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CN103590084A - Apparatus and method used for quick preparation of nanostructured arrays - Google Patents

Apparatus and method used for quick preparation of nanostructured arrays Download PDF

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CN103590084A
CN103590084A CN201210292689.0A CN201210292689A CN103590084A CN 103590084 A CN103590084 A CN 103590084A CN 201210292689 A CN201210292689 A CN 201210292689A CN 103590084 A CN103590084 A CN 103590084A
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nozzle
metal sheet
tinsel
cavity
electrolytic solution
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CN103590084B (en
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王坚
何增华
贾照伟
金一诺
王晖
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ACM Research Shanghai Inc
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Abstract

本发明公开了一种快速制备纳米结构阵列的装置及方法。该装置包括:夹具,夹持一金属片;喷嘴,设置成与金属片相对,以适于向金属片的表面喷射电解液;马达,与夹具相连接用以驱动夹具相对喷嘴旋转、垂直移动或者水平移动;可变直流电源,该可变直流电源的阳极电连接金属片,可变直流电源的阴极电连接喷嘴;腔体,适于回收喷射到金属片表面的电解液;及制冷装置,与腔体和喷嘴相连接,该制冷装置能够冷却腔体中的电解液并将冷却后的电解液供应给喷嘴。本发明通过将电解液回收并冷却后再次供应给喷嘴,并由喷嘴喷射至金属片的表面进行电化学阳极氧化,因而可以消除因提高电化学阳极氧化电压而产生的热量,使得可以通过提高电化学阳极氧化电压来提高纳米结构阵列的制备速率,此外,该装置也适用于制备大面积纳米结构阵列。

Figure 201210292689

The invention discloses a device and a method for rapidly preparing a nanostructure array. The device includes: a clamp, clamping a metal sheet; a nozzle, arranged opposite to the metal sheet, so as to be suitable for spraying electrolyte solution on the surface of the metal sheet; a motor, connected with the clamp to drive the clamp to rotate relative to the nozzle, move vertically or Horizontal movement; variable DC power supply, the anode of the variable DC power supply is electrically connected to the metal sheet, and the cathode of the variable DC power supply is electrically connected to the nozzle; the cavity is suitable for recovering the electrolyte sprayed on the surface of the metal sheet; and the refrigeration device is connected with the metal sheet. The cavity is connected with the nozzle, and the cooling device can cool the electrolyte in the cavity and supply the cooled electrolyte to the nozzle. In the present invention, the electrolyte is recovered and cooled and supplied to the nozzle again, and sprayed onto the surface of the metal sheet by the nozzle for electrochemical anodization, thereby eliminating the heat generated by increasing the electrochemical anodization voltage, so that the electrolytic anodization can be improved by increasing the electrolytic anodic oxidation voltage. The chemical anodizing voltage is used to increase the preparation rate of the nanostructure array, and in addition, the device is also suitable for preparing a large-area nanostructure array.

Figure 201210292689

Description

一种快速制备纳米结构阵列的装置及方法A device and method for rapidly preparing nanostructure arrays

技术领域 technical field

本发明涉及纳米结构阵列的制备技术领域,尤其涉及一种快速制备纳米结构阵列的装置及方法。The invention relates to the technical field of preparation of nanostructure arrays, in particular to a device and method for rapidly preparing nanostructure arrays.

背景技术 Background technique

近些年来,纳米技术蓬勃发展,并在不同领域中展现出广阔的应用前景。其中,具有规整性、周期性的纳米结构阵列材料在光子晶体、存储器和光电子器件等领域有着很广泛的应用。周期性的纳米结构阵列通常可由聚焦离子束、模板法和电化学阳极氧化等方法制备得到,其中,电化学阳极氧化方法是一种简易的、低成本的自组装纳米结构阵列制备方法。In recent years, nanotechnology has developed vigorously and has shown broad application prospects in different fields. Among them, regular and periodic nanostructure array materials are widely used in the fields of photonic crystals, memory and optoelectronic devices. Periodic nanostructure arrays can usually be prepared by focused ion beam, template method, and electrochemical anodization. Among them, electrochemical anodization is a simple and low-cost method for preparing self-assembled nanostructure arrays.

由电化学阳极氧化方法制备的纳米结构阵列包括多孔纳米阵列和纳米管阵列。电化学制备的多孔纳米阵列较常见的为多孔阳极氧化铝,阳极氧化铝的制备方法有恒压、恒流或脉冲氧化等形式,在草酸、硫酸或磷酸等电解液中制得。阳极氧化铝的典型制备工艺是在室温条件下,金属铝片在0.3M的草酸溶液中并在40V电压下电化学氧化制得。该制备方法虽然能够得到规整性非常好的氧化铝纳米阵列,但是由于反应速率较低,薄膜生长较慢,限制了其进一步的应用。Nanostructure arrays prepared by electrochemical anodization include porous nanoarrays and nanotube arrays. Porous nano-arrays prepared electrochemically are more commonly porous anodized alumina. The preparation methods of anodized alumina include constant voltage, constant current or pulse oxidation, etc., and are prepared in electrolytes such as oxalic acid, sulfuric acid or phosphoric acid. The typical preparation process of anodized aluminum is to electrochemically oxidize metal aluminum flakes in 0.3M oxalic acid solution at a voltage of 40V at room temperature. Although this preparation method can obtain alumina nano-arrays with very good regularity, its further application is limited due to the low reaction rate and slow film growth.

为了提高薄膜生长速率,在电化学阳极氧化过程中,可以通过提高电极两端的电压或改变电解液的浓度来提高薄膜的生长速率。然而,由于氧化速率增大,反应产生大量的反应热,产生的反应热会导致电解槽中局部电解液的温度迅速升高,如果不及时排除这些热量,生成的薄膜就有被击穿的可能性,同时,电解液的温度升高也会造成生成的薄膜溶解。此外,在较高的电压条件下,电流密度较大(大于20mAcm-2),产生的反应热较多,当金属片尺寸过大时,在电解槽中不宜通过搅拌等方式移除过多的反应热,所以在电解槽中,不能阳极氧化制备大面积的纳米结构阵列。因此,在电解槽中电化学阳极氧化制备纳米结构阵列的方法因其制备的速率较低,又不能制备大面积纳米结构阵列而越来越不能满足纳米技术发展的需要。In order to increase the growth rate of the film, in the process of electrochemical anodic oxidation, the growth rate of the film can be increased by increasing the voltage across the electrodes or changing the concentration of the electrolyte. However, due to the increased oxidation rate, the reaction generates a large amount of reaction heat, which will cause the temperature of the local electrolyte in the electrolytic cell to rise rapidly. If the heat is not removed in time, the formed film may be broken down. At the same time, the temperature rise of the electrolyte will also cause the dissolution of the formed film. In addition, under higher voltage conditions, the current density is higher (greater than 20mAcm -2 ), and more reaction heat is generated. When the size of the metal sheet is too large, it is not appropriate to remove too much by stirring in the electrolytic cell. The reaction is hot, so in the electrolytic cell, it cannot be anodized to prepare large-area nanostructure arrays. Therefore, the method of preparing nanostructure arrays by electrochemical anodization in an electrolytic bath is increasingly unable to meet the needs of the development of nanotechnology because of its low preparation rate and the inability to prepare large-area nanostructure arrays.

发明内容 Contents of the invention

本发明的目的是针对上述背景技术存在的缺陷提供一种能快速制备大面积纳米结构阵列的装置。The purpose of the present invention is to provide a device capable of rapidly preparing large-area nanostructure arrays for the defects of the above-mentioned background technology.

为实现上述目的,本发明提供的一种快速制备纳米结构阵列的装置,包括:一夹具,夹持一金属片;一喷嘴,设置成与所述金属片相对,以适于向所述金属片的表面喷射电解液;一马达,与所述夹具相连接用以驱动所述夹具相对所述喷嘴旋转、垂直移动或者水平移动;一可变直流电源,所述可变直流电源的阳极电连接所述金属片,所述可变直流电源的阴极电连接所述喷嘴;一腔体,适于回收喷射到所述金属片表面的电解液;及一制冷装置,与所述腔体和所述喷嘴相连接,所述制冷装置能够冷却所述腔体中的电解液并将冷却后的电解液供应给所述喷嘴。In order to achieve the above object, the present invention provides a device for rapidly preparing nanostructure arrays, including: a clamp, clamping a metal sheet; a nozzle, arranged to be opposite to the metal sheet, so as to be suitable for spray electrolyte on the surface of the nozzle; a motor connected with the fixture to drive the fixture to rotate, move vertically or horizontally relative to the nozzle; a variable DC power supply, the anode of the variable DC power supply is electrically connected to the The metal sheet, the cathode of the variable DC power supply is electrically connected to the nozzle; a cavity is suitable for recovering the electrolyte sprayed on the surface of the metal sheet; and a refrigeration device is connected with the cavity and the nozzle connected, the cooling device can cool the electrolyte in the cavity and supply the cooled electrolyte to the nozzle.

本发明的又一目的是提供一种使用上述装置快速制备大面积纳米结构阵列的方法,包括如下步骤:Another object of the present invention is to provide a method for rapidly preparing a large-area nanostructure array using the above-mentioned device, comprising the following steps:

将金属片夹持于夹具上;Clamp the metal sheet on the fixture;

利用喷嘴向所述金属片的表面喷射电解液,润湿所述金属片的表面;Spraying an electrolyte solution onto the surface of the metal sheet through a nozzle to wet the surface of the metal sheet;

将喷射到所述金属片表面的电解液回收于腔体中;及recovering the electrolyte sprayed onto the surface of the metal sheet in the cavity; and

由制冷装置冷却所述腔体中的电解液并将冷却后的电解液重新供应至所述喷嘴。The electrolyte in the cavity is cooled by a cooling device and the cooled electrolyte is re-supplied to the nozzle.

综上所述,本发明一种快速制备纳米结构阵列的装置及方法通过将电解液回收并冷却后再次供应给所述喷嘴,并由所述喷嘴喷射至所述金属片的表面进行电化学阳极氧化,由于电解液的循环流动并被冷却,因而可以消除因提高电化学阳极氧化电压而产生的热量,使得可以通过提高电化学阳极氧化电压来提高纳米结构阵列的制备速率,此外,该装置也适用于制备大面积纳米结构阵列。To sum up, the present invention provides a device and method for rapidly preparing nanostructure arrays by recovering and cooling the electrolyte solution and then supplying it to the nozzle again, and spraying it onto the surface of the metal sheet for electrochemical anode Oxidation, due to the circulating flow of the electrolyte and being cooled, the heat generated by increasing the electrochemical anodizing voltage can be eliminated, so that the preparation rate of the nanostructure array can be increased by increasing the electrochemical anodizing voltage. In addition, the device is also It is suitable for preparing large-area nanostructure arrays.

附图说明 Description of drawings

图1为本发明一种快速制备纳米结构阵列的装置的剖面结构示意图。FIG. 1 is a schematic cross-sectional structure diagram of a device for rapidly preparing nanostructure arrays according to the present invention.

图2为本发明电化学阳极氧化装置的剖面结构示意图。Fig. 2 is a schematic cross-sectional structure diagram of the electrochemical anodizing device of the present invention.

图3为在金属片表面的边缘及其侧壁涂上绝缘聚合物后的示意图。Fig. 3 is a schematic diagram after coating the insulating polymer on the edge of the surface of the metal sheet and its sidewall.

图4为图3沿A-A’线的剖视图。Fig. 4 is a sectional view along line A-A' of Fig. 3 .

图5(a)至5(c)示出了制备纳米结构阵列的工艺过程。Figures 5(a) to 5(c) illustrate the process of preparing nanostructure arrays.

图6为本发明一种快速制备纳米结构阵列的方法的流程图。Fig. 6 is a flowchart of a method for rapidly preparing nanostructure arrays in the present invention.

具体实施方式 Detailed ways

为详细说明本发明的技术内容、构造特征、所达成目的及功效,下面将结合实施例并配合图式予以详细说明。In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

请参阅图1至图4,本发明一种快速制备纳米结构阵列的装置包括电化学阳极氧化装置和电解液供应装置。Please refer to FIG. 1 to FIG. 4 , a device for rapidly preparing nanostructure arrays in the present invention includes an electrochemical anodizing device and an electrolyte supply device.

电化学阳极氧化装置包括一夹具101、一喷嘴102、一马达103、一可变直流电源109及一电压控制器(图中未示)。夹具101夹持一大尺寸金属片200,金属片200可以是铝、钛和锡等金属,根据不同需求,可以选用不同金属。喷嘴102设置成与金属片200相对,以适于向金属片200喷射电解液104。马达103与夹具101相连接用以驱动夹具101相对喷嘴102旋转、垂直移动或者水平移动。可变直流电源109的阳极通过夹具101电连接金属片200的背面,可变直流电源109的阴极电连接喷嘴102,在本实施例中,选用了可编程直流电源为电化学阳极氧化提供电源。电压控制器与可变直流电源109相连接并控制可变直流电源109的电压输出,电压控制器控制可变直流电源109输出的电压为10V至300V。接通可变直流电源109并向金属片200喷射电解液104时,喷嘴102、电解液104、金属片200及可变直流电源109形成一电流回路,从而使金属片200氧化。The electrochemical anodizing device includes a fixture 101 , a nozzle 102 , a motor 103 , a variable DC power supply 109 and a voltage controller (not shown in the figure). The fixture 101 clamps a metal sheet 200 with a large size. The metal sheet 200 can be made of metals such as aluminum, titanium and tin, and different metals can be selected according to different requirements. The nozzle 102 is disposed opposite to the metal sheet 200 to be suitable for spraying the electrolytic solution 104 to the metal sheet 200 . The motor 103 is connected with the clamp 101 to drive the clamp 101 to rotate relative to the nozzle 102 , to move vertically or horizontally. The anode of the variable DC power supply 109 is electrically connected to the back of the metal sheet 200 through the clamp 101, and the cathode of the variable DC power supply 109 is electrically connected to the nozzle 102. In this embodiment, a programmable DC power supply is selected to provide power for electrochemical anodization. The voltage controller is connected with the variable DC power supply 109 and controls the voltage output of the variable DC power supply 109. The voltage controller controls the output voltage of the variable DC power supply 109 to be 10V to 300V. When the variable DC power supply 109 is turned on and the electrolyte 104 is sprayed to the metal sheet 200 , the nozzle 102 , the electrolyte 104 , the metal sheet 200 and the variable DC power supply 109 form a current loop to oxidize the metal sheet 200 .

电解液供应装置包括一腔体105、一电解液槽106、一制冷装置107及一流量控制器108。腔体105适于回收喷射到金属片200的电解液104,具体地,在金属片200的电化学阳极氧化过程中,由于马达103驱动夹具101旋转,金属片200上的电解液104被甩离金属片200并落入腔体105。电解液槽106分别与腔体105和喷嘴102连通,腔体105中的电解液104被引入电解液槽106,并经由电解液槽106流入制冷装置107中,制冷装置107将电解液104冷却至目标设定温度,然后冷却后的电解液104被引回到电解液槽106,最后再由电解液槽106重新供应给喷嘴102。在电解液槽106与喷嘴102之间设置有流量控制器108,用于调节电解液104的压力和流量,以将具有一定压力和流量的电解液104供应给喷嘴102,喷嘴102将冷却后的电解液104喷射至金属片200的表面从而氧化金属片200。The electrolyte supply device includes a cavity 105 , an electrolyte tank 106 , a cooling device 107 and a flow controller 108 . The cavity 105 is adapted to recover the electrolyte 104 sprayed onto the metal sheet 200. Specifically, during the electrochemical anodizing process of the metal sheet 200, the electrolyte 104 on the metal sheet 200 is thrown away due to the rotation of the clamp 101 driven by the motor 103. The metal sheet 200 falls into the cavity 105 . The electrolyte tank 106 communicates with the cavity 105 and the nozzle 102 respectively, the electrolyte 104 in the cavity 105 is introduced into the electrolyte tank 106, and flows into the cooling device 107 through the electrolyte tank 106, and the cooling device 107 cools the electrolyte 104 to The target temperature is set, and then the cooled electrolyte 104 is led back to the electrolyte tank 106 , and finally re-supplied from the electrolyte tank 106 to the nozzle 102 . A flow controller 108 is arranged between the electrolyte tank 106 and the nozzle 102, which is used to adjust the pressure and flow of the electrolyte 104, so as to supply the electrolyte 104 with a certain pressure and flow to the nozzle 102, and the nozzle 102 will cool the The electrolytic solution 104 is sprayed onto the surface of the metal sheet 200 to oxidize the metal sheet 200 .

下面简要介绍使用上述装置制备纳米结构阵列的工艺过程。首先在进行电化学阳极氧化之前,移动夹具101,使喷嘴102正对着金属片200的中心,喷嘴102向金属片200的表面喷射电解液104,同时马达103驱动夹具101以恒定角速度旋转,由于离心力的作用,喷射至金属片200表面的电解液104向金属片200表面的四周分散,从而将金属片200的表面全部润湿,金属片200的表面覆盖上一层薄电解液层,避免在金属片200的表面出现金属-空气-电解液三相点,因为一旦出现金属-空气-电解液三相点,在电化学阳极氧化时,就会导致金属片200表面的电场分布不均匀而无法生成纳米结构阵列。The following briefly introduces the process of preparing nanostructure arrays using the above-mentioned device. First, before electrochemical anodization, move the clamp 101 so that the nozzle 102 is facing the center of the metal sheet 200, the nozzle 102 sprays the electrolyte 104 to the surface of the metal sheet 200, and the motor 103 drives the clamp 101 to rotate at a constant angular velocity, because Under the effect of centrifugal force, the electrolytic solution 104 sprayed onto the surface of the metal sheet 200 is scattered around the surface of the metal sheet 200, thereby fully wetting the surface of the metal sheet 200, and the surface of the metal sheet 200 is covered with a thin layer of electrolyte solution to avoid the The metal-air-electrolyte triple point appears on the surface of the metal sheet 200, because once the metal-air-electrolyte triple point occurs, the electric field distribution on the surface of the metal sheet 200 will be uneven and unable to Generate arrays of nanostructures.

在将金属片200的表面润湿的步骤后且在后续的将喷射到所述金属片表面的电解液回收于腔体中的步骤之前,接通可变直流电源109,在较低的恒定电压下氧化金属片200的表面,并在金属片200的表面形成一层氧化层400,如图5(b)所示。在形成氧化层400的过程中,电化学阳极氧化的电压较低,以制备多孔阳极氧化铝为例,在0.3M的草酸溶液中、温度为0℃,氧化电压小于40V或电流密度小于5mAcm-2及氧化时间为1至2分钟的条件下,可以在铝片的表面形成几百纳米厚的氧化铝层。After the step of wetting the surface of the metal sheet 200 and before the subsequent step of reclaiming the electrolyte sprayed onto the surface of the metal sheet in the cavity, the variable DC power supply 109 is switched on at a lower constant voltage The surface of the metal sheet 200 is oxidized and an oxide layer 400 is formed on the surface of the metal sheet 200 , as shown in FIG. 5( b ). In the process of forming the oxide layer 400, the electrochemical anodic oxidation voltage is relatively low. Taking the preparation of porous anodized aluminum as an example, in 0.3M oxalic acid solution at a temperature of 0°C, the oxidation voltage is less than 40V or the current density is less than 5mAcm- 2 and under the condition that the oxidation time is 1 to 2 minutes, an aluminum oxide layer with a thickness of several hundred nanometers can be formed on the surface of the aluminum sheet.

喷嘴102继续向金属片200的表面喷射电解液104,同时提高电化学阳极氧化的电压,金属片200的表面进一步快速氧化形成纳米结构阵列500,如图5(c)所示。以在草酸溶液中制备多孔阳极氧化铝为例,将氧化电压提高到70V至130V,此时的电流密度为20mAcm-2至200mAcm-2,金属铝的表面快速氧化形成氧化铝纳米结构阵列。虽然提高电化学阳极氧化的电压会在形成纳米结构阵列500的过程中产生大量的热,然而,由于本装置中的电解液104是循环流动并被冷却,所以产生的热量能够迅速被消除,避免产生的热量对形成的纳米结构阵列500造成破坏。由于离子扩散等因素影响,金属片200表面的氧化反应主要发生在与喷嘴102正对着的区域,因此,金属片200表面的中心区域首先被氧化,然后水平移动夹具101并旋转夹具101使金属片200表面上的其他区域被氧化,进而在金属片200的整个表面形成纳米结构阵列500,因而可以制备大面积纳米结构阵列500。此外,可以根据需要的氧化物的厚度,设定夹具101旋转的角速度或线速度和转速。The nozzle 102 continues to spray the electrolyte 104 on the surface of the metal sheet 200, while increasing the voltage of electrochemical anodization, the surface of the metal sheet 200 is further rapidly oxidized to form a nanostructure array 500, as shown in FIG. 5(c). Taking the preparation of porous anodic alumina in oxalic acid solution as an example, the oxidation voltage is increased to 70V to 130V, and the current density is 20mAcm -2 to 200mAcm -2 at this time, and the surface of metal aluminum is rapidly oxidized to form an alumina nanostructure array. Although increasing the voltage of electrochemical anodization can generate a large amount of heat in the process of forming the nanostructure array 500, yet, because the electrolyte 104 in this device is circulated and cooled, so the generated heat can be eliminated quickly, avoiding The generated heat damages the formed nanostructure array 500 . Due to factors such as ion diffusion, the oxidation reaction on the surface of the metal sheet 200 mainly occurs in the area facing the nozzle 102. Therefore, the central area of the surface of the metal sheet 200 is first oxidized, and then the horizontal movement of the clamp 101 and the rotation of the clamp 101 make the metal Other areas on the surface of the sheet 200 are oxidized, and then the nanostructure array 500 is formed on the entire surface of the metal sheet 200, so that a large-area nanostructure array 500 can be prepared. In addition, the angular velocity or linear velocity and rotation speed of the fixture 101 can be set according to the required thickness of the oxide.

优选的,请参阅图3和图4,金属片200表面的边缘及其侧壁涂有一层绝缘聚合物300。在电化学阳极氧化过程中,由于金属片200边缘断面的存在,当氧化进行到金属片200的边缘时,会导致金属片200上的电流分布不均,而在金属片200表面的边缘及其侧壁涂上一层所述绝缘聚合物300能够很好的解决此问题。Preferably, please refer to FIG. 3 and FIG. 4 , the edge of the surface of the metal sheet 200 and its sidewall are coated with a layer of insulating polymer 300 . In the electrochemical anodizing process, due to the existence of the edge section of the metal sheet 200, when the oxidation proceeds to the edge of the metal sheet 200, the current distribution on the metal sheet 200 will be uneven, and the edge of the metal sheet 200 surface and its Coating a layer of the insulating polymer 300 on the side wall can solve this problem well.

请参阅图5(a)至5(c)及图6,本发明还提供一种使用上述装置快速制备纳米结构阵列的方法,包括如下步骤:Please refer to Figures 5(a) to 5(c) and Figure 6, the present invention also provides a method for rapidly preparing nanostructure arrays using the above device, including the following steps:

S11:将金属片200夹持于夹具101上;S11: Clamp the metal sheet 200 on the fixture 101;

S12:利用喷嘴102向金属片200的表面喷射电解液104,润湿金属片200的表面;S12: using the nozzle 102 to spray the electrolyte 104 on the surface of the metal sheet 200 to wet the surface of the metal sheet 200;

S13:将喷射到金属片200表面的电解液104回收于腔体105中;S13: Recover the electrolyte 104 sprayed onto the surface of the metal sheet 200 in the cavity 105;

S14:由制冷装置107冷却腔体105中的电解液104并将冷却后的电解液104重新供应至喷嘴102。S14 : cooling the electrolyte 104 in the cavity 105 by the cooling device 107 and supplying the cooled electrolyte 104 to the nozzle 102 again.

较佳的,润湿金属片200的表面后,先在低电压下氧化金属片200的表面,形成一氧化层400,然后提高电化学阳极氧化电压并继续氧化金属片200的表面,快速形成纳米结构阵列500。Preferably, after wetting the surface of the metal sheet 200, first oxidize the surface of the metal sheet 200 at a low voltage to form an oxide layer 400, then increase the electrochemical anodic oxidation voltage and continue to oxidize the surface of the metal sheet 200 to quickly form nano structure array 500 .

由上述可知,本发明一种快速制备纳米结构阵列的装置及方法通过将电解液104回收并冷却后再次供应给喷嘴102,并由喷嘴102喷射至金属片200的表面进行电化学阳极氧化,由于电解液104的循环流动并被冷却,因而可以消除因提高电化学阳极氧化电压而产生的热量,使得可以通过提高电化学阳极氧化电压来提高纳米结构阵列500的制备速率,此外,该装置也适用于制备大面积纳米结构阵列500。As can be seen from the above, a device and method for rapidly preparing nanostructure arrays in the present invention recovers and cools the electrolyte 104 and then supplies it to the nozzle 102 again, and sprays the nozzle 102 onto the surface of the metal sheet 200 for electrochemical anodic oxidation. The circulation of the electrolyte 104 flows and is cooled, thereby eliminating the heat generated by increasing the electrochemical anodizing voltage, so that the preparation rate of the nanostructure array 500 can be increased by increasing the electrochemical anodizing voltage. In addition, the device is also suitable for To prepare a large-area nanostructure array 500 .

综上所述,本发明一种快速制备纳米结构阵列的装置及方法通过上述实施方式及相关图式说明,己具体、详实的揭露了相关技术,使本领域的技术人员可以据以实施。而以上所述实施例只是用来说明本发明,而不是用来限制本发明的,本发明的权利范围,应由本发明的权利要求来界定。至于本文中所述元件数目的改变或等效元件的代替等仍都应属于本发明的权利范围。In summary, a device and method for rapidly preparing nanostructure arrays according to the present invention has disclosed related technologies in detail and in detail through the above-mentioned embodiments and related drawings, so that those skilled in the art can implement them accordingly. The above-mentioned embodiments are only used to illustrate the present invention, rather than to limit the present invention, and the scope of rights of the present invention should be defined by the claims of the present invention. Changes in the number of elements described herein or substitution of equivalent elements should still fall within the scope of the present invention.

Claims (9)

1. prepare fast a device for nano-structure array, comprising:
One fixture, clamps a tinsel;
One nozzle, be arranged to relative with described tinsel, to be suitable for the jet surface electrolytic solution to described tinsel;
One motor, is connected to drive described fixture to rotate, vertically move or move horizontally relative to described nozzle with described fixture;
One variable direct supply, the anode of described variable direct supply is electrically connected to described tinsel, and the cathodic electricity of described variable direct supply connects described nozzle;
One cavity, is suitable for reclaiming the electrolytic solution that is ejected into described tinsel surface; And
One refrigeration plant, is connected with described nozzle with described cavity, and the electrolytic solution of described refrigeration plant in can cooling described cavity is also supplied to described nozzle by cooled electrolytic solution.
2. a kind of device of preparing fast nano-structure array according to claim 1, is characterized in that: between described cavity and described refrigeration plant, be provided with an electrolytic bath, described electrolytic bath is communicated with described cavity and described nozzle respectively,
Wherein, the electrolytic solution in described cavity is introduced into described electrolytic bath, and flows into and in described refrigeration plant, carry out coolingly via described electrolytic bath, and cooled electrolytic solution is drawn gets back to described electrolytic bath, by described electrolytic bath, is supplied to described nozzle.
3. a kind of device of preparing fast nano-structure array according to claim 2, it is characterized in that: between described electrolytic bath and described nozzle, be provided with a flow director, this flow director is suitable for regulating the pressure of electrolytic solution and flow so that the electrolytic solution with certain pressure and flow is supplied to described nozzle.
4. a kind of device of preparing fast nano-structure array according to claim 1, is characterized in that: edge and the sidewall thereof on described tinsel surface scribble one deck insulating polymer.
5. a kind of device of preparing fast nano-structure array according to claim 1, it is characterized in that: also further comprise a voltage controller, described voltage controller is connected with described variable direct supply and controls the Voltage-output of described variable direct supply.
6. a kind of device of preparing fast nano-structure array according to claim 5, is characterized in that: the voltage that described voltage controller is controlled described variable direct supply output is 10V to 300V.
7. a kind of device of preparing fast nano-structure array according to claim 1, is characterized in that: described variable direct supply is programmable DC power supply.
8. the device described in right to use requirement 1 is prepared a method for nano-structure array fast, comprises the steps:
Tinsel is held on fixture;
Utilize nozzle to the jet surface electrolytic solution of described tinsel, the surface of wetting described tinsel;
The electrolytic solution that is ejected into described tinsel surface is recovered in cavity; And
Electrolytic solution in the cooling described cavity of refrigeration plant is also supplied to described nozzle again by cooled electrolytic solution.
9. a kind of method of preparing fast nano-structure array according to claim 8, it is characterized in that: after the surperficial step of wetting described tinsel and before the electrolytic solution that is ejected into described tinsel surface is recovered in to the step in cavity, further comprise: first under low voltage, be oxidized the surface of described tinsel, form a zone of oxidation, the surface of then improving electrochemical anodic oxidation voltage and continuing the described tinsel of oxidation, forms nano-structure array fast.
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CN202323073U (en) * 2011-11-22 2012-07-11 哈尔滨学院 Microarc oxidation device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1124304A (en) * 1994-03-17 1996-06-12 株式会社半导体能源研究所 Apparatus and method for anodic sxidation
CN101459050A (en) * 2007-12-14 2009-06-17 盛美半导体设备(上海)有限公司 Method and apparatus for metallic layer front wafer surface presoaking for electrochemical or chemical deposition
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