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JP4545230B1 - Pattern forming device - Google Patents

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JP4545230B1
JP4545230B1 JP2010088358A JP2010088358A JP4545230B1 JP 4545230 B1 JP4545230 B1 JP 4545230B1 JP 2010088358 A JP2010088358 A JP 2010088358A JP 2010088358 A JP2010088358 A JP 2010088358A JP 4545230 B1 JP4545230 B1 JP 4545230B1
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substrate
support plate
pattern
detection
processing
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JP2011175224A (en
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智雄 松下
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Abstract


【課題】 基板に対するパターン形成を迅速且つ正確に行うことができるパターン形成装置を提供する。
【解決手段】 基板wに対してパターン形成を行うパターン形成装置1であって、支持板2と、支持板2を回動する駆動手段8と、支持板2の回動により検出位置Dに搬送された基板wの位置を検出する基板位置検出手段20と、支持板2の回動により加工位置Pに搬送された基板wに対してパターン形成を行う加工手段30とを備え、支持板2の各装着部4,4は、基板位置検出手段20の検出に基づいて基板wの位置を修正する位置修正手段5を備えており、駆動手段8は、支持板2を正逆両方向に180°回動して各装着部4,4が検出位置Dと加工位置Pとの間で移動するように制御される。
【選択図】図1

PROBLEM TO BE SOLVED: To provide a pattern forming apparatus capable of performing pattern formation on a substrate quickly and accurately.
SOLUTION: A pattern forming apparatus 1 for forming a pattern on a substrate w, which is transported to a detection position D by a support plate 2, a drive unit 8 for rotating the support plate 2, and a rotation of the support plate 2. Substrate position detecting means 20 for detecting the position of the substrate w, and processing means 30 for forming a pattern on the substrate w transported to the processing position P by the rotation of the support plate 2. Each of the mounting portions 4 and 4 includes a position correcting unit 5 that corrects the position of the substrate w based on the detection by the substrate position detecting unit 20, and the driving unit 8 rotates the support plate 2 180 degrees in both forward and reverse directions. The mounting portions 4 and 4 are controlled to move so as to move between the detection position D and the processing position P.
[Selection] Figure 1

Description

本発明は、基板に対して印刷やレーザ加工等によりパターン形成を行うパターン形成装置に関する。   The present invention relates to a pattern forming apparatus that forms a pattern on a substrate by printing, laser processing, or the like.

基板に対してパターン形成を行うための装置として、例えば特許文献1に開示されたスクリーン印刷装置が知られている。図4に示すように、この印刷装置50は、一方向に回転するテーブル51の上面に3つの位置修正機構52が設けられており、設置位置において位置修正機構52に設置されたワークwは、テーブル51が120°回転することによりカメラ53の下方に移動し、カメラ53の検出に基づき位置修正が行われた後、再びテーブル51が120°回転して印刷ユニット54に搬送される。印刷ユニット54において印刷が行われたワークwは、更に120°回転して設置位置に戻る。こうして、投入したワークwに対する印刷を順次行うことができる。   As an apparatus for forming a pattern on a substrate, for example, a screen printing apparatus disclosed in Patent Document 1 is known. As shown in FIG. 4, the printing apparatus 50 is provided with three position correction mechanisms 52 on the upper surface of a table 51 that rotates in one direction, and the workpiece w installed in the position correction mechanism 52 at the installation position is: When the table 51 is rotated by 120 °, the table 51 is moved below the camera 53. After the position is corrected based on the detection of the camera 53, the table 51 is rotated again by 120 ° and conveyed to the printing unit. The work w on which printing has been performed in the printing unit 54 is further rotated by 120 ° and returned to the installation position. In this way, it is possible to sequentially print the input workpiece w.

特開平11−129444号公報JP 11-129444 A

ところが、上記従来の印刷装置50は、設置位置に投入されたワークwが再び設置位置に戻るまでに、カメラ53及び印刷ユニット54でそれぞれ停止して位置修正及び印刷を順次行う必要があるため、迅速なパターン形成ができないという問題があった。   However, the above-described conventional printing apparatus 50 needs to perform position correction and printing sequentially by stopping by the camera 53 and the printing unit 54 before the workpiece w put into the installation position returns to the installation position again. There was a problem that rapid pattern formation was impossible.

そこで、本発明は、基板に対するパターン形成を迅速且つ正確に行うことができるパターン形成装置の提供を目的とする。   SUMMARY An advantage of some aspects of the invention is that it provides a pattern forming apparatus capable of performing pattern formation on a substrate quickly and accurately.

本発明の前記目的は、基板に対してパターン形成を行うパターン形成装置であって、起立する回動軸周りに回動自在に支持され前記回動軸を挟んだ両側に基板が装着される装着部を有する支持板と、前記支持板を回動する駆動手段と、前記支持板の回動により検出位置に搬送された基板の位置を検出する基板位置検出手段と、前記支持板の回動により加工位置に搬送された基板に対してパターン形成を行う加工手段とを備え、前記駆動手段は、前記支持板を正逆両方向に180°回動して前記各装着部が前記検出位置と前記加工位置との間で移動するように制御され、前記装着部は、配線を介して駆動されるアクチュエータからなる位置修正装置と、基板を保持するテーブルとを備え、前記基板位置検出手段の検出に基づいて前記アクチュエータの作動により前記テーブルを移動して、前記テーブルに保持された基板の位置修正を行うように構成されているパターン形成装置により達成される。
The object of the present invention is a pattern forming apparatus for forming a pattern on a substrate, wherein the substrate is mounted on both sides of the rotating shaft supported rotatably around a rotating shaft that stands up. A support plate having a portion, a drive unit for rotating the support plate, a substrate position detection unit for detecting the position of the substrate conveyed to the detection position by the rotation of the support plate, and the rotation of the support plate Processing means for forming a pattern on the substrate transported to the processing position, and the driving means rotates the support plate 180 ° in both forward and reverse directions so that the mounting portions are located at the detection position and the processing position. The mounting unit includes a position correction device including an actuator driven via wiring, and a table that holds a substrate, and is based on detection by the substrate position detection unit. Actu Move the table by the operation of the motor is accomplished by Configured patterning device to perform the positional correction of the substrate held on said table.

このパターン形成装置は、前記検出位置にある前記装着部に対して基板の搬入及び搬出を行う搬出入手段を更に備えることが好ましい。   It is preferable that the pattern forming apparatus further includes a loading / unloading unit that loads and unloads the substrate with respect to the mounting portion at the detection position.

本発明によれば、基板に対するパターン形成を迅速且つ正確に行うことができるパターン形成装置を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the pattern formation apparatus which can perform the pattern formation with respect to a board | substrate rapidly and correctly can be provided.

本発明の一実施形態に係るパターン形成装置の平面図である。It is a top view of the pattern formation apparatus which concerns on one Embodiment of this invention. 図1の要部側面図である。It is a principal part side view of FIG. 本発明の他の実施形態に係るパターン形成装置の要部平面図である。It is a principal part top view of the pattern formation apparatus which concerns on other embodiment of this invention. 従来のパターン形成装置の斜視図である。It is a perspective view of the conventional pattern formation apparatus.

以下、本発明の実施の形態について、添付図面を参照して説明する。図1は、本発明の一実施形態に係るパターン形成装置の平面図である。図1に示すように、パターン形成装置1は、両側に基板wの装着部4,4を有する支持板2と、支持板2を回動する駆動装置8と、装着部4に対する基板wの搬出入を行う搬出入装置10と、装着部4に取り付けられた基板wの位置を検出する基板位置検出装置20と、装着部4に取り付けられた基板wに対してパターン形成を行う加工装置30とを備えている。   Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of a pattern forming apparatus according to an embodiment of the present invention. As shown in FIG. 1, the pattern forming apparatus 1 includes a support plate 2 having mounting portions 4 and 4 for the substrate w on both sides, a driving device 8 for rotating the support plate 2, and carrying out the substrate w to the mounting portion 4. A loading / unloading device 10 for loading / unloading, a substrate position detection device 20 for detecting the position of the substrate w attached to the mounting portion 4, and a processing device 30 for forming a pattern on the substrate w attached to the mounting portion 4 It has.

支持板2は、図2に側面図で示すように、起立する回動軸7に中心部が支持されており、揺動モータ等のロータリーアクチュエータからなる駆動装置8により、回動軸7周り(図1の矢示A方向)に回動自在とされている。装着部4,4は、回動軸7を挟んで支持板2の長手方向両側の上面にそれぞれ設けられている。   As shown in a side view in FIG. 2, the support plate 2 is supported at the center by an upright rotating shaft 7, and around the rotating shaft 7 by a driving device 8 including a rotary actuator such as a swing motor ( It can be freely rotated in the direction of arrow A in FIG. The mounting portions 4 and 4 are respectively provided on the upper surfaces on both sides in the longitudinal direction of the support plate 2 with the rotation shaft 7 interposed therebetween.

各装着部4は、サーボモータ等の3つのアクチュエータ5a,5b,5cからなる位置修正装置5と、基板wを保持するテーブル6とを備えており、テーブル6を水平面に沿って図1のX方向、Y方向及びθ方向に移動させることにより、テーブル6に保持された基板wの位置修正を行うことができる。テーブル6には、多数の吸引孔(図示せず)が形成されており、上面に載置された基板wを固定することができる。   Each mounting portion 4 includes a position correcting device 5 including three actuators 5a, 5b, and 5c such as a servo motor, and a table 6 that holds a substrate w. The table 6 extends along the horizontal plane X in FIG. The position of the substrate w held on the table 6 can be corrected by moving in the direction, the Y direction, and the θ direction. A number of suction holes (not shown) are formed in the table 6, and the substrate w placed on the upper surface can be fixed.

搬出入装置10は、図1及び図2に示すように、基板wを移送するベルトコンベア等のコンベア40の近傍上方に配置されており、コンベア40の搬送面41と支持板2の装着部4との間で、基板wを交換することができる。この搬出入装置10は、水平方向に延びる支持アーム12を備え、この支持アーム12の中心部には、鉛直方向に延びる回転軸14が設けられている。この回転軸14の上端部にはモータ15が連結されており、これにより支持アーム12が水平面上を回転できるように構成されている。また、回転軸14は、上下方向に移動可能に本体部11に支持された移動軸16とモータ15を介して連結されており、これにより支持アーム12は、上下方向に移動できるように構成されている。支持アーム12の両端部下面側には、吸盤やベルヌーイチャック等の吸引保持部13,13がそれぞれ設けられており、基板wを吸着保持可能に構成されている。   As shown in FIGS. 1 and 2, the carry-in / out device 10 is arranged in the vicinity of a conveyor 40 such as a belt conveyor for transferring the substrate w, and the carrying surface 41 of the conveyor 40 and the mounting portion 4 for the support plate 2. The substrate w can be exchanged between the two. The carry-in / out device 10 includes a support arm 12 extending in the horizontal direction, and a rotation shaft 14 extending in the vertical direction is provided at the center of the support arm 12. A motor 15 is connected to the upper end portion of the rotary shaft 14 so that the support arm 12 can rotate on a horizontal plane. The rotating shaft 14 is connected to a moving shaft 16 supported by the main body 11 so as to be movable in the vertical direction via a motor 15, whereby the support arm 12 is configured to be movable in the vertical direction. ing. Suction holders 13 and 13 such as a suction cup and a Bernoulli chuck are provided on the lower surfaces of both ends of the support arm 12, respectively, so that the substrate w can be sucked and held.

基板位置検出装置20は、装着部4に装着された基板wの一部や、基板wに予め印刷されている見当マークの位置を読み取って基板wの位置を検出できるように構成されており、CCDカメラや顕微鏡などの撮像装置22を備えている。撮像装置22の数は特に限定されないが、本実施形態では2つ設けられている。   The substrate position detection device 20 is configured to detect the position of the substrate w by reading a part of the substrate w mounted on the mounting unit 4 or the position of a registration mark printed in advance on the substrate w. An imaging device 22 such as a CCD camera or a microscope is provided. Although the number of the imaging devices 22 is not particularly limited, two are provided in the present embodiment.

加工装置30は、基板上に導電ペースト等を塗布してパターン形成する装置であり、例えば、スクリーン印刷機を例示することができる。加工装置30は、予め設定されたパターン形状に基づき、基板上に印刷パターンや溝パターン等の各種パターンを形成可能なものであればよく、例えば、レーザ加工により基板上に配線パターンやマーキングを施すことができるレーザ加工装置や、インクジェット方式の印刷装置であってもよい。   The processing apparatus 30 is an apparatus that forms a pattern by applying a conductive paste or the like on a substrate. For example, a screen printing machine can be exemplified. The processing apparatus 30 only needs to be able to form various patterns such as a printing pattern and a groove pattern on the substrate based on a preset pattern shape. For example, the processing device 30 applies a wiring pattern or marking on the substrate by laser processing. It may be a laser processing apparatus or an ink jet printing apparatus.

基板位置検出装置20及び加工装置30は、支持板2が図1に破線で示す位置にあるときに、各装着部4,4に装着された基板wに対して、位置検出とパターン形成とをそれぞれ行うことができるように配置されている。駆動装置8は、基板位置検出装置20による基板wの位置検出が可能な検出位置Dと、加工装置30による基板wへのパターン形成が可能な加工位置Pとの間で各装着部4,4が移動するように、支持板2を正逆両方向に180°回動する。   The substrate position detection device 20 and the processing device 30 perform position detection and pattern formation on the substrate w mounted on the mounting portions 4 and 4 when the support plate 2 is at the position indicated by the broken line in FIG. Arranged so that each can be done. The driving device 8 includes the mounting portions 4 and 4 between a detection position D where the substrate position detection device 20 can detect the position of the substrate w and a processing position P where the processing device 30 can form a pattern on the substrate w. The support plate 2 is rotated 180 ° in both forward and reverse directions so that the

これら駆動装置8、搬出入装置10、基板位置検出装置20、加工装置30、コンベア40及び装着部4が備える各アクチュエータ5a〜5cの作動は、不図示の制御装置により制御される。   The operations of the actuators 5a to 5c included in the driving device 8, the loading / unloading device 10, the substrate position detection device 20, the processing device 30, the conveyor 40, and the mounting unit 4 are controlled by a control device (not shown).

次に、上記のパターン形成装置1を用いて基板にパターン形成する方法を説明する。制御装置は、コンベア40を間欠駆動して基板wを移送し、コンベア40上のパターン形成されていない基板wが支持アーム12の下方に到達したときにコンベア40を停止すると共に、装着部4の一方が検出位置Dにある位置で支持板2を停止する。   Next, a method for forming a pattern on a substrate using the pattern forming apparatus 1 will be described. The control device intermittently drives the conveyor 40 to transfer the substrate w, stops the conveyor 40 when the unpatterned substrate w on the conveyor 40 reaches below the support arm 12, and The support plate 2 is stopped at a position where one is at the detection position D.

そして、支持アーム12を下降させて、コンベア40および装着部4に支持された基板wをそれぞれ吸引保持部13,13により吸引保持する。この後、支持アーム12を上昇させながら180°回転して基板wを入れ替え、再度下降させることにより、コンベア40および装着部4に基板を載置する。こうして、コンベア40から装着部4への基板wの搬入が行われると共に、装着部4からコンベア40への基板wの搬出が行われる。   Then, the support arm 12 is lowered, and the substrate w supported by the conveyor 40 and the mounting portion 4 is sucked and held by the suction holding portions 13 and 13, respectively. Thereafter, the substrate w is replaced by rotating 180 ° while raising the support arm 12 and lowered again, whereby the substrate is placed on the conveyor 40 and the mounting portion 4. Thus, the substrate w is carried from the conveyor 40 to the mounting unit 4 and the substrate w is carried from the mounting unit 4 to the conveyor 40.

次に、装着部4に取り付けられた基板wの位置修正を行う。すなわち、基板位置検出装置20によって装着部4上の基板wの位置を検出した後、検出された基板wの位置と、予め設定している基板wの所定位置とのずれ量を算出する。その後、算出されたずれ量に基づいて、位置修正装置5の各アクチュエータ5a,5b,5cを作動させて、基板の位置ずれを吸収する方向にテーブル6を移動する。これにより、装着部4上の基板wの位置を、予め設定された位置に補正することができる。装着部4の一方が検出位置Dで停止している間は、装着部4の他方は加工位置Pで停止している。加工装置30は、加工位置Pにある装着部4に装着された基板wに対して、所定のパターン形成を行う。   Next, position correction of the board | substrate w attached to the mounting part 4 is performed. That is, after the position of the substrate w on the mounting unit 4 is detected by the substrate position detection device 20, a deviation amount between the detected position of the substrate w and a predetermined position of the substrate w set in advance is calculated. Thereafter, based on the calculated deviation amount, the actuators 5a, 5b, 5c of the position correction device 5 are operated to move the table 6 in a direction to absorb the substrate deviation. Thereby, the position of the board | substrate w on the mounting part 4 can be correct | amended to the position set beforehand. While one of the mounting portions 4 is stopped at the detection position D, the other of the mounting portions 4 is stopped at the processing position P. The processing apparatus 30 forms a predetermined pattern on the substrate w mounted on the mounting unit 4 at the processing position P.

制御装置は、装着部4からの位置修正完了信号と、加工装置30からのパターン形成完了信号の双方の入力を受けると、支持板2を180°回動させて、検出位置Dにあった位置修正後の基板wを加工位置Pに搬送すると共に、加工位置Pにあったパターン形成後の基板wを検出位置Dに搬送する。そして、検出位置Dに搬送された基板wを、搬出入装置10の作動によりコンベア40上の基板wと交換して新たな基板wの位置検出及び位置修正を行う一方、加工位置Pに搬送された基板wに対してはパターン形成を行う。この後、支持板2を上記回動方向とは逆方向に180°回動して基板wの入れ替えを行うことにより、コンベア40により移送される基板wに対してパターン形成を順次行うことができる。   When the control device receives both the position correction completion signal from the mounting portion 4 and the pattern formation completion signal from the processing device 30, the control device rotates the support plate 2 by 180 ° to find the position at the detection position D. The corrected substrate w is transported to the processing position P, and the substrate w after pattern formation at the processing position P is transported to the detection position D. Then, the substrate w transported to the detection position D is exchanged with the substrate w on the conveyor 40 by the operation of the carry-in / out device 10 to detect the position and correct the position of the new substrate w, while being transported to the processing position P. A pattern is formed on the substrate w. Thereafter, the support plate 2 can be rotated 180 ° in the direction opposite to the rotation direction so as to replace the substrate w, whereby pattern formation can be sequentially performed on the substrates w transferred by the conveyor 40. .

本実施形態のパターン形成装置1によれば、支持板2を正逆両方向に180°回動することにより、一方の装着部4が検出位置Dに来たときに装着部4の他方が加工位置Pに来るように、各装着部4,4が検出位置Dと加工位置Pとの間で移動するので、基板wの位置検出とパターン形成とを常に同時に行うことができる。したがって、基板wに対するパターン形成を迅速に行うことができる。   According to the pattern forming apparatus 1 of the present embodiment, the support plate 2 is rotated 180 ° in both forward and reverse directions, so that when the one mounting portion 4 comes to the detection position D, the other of the mounting portions 4 is in the processing position. Since the mounting portions 4 and 4 move between the detection position D and the processing position P so as to come to P, the position detection and pattern formation of the substrate w can always be performed simultaneously. Therefore, pattern formation on the substrate w can be performed quickly.

また、支持板2は、正逆両方向に回動するので、位置修正装置5の各アクチュエータ5a〜5c等に接続された配線が回動軸7等に巻き付くおそれがなく、正確なパターン形成を維持することができる。   Further, since the support plate 2 is rotated in both forward and reverse directions, there is no possibility that the wiring connected to the actuators 5a to 5c of the position correction device 5 is wound around the rotation shaft 7 and the like, and accurate pattern formation is performed. Can be maintained.

また、本実施形態のように、検出位置Dで停止している装着部4に対して、搬出入装置10により基板wの搬入及び搬出を行うように構成することで、一方の装着部4で基板wのパターン形成を行っている間に、他方の装着部4で基板wの位置検出だけでなく基板wの搬出入も行うことができる。したがって、基板wに対するパターン形成をより迅速に行うことができる。但し、装着部4に対する基板wの搬出入位置は検出位置Dに限定されるものではなく、装着部4が加工位置Pから検出位置Dまで搬送される間の任意の位置であってもよい。   Further, as in the present embodiment, the mounting portion 4 stopped at the detection position D is configured to carry in and out the substrate w by the carry-in / out device 10, so that one mounting portion 4 While the pattern of the substrate w is being formed, not only the position detection of the substrate w but also the loading / unloading of the substrate w can be performed by the other mounting portion 4. Therefore, pattern formation on the substrate w can be performed more quickly. However, the carry-in / out position of the substrate w with respect to the mounting unit 4 is not limited to the detection position D, and may be any position during which the mounting unit 4 is transported from the processing position P to the detection position D.

本実施形態においては、一方の装着部4における基板wの位置修正が完了した後に支持板2を回動するように駆動装置8の駆動制御を行っているが、他方の装着部4の基板wに対するパターン形成が完了している場合には、一方の装着部4における基板wの位置検出が行われた時点で支持板2の回動を開始し、支持板2の回動中に装着部4による基板wの位置修正を行うように構成してもよい。これにより、一方の装着部4に対する基板wの搬出入に時間がかかった場合でも、タイムロスを最小限に抑制して生産性を良好に維持することができる。   In this embodiment, the drive device 8 is controlled to rotate the support plate 2 after the correction of the position of the substrate w in the one mounting portion 4 is completed, but the substrate w of the other mounting portion 4 is controlled. When the pattern formation is completed, the rotation of the support plate 2 is started when the position of the substrate w in the one mounting portion 4 is detected, and the mounting portion 4 is rotated during the rotation of the support plate 2. The position of the substrate w may be corrected by the above. Thereby, even when it takes time to carry in / out the substrate w with respect to the one mounting portion 4, the time loss can be minimized and the productivity can be maintained satisfactorily.

本実施形態における支持板2は、矩形状の長手方向両側にそれぞれ配置された一対の装着部4,4を備える構成としているが、図3に示すように、支持板2を円板状に形成して、複数対(例えば3対)の装着部4a,4a;4b,4b;4c,4cを備える構成にしてもよい。各対の装着部は、回動軸7を挟んで対向配置されており、対によって装着部の大きさや形状が異なることが好ましい。このような構成によれば、基板wの大きさや形状に合った装着部の対(例えば、装着部4b,4b)を適宜選択して、選択した装着部4b,4bがそれぞれ検出位置及び加工位置に来るように支持板2の回動(正逆両方向に180°の回動)を制御することで、パターン形成装置1の汎用性を高めることができる。支持板2は、矩形状や円板状以外に、楕円形状や十字状など種々の形状にすることができる。   The support plate 2 in the present embodiment is configured to include a pair of mounting portions 4 and 4 disposed on both sides of the rectangular shape in the longitudinal direction, but the support plate 2 is formed in a disc shape as shown in FIG. And you may make it the structure provided with multiple pairs (for example, 3 pairs) mounting part 4a, 4a; 4b, 4b; 4c, 4c. Each pair of mounting portions is disposed to face each other with the rotation shaft 7 in between, and the size and shape of the mounting portions are preferably different depending on the pair. According to such a configuration, a pair of mounting portions (for example, mounting portions 4b and 4b) matching the size and shape of the substrate w is appropriately selected, and the selected mounting portions 4b and 4b are respectively detected and processed. The versatility of the pattern forming apparatus 1 can be enhanced by controlling the rotation of the support plate 2 (180 ° rotation in both forward and reverse directions) so that The support plate 2 can have various shapes such as an elliptical shape and a cross shape in addition to the rectangular shape and the disc shape.

また、搬出入装置10の構成は、本実施形態のように回転方式のものに限定されず、例えば、ベルト駆動方式やボールねじ駆動方式等により基板wを直進搬送して基板wの入れ替えを行う構成など、装着部4に対する基板wの搬入及び搬出が可能な公知のものを採用することができる。基板wの搬入及び搬出は、パターン形成の迅速化を図る観点から、本実施形態と同様に検出位置にある装着部に対して行うことが好ましい。   Further, the configuration of the carry-in / out apparatus 10 is not limited to the rotation type as in the present embodiment, and for example, the substrate w is exchanged by linearly conveying the substrate w by a belt driving method, a ball screw driving method, or the like. A well-known thing which can carry in and carry out the board | substrate w with respect to the mounting part 4, such as a structure can be employ | adopted. The loading and unloading of the substrate w is preferably performed with respect to the mounting portion at the detection position in the same manner as the present embodiment from the viewpoint of speeding up the pattern formation.

また、本実施形態においては、基板位置検出装置20により検出された基板wの位置修正を、各装着部4が備える位置修正装置5により行っているが、基板位置修正手段は、必ずしも各装着部4に設ける必要はない。また、検出された基板wの位置修正手段は、基板wを物理的に移動させる構成に限定されるものではなく、パターン形成を行う加工装置30に位置修正機能を内蔵させたものであってもよい。   Further, in the present embodiment, the position correction of the substrate w detected by the substrate position detection device 20 is performed by the position correction device 5 provided in each mounting portion 4, but the substrate position correcting means is not necessarily provided by each mounting portion. 4 need not be provided. The detected position correction means for the substrate w is not limited to the configuration in which the substrate w is physically moved, and the position correction function may be incorporated in the processing apparatus 30 that performs pattern formation. Good.

例えば、加工装置30が、設定された加工目標座標に基づいてXY平面上でレーザスポットを走査することにより基板に対してパターン形成を行うことができるレーザ加工装置である場合、基板位置検出装置20の検出基準面とレーザ加工装置の加工基準面とが同一平面上となるように支持板2を水平回動可能に設定し、基板位置検出装置20により検出された基板の位置をレーザ加工装置に入力することにより、この検出結果に基づいてレーザ加工装置における加工目標座標を補正することができる。すなわち、レーザ加工装置における基準座標系での加工目標座標を、基板位置検出装置20の検出に基づき算出されたx方向、y方向及びθ方向(図1参照)のずれ量に基づいて仮想座標系での加工目標座標に変換し、この仮想座標系でレーザスポットの駆動制御を行うことにより、各装着部4に取り付けられた基板自体を移動させることなく正確なパターン形成を行うことができる。この構成によれば、各装着部4の位置修正装置5が不要になるため構成の簡素化を図ることができるだけでなく、基板の移動による位置合わせが不要であるために作業をより迅速に行うことが可能になる。加工手段が基板位置修正手段を内蔵する構成としては、上記のものに限定されず、例えば、加工手段がスクリーン印刷機である場合には、基板検出位置に基づいてスクリーン位置を調整することにより、基板自体を移動させることなく基板の位置ずれを補償することができる。 For example, when the processing apparatus 30 is a laser processing apparatus that can perform pattern formation on the substrate by scanning a laser spot on the XY plane based on the set processing target coordinates, the substrate position detection apparatus 20 The support plate 2 is set to be horizontally rotatable so that the detection reference surface of the laser beam and the processing reference surface of the laser processing apparatus are on the same plane, and the position of the substrate detected by the substrate position detection device 20 is set in the laser processing apparatus. By inputting, the processing target coordinates in the laser processing apparatus can be corrected based on the detection result. In other words, the processing target coordinates in the reference coordinate system in the laser processing apparatus are determined based on the deviation amounts in the x direction, the y direction, and the θ direction (see FIG. 1) calculated based on the detection by the substrate position detection apparatus 20. By converting to processing target coordinates in FIG. 5 and performing drive control of the laser spot in this virtual coordinate system, accurate pattern formation can be performed without moving the substrate itself attached to each mounting portion 4. According to this configuration, the position correcting device 5 of each mounting portion 4 is not required, so that not only the configuration can be simplified, but also the operation is performed more quickly because the alignment by the movement of the substrate is unnecessary. It becomes possible. The configuration in which the processing means incorporates the substrate position correcting means is not limited to the above, and for example, when the processing means is a screen printer, by adjusting the screen position based on the substrate detection position, The displacement of the substrate can be compensated without moving the substrate itself.

1 パターン形成装置
2 支持板
4 装着部
5 位置修正装置
7 回動軸
8 駆動装置
10 搬出入装置
20 基板位置検出装置
30 加工装置
40 コンベア
w 基板
DESCRIPTION OF SYMBOLS 1 Pattern formation apparatus 2 Support plate 4 Mounting part 5 Position correction apparatus 7 Rotating shaft 8 Drive apparatus 10 Carrying in / out apparatus 20 Substrate position detection apparatus 30 Processing apparatus 40 Conveyor w Substrate

Claims (2)

基板に対してパターン形成を行うパターン形成装置であって、
起立する回動軸周りに回動自在に支持され前記回動軸を挟んだ両側に基板が装着される装着部を有する支持板と、
前記支持板を回動する駆動手段と、
前記支持板の回動により検出位置に搬送された基板の位置を検出する基板位置検出手段と、
前記支持板の回動により加工位置に搬送された基板に対してパターン形成を行う加工手段とを備え、
前記駆動手段は、前記支持板を正逆両方向に180°回動して前記各装着部が前記検出位置と前記加工位置との間で移動するように制御され、
前記装着部は、配線を介して駆動されるアクチュエータからなる位置修正装置と、基板を保持するテーブルとを備え、前記基板位置検出手段の検出に基づいて前記アクチュエータの作動により前記テーブルを移動して、前記テーブルに保持された基板の位置修正を行うように構成されているパターン形成装置。
A pattern forming apparatus for forming a pattern on a substrate,
A support plate having a mounting portion on which the substrate is mounted on both sides sandwiching the rotating shaft supported rotatably around the rotating shaft that stands;
Drive means for rotating the support plate;
Substrate position detecting means for detecting the position of the substrate conveyed to the detection position by the rotation of the support plate;
Processing means for forming a pattern on the substrate conveyed to the processing position by the rotation of the support plate;
The drive means is controlled so that the support plate is rotated 180 ° in both forward and reverse directions so that the mounting portions move between the detection position and the processing position.
The mounting portion includes a position correction device including an actuator driven via wiring, and a table for holding a substrate, and the table is moved by the operation of the actuator based on the detection of the substrate position detecting means. A pattern forming apparatus configured to correct the position of the substrate held on the table .
前記検出位置にある前記装着部に対して基板の搬入及び搬出を行う搬出入手段を更に備える請求項1に記載のパターン形成装置。
The pattern forming apparatus according to claim 1, further comprising a loading / unloading unit that loads and unloads the substrate with respect to the mounting portion at the detection position.
JP2010088358A 2010-01-26 2010-04-07 Pattern forming device Expired - Fee Related JP4545230B1 (en)

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