that the referred device or element must have a particular orientation, be constructed and operate in a particular orientation, it should not be construed as a limitation on the application.

Example 1:

A preparation method of a low-cost LED light-emitting device, as shown in Figures 1, 4, and 6, includes the steps:

S1, mount the LED particles or LED chips on the substrate to obtain a substrate on which the LED particles or LED chips are pasted, and the substrate has a flow channel for pouring glue into the concave part of the mold for forming the lens; S2, the The substrate on which the LED particles or LED chips are attached is placed and pressed on the mold, the LED particles or LED chips are located in the recessed part of the mold, and there is a gap between the LED particles or LED chips and the recessed part of the mold S3, the flow channel of the substrate is filled with curing glue, the flow channel is filled with curing glue on the recessed part of the mold, and after the curing glue is cured, the curing glue directly press-molded the lens and the LED particles or the LED chip and the substrate. fixed together.

One flow channel of the base plate is capable of filling a plurality of concave parts of the mold with glue. The substrate is provided with a plurality of flow channels, the shapes of the plurality of flow channels are the same, the flow channels include a glue filling point and a branch channel, one flow channel has a glue filling point, and a flow channel has a plurality of branch channels. The glue point is arranged on the lower panel of the substrate, the branch channel is a groove arranged inside the substrate, one end of the branch channel is connected to the glue point, and the other end is arranged between the LED particles or LED chips and the mold the gap between the recessed parts. One runner is filled with glue to form 4 lenses, the runner is "X" type, and one glue point is set at the center point of the X runner. The depth of the branch is 0.8 mm, and the width of the branch is 1.8 mm. When the mold is opened, the glue filling point of the runner is automatically cut off. The number of concave parts of one mold is different from the number of LED particles or LED chips of the LED light emitting device, and the number of concave parts of one mold is 1/20 of the number of LED particles or LED chips of the LED light emitting device. During production, the substrate above the mold can be periodically moved, and an LED light-emitting device can be formed by multiple injection molding. The shape of the lens directly molded by curing glue is M-shaped, the substrate is a PCB substrate, and there are multiple LED particles or LED chips, which are evenly distributed in rows and columns, and the LED particles include LED chips and LED chips. The bracket, the LED chip includes a blue LED chip, a red LED chip and a green LED chip.

Example 2:

An LED light-emitting device, as shown in FIG. 5, includes: a substrate, LED particles or LED chips, and a lens, the LED particles or LED chips are mounted on the substrate, and the lens is above the LED particles or LED chips, so The lens is directly molded by curing glue, and it is characterized in that the inside of the substrate has a flow channel, and the flow channel is used for pouring glue into the concave part of the mold to form the lens, and the flow channel of the substrate is filled with curing glue, the flow channel is connected with one or more lenses.

The substrate has a plurality of flow channels, and the shapes of the plurality of flow channels are the same. One runner of the base plate is capable of pouring glue into the concave parts of 8 of the molds. The flow channel includes a gluing point and a branch channel, one flow channel has one, and one flow channel has a plurality of branch channels. The glue filling point is arranged on the lower panel of the substrate, the branch channel is arranged inside the substrate, one end of the branch channel is connected with the glue filling point, and the other end is connected with the lens. One runner is connected with 8 lenses, the runner is composed of 4 parallel branches and a branch perpendicular to the parallel branch, and there is one glue point. The depth of the branch channel is 1.0 mm, and the width of the branch channel is 2 mm. The shape of the lens directly molded by curing glue is a four-peak overlapping shape, the substrate is an FPC substrate, and there are multiple LED particles or LED chips, which are evenly distributed in rows and columns, and the LED particles include LED chips and brackets, LED chips are blue LED chips.

Although the present application has disclosed various aspects and embodiments, other aspects and embodiments will be apparent to those skilled in the art, and several modifications and improvements can be made without departing from the concept of the present application. All belong to the protection scope of this application. The various aspects and embodiments disclosed in the present application are only used for illustration, and are not intended to limit the present application, and the actual protection scope of the present application is subject to the claims.

Claims (8)

1. A preparation method of a low-cost LED light-emitting device is characterized by comprising the following steps:

s1, mounting the LED particles or the LED chips on a substrate to obtain the substrate with the LED particles or the LED chips mounted thereon, wherein a flow channel for filling glue into a concave part of the mold for forming the lens is arranged in the substrate; a runner capable of pouring a plurality of recessed portions of the mold;

s2, placing and pressing the substrate pasted with the LED particles or the LED chips on a mold, wherein the LED particles or the LED chips are positioned in the concave parts of the mold, and gaps are reserved between the LED particles or the LED chips and the concave parts of the mold;

s3, pouring curing glue into the flow channel of the substrate, pouring curing glue into the recessed part of the mold through the flow channel, and after the curing glue is cured, fixing the lens and the LED particles or the LED chip and the substrate which are directly formed by compression molding of the curing glue; the runner includes encapsulating point and branch way, and a runner has a plurality of branch ways, branch way is the groove that sets up in the base plate inside, the one end and the encapsulating point of branch way are connected, and the other end sets up clearance department between LED granule or LED chip and the mould depressed part.

2. The method of claim 1, wherein the substrate has one or more flow channels, the flow channels have the same or different shapes, and one flow channel has one or more glue filling points, and the glue filling points are disposed on the lower panel of the substrate.

3. The method of claim 2, wherein a runner having a shape related to the number of the concave portions of the mold connected to the runner, one runner is filled with the glue to form 2 lenses, the runner is of a "one" or "I" type, and a filling point is disposed at a center point of the runner; one runner is filled with glue to form 3 lenses, the runner is Y-shaped, and one glue filling point is arranged at the center point of the Y-shaped runner; 4 lenses are formed by pouring glue into one flow channel, the flow channel is in an X shape, and one glue pouring point is arranged at the center point of the X flow channel; the number of the lenses formed by pouring glue into one flow channel is more than 4, the flow channel consists of more than 2 parallel branch channels and a branch channel vertical to the parallel branch channels, and one or more glue pouring points are arranged.

4. The method for manufacturing a low-cost LED light emitting device according to claim 1, wherein the number of the concave portions of one mold is the same as or different from the number of LED particles or LED chips of the LED light emitting device.

5. The method of manufacturing a low-cost LED light emitting device according to claim 4, wherein the number of the concave portions of one mold is 1/60-1/2 of the number of LED particles or LED chips of the LED light emitting device.

6. An LED light emitting device comprising: the LED die comprises a substrate, LED particles or LED chips and a lens, wherein the LED particles or the LED chips are attached to the substrate, the lens is arranged above the LED particles or the LED chips, and the lens is directly molded by curing glue in a compression mode; the runner includes encapsulating point and branch way, and a runner has a plurality of branch ways, branch way sets up inside the base plate, the one end and the encapsulating point of branch way are connected, the other end and lens are connected.

7. The LED light emitting device of claim 6, wherein the substrate has one or more flow channels, the flow channels are identical or different in shape, and one flow channel has one or more glue filling points.

8. The LED light emitting device of claim 7, wherein the potting dots are disposed on the lower panel of the substrate, and a shape of one of the flow channels is related to a number of the flow channel connection lenses.

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