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CN103874394B - 电子装置及其散热器模组 - Google Patents

电子装置及其散热器模组 Download PDF

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Publication number
CN103874394B
CN103874394B CN201210549242.7A CN201210549242A CN103874394B CN 103874394 B CN103874394 B CN 103874394B CN 201210549242 A CN201210549242 A CN 201210549242A CN 103874394 B CN103874394 B CN 103874394B
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Prior art keywords
base
fin
radiator module
fins
section
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Expired - Fee Related
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CN201210549242.7A
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English (en)
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CN103874394A (zh
Inventor
姜云
常志安
翟晓风
卞强
谢炳志
房宁
陆翌琪
刘艳琴
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State Grid Corp of China SGCC
Dezhou Power Supply Co of State Grid Shandong Electric Power Co Ltd
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State Grid Corp of China SGCC
Dezhou Power Supply Co of State Grid Shandong Electric Power Co Ltd
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Priority to CN201210549242.7A priority Critical patent/CN103874394B/zh
Priority to TW101148851A priority patent/TW201428465A/zh
Priority to US13/730,681 priority patent/US9007772B2/en
Publication of CN103874394A publication Critical patent/CN103874394A/zh
Application granted granted Critical
Publication of CN103874394B publication Critical patent/CN103874394B/zh
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种电子装置，包括一机箱、一设于机箱内的电路板、一设于电路板上的散热器模组及一设于机箱内的正对散热器模组的风扇，所述散热器模组包括一底座及若干鳍片，底座的上表面设置若干平行的固持部，每一固持部包括一长形的截面概呈半圆形的卡槽，每一鳍片包括一主体板及一形成于主体板下侧的截面概呈圆形的枢接部，每一鳍片的枢接部枢转安装于底座的对应的卡槽内。相较现有技术，本发明电子装置及其散热器模组的鳍片可枢转地设置于底座上，可枢转鳍片的方向以利风流通过对其它电子元件进行散热。

Description

电子装置及其散热器模组
技术领域
本发明涉及一种电子装置及其散热器模组。
背景技术
在服务器系统中，双CPU或是多CPU架构非常常见，很多时候CPU会采用前后排列的方式，前部CPU因靠近风扇，所以风流流经前部CPU的散热器时流速较快、散热效果较好，而后部CPU因前部CPU的散热器的阻挡，风流流速变低，散热效果较差，不利于后部CPU散热。
发明内容
鉴于以上内容，有必要提供一种电子装置及其散热器模组，可以更加方便远离风扇一侧的电子元件散热。
一种散热器模组，包括一底座及若干鳍片，底座的上表面设置若干平行的固持部，每一固持部包括一长形的截面概呈半圆形的卡槽，每一鳍片包括一主体板及一形成于主体板下侧的截面概呈圆形的枢接部，每一鳍片的枢接部枢转安装于底座的对应的卡槽内。
一种电子装置，包括一机箱、一设于机箱内的电路板、一设于电路板上的散热器模组及一设于机箱内的正对散热器模组的风扇，所述散热器模组包括一底座及若干鳍片，底座的上表面设置若干平行的固持部，每一固持部包括一长形的截面概呈半圆形的卡槽，每一鳍片包括一主体板及一形成于主体板下侧的截面概呈圆形的枢接部，每一鳍片的枢接部枢转安装于底座的对应的卡槽内。
相较现有技术，本发明电子装置及其散热器模组的鳍片可枢转地设置于底座上，可枢转鳍片的方向以利风流通过对其它电子元件进行散热。
附图说明
下面参照附图结合具体实施方式对本发明作进一步的描述。
图1为本发明电子装置的立体示意图。
图2为本发明散热器模组的立体分解图。
图3为图2中III处的放大图。
图4为图2的立体组合图。
图5为图4中V处的放大图。
图6为本发明散热器模组的第二固定架的示意图。
图7为本发明散热器模组的另一使用状态的立体图。
主要元件符号说明
机箱 10
电路板 20
散热器模组 30
底座 31
固定块 311
固定孔 313
固持部 315
卡槽 3151
鳍片 33
主体板 331
枢接部 333
第一固定架 35
定位杆 351、351
定位部 3511、3711
凸片 3513、3713
支撑杆 353、373
固定孔 3531、3731
散热器 40
风扇 50
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明电子装置包括一机箱10、一设于机箱10内的电路板20、一散热器模组30、一散热器40及一风扇50。本实施方式中，散热器模组30用于对安装于电路板20上的一第一CPU（图未示）进行散热，散热器40用于对安装于电路板20上的一第二CPU（图未示）进行散热。风扇50固设于机箱10内并正对散热器模组30。散热器模组30位于风扇50与散热器40之间。
请参阅图2及图3，散热器模组30包括一概呈方形的底座31、若干鳍片33及若干第一固定架35。底座31的四角凸设若干固定块311用于将该散热器模组30固定于电路板20上。底座31的沿风流方向的两相对侧边各开设若干固定孔313。底座31的上表面设置若干平行的固持部315，每一固持部315包括一长形的截面概呈半圆形的卡槽3151。每一鳍片33包括一主体板331及一形成于主体板331下侧的截面概呈圆形的枢接部333。
第一固定架35包括一水平的定位杆351及自定位杆351向下延伸形成的两间隔的竖直的支撑杆353。每一定位杆351的一侧间隔凸设若干定位部3511，每一定位部3511包括与支撑杆353平行的竖直的两凸片3513。每一支撑杆353的远离定位杆351的一端设有一固定孔3531。
请一并参阅图4及图5，每一鳍片33的枢接部333枢转收容于底座31的对应的卡槽3151内。第一固定架35的支撑杆353利用其固定孔3531固定于底座31的侧边的固定孔313内。每一鳍片33的侧缘卡置于对应的第一固定架35的一定位部3511的两凸片3513之间。此时，鳍片33均垂直于底座31。
请一并参阅图6，第二固定架37包括一水平的定位杆371及自定位杆371向下延伸形成的两间隔的竖直的支撑杆373。每一定位杆371的一侧间隔凸设若干定位部3711，每一定位部3711包括与支撑杆373呈一定夹角倾斜的平行的两凸片3713。每一支撑杆373的远离定位杆371的一端设有一固定孔3731。
图7所示为本发明散热器模组30的另一使用状态，部分鳍片33向一侧倾斜一定的角度。第二固定架37的支撑杆373利用其固定孔3731固定于底座31的侧边的固定孔313内。每一鳍片33的侧缘卡置于第二固定架37的一定位部3711的两凸片3713之间，进而在鳍片33的中部形成一风道。如图1所示，风扇50的风流即可经过散热器模组30的鳍片33中间形成的风道流向散热器40，更加有利于散热器40的散热。

Claims (2)

1.一种散热器模组，包括一底座及若干鳍片，底座的上表面设置若干平行的固持部，每一固持部包括一长形的截面概呈半圆形的卡槽，每一鳍片包括一主体板及一形成于主体板下侧的截面概呈圆形的枢接部，每一鳍片的枢接部枢转安装于底座的对应的卡槽内；其中，底座的一侧固设一固定架，固定架包括一定位杆，定位杆间隔凸设若干定位部，每一鳍片的侧缘夹置于对应的定位部。
2.一种电子装置，包括一机箱、一设于机箱内的电路板、一设于电路板上的散热器模组及一设于机箱内的正对散热器模组的风扇，所述散热器模组包括一底座及若干鳍片，底座的上表面设置若干平行的固持部，每一固持部包括一长形的截面概呈半圆形的卡槽，每一鳍片包括一主体板及一形成于主体板下侧的截面概呈圆形的枢接部，每一鳍片的枢接部枢转安装于底座的对应的卡槽内；其中，底座的一侧固设一固定架，固定架包括一定位杆，定位杆间隔凸设若干定位部，每一鳍片的侧缘夹置于对应的定位部。
CN201210549242.7A 2012-12-18 2012-12-18 电子装置及其散热器模组 Expired - Fee Related CN103874394B (zh)

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TW101148851A TW201428465A (zh) 2012-12-18 2012-12-20 電子裝置及其散熱器模組
US13/730,681 US9007772B2 (en) 2012-12-18 2012-12-28 Electronic device with heat dissipation module

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CN103874394A (zh) 2014-06-18
US9007772B2 (en) 2015-04-14
US20140168895A1 (en) 2014-06-19
TW201428465A (zh) 2014-07-16

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