CN103579409B - The groove processing method and groove processing apparatus of substrate - Google Patents

Abstract

The present invention relates to a groove processing method and a groove processing device for a substrate. The present invention can stabilize the groove processing tool when forming a groove on a substrate by using a head portion that supports the groove processing tool in a swingable manner. Grooves are processed with good precision. The groove processing method includes a substrate placement step, a processing position calculation step, and a processing step. In the substrate placing step, the substrate is placed on the table so that the line to be processed of the substrate is inclined within a predetermined angle range with respect to the Y direction. In the processing position calculating step, the processing start position and the processing end position of the planned processing line of the substrate are calculated. The processing step is to perform groove processing along the planned processing line while moving the groove processing tool relative to the substrate in X direction and Y direction according to the calculated processing start position and processing end position.

Description

Substrate groove processing method and groove processing device

technical field

The present invention relates to a groove processing method, in particular to a groove processing method for a substrate on which grooves are formed on the surface of the substrate along a planned processing line. Also, it relates to a grooving device for a substrate for realizing the method.

Background technique

A thin-film solar cell is manufactured, for example, by the steps shown below. That is, first, a lower electrode film made of a Mo film is formed on a substrate such as glass, and then, grooves are formed in the lower electrode film, thereby dividing into strips. Next, a compound semiconductor film including a chalcopyrite structure compound semiconductor film such as a CIGS film is formed on the lower electrode film. Then, a part of the above-mentioned semiconductor film was removed in stripes by trench processing and divided into strips to form an upper electrode film so as to cover the above-mentioned. Finally, a part of the upper electrode film was stripped and divided into strips by grooving.

In the manufacture of the thin-film solar cell as above, a scribing apparatus as disclosed in Patent Document 1 is used. In the apparatus of this patent document 1, the stage on which a board|substrate is mounted, the support member arrange|positioned above the stage, and a film removal mechanism are provided. The membrane cutting mechanism has a pendulum swinging body that can be moved up and down and swings freely in the groove forming direction.

In the device of this patent document 1, a groove machining tool is attached to the tip of the pendulum oscillating body. With such a configuration, grooves can be formed on the film every time it travels back and forth.

In the device of Patent Document 1, the rocking body on which the tool is mounted is supported by a rocking shaft and rocked. Also, the swing shaft is supported by the frame and two members.

In such a device of Patent Document 1, in order to smoothly rock the rocking body, it is necessary to provide a slight margin (gap) between the rocking body and the two members supporting it in the axial direction of the rocking shaft.

Due to this gap, when the rocker is moved in the direction of groove formation during groove machining, the rocker and the groove processing tool mounted thereon shake in the axial direction of the rocker shaft, and the position of the groove processing tool changes. Get unstable. Therefore, the groove cannot be formed with high precision.

[Prior Art Literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-245255

Contents of the invention

[Problem to be solved by the invention]

An object of the present invention is to stabilize the groove processing tool and perform groove processing with high precision when forming a groove on a substrate using a head portion which supports the groove processing tool in a swingable manner.

[Technical means to solve the problem]

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. The substrate groove processing method of the present invention is a method in which a processing device is provided with a stage having a mounting surface on which the substrate is mounted, a head, and a moving mechanism, and the surface of the substrate is formed along a planned processing line extending in the Y direction. form grooves. The head has: a rocking shaft that supports the groove processing tool freely and extends in the X direction; and a restriction mechanism that restricts the groove processing tool from moving along the rocking shaft. The movement mechanism is a mechanism for relatively moving the platform and the head in the X direction and the Y direction perpendicular to the X direction within the horizontal plane. And, this grooving method comprises the following steps:

Substrate loading step: placing the substrate on the platform in such a way that the planned processing line of the substrate is inclined within a predetermined angle range relative to the Y direction;

Processing position calculation step: calculating the processing start position and processing end position of the processing scheduled line of the substrate; and

Processing step: according to the calculated processing start position and processing end position, the groove processing tool is relatively moved relative to the substrate in the X direction and the Y direction, and the groove processing is performed along the processing scheduled line.

Here, by relatively moving the stage and the head, a groove is formed on the substrate using a groove machining tool attached to the head.

During the groove processing, the substrate is placed on the stage so that the processing line is inclined within a predetermined angle range with respect to the Y direction. Therefore, the groove machining tool moves obliquely with respect to the Y direction. At this time, since machining resistance acts on the grooving tool, a force component pressing against one side of the rocking shaft in the axial direction and a force component rocking around the rocking shaft act on the head due to the machining resistance. In this way, the head is pressed against one end side of the rocking shaft by the machining resistance, so that the gap between the head and the member supporting it disappears during machining. Therefore, the position of the head during grooving is stabilized, and the grooves can be formed with high precision.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned substrate groove processing method, wherein the step of placing the substrate includes the following steps:

Step 1: placing the substrate on the platform;

Step 2: Confirm the posture of the substrate placed on the platform;

Step 3: determine whether the planned processing line in the substrate is within the range of a predetermined inclination angle with respect to the Y direction; and

Step 4: When the planned processing line of the substrate is not within the predetermined inclination angle range, the posture of the substrate is controlled so as to be within the predetermined angle range.

Here, when the substrate is tilted within a predetermined angle range when the substrate is placed on the stage, the subsequent steps are directly performed. Also, when the substrate is not inclined within a predetermined angle range when the substrate is placed on the stage, the posture of the substrate is controlled. Therefore, at the time of grooving, the gap between the head and the member supporting it is surely eliminated, and the position of the head is stabilized.

In the above-mentioned groove processing method of a substrate, in the second step, an alignment mark of the substrate placed on the stage is photographed to confirm the posture of the substrate.

The purpose of the present invention and the solution to its technical problems are also achieved by the following technical solutions. The substrate groove processing apparatus of the present invention is an apparatus for forming a groove on a substrate surface along a processing plan line extending in the Y direction, and includes: a stage having a mounting surface on which the substrate is mounted, a head, a moving mechanism, A substrate posture confirmation device, a substrate posture control mechanism, and a control means. The head has a rocking shaft extending in the X direction perpendicular to the Y direction, and has a restricting mechanism for rockably supporting the groove processing tool on the rocking shaft and restricting movement of the groove processing tool along the rocking shaft. The moving mechanism relatively moves the platform and the head in the X direction and the Y direction within the horizontal plane. The substrate posture checking device checks the posture of the substrate placed on the stage. The substrate posture control mechanism controls the posture of the substrate on the stage relative to the head. The control means controls the moving mechanism and the substrate posture control mechanism based on the confirmation result from the substrate posture confirmation device.

Furthermore, the control means has a processing position calculation function and a movement control function. The processing position calculation function calculates the processing start position and the processing end position of the processing scheduled line on the substrate placed on the table so that the processing scheduled line of the substrate falls within a predetermined angular range. The movement control function is to control the movement mechanism according to the calculation result of the machining position calculation function, so that the groove machining tool moves from the machining start position to the machining end position.

Here, by relatively moving the stage and the head, a groove is formed on the substrate using a groove machining tool attached to the head.

At this time, the head is pressed against one end of the rocking shaft by the processing resistance, and the gap between the head and the member supporting it disappears during processing. Therefore, the position of the head during grooving is stabilized, and the grooves can be formed with high precision.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the aforementioned substrate grooving device, the groove processing device further includes a substrate posture control mechanism that controls the posture of the substrate on the stage relative to the head. Furthermore, the control means further has a substrate posture determination function and a substrate posture control function. The substrate posture determination function is to determine whether the planned processing line is inclined within a predetermined angle range with respect to the Y direction in the substrate placed on the platform based on the confirmation result obtained by the substrate posture confirmation device. The substrate posture control function controls the substrate posture control mechanism so that the substrate's planned processing line falls within a predetermined angle range when the substrate's planned processing line is not within a predetermined inclination angle range. Further, the control means controls the substrate posture control mechanism and the moving mechanism based on the confirmation result from the substrate posture confirmation device.

In the aforementioned substrate groove processing device, the head has a base, a holder, and a pressing member. The holder is vertically movably supported with respect to the base, and holds the groove processing tool. The pressing member presses the grooving tool held by the holder against the substrate with a predetermined pressing force.

In this device, the groove machining tool presses the substrate with a predetermined pressing force by the pressing member, and moves back and forth. Also, grooves are formed on the substrate both at the time of forward movement and at the time of forward movement.

In the aforementioned groove machining device for a substrate, the holder has a holder body, a support member fixed to the holder body, and a rocking member. The rocking member is freely rockable on the holder body and the supporting member, and is supported freely movable along the axial direction of the rocking shaft. A groove processing tool is installed at the front end, and rocks along the periphery of the rocking shaft to obtain the moving position and coming. to move the position.

In the aforementioned groove processing device for a substrate, a space for accommodating the rocking member supported by the rocking shaft is formed between the holder body and the support member, and the restricting mechanism is constituted by the holder body and the support member.

[Effect of the invention]

As described above, in the present invention, when a groove is formed on a substrate using the head portion which supports the groove forming tool in a swingable manner, the groove forming tool can be stabilized and the groove can be formed with high precision.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is an external perspective view of a substrate groove processing device according to an embodiment of the present invention.

Fig. 2 is a front view of the head of the groove machining device.

Fig. 3 is a schematic diagram for explaining the operation during grooving.

Fig. 4 is a control block diagram of the groove processing device.

Fig. 5 is a flow chart of groove machining.

FIG. 6 is a diagram showing control of the posture of the substrate during grooving.

Fig. 7 is a schematic view showing the movement of the rocking member during groove processing.

Fig. 8 is a schematic view showing the movement of the rocking member during groove processing.

【Symbol Description】

1: Platform 2: Tools

3: Head 4: Camera (board posture confirmation device)

6a: Y direction drive mechanism

6b: θ drive mechanism (substrate attitude control mechanism)

6c: X-direction drive mechanism 17: Holder

18: Rocking member 19: Cylinder

22: Holder body (restriction mechanism) 23: Support member (restriction mechanism)

36: Air nozzle 38a, 38b: Knife

40: Control Department

detailed description

In order to further explain the technical means adopted by the present invention to achieve the intended purpose of the invention and its effects, the specific implementation of the substrate groove processing method and groove processing device according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , structure, feature and effect thereof, detailed description is as follows.

FIG. 1 shows an external perspective view of a groove processing device according to an embodiment of the present invention.

[Overall configuration of groove processing device]

This device includes: a stage 1 on which a substrate W is placed, a head 3 on which a groove processing tool (hereinafter, simply referred to as a tool) 2 is mounted, and two cameras 4 and two monitors 5 as means for checking the posture of the substrate. .

The platform 1 can move in the Y direction of FIG. 1 in the horizontal plane by the Y-direction drive mechanism 6a (see FIG. 4 ), and can rotate to any angle in the horizontal plane by the θ drive mechanism 6b (see FIG. 4 ). The drive mechanisms 6a and 6b each include a motor or the like, and are arranged below the platform 1 . The posture of the substrate W placed on the stage 1 can be controlled by rotating the stage 1 in the horizontal plane by the θ drive mechanism 6b.

The head 3 can move in the X direction above the platform 1 by the X direction driving mechanism 6c. In addition, as shown in FIG. 1, an X direction is a direction orthogonal to a Y direction in a horizontal plane. The X-direction drive mechanism 6c has a pair of support columns 7a, 7b, a guide rod 8 provided between the pair of support columns 7a, 7b, and a motor 10 that drives a guide 9 formed on the guide rod 8. The head 3 is movable in the X direction along the guide 9 as described above.

The two cameras 4 are respectively fixed to the pedestal 12 . Each pedestal 12 is movable along a guide 14 provided on the support table 13 and extending in the X direction. The two cameras 4 can move up and down, and images captured by each camera 4 are displayed on the corresponding monitor 5 .

[head]

In FIG. 2, the head 3 is extracted and shown. The head 3 has a plate-shaped base 16 , a holder 17 , and an air cylinder 19 .

The holder 17 is vertically slidably supported with respect to the base 16 via rails not shown. The holder 17 has a holder body 22 , a support member 23 fixed to the surface of the holder body 22 , and a rocking member 18 .

The holder body 22 is formed in a plate shape, and has an opening 22a at an upper portion. The support member 23 is a rectangular member that is long in the lateral direction, and has a through-hole 23a through which the swing member 18 is inserted.

The rocking member 18 is rockably supported by the holder main body 22 and the supporting member 23 . More specifically, a space for accommodating a rocking member is formed between the holder main body 22 and the supporting member 23 . Further, the swing member 18 is restricted from moving in the axial direction of the swing shaft by the holder body 22 and the support member 23 . That is, the restriction mechanism is constituted by the holder body 22 and the support member 23 . The swing member 18 has a lower tool mounting portion 24 and an extension portion 25 formed to extend upward from the tool mounting portion 24 .

A groove is formed in the tool mounting portion 24, the tool 2 is inserted into the groove, and the tool 2 is fixed in the groove by the fixing plate 24a.

A through-hole 25 a penetrating in the horizontal direction and in a direction perpendicular to the groove formation direction is formed in the lower portion of the extension portion 25 . And the swing member 18 is swingable around the pin 26 which penetrates this hole 25a as a center. The pin 26 is supported by the holder body 22 and the support member 23 . In addition, a predetermined clearance is provided between the rocking member 18, the holder main body 22, and the support member 23 so that the rocking member 18 can rock smoothly. Also, the rocking member 18 is movable in the axial direction along the pin 26 .

On the left and right sides of the upper end portion 25b of the extension portion 25, a pair of restricting members 27a and 27b are provided. As shown in FIG. 3, each restricting member 27a, 27b has the cylindrical member 28a, 28b fixed to the holder main body 22, and the spring 29a, 29b inserted in the cylindrical member 28a, 28b. And, the swing member 18 is maintained at the neutral position shown in FIG. 2 and FIG. 3( b ) by abutting the front ends of the respective springs 29 a and 29 b against the upper end portion 25 b of the extension portion 25 . Further, the rocking member 18 rocks to press one of the springs 29a, 29b, and the upper end portion 25b of the extension part 25 abuts against the cylindrical members 28a, 28b, thereby restricting the rocking angle. Furthermore, FIG. 3 schematically shows movement of the rocking member 18 .

The cylinder 19 is fixed to the upper surface of the cylinder supporting member 30 . The cylinder support member 30 is arranged on the upper portion of the holder 17 and is fixed to the base 16 . A hole penetrating in the vertical direction is formed in the cylinder support member 30 , and a piston rod (not shown) of the air cylinder 19 penetrates the through hole, and the rod end is connected to the holder 17 .

In addition, a spring support member 31 is provided on the upper portion of the base 16 . A spring 32 is provided between the spring support member 31 and the holder 17 , and the holder 17 is urged upward by the spring 32 . With this spring 32, the self-weight of the holder 17 can be almost eliminated.

On the left and right sides of the holder 17, a pair of air supply parts 34a, 34b are provided. A pair of air supply part 34a, 34b has the same structure, and has the joint 35 and the air nozzle 36, respectively.

[control department]

This grooving device has a control unit 40 for controlling each unit. As shown in FIG. 4 , image data from the camera 4 is input to the control unit 40 . Also, the control unit 40 is connected to the cylinder 19 of the head 3, the Y direction driving mechanism 6a for moving the platform 1 to the Y direction, the X direction driving mechanism 6c for making the head 3 move in the X direction, and the X direction driving mechanism 6c for moving the platform 1 to the Y direction. Theta drive mechanism 6b that rotates the platform 1 in the horizontal plane.

The control unit 40 is constituted by a microcomputer, and has the following functions.

Substrate attitude determination function: Based on the image data obtained by the camera 4, it is a function to determine whether the planned processing line is inclined within a predetermined angle range with respect to the Y direction in the substrate W placed on the stage 1.

Substrate attitude control function: When the planned processing line of the substrate W is not within the predetermined inclination angle range, the θ drive mechanism is controlled to control the posture of the substrate W so that the planned processing line of the substrate W falls within the predetermined angle range Function.

Machining position calculation function: a function to calculate the machining start position and machining end position of the planned machining line on the substrate W controlled by the posture control function of the substrate.

Movement control function: the function of controlling the X, Y moving mechanism 6 according to the calculation result of the processing position calculation mechanism, so as to move the tool 2 from the processing start position to the processing end position.

[tool]

A knife is formed at the front end portion of the tool 2 . Specifically, as shown in FIG. 2 , a first blade 38 a and a second blade 38 b are formed on both sides in the moving direction at the tip of the blade. Here, the first blade 38a is a blade for processing grooves when moving forward, and the second blade 38b is a blade for processing grooves when moving back and forth.

[Groove processing action]

Using the flow chart in FIG. 5 , the operation of performing grooving on a thin-film solar cell substrate using the above-mentioned apparatus will be described.

Once the substrate W is placed on the stage 1, the posture of the substrate W is photographed using the camera 4 in step S1. In step S2, the direction of the planned processing line is calculated based on the photographed data. That is, for example, an image of an alignment mark on the substrate W is photographed, and the inclination angle of the line to be processed on the substrate W with respect to the Y direction is calculated.

Next, in step S3, it is determined whether or not the inclination angle obtained in step S2 is a predetermined inclination angle. When the inclination angle is not within the predetermined angle range, the process proceeds from step S3 to step S4. In step S4 , as shown in FIGS. 6( a ) and ( b ), the stage 1 is rotated by the θ drive mechanism 6 b, and the posture of the substrate W is controlled. Then, the inclination angle of the line to be processed on the substrate W relative to the Y direction is set within a predetermined angle range (here, the inclination angle is set to θ1). Thereafter, the process proceeds to step S5.

Also, when the inclination angle of the line to be processed with respect to the Y direction is already within a predetermined angle range in the state where the substrate W is placed on the table 1, the process proceeds from step S3 to step S5.

In step S5, according to the direction of the planned machining line obtained in step S2, or the inclination angle θ1 of the posture control by step S4, the machining start position and the machining end position of the machining planned line (refer to FIG. 6(b) ) to perform operations.

In step S6, the tool 2 is moved from the machining start position to the machining end position to perform groove machining.

Specifically, first, the air cylinder 19 is driven to lower the holder 17 and the rocking member 18, and the tip of the tool 2 is brought into contact with the film. The pressure applied to the film by the tool 2 at this time is adjusted by the air pressure supplied to the air cylinder 19 . In addition, in the following description, the board|substrate W is mounted on the stage 1 in the posture inclined only by angle θ1 with respect to a Y direction.

Next, the X-direction drive mechanism 6c and the Y-direction drive mechanism 6a are driven to scan the head portion 3 along the line L to be grooved. FIG. 3 schematically shows the postures of the swing member 18 and the tool 2 at this time.

When moving in the forward direction shown in FIG. 3( a ) (when moving to the right in FIG. 3 ), the first knife 38 a comes into contact with the thin film on the substrate. Here, as shown in Fig. 6(b) and Fig. 7, the processing line L is only inclined at an angle θ1 with respect to the Y direction, so the tool 2 is moved in the +M direction to generate processing resistance (R), then along the rocking axis The swing member 18 is acted on by a first component force (Fy) that oscillates around the holder body 22 and a second component force (Fx) that presses against the side of the holder main body 22 .

By the above first component force (Fy), the rocking member 18 rocks clockwise around the pin 26 . As shown in FIG. 3( a ), this swinging is restricted by abutting the upper end portion 25 b of the swinging member 18 against the cylindrical member 28 a on the right side. Moreover, the swing member 18 moves toward the holder main body 22 side and is pressed against the holder main body 22 by the second component force (Fx). That is, the holder body 22 restricts movement along the rocking axis of the rocking member 18 and the tool 2 held by the rocking member 18 .

As described above, the tool 2 is stabilized in the postures shown in FIG. 3( a ) and FIG. 7 , and moves in the +M direction in this state to form a groove.

Next, in step S7, it is judged whether or not the groove machining has been completed for all the planned machining lines. When the groove machining has not been completed for all the planned machining lines, the process returns from step S7 to step S5, and the same process as above is repeatedly executed.

That is, the head 3 is relatively moved with respect to the substrate, and the tool 2 is moved to the line on which the groove processing is planned to be lowered next. Then, in the same manner as above, the tool 2 is pressed against the thin film on the substrate, and the head 3 is moved in a direction opposite to the above.

During this back and forth movement (when moving to the left in FIG. 3 ), the second knife 38b comes into contact with the thin film on the substrate. Here, as shown in the schematic diagram of FIG. 8 , machining resistance (-R) occurs contrary to the forward movement. Then, the first component force (-Fy) that oscillates along the circumference of the oscillating shaft and the second component force (-Fx) that presses against the support member 23 side act on the oscillating member 18 .

By the above first component force (-Fy), the rocking member 18 rocks counterclockwise around the pin 26 . As shown in FIG. 3( c ), this swinging is restricted by abutting the upper end portion 25 b of the swinging member 18 against the cylindrical member 28 b on the right side. Moreover, the swing member 18 moves toward the support member 23 side by the second component force (−Fx), and is pressed against the support member 23 . That is, the support member 23 restricts movement along the rocking axis of the rocking member 18 and the tool 2 held by the rocking member 18 .

As described above, the tool 2 is stabilized in the postures shown in FIG. 3( c ) and FIG. 8 , and moves in the −M direction in this state to form a groove.

Furthermore, when moving back and forth, when calculating the processing start position and the processing end position, it is necessary to calculate the distance of the moving part (gap part) of the tool 2 along the rocking axis in addition to the distance of the pitch part of the planned processing line. coordinate correction.

The above processing is repeatedly executed, and when the groove processing is completed for all the planned processing lines, the processing is terminated.

[feature]

Since the planned machining line on which the head 3 moves is only inclined at a predetermined angle with respect to the Y direction, the rocking member 18 is pressed against one side of the rocking shaft in the axial direction by the machining resistance during machining. Therefore, the posture of the rocking member 18 is stable during processing, and the grooves can be formed with high precision.

The above descriptions are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the technology of the present invention. Anyone familiar with this field Without departing from the scope of the technical solution of the present invention, those skilled in the art can use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes. Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (8)

1. A groove processing method for a substrate, characterized in that it forms a groove on the substrate surface along a processing predetermined line extending in the Y direction by a processing device, and the processing device has: a platform having a mounting surface on which the substrate is mounted; a head having a rocking shaft extending in the X direction that supports the groove machining tool freely and rockably, and a restricting mechanism that restricts movement of the groove machining tool along the rocking shaft; and a moving mechanism, which is used to relatively move the platform and the head in the X direction and the Y direction orthogonal to the X direction in a horizontal plane; The groove processing method of the substrate includes: a substrate placing step, which is to place the substrate on the platform in such a manner that the planned processing line of the substrate is inclined within a predetermined angle range relative to the Y direction; a processing position calculation step, which calculates the processing start position and the processing end position of the processing scheduled line of the substrate; and A machining step of performing groove machining along the planned machining line while relatively moving the groove machining tool to the substrate in the X direction and the Y direction based on the calculated machining start position and the machining end position . 2. The groove processing method of the substrate according to claim 1, wherein, The substrate loading step includes: Step 1, which mounts the substrate on the platform; a second step of confirming the posture of the substrate placed on the platform; Step 3, which determines whether the planned processing line in the substrate is within a range of a predetermined inclination angle with respect to the Y direction; and In a fourth step, when the inclination angle of the line to be processed on the substrate with respect to the Y direction is not within the predetermined inclination angle range, the posture of the substrate is controlled so as to be within the predetermined angle range. 3 . The substrate grooving method according to claim 2 , wherein in the second step, an alignment mark of the substrate placed on the stage is photographed to confirm the posture of the substrate. 4 . 4. A groove processing device for a substrate, characterized in that it is a groove processing device that forms a groove on a substrate surface along a processing schedule line extending in the Y direction, and has: a platform having a mounting surface on which the substrate is mounted; a head having a rocking shaft extending in an X direction perpendicular to the Y direction, the rocking shaft rockably supporting the groove processing tool, and having a restricting mechanism restricting movement of the groove processing tool along the rocking shaft; a moving mechanism, which is used to relatively move the platform and the head in the X direction and the Y direction in a horizontal plane; a substrate posture confirmation device, which confirms the posture of the substrate placed on the platform; a substrate posture control mechanism that controls the posture of the substrate on the stage relative to the head; and control means for controlling the movement mechanism and the substrate posture control mechanism based on the confirmation result from the substrate posture confirmation device; This control has: a processing position calculation function for calculating the processing start position and Calculate the machining end position; and The movement control function controls the movement mechanism according to the calculation result of the machining position calculation function, so that the groove machining tool moves from the machining start position to the machining end position. 5. The substrate grooving device according to claim 4, wherein, The groove processing apparatus further includes a substrate posture control mechanism that controls the posture of the substrate on the stage relative to the head; The control means further has: A substrate posture determination function, which determines whether, in the substrate placed on the platform, the line to be processed is inclined within a predetermined range of inclination angles with respect to the Y direction, based on the confirmation result obtained by the substrate posture confirmation device; and The substrate posture control function, which controls the substrate posture control mechanism so that the substrate's planned processing line is relative to the Y direction when the inclination angle of the substrate is not within the predetermined inclination angle range controlling the posture of the substrate so that the inclination angle in the Y direction is within the predetermined inclination angle range; The substrate posture control mechanism and the moving mechanism are controlled based on the confirmation result from the substrate posture confirmation device. 6. The substrate groove processing device according to claim 4 or 5, wherein the head has: base; a holder which is vertically supported relative to the base and which holds the groove processing tool; and The pressing member presses the grooving tool held by the holder against the substrate with a predetermined pressing force. 7. The substrate groove processing device according to claim 6, wherein the holder has: Hold the body; a support member fixed to the holder body; and The rocking member is rockably supported by the holder body and the supporting member, and is supported freely movable along the axial direction of the rocking shaft. Shake around and get to and from mobile locations. 8. The substrate grooving device according to claim 7, wherein, A space for accommodating the swing member supported by the swing shaft is formed between the holder body and the support member, and the restricting mechanism is constituted by the holder body and the support member.