CN101250644A - Copper-base alloy capable of being used for lead frame material and manufacture method thereof - Google Patents
Copper-base alloy capable of being used for lead frame material and manufacture method thereof Download PDFInfo
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- CN101250644A CN101250644A CNA2008100340120A CN200810034012A CN101250644A CN 101250644 A CN101250644 A CN 101250644A CN A2008100340120 A CNA2008100340120 A CN A2008100340120A CN 200810034012 A CN200810034012 A CN 200810034012A CN 101250644 A CN101250644 A CN 101250644A
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- 239000000956 alloy Substances 0.000 title claims abstract description 56
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 49
- 239000000463 material Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 62
- 239000010949 copper Substances 0.000 claims abstract description 62
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 27
- 229910052709 silver Inorganic materials 0.000 claims abstract description 22
- 239000004332 silver Substances 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 16
- 239000012535 impurity Substances 0.000 claims abstract description 14
- 238000002360 preparation method Methods 0.000 claims abstract description 13
- 230000032683 aging Effects 0.000 claims description 43
- 238000005097 cold rolling Methods 0.000 claims description 32
- 238000005266 casting Methods 0.000 claims description 15
- 238000002791 soaking Methods 0.000 claims description 15
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 13
- 238000005242 forging Methods 0.000 claims description 10
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 3
- 238000003723 Smelting Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 description 5
- 230000004927 fusion Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000005303 weighing Methods 0.000 description 4
- 238000005275 alloying Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- Conductive Materials (AREA)
Abstract
The invention discloses a copper base alloy which can be used as lead frame material and the process for preparation thereof, wherein the alloy comprises 1.0-3.5wt% nickel, 0.2-0.8wt% silicon, and 0.06-0.15wt% silver, the others are copper and unavoidable impurities. The invention improves the property of the alloy through adding trace quantity of silver. Tensile strength of the copper base alloy which is prepared by the invention achieves 600-850MPa, electric conductivity achieves 50-75%IACS, percentage of elongation is more than 5%, and softening temperature is more than 450 DEG C, and the copper base alloy can better satisfy the requirements of electronic industry fields such as lead frame material and the like to the property of copper base alloy.
Description
Technical field
The present invention relates to a kind of nickel and make the copper base alloy of time main component, relate to a kind ofly possess high strength and middle conductivity can be used as copper base alloy of blaster fuse frame material and preparation method thereof in particular.
Background technology
Unicircuit is the basis and the core of electronics and information industry, and blaster fuse frame material then is the main raw of unicircuit encapsulation.The copper base blaster fuse frame material of having developed at present mainly contains CuNiSi system, CuFeP system, CuCrZr system, CuAg system etc.The major country of production of copper base blaster fuse frame material is Japan, the U.S., Germany, France and Britain, and is wherein Japanese with fastest developing speed, occupied the lead frame market in the whole world about 70%.Circuit lead frame quality, output and the kind of China have a long way to go compared with developed countries.Product only limits to 3 trade mark: KFC (the Japanese trade mark, i.e. C19210), C194 and the C1220 (U.S.'s trade mark) of Cu-Fe-P alloy, and the lead frame copper strip industrial scale is little, the quality low precision.
Patent about blaster fuse frame material relates generally to CuCrZr and CuFeP alloy both at home and abroad, for example Chinese patent application number 03149851.5, disclosed copper alloy contains 1.0～3.5% Ni, 0.1～1.0% Si, 0.05～0.4% mishmetal, surplus are copper and unavoidable impurities, but its over-all properties is relatively low, alloy strength is 546～750MPa, and electric conductivity is 44～59.5%IACS.Another patent 86102885 of China adds Mg to improve its intensity and anti-relaxed stress on the basis of CuNiSi; Its alloys range is Ni:2～4.8%, Si:0.2～1.4%, Mg:0.05～0.45%.Chinese patent application 200510065789.X, relating to a copper alloy with high strength and high conductivity Ni content is 1.5～4.0%, Si content is 0.15～1.0%, contains a kind of to improve its over-all properties among 0.01～1.0% Zn, Mg, Sn and the In simultaneously.U.S. Pat 5846346 adds Sn to improve its intensity on the basis of CuNiSi, its alloys range is Ni:0.5～4%, Si:0.1～1%, Sn:0.05～0.8%.The difference of each patent is the difference of alloying constituent, improves the over-all properties of alloy by adding suitable trace element.
Summary of the invention
Technical problem to be solved by this invention provides high strength and high conductive lead frame copper base alloy and preparation method thereof of a kind of excellent combination property.
The technical solution used in the present invention: a kind of copper base alloy that can be used as blaster fuse frame material, contain 1.0～3.5wt% nickel, 0.2～0.8wt% silicon, 0.06～0.15wt% silver, all the other are copper and unavoidable impurities.
Described copper base alloy contains 1.0～1.6wt% nickel, 0.23～0.36wt% silicon, 0.08～0.1wt% silver, and all the other are copper and unavoidable impurities.
Described copper base alloy contains 2.0～2.4wt% nickel, 0.45～0.55wt% silicon, 0.08～0.1wt% silver, and all the other are copper and unavoidable impurities.
Described copper base alloy contains 2.9～3.3wt% nickel, 0.65～0.75wt% silicon, 0.08～0.1wt% silver, and all the other are copper and unavoidable impurities.
The tensile strength of described copper base alloy reaches that 600～850MPa, specific conductivity reach 50～75%IACS, unit elongation reaches more than 5%, and softening temperature reaches more than 450 ℃.
The preparation method of described copper base alloy comprises the following steps:
A. according to 1.0～3.5wt% nickel, 0.2～0.8wt% silicon, 0.06～0.15wt% silver, all the other carry out smelting copper alloy for the ratio of copper;
B. the ingot casting that step a is obtained carries out forge hot, and hot forging temperature is 850～900 ℃, forging deformation amount 65～80%;
C. the ingot casting after the forge hot is carried out solution treatment in chamber type electric resistance furnace, controlled temperature is 850～940 ℃, and insulation 1～2h carries out shrend then;
D. on double-roll rolling mill, carry out then cold rolling, cold rolling reduction 30～70%;
E. adopt the interrupted aging art breading, aging temp is 400～500 ℃, and soaking time is 0.25～6h;
F. alloy is carried out finally cold roller and deformed, cold rolling reduction 30～80%.
Repeating step e carries out secondary or the above interrupted aging art breading of secondary, can improve the performance of final alloy product.
Treatment temp should progressively reduce when carrying out the above interrupted aging art breading of secondary or secondary.
Step f controls cold rolling reduction 30～80%.
Beneficial effect of the present invention: the Cu alloy material of the present invention preparation belongs to the Cu alloy material that high-strength highly-conductive has both, and over-all properties is superior, alloy structure is even, precipitated phase small and dispersed, softening temperature height, and the alloy price is relatively low, the production efficiency height.The copper base alloy of the present invention preparation is second to separate out mutually and produce reinforcement, and that separates out second is Ni mutually
2Si.Have only and adopt suitable Ni, Si element wt ratio could guarantee behind the alloy aging in the matrix residual less alloying element and make the higher electric conductivity of alloy acquisition, so the part by weight of Ni, Si element is controlled between 4.0～4.5.Because Ag is to the almost not influence of electroconductibility of copper matrix, its crystalline structure with copper is identical simultaneously, lattice constant is close, after adding the Ag element, it can preferentially dissolve in the copper matrix and then can impel separating out of elements such as Ni, Si, and Ag dissolves in the effect that also has solution strengthening behind the copper matrix, and the resistance to elevated temperatures that improves copper.The solubleness of Ag in copper is about 0.1wt% during room temperature, but Ag belongs to noble metal, is controlled at the scope of 0.06～0.15wt% according to the add-on of cost and performance requriements Ag.The copper base alloy tensile strength of the present invention preparation reaches that 600～850MPa, specific conductivity reach 50～75%IACS, unit elongation reaches more than 5%, softening temperature is more than 450 ℃, can satisfy preferably electronics industry such as blaster fuse frame material with material to the copper alloy performance demands.
Embodiment
Below by embodiment the present invention is described in further detail: a kind of copper base alloy that can be used as blaster fuse frame material, contain 1.0～3.5wt% nickel, 0.2～0.8wt% silicon, 0.06～0.15wt% silver, all the other are copper and unavoidable impurities.
Described copper base alloy contains 1.0～1.6wt% nickel, 0.23～0.36wt% silicon, 0.08～0.1wt% silver, and all the other are copper and unavoidable impurities.
Described copper base alloy contains 2.0～2.4wt% nickel, 0.45～0.55wt% silicon, 0.08～0.1wt% silver, and all the other are copper and unavoidable impurities.
Described copper base alloy contains 2.9～3.3wt% nickel, 0.65～0.75wt% silicon, 0.08～0.1wt% silver, and all the other are copper and unavoidable impurities.
The preparation method of described copper base alloy comprises the following steps:
A. according to 1.0～3.5wt% nickel, 0.2～0.8wt% silicon, 0.06～0.15wt% silver, all the other carry out smelting copper alloy for the ratio of copper;
B. the ingot casting that step a is obtained carries out forge hot, and hot forging temperature is 850～900 ℃, forging deformation amount 65～80%;
C. the ingot casting after the forge hot is carried out solution treatment in chamber type electric resistance furnace, controlled temperature is 850～940 ℃, and insulation 1～2h carries out shrend then;
D. on double-roll rolling mill, carry out then cold rolling, cold rolling reduction 30～70%;
E. adopt the interrupted aging art breading, aging temp is 400～500 ℃, and soaking time is 0.25～6h;
F. alloy is carried out finally cold roller and deformed, cold rolling reduction 30～80%.
Repeating step e carries out secondary or the above interrupted aging art breading of secondary, can improve the performance of final alloy product.Treatment temp should progressively reduce when carrying out the above interrupted aging art breading of secondary or secondary.Step f control cold rolling reduction can be 30～80%.
Embodiment 1
Take by weighing 1.3%Ni, 0.3%Si, 0.08%Ag according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 70%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 860 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 70%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 480 ℃, soaking time is 2h, carry out deflection again and be 40% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 450 ℃, soaking time is 3h, obtains the interrupted aging material.The interrupted aging material is carried out final cold-rolling treatment, and deflection is 75%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 625MPa, specific conductivity reaches 450 ℃ of 73%IACS, softening temperatures.
Embodiment 2
Take by weighing 2.2%Ni, 0.5%Si, 0.08%Ag according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 70%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 900 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 45%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 480 ℃, soaking time is 2h, carry out deflection again and be 40% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 440 ℃, soaking time is 3h, obtains the interrupted aging material.The interrupted aging material is carried out final cold-rolling treatment, and deflection is 45%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 730MPa, specific conductivity reaches 470 ℃ of 59%IACS, softening temperatures.
Embodiment 3
Take by weighing 2.2%Ni, 0.5%Si, 0.13%Ag according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 70%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 900 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 45%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 480 ℃, soaking time is 2h, carry out deflection again and be 40% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 440 ℃, soaking time is 3h, obtains the interrupted aging material.The interrupted aging material is carried out final cold-rolling treatment, and deflection is 50%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 730MPa, specific conductivity reaches 470 ℃ of 59%IACS, softening temperatures.
Embodiment 4
Take by weighing 3.1%Ni, 0.7%Si, 0.1%Ag according to weight percent, all the other are copper, and each component is mixed the back 1200～1350 ℃ of following meltings, injects mold after the fusion, forms ingot casting; To the ingot casting forge hot, its temperature is 850～900 ℃, and the forging deformation amount is 70%, obtains the forge hot material; The forge hot material is carried out solution treatment, and its temperature is 930 ℃, and soaking time is 1h, and shrend then obtains cold material; To the pre-cold rolling processing of this cold material, deflection is 60%, obtains pre-cold rolling material; To pre-cold rolling stock grading ageing treatment is twice, interrupted aging is handled for the first time, aging temp is 480 ℃, soaking time is 2h, carry out deflection again and be 40% cold-rolling treatment, carry out second time interrupted aging then and handle, aging temp is 430 ℃, soaking time is 3h, obtains the interrupted aging material.The interrupted aging material is carried out final cold-rolling treatment, and deflection is 60%, promptly obtains copper alloy material for lead frame, and its tensile strength reaches 840MPa, specific conductivity reaches 500 ℃ of 56%IACS, softening temperatures.
Embodiment 1～4 becomes qualified ingot casting with Cu, Ni, Si, the P of certain proportioning according to the ratio founding of table 1, carry out forge hot at 850～900 ℃, then carry out technologies such as solution treatment, cold roller and deformed and interrupted aging, Ni, Si, P are fully separated out from matrix, thereby obtain the high strength of excellent combination property and the Cu alloy material that high conduction performance has concurrently, its over-all properties sees Table 1.
Table 1
| Embodiment | 1 | 2 | 3 | 4 |
| Alloying constituent/wt% solution treatment/℃ cold roller and deformed/% interrupted aging/℃ end is cold roller and deformed/% tensile strength/MPa | Cu- 1.3Ni-0.3Si-0 .08Ag 860 70 480，450 75 625 | Cu- 2.2Ni-0.5Si- 0.08Ag 900 45 480，440 45 730 | Cu- 2.2Ni-0.5Si-0. 13Ag 900 45 480，440 50 750 | Cu- 3.1Ni-0.7Si- 0.1Ag 930 60 480，430 60 840 |
| Specific conductivity/%IACS softening temperature/℃ | 73 450 | 59 470 | 66 470 | 56 500 |
Above said content only is the basic explanation of the present invention under conceiving, and according to any equivalent transformation that technical scheme of the present invention is done, all should belong to protection scope of the present invention.
Claims (9)
1. a copper base alloy that can be used as blaster fuse frame material contains 1.0～3.5wt% nickel, 0.2～0.8wt% silicon, 0.06～0.15wt% silver, and all the other are copper and unavoidable impurities.
2. according to the described copper base alloy of claim 1, it is characterized in that: contain 1.0～1.6wt% nickel, 0.23～0.36wt% silicon, 0.08～0.1wt% silver, all the other are copper and unavoidable impurities.
3. according to the described copper base alloy of claim 1, it is characterized in that: contain 2.0～2.4wt% nickel, 0.45～0.55wt% silicon, 0.08～0.1wt% silver, all the other are copper and unavoidable impurities.
4. according to the described copper base alloy of claim 1, it is characterized in that: contain 2.9～3.3wt% nickel, 0.65～0.75wt% silicon, 0.08～0.1wt% silver, all the other are copper and unavoidable impurities.
5. according to any one described copper base alloy of claim 1～4, it is characterized in that: the tensile strength of described copper base alloy reaches that 600～850MPa, specific conductivity reach 50～75%IACS, unit elongation reaches more than 5%, and softening temperature reaches more than 450 ℃.
6. the preparation method of the described copper base alloy of claim 1 comprises the following steps:
A. according to 1.0～3.5wt% nickel, 0.2～0.8wt% silicon, 0.06～0.15wt% silver, all the other carry out smelting copper alloy for the ratio of copper;
B. the ingot casting that step a is obtained carries out forge hot, and hot forging temperature is 850～900 ℃, forging deformation amount 65～80%;
C. the ingot casting after the forge hot is carried out solution treatment in chamber type electric resistance furnace, controlled temperature is 850～940 ℃, and insulation 1～2h carries out shrend then;
D. on double-roll rolling mill, carry out then cold rolling, cold rolling reduction 30～70%;
E. adopt the interrupted aging art breading, aging temp is 400～500 ℃, and soaking time is 0.25～6h;
F. alloy is carried out finally cold roller and deformed, cold rolling reduction 30～80%.
7. according to the preparation method of the described copper base alloy of claim 6, it is characterized in that: repeating step e carries out secondary or the above interrupted aging art breading of secondary.
8. according to the preparation method of claim 7 copper base alloy, it is characterized in that: treatment temp progressively reduces when carrying out the above interrupted aging art breading of secondary or secondary.
9. according to the preparation method of the described copper base alloy of claim 6, it is characterized in that: step f controls cold rolling reduction 30～50%.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812612A (en) * | 2010-05-13 | 2010-08-25 | 中铝洛阳铜业有限公司 | Nickel-copper alloy rod or profile for high-speed electrified railway in CY state |
| CN102982975A (en) * | 2012-12-04 | 2013-03-20 | 江苏亚威变压器有限公司 | Low-consumption loss transformer |
| CN104046843A (en) * | 2014-06-30 | 2014-09-17 | 中色奥博特铜铝业有限公司 | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof |
| CN105088008A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Microalloyed copper alloy frame strip and manufacturing method thereof |
| CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
-
2008
- 2008-02-28 CN CNA2008100340120A patent/CN101250644A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812612A (en) * | 2010-05-13 | 2010-08-25 | 中铝洛阳铜业有限公司 | Nickel-copper alloy rod or profile for high-speed electrified railway in CY state |
| CN101812612B (en) * | 2010-05-13 | 2011-10-05 | 中铝洛阳铜业有限公司 | Nickel-copper alloy rod or profile for high-speed electrified railway in CY state |
| CN102982975A (en) * | 2012-12-04 | 2013-03-20 | 江苏亚威变压器有限公司 | Low-consumption loss transformer |
| CN104046843A (en) * | 2014-06-30 | 2014-09-17 | 中色奥博特铜铝业有限公司 | Copper-nickel-silicon alloy material containing rare-earth cerium, lead frame strip and preparation method thereof |
| CN105088008A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Microalloyed copper alloy frame strip and manufacturing method thereof |
| CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
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Open date: 20080827 |