CN103667775B - A kind of Copper alloy semiconductor lead frame - Google Patents
A kind of Copper alloy semiconductor lead frame Download PDFInfo
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- CN103667775B CN103667775B CN201310615729.5A CN201310615729A CN103667775B CN 103667775 B CN103667775 B CN 103667775B CN 201310615729 A CN201310615729 A CN 201310615729A CN 103667775 B CN103667775 B CN 103667775B
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- lead frame
- cold rolling
- copper alloy
- semiconductor lead
- anneal
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000000137 annealing Methods 0.000 claims abstract description 39
- 238000012545 processing Methods 0.000 claims abstract description 39
- 238000005097 cold rolling Methods 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000001556 precipitation Methods 0.000 claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 238000005275 alloying Methods 0.000 claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 238000005098 hot rolling Methods 0.000 claims description 13
- 239000002994 raw material Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 230000002784 sclerotic effect Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000470 constituent Substances 0.000 abstract description 4
- 229910000863 Ferronickel Inorganic materials 0.000 abstract description 3
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000013011 mating Effects 0.000 abstract description 2
- 238000005457 optimization Methods 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- JUWOETZNAMLKMG-UHFFFAOYSA-N [P].[Ni].[Cu] Chemical compound [P].[Ni].[Cu] JUWOETZNAMLKMG-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005713 exacerbation Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a kind of Copper alloy semiconductor lead frame, it is the constituent optimization by ferronickel phosphor-copper precipitation strength type alloy system, and conservative control annealing temperature, annealing time and cold-rolling process parameter, determine the alloying constituent of mating the most and complete processing, shorten heat treatment time, improve production efficiency, obtain the precipitation hardenable copper alloy having excellent mechanical performance and conductivity concurrently, by moulding process, it is shaped to semiconductor lead frame the most at last subsequently simultaneously.
Description
Technical field
The present invention relates to the technical field of semiconductor packages, semiconductor lead frame that is that the copper alloy of a kind of mechanical property and conductivity excellence is particularly provided and that manufactured by this copper alloy.
Background technology
Cu alloy material has excellent physical strength and good conductivity, and production cost relative moderate, is thus widely used in the electronic apparatus part manufacture field such as semiconductor lead frame in addition.
But along with the Industrial products such as unicircuit are to the trend of high-density, miniaturization, multifunction development, more and more higher requirement be it is also proposed for the intensity of the copper alloy as leadframe base materials, conductivity.Excellent physical strength and the requirements at the higher level of conductivity are had concurrently for copper alloy, precipitation hardening is a kind of method comparatively effectively improving copper alloy performance, the particularly copper alloy of copper nickel phosphorus system, its precipitation strengthening capacity is comparatively outstanding, obtain more investigation and application, such as, disclose a kind of precipitation hardenable copper alloy of copper nickel phosphorus system with sharp document CN200880126328.0.
But existing precipitation hardenable copper alloy all needs to carry out long thermal treatment to improve alloy property, thus be met the copper alloy of requirement, just include the thermal treatment carried out by the copper alloy after cold rolling at least 2 hours in such as, preparation section in CN200880126328.0.Such preparation technology is existing defects in production efficiency not only, cost is also uneconomic.
Summary of the invention
Namely object of the present invention is to provide a kind of semiconductor lead frame forming precipitation hardenable copper alloy that is reasonable, excellent performance and manufacture.
Technical scheme of the present invention is achieved in that
The raw-material preparation of copper alloy:
One, prepare burden: take weight percent as 0.15-0.2Ni, 0.15-0.2Fe, 0.09-0.12P, 0.1-0.15Zn, 0.25-0.3Sn, surplus for Cu and inevitably impurity join and get raw material, wherein must meet (Ni+Fe): P=3-3.5, the powder of described raw material is purity to be 99.99% oxygen free copper and purity be each alloying element of 99.9%;
Two, melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, described melting is for first inserting in stove by Cu, Zn, Sn mixing, temperature is risen to 1230-1250 DEG C and Keep agitation melt fully to mix, add Ni, Fe and P subsequently, continue to be warming up to 1280-1300 DEG C and be incubated and carry out melting, after melting, water casting copper alloys ingot;
Three, hot rolling: carry out hot rolling after copper alloy ingot is heated to 950-980 DEG C to desired thickness, finishing temperature control is at 730-750 DEG C;
Four, cold rolling processing: the cold rolling processing copper alloy of hot rolling being carried out after the scale removal of milling face 70-75% draft;
Five, anneal+cold rolling processing: the copper alloy cold rolling processing obtained is under the condition of 570-600 DEG C after anneal 1.5-2min, again carry out the cold rolling processing of 40-45% draft, after reducing annealing temperature to 530-550 DEG C again anneal 1.5-2min subsequently, carry out the cold rolling processing of 40-45% draft again, subsequently after 530-550 DEG C again anneal 1.5-2min, carry out the cold rolling of 40-45% draft again and be worked into desired thickness, be finally precipitated sclerotic type copper alloy at 380-400 DEG C of condition annealing 2-3min;
The preparation of semiconductor lead frame:
One, impact briquetting: be semiconductor lead frame work in-process by impact briquetting by the precipitation hardenable copper alloy prepared before;
Two, electroplate: will carry out electroplating processes to form overlay coating through the pretreated semiconductor lead frame work in-process of cleaning, described coating is at least one in the group of nickel, palladium, gold and silver or its alloy formation;
Three, final shaping unit: the semiconductor lead frame work in-process through electroplating processes are carried out slice processing with final molding.
Wherein preferred, described hot rolling is 1.5-2mm to desired thickness, and the passage of hot rolling is at least 6.
Preferred further, in described anneal+cold rolling processing, finally the cold rolling desired thickness that is worked into is 0.2-0.4mm.
Preferred further, alloying element content is 0.17Ni, 0.17Fe, 0.1P.
Preferred further, the content of alloy element Zn is 0.12.
Preferred further, the content of alloying element Sn is 0.28.
Preferred further, in anneal+cold rolling processing, the temperature that first time anneals is 580 DEG C, and annealing time is 1.8min; Rear twice annealed temperature is 540 DEG C, and annealing time is 1.8min; The temperature of final annealing is 380 DEG C, and annealing time is 2min.
Preferred further, in anneal+cold rolling processing, the draft of cold rolling processing is 43%.
Preferred further, described overlay coating is the coating of nickel or its alloy.
The invention has the advantages that: have selected ferronickel phosphor-copper precipitation strength type alloy system, optimize the proportioning of each alloying element, and with the addition of Zn, Sn alloying element in right amount, control annealing temperature, annealing time and cold-rolling process parameter, shorten heat treatment time, improve production efficiency, obtain the precipitation hardenable copper alloy having excellent mechanical performance and conductivity concurrently simultaneously, and the preparation of precipitation hardenable copper alloy is become semiconductor lead frame.
Embodiment
Embodiment 1-6, and comparative example 1*-8*:
One, prepare burden: match well with the weight percent shown in table 1 and get raw material, the powder of described raw material is purity to be 99.99% oxygen free copper and purity be each alloying element of 99.9%;
Two, melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, described melting is for first inserting in stove by Cu, Zn, Sn mixing, temperature is risen to 1240 DEG C and Keep agitation melt fully to mix, add Ni, Fe and P subsequently, continue to be warming up to 1300 DEG C and be incubated and carry out melting, after melting, casting obtains Ф 30mm, the copper alloy ingot of long 200mm;
Three, hot rolling: carry out 6 passage hot rollings after copper alloy ingot is heated to 960 DEG C to 8mm, finishing temperature control is at 740 DEG C;
Four, cold rolling processing: the cold rolling processing copper alloy of hot rolling being carried out after the scale removal of milling face 75% draft;
Five, anneal+cold rolling processing: the thick copper alloy of the 2mm cold rolling processing obtained is under the condition of 570 DEG C after anneal 1.5min, again carry out the cold rolling processing of 40% draft, reduce annealing temperature to 530 subsequently DEG C again after anneal 1.5min, carry out the cold rolling processing of 40% draft again, subsequently after 530 DEG C again anneal 1.5min, carry out the cold rolling of 40% draft again and be worked into desired thickness, be finally precipitated sclerotic type copper alloy at 380 DEG C of condition annealing 2min.
Table 1
As shown in Table 1, the content of Ni, Fe, P and correlation proportion have very important impact for the over-all properties of copper alloy, first the interpolation of P can not be excessive, otherwise Drawing abillity severe exacerbation will be made, its addition must be limited in less than 0.12%, but very little, otherwise can not will be difficult to the object reaching precipitation strength, therefore at least will add 0.09%; And in order to form Ni, Fe, P composite precipitation strengthening precipitated phase, should meet (Ni+Fe): P=3-3.5, the excessive raising being unprofitable to intensity of ratio causes the deterioration of processing characteristics and conductivity on the contrary, and ratio is too small, is difficult to the demand forming composite precipitation strengthening precipitated phase.Particularly preferred, alloying element percentage composition is 0.17Ni, 0.17Fe, 0.1P.Zn and Sn also plays great role for the raising of intensity in alloy system of the present invention, but too high addition can not be proportional raising intensity, processing characteristics can be worsened on the contrary, too low addition does not then produce corresponding effect, particularly preferred, coordinate the Zn of the interpolation 0.12% and Sn of 0.28%.
Embodiment 7-10, and comparative example 9*-12*, the composition of alloy is identical with embodiment 2, annealing temperature and the time (A) for the first time, the annealing temperature of latter twice and time (B), the temperature and time (C) of final annealing, the preparation technology parameters such as the draft of cold rolling processing are see table 2.
Table 2
As shown in Table 2, anneal first, the temperature of process annealing and final annealing is unsuitable too high, otherwise do not reach requirement by causing the intensity of copper alloy, but can not be too low, the too low effect not having annealing, causes processing characteristics and conductivity not to reach requirement, considers the impact of middle cold rolling processing simultaneously, the temperature of annealing first should be set to the temperature higher than process annealing, it is low that the temperature of final annealing then should be tried one's best; And annealing time also should be moderate, long annealing time is not only unprofitable to the significantly raising of processing characteristics and conductivity, also can cause the deterioration of intensity, be also simultaneously that totally unfavorable, too short annealing time is then but less than the object of annealing modification in production efficiency, production energy consumption; Particularly preferred, the temperature of annealing first is 580 DEG C, and annealing time is 1.8min; The temperature of process annealing is 540 DEG C, and annealing time is 1.8min; The temperature of final annealing is 380 DEG C, and annealing time is 2min.The draft of cold rolling processing needs to control at 40-45%, and too high draft can cause the deterioration of processing characteristics and conductivity, and too low draft does not then have increases strengthening phase precipitation, compensates the object of anneal intensity loss.
Embodiment 11 is that semiconductor lead frame prepared by the copper alloy adopting embodiment 9 to obtain, specifically:
One, impact briquetting: be semiconductor lead frame work in-process by impact briquetting by copper alloy;
Two, electroplate: will carry out electroplating processes to form overlay coating through the pretreated semiconductor lead frame work in-process of cleaning, described coating is nickel layer;
Three, final shaping unit: the semiconductor lead frame work in-process through electroplating processes are carried out slice processing with final molding.
To sum up, the present invention is by the constituent optimization of ferronickel phosphor-copper precipitation strength type alloy system, and conservative control annealing temperature, annealing time and cold-rolling process parameter, determine the alloying constituent of mating the most and complete processing, shorten heat treatment time, improve production efficiency, obtain the precipitation hardenable copper alloy having excellent mechanical performance and conductivity concurrently, by moulding process, it is shaped to semiconductor lead frame the most at last simultaneously.
Claims (6)
1. a Copper alloy semiconductor lead frame, it is obtained by following preparation process:
The raw-material preparation of copper alloy:
One, prepare burden: take weight percent as 0.17Ni, 0.17Fe, 0.1P, 0.12Zn, 0.28Sn, surplus for Cu and inevitably impurity join and get raw material, the powder of described raw material is purity to be 99.99% oxygen free copper and purity be each alloying element of 99.9%;
Two, melting: the raw material prepared is carried out melting under nitrogen protection atmosphere in high frequency furnace, described melting is for first inserting in stove by Cu, Zn, Sn mixing, temperature is risen to 1230-1250 DEG C and Keep agitation melt fully to mix, add Ni, Fe and P subsequently, continue to be warming up to 1280-1300 DEG C and be incubated and carry out melting, after melting, water casting copper alloys ingot;
Three, hot rolling: carry out hot rolling after copper alloy ingot is heated to 950-980 DEG C to desired thickness, finishing temperature control is at 730-750 DEG C;
Four, cold rolling processing: the cold rolling processing copper alloy of hot rolling being carried out after the scale removal of milling face 70-75% draft;
Five, anneal+cold rolling processing: the copper alloy cold rolling processing obtained is under the condition of 570-600 DEG C after anneal 1.5-2min, again carry out the cold rolling processing of 40-45% draft, after reducing annealing temperature to 530-550 DEG C again anneal 1.5-2min subsequently, carry out the cold rolling processing of 40-45% draft again, subsequently after 530-550 DEG C again anneal 1.5-2min, carry out the cold rolling of 40-45% draft again and be worked into desired thickness, be finally precipitated sclerotic type copper alloy at 380-400 DEG C of condition annealing 2-3min;
The preparation of semiconductor lead frame:
One, impact briquetting: be semiconductor lead frame work in-process by impact briquetting by the precipitation hardenable copper alloy prepared before;
Two, electroplate: will carry out electroplating processes to form overlay coating through the pretreated semiconductor lead frame work in-process of cleaning, described coating is at least one in the group of nickel, palladium, gold and silver or its alloy formation;
Three, final shaping unit: the semiconductor lead frame work in-process through electroplating processes are carried out slice processing with final molding.
2. semiconductor lead frame according to claim 1, is characterized in that: described hot rolling is 1.5-2mm to desired thickness, and the passage of hot rolling is at least 6.
3. semiconductor lead frame according to claim 1, is characterized in that: in described anneal+cold rolling processing, and finally the cold rolling desired thickness that is worked into is 0.2-0.4mm.
4. semiconductor lead frame according to claim 1, is characterized in that: in anneal+cold rolling processing, and the temperature that first time anneals is 580 DEG C, and annealing time is 1.8min; Rear twice annealed temperature is 540 DEG C, and annealing time is 1.8min; The temperature of final annealing is 380 DEG C, and annealing time is 2min.
5. semiconductor lead frame according to claim 1, is characterized in that: in anneal+cold rolling processing, and the draft of cold rolling processing is 43%.
6. semiconductor lead frame according to claim 1, is characterized in that: described overlay coating is the coating of nickel or its alloy.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310615729.5A CN103667775B (en) | 2013-11-27 | 2013-11-27 | A kind of Copper alloy semiconductor lead frame |
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| CN201310615729.5A CN103667775B (en) | 2013-11-27 | 2013-11-27 | A kind of Copper alloy semiconductor lead frame |
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| CN103667775A CN103667775A (en) | 2014-03-26 |
| CN103667775B true CN103667775B (en) | 2016-04-13 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105088009A (en) * | 2015-07-26 | 2015-11-25 | 邢桂生 | Copper alloy frame strip and making method thereof |
| CN105088006A (en) * | 2015-09-02 | 2015-11-25 | 宁波兴业盛泰集团有限公司 | Low-cost and stress-relaxation-resistant copper alloy lead frame material and preparation method thereof |
| JP7061247B1 (en) * | 2020-12-28 | 2022-04-28 | 松田産業株式会社 | Nickel electrolytic plating film and plating structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000119779A (en) * | 1998-10-15 | 2000-04-25 | Dowa Mining Co Ltd | Copper alloy for lead frame excellent in etching processability and its manufacturing method |
| JP2007039735A (en) * | 2005-08-03 | 2007-02-15 | Kobe Steel Ltd | Method for producing copper alloy sheet with deformed cross section |
| CN102560181A (en) * | 2010-12-08 | 2012-07-11 | 日立电线株式会社 | Copper alloy material for electrical and electronic component |
| CN102983083A (en) * | 2012-12-24 | 2013-03-20 | 厦门永红科技有限公司 | Lead wire frame and production method thereof |
| JP2013087338A (en) * | 2011-10-19 | 2013-05-13 | Hitachi Cable Ltd | High strength and high conductive copper alloy and manufacturing method thereof |
| JP2013185232A (en) * | 2012-03-09 | 2013-09-19 | Hitachi Cable Ltd | Copper alloy material and method for manufacturing copper alloy material |
-
2013
- 2013-11-27 CN CN201310615729.5A patent/CN103667775B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000119779A (en) * | 1998-10-15 | 2000-04-25 | Dowa Mining Co Ltd | Copper alloy for lead frame excellent in etching processability and its manufacturing method |
| JP2007039735A (en) * | 2005-08-03 | 2007-02-15 | Kobe Steel Ltd | Method for producing copper alloy sheet with deformed cross section |
| CN102560181A (en) * | 2010-12-08 | 2012-07-11 | 日立电线株式会社 | Copper alloy material for electrical and electronic component |
| JP2013087338A (en) * | 2011-10-19 | 2013-05-13 | Hitachi Cable Ltd | High strength and high conductive copper alloy and manufacturing method thereof |
| JP2013185232A (en) * | 2012-03-09 | 2013-09-19 | Hitachi Cable Ltd | Copper alloy material and method for manufacturing copper alloy material |
| CN102983083A (en) * | 2012-12-24 | 2013-03-20 | 厦门永红科技有限公司 | Lead wire frame and production method thereof |
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Inventor after: Zheng Feng Inventor after: Su Jiajia Inventor after: Lin Yusheng Inventor before: Mao Yangqun |
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Effective date of registration: 20170519 Address after: 522000 Renhe Industrial Park, fishing town, Jieyang Airport Economic Zone, Guangdong Patentee after: GUANGDONG XIANJIE ELECTRONIC CO.,LTD. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170519 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: Yuyao City, Zhejiang province 315400 Ningbo City Yangming streets Liang Yan Cun Patentee before: YUYAO SHISEN COPPER FACTORY |
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