CN103667774B - A kind of preparation method of Copper alloy semiconductor lead frame - Google Patents
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- CN103667774B CN103667774B CN201310615716.8A CN201310615716A CN103667774B CN 103667774 B CN103667774 B CN 103667774B CN 201310615716 A CN201310615716 A CN 201310615716A CN 103667774 B CN103667774 B CN 103667774B
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000000137 annealing Methods 0.000 claims abstract description 57
- 238000005097 cold rolling Methods 0.000 claims abstract description 38
- 238000001556 precipitation Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 11
- 238000005275 alloying Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 230000009467 reduction Effects 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000005098 hot rolling Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000011265 semifinished product Substances 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 230000003143 atherosclerotic effect Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 230000006698 induction Effects 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 229910000863 Ferronickel Inorganic materials 0.000 abstract description 3
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000470 constituent Substances 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 2
- 230000006866 deterioration Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- JUWOETZNAMLKMG-UHFFFAOYSA-N [P].[Ni].[Cu] Chemical compound [P].[Ni].[Cu] JUWOETZNAMLKMG-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004881 precipitation hardening Methods 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000032696 parturition Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides the preparation method of a kind of Copper alloy semiconductor lead frame, constituent optimization by ferronickel phosphor-copper precipitation strength type alloy system, and conservative control annealing temperature, annealing time and cold-rolling process parameter, determine the alloying component and processing technique mated the most, shorten heat treatment time, improve production efficiency, obtain the precipitation hardenable copper alloy having excellent mechanical performance and electric conductivity concurrently simultaneously, by moulding process, it is shaped to semiconductor lead frame the most at last.
Description
Technical field
The present invention relates to the technical field of semiconductor packages, a kind of mechanical property and electric conductivity are particularly provided
The preparation method of excellent copper alloy and the preparation method of semiconductor lead frame manufactured by this copper alloy.
Background technology
Cu alloy material has the mechanical strength of excellence and preferable electric conductivity, and production cost is relative in addition
Cheap, thus it is widely used in the electronic apparatus part manufacture field such as semiconductor lead frame.
However as industrial products such as integrated circuits to high density, miniaturization, the trend of multifunction development,
For it is also proposed the highest wanting as the intensity of the copper alloy of leadframe base materials, electric conductivity
Ask.Copper alloy being had concurrently to mechanical strength and the requirements at the higher level of electric conductivity of excellence, precipitation-hardening is a kind of
The method the most effectively improving copper alloy performance, the particularly copper alloy of copper nickel phosphorus system, its precipitation-hardening
Ability is the most prominent, it is thus achieved that more research and application, such as patent documentation CN200880126328.0
Disclose the precipitation hardenable copper alloy of a kind of copper nickel phosphorus system.
But existing precipitation hardenable copper alloy to be required for carrying out long heat treatment alloy properties to improve
Can, thus be just met in the preparation section in the copper alloy of requirement, such as CN200880126328.0
Include the heat treatment carried out by the copper alloy after cold rolling at least 2 hours.Such preparation technology is not only giving birth to
Produce existing defects in efficiency, cost is also uneconomic.
Summary of the invention
The purpose of the present invention is i.e. that providing a kind of forms reasonable, the precipitation hardenable copper alloy system of excellent performance
The preparation method of the semiconductor lead frame made.
The technical scheme is that and be achieved in that:
The raw-material preparation of copper alloy:
One, dispensing: with percentage by weight as 0.15-0.2Ni, 0.15-0.2Fe, 0.09-0.12P, 0.1-0.15Zn,
0.25-0.3Sn, surplus be Cu and inevitably impurity join and take raw material, wherein must meet (Ni+Fe):
P=3-3.5, described raw material be purity be the powder of 99.99% oxygen-free copper and each alloying element that purity is 99.9%
End；
Two, melting: the raw material prepared is carried out under nitrogen protection atmosphere in coreless induction furnace melting, described molten
Temperature, for first inserting in stove by Cu, Zn, Sn mixing, is risen to 1230-1250 DEG C and continuously stirred melt by refining
It is sufficiently mixed, is subsequently added Ni, Fe and P, be continuously heating to 1280-1300 DEG C and insulation carries out melting,
Casting copper alloys ingot is watered after melting；
Three, hot rolling: carry out hot rolling after copper alloy ingot is heated to 950-980 DEG C to desired thickness,
Finishing temperature control is at 730-750 DEG C；
Four, cold rolling processing: the copper alloy of hot rolling is carried out after the scale removal of milling face 70-75% pressure
The cold rolling processing of rate；
Five, annealing+cold rolling processing: the copper alloy cold rolling processing obtained is under conditions of 570-600 DEG C
After annealing 1.5-2min, again carry out the cold rolling processing of 40-45% reduction ratio, reduce annealing temperature subsequently
To 530-550 DEG C again annealing 1.5-2min, then carry out the cold rolling processing of 40-45% reduction ratio, with
After after 530-550 DEG C again annealing 1.5-2min, then carry out the cold rolling of 40-45% reduction ratio and be worked into
Desired thickness, is finally precipitated atherosclerotic type copper alloy at 380-400 DEG C of condition annealing 2-3min；
The preparation of semiconductor lead frame:
One, punch forming: be partly to lead by punch forming by the precipitation hardenable copper alloy prepared before
Body lead frame semi-finished product；
Two, plating: the semiconductor lead frame semi-finished product through over cleaning pretreatment are carried out electroplating processes with shape
Becoming overlay coating, described coating is at least one in the group that nickel, palladium, gold, silver or its alloy are constituted；
Three, final shaping unit: the semiconductor lead frame semi-finished product of electroplated process are carried out slice processing with finally
Molding.
Wherein preferred, described hot rolling to desired thickness is 1.5-2mm, and the passage of hot rolling is at least
It is 6.
It is further preferred that in described annealing+cold rolling processing, the most cold rolling desired thickness that is worked into is
0.2-0.4mm。
It is further preferred that alloying element content is 0.17Ni, 0.17Fe, 0.1P.
It is further preferred that the content of alloy element Zn is 0.12.
It is further preferred that the content of alloying element Sn is 0.28.
It is further preferred that in annealing+cold rolling processing, the temperature of annealing is 580 DEG C for the first time, annealing
Time is 1.8min；Rear twice annealed temperature is 540 DEG C, and annealing time is 1.8min；Final annealing
Temperature is 380 DEG C, and annealing time is 2min.
It is further preferred that in annealing+cold rolling processing, the reduction ratio of cold rolling processing is 43%.
It is further preferred that the coating that described overlay coating is nickel or its alloy.
It is an advantage of the current invention that: have selected ferronickel phosphor-copper precipitation strength type alloy system, optimize each alloy
The proportioning of element, and with the addition of Zn, Sn alloying element in right amount, control annealing temperature, annealing time and
Cold-rolling process parameter, shortens heat treatment time, improves production efficiency, obtains simultaneously and has excellent mechanical concurrently
The precipitation hardenable copper alloy of performance and electric conductivity, and the preparation of precipitation hardenable copper alloy is become quasiconductor
Lead frame.
Detailed description of the invention
Embodiment 1-6, and comparative example 1*-8*:
One, dispensing: join with the percentage by weight shown in table 1 and take raw material, described raw material be purity be 99.99%
Oxygen-free copper and purity are the powder of each alloying element of 99.9%；
Two, melting: the raw material prepared is carried out under nitrogen protection atmosphere in coreless induction furnace melting, described molten
Temperature, for first inserting in stove by Cu, Zn, Sn mixing, is risen to 1240 DEG C and continuously stirred melt is abundant by refining
Mixing, is subsequently added Ni, Fe and P, is continuously heating to 1300 DEG C and insulation carries out melting, cast after melting
Obtain the copper alloy ingot of Ф 30mm, long 200mm；
Three, hot rolling: carry out 6 passage hot rollings after copper alloy ingot is heated to 960 DEG C to 8mm,
Finishing temperature control is at 740 DEG C；
Four, cold rolling processing: the copper alloy of hot rolling is carried out after the scale removal of milling face 75% reduction ratio
Cold rolling processing；
Five, annealing+cold rolling processing: copper alloy thick for the 2mm cold rolling processing obtained is at 570 DEG C
Under the conditions of make annealing treatment after 1.5min, again carry out the cold rolling processing of 40% reduction ratio, reduce annealing temperature subsequently
Spend to 530 DEG C again annealing 1.5min, then carry out the cold rolling processing of 40% reduction ratio, exist subsequently
530 DEG C again after annealing 1.5min, then carry out the cold rolling of 40% reduction ratio and be worked into desired thickness,
It is precipitated atherosclerotic type copper alloy eventually at 380 DEG C of conditions annealing 2min.
Table 1
As shown in Table 1, the content of Ni, Fe, P and relevant ratio are for the combination property of copper alloy
The interpolation having very important impact, first P can not be excessive, and drawing abillity otherwise will be made tight
Heavily deteriorate, it is necessary to its addition is limited in less than 0.12%, but can not otherwise will be difficult to reach very little
The purpose of precipitation strength, therefore at least to add 0.09%；And it is strong in order to form Ni, Fe, P composite precipitation
Change precipitated phase, it should meeting (Ni+Fe): P=3-3.5, the excessive raising being unprofitable to intensity of ratio is made on the contrary
Becoming processing characteristics and the deterioration of electric conductivity, ratio is too small, is difficult to be formed the need of composite precipitation strengthening precipitated phase
Ask.Particularly preferred, alloying element percentage composition is 0.17Ni, 0.17Fe, 0.1P.Zn and Sn is for this
In invention alloy system, the raising of intensity also functions to great role, but too high addition can not be proportional
Improving intensity, can deteriorate processing characteristics on the contrary, too low addition then can not produce corresponding effect, especially
Preferably, the Sn of the Zn and 0.28% adding 0.12% is coordinated.
Embodiment 7-10, and comparative example 9*-12*, the composition of alloy not embodiment 2 is identical, moves back for the first time
Fire temperature and time (A), the annealing temperature of latter twice and time (B), the temperature and time of final annealing
(C), the preparation technology parameter such as reduction ratio of cold rolling processing sees table 2.
Table 2
As shown in Table 2, the temperature of annealing, intermediate annealing and final annealing is unsuitable too high first, no
Then the intensity causing copper alloy is not reached requirement, but can not be the lowest, the lowest effect not having annealing,
Cause processing characteristics and electric conductivity not to reach requirement, simultaneously take account of the impact of middle cold rolling processing, it should
The temperature annealed first is set above the temperature of intermediate annealing, and the temperature of final annealing then should be tried one's best
Low；And annealing time should also be as moderate, long annealing time is not only unprofitable to processing characteristics and electric conductivity
Be greatly improved, also result in the deterioration of intensity, be also the most not in production efficiency, energy consumption simultaneously
Profit, too short annealing time then but the purpose modified less than annealing；Particularly preferred, anneal first
Temperature is 580 DEG C, and annealing time is 1.8min；The temperature of intermediate annealing is 540 DEG C, and annealing time is
1.8min；The temperature of final annealing is 380 DEG C, and annealing time is 2min.The reduction ratio of cold rolling processing needs
Controlling at 40-45%, too high reduction ratio can cause the deterioration of processing characteristics and electric conductivity, too low pressure
Rate does not then have increase hardening constituent and separates out, and compensates the purpose of anneal intensity loss.
Embodiment 11 is that the copper alloy using embodiment 9 to obtain prepares semiconductor lead frame, specifically:
One, punch forming: be semiconductor lead frame semi-finished product by punch forming by copper alloy；
Two, plating: the semiconductor lead frame semi-finished product through over cleaning pretreatment are carried out electroplating processes with shape
Becoming overlay coating, described coating is nickel coating；
Three, final shaping unit: the semiconductor lead frame semi-finished product of electroplated process are carried out slice processing with finally
Molding.
To sum up, the present invention constituent optimization by ferronickel phosphor-copper precipitation strength type alloy system, and conservative control
Annealing temperature, annealing time and cold-rolling process parameter, determine the alloying component and processing technique mated the most,
Shorten heat treatment time, improve production efficiency, obtain simultaneously and have excellent mechanical performance and electric conductivity concurrently
Precipitation hardenable copper alloy, by moulding process, it is shaped to semiconductor lead frame the most at last.
Claims (6)
1. a preparation method for Copper alloy semiconductor lead frame, it includes following preparation process:
The raw-material preparation of copper alloy:
One, dispensing: with percentage by weight as 0.17Ni, 0.17Fe, 0.1P, 0.12Zn, 0.28Sn, surplus be as Cu with inevitable
Impurity join and take raw material, described raw material be purity be the powder of 99.99% oxygen-free copper and each alloying element that purity is 99.9%；
Two, melting: the raw material prepared is carried out under nitrogen protection atmosphere in coreless induction furnace melting, described melting be first by Cu, Zn,
Sn mixing is inserted in stove, temperature rises to 1230-1250 DEG C and continuously stirred melt is sufficiently mixed, be subsequently added Ni, Fe and P,
It is continuously heating to 1280-1300 DEG C and insulation carries out melting, after melting, water casting copper alloys ingot；
Three, hot rolling: carry out hot rolling after copper alloy ingot is heated to 950-980 DEG C and exist to desired thickness, finishing temperature control
730-750℃；
Four, cold rolling processing: the copper alloy of hot rolling is carried out after the scale removal of milling face the cold rolling processing of 70-75% reduction ratio；
Five, annealing+cold rolling processing: the copper alloy cold rolling processing obtained makes annealing treatment 1.5-2min under conditions of 570-600 DEG C
After, again carry out the cold rolling processing of 40-45% reduction ratio, reduce annealing temperature subsequently and again make annealing treatment to 530-550 DEG C
After 1.5-2min, then carry out the cold rolling processing of 40-45% reduction ratio, subsequently after 530-550 DEG C again annealing 1.5-2min,
Carry out the cold rolling of 40-45% reduction ratio again and be worked into desired thickness, be finally precipitated at 380-400 DEG C of condition annealing 2-3min
Atherosclerotic type copper alloy；
The preparation of semiconductor lead frame:
One, punch forming: be semiconductor lead frame semi-finished product by punch forming by the precipitation hardenable copper alloy prepared before；
Two, plating: the semiconductor lead frame semi-finished product through over cleaning pretreatment are carried out electroplating processes to form overlay coating, described
Coating is at least one in the group that nickel, palladium, gold, silver or its alloy are constituted；
Three, final shaping unit: the semiconductor lead frame semi-finished product of electroplated process are carried out slice processing with final molding.
Preparation method the most according to claim 1, it is characterised in that: described hot rolling to desired thickness is 1.5-2mm, heat
The passage rolling processing is at least 6.
Preparation method the most according to claim 1, it is characterised in that: in described annealing+cold rolling processing, the most cold rolling add
Work is 0.2-0.4mm to desired thickness.
Preparation method the most according to claim 1, it is characterised in that: in annealing+cold rolling processing, the temperature of annealing for the first time
Degree is 580 DEG C, and annealing time is 1.8min；Rear twice annealed temperature is 540 DEG C, and annealing time is 1.8min；Final annealing
Temperature be 380 DEG C, annealing time is 2min.
Preparation method the most according to claim 1, it is characterised in that: in annealing+cold rolling processing, the pressure of cold rolling processing
Rate is 43%.
Preparation method the most according to claim 1, it is characterised in that: described overlay coating is the coating of nickel or its alloy.
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| CN105088006A (en) * | 2015-09-02 | 2015-11-25 | 宁波兴业盛泰集团有限公司 | Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof |
| KR102746569B1 (en) * | 2017-02-04 | 2024-12-24 | 마테리온 코포레이션 | Copper-nickel-tin alloys |
| CN116479485B (en) * | 2023-05-04 | 2023-10-20 | 泰州东田电子有限公司 | High-reliability lead frame and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940104A (en) * | 2006-08-16 | 2007-04-04 | 苏州有色金属加工研究院 | Copper alloy for lead-wire frame and its production |
| CN101225488A (en) * | 2008-01-15 | 2008-07-23 | 上海理工大学 | Copper alloy material for lead frame and preparation method thereof |
| CN102286675A (en) * | 2010-06-18 | 2011-12-21 | 日立电线株式会社 | Copper alloy material for electrical and electronic parts and method for producing same |
| CN102983083A (en) * | 2012-12-24 | 2013-03-20 | 厦门永红科技有限公司 | Lead wire frame and production method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2010285671A (en) * | 2009-06-15 | 2010-12-24 | Hitachi Cable Ltd | High strength and high conductivity copper alloy and method for producing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940104A (en) * | 2006-08-16 | 2007-04-04 | 苏州有色金属加工研究院 | Copper alloy for lead-wire frame and its production |
| CN101225488A (en) * | 2008-01-15 | 2008-07-23 | 上海理工大学 | Copper alloy material for lead frame and preparation method thereof |
| CN102286675A (en) * | 2010-06-18 | 2011-12-21 | 日立电线株式会社 | Copper alloy material for electrical and electronic parts and method for producing same |
| CN102983083A (en) * | 2012-12-24 | 2013-03-20 | 厦门永红科技有限公司 | Lead wire frame and production method thereof |
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