CN103571640A - Water-based LED (Light-Emitting Diode) chip cleaning agent and preparation method thereof - Google Patents
Water-based LED (Light-Emitting Diode) chip cleaning agent and preparation method thereof Download PDFInfo
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- CN103571640A CN103571640A CN201310527309.1A CN201310527309A CN103571640A CN 103571640 A CN103571640 A CN 103571640A CN 201310527309 A CN201310527309 A CN 201310527309A CN 103571640 A CN103571640 A CN 103571640A
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims description 10
- 239000012459 cleaning agent Substances 0.000 title abstract 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 7
- ABBQHOQBGMUPJH-UHFFFAOYSA-M Sodium salicylate Chemical compound [Na+].OC1=CC=CC=C1C([O-])=O ABBQHOQBGMUPJH-UHFFFAOYSA-M 0.000 claims abstract description 7
- 239000008367 deionised water Substances 0.000 claims abstract description 7
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 7
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 7
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 229960004025 sodium salicylate Drugs 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000003647 oxidation Effects 0.000 claims abstract description 5
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 5
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 claims abstract description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 12
- 239000012752 auxiliary agent Substances 0.000 claims description 7
- XURGPLKLBUMZTN-UHFFFAOYSA-N 2-butyl-3-methylbenzene-1,4-diol Chemical group CCCCC1=C(C)C(O)=CC=C1O XURGPLKLBUMZTN-UHFFFAOYSA-N 0.000 claims description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 6
- IMQLKJBTEOYOSI-GPIVLXJGSA-N Inositol-hexakisphosphate Chemical compound OP(O)(=O)O[C@H]1[C@H](OP(O)(O)=O)[C@@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@H](OP(O)(O)=O)[C@@H]1OP(O)(O)=O IMQLKJBTEOYOSI-GPIVLXJGSA-N 0.000 claims description 6
- 102000004895 Lipoproteins Human genes 0.000 claims description 6
- 108090001030 Lipoproteins Proteins 0.000 claims description 6
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 claims description 6
- IMQLKJBTEOYOSI-UHFFFAOYSA-N Phytic acid Natural products OP(O)(=O)OC1C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C(OP(O)(O)=O)C1OP(O)(O)=O IMQLKJBTEOYOSI-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 239000003153 chemical reaction reagent Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- CKQVRZJOMJRTOY-UHFFFAOYSA-N octadecanoic acid;propane-1,2,3-triol Chemical compound OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O CKQVRZJOMJRTOY-UHFFFAOYSA-N 0.000 claims description 6
- 229940068041 phytic acid Drugs 0.000 claims description 6
- 235000002949 phytic acid Nutrition 0.000 claims description 6
- 239000000467 phytic acid Substances 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 239000003112 inhibitor Substances 0.000 claims description 3
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 229910021645 metal ion Inorganic materials 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract description 2
- 239000002689 soil Substances 0.000 abstract description 2
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 239000000654 additive Substances 0.000 abstract 3
- 230000000996 additive effect Effects 0.000 abstract 3
- IMOYOUMVYICGCA-UHFFFAOYSA-N 2-tert-butyl-4-hydroxyanisole Chemical compound COC1=CC=C(O)C=C1C(C)(C)C IMOYOUMVYICGCA-UHFFFAOYSA-N 0.000 abstract 1
- 235000019441 ethanol Nutrition 0.000 abstract 1
- 150000002191 fatty alcohols Chemical class 0.000 abstract 1
- 125000005456 glyceride group Chemical group 0.000 abstract 1
- 239000002736 nonionic surfactant Substances 0.000 abstract 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical compound CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002085 irritant Substances 0.000 description 1
- 231100000021 irritant Toxicity 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
The invention relates to a water-based LED (Light-Emitting Diode) chip cleaning agent. The water-based LED chip cleaning agent is prepared from the following raw materials in parts by weight: 3-4 parts of heterogeneous fatty alcohol polyoxyethylene ether, 1-2 parts of monostearate glyceride, 2-3 parts of sodium salicylate, 20-25 parts of propanediol, 10-12 parts of 1, 3-dioxolane, 3-4 parts of rosin, 30-35 parts of ethyl alcohol, 6-8 parts of tert-butyl-4-hydroxy anisole, 4-5 parts of tripropylene glycol methyl ether, 4-5 parts of additive and 100-120 parts of deionized water. By adopting the water-based LED chip cleaning agent, as a nonionic surfactant is used, the water-based LED chip cleaning agent is good in the synergistic effect and has rapid cleaning ability to organic matters, metal ions, particles and the like, new ionic soil can not be generated, and a chip is not corroded; as the loss is less, the cost is lowered, and the time is saved, the chip yield is greatly increased; as the additive can be used for forming a protective film on the surface of the chip, air is isolated, water and other molecules in the atmosphere are prevented from corroding the chip, and the additive can be used for resisting oxidation and is convenient for a next manufacturing process.
Description
Technical field
The present invention relates to clean-out system field, relate in particular to a kind of water base LED chip clean-out system and preparation method thereof.
Background technology
The industry Wafer Cleanings such as silicon slice detergent is widely used in photovoltaic, electronics; Because silicon chip can pollute to some extent in transportation, surface cleanliness is not very high, the corrosion and the etching that are about to carry out is had a huge impact, so first will carry out a series of cleaning operation to silicon chip surface.First the general thinking of cleaning is to remove surperficial organic contaminations, and dissolved oxygen film then, because zone of oxidation is " contamination fall into into ", can cause epitaxy defect; Remove again particle, metal etc., make the surface passivation of silicon chip simultaneously.
Current most silicon slice detergent adopts a liquid and No. three liquid in RAC cleaning, but the aobvious alkalescence of liquid may cause silicon face coarse, strictly control temperature, concentration and time; No. three liquid is aobvious acid, has severe corrosive, also unfavorable to HUMAN HEALTH, production cost is high, irritant smell, contaminate environment, therefore require further improvement formula, with reach clean thorough, pollution-free, corrode little, to HUMAN HEALTH, circuit safety, the object that reduces costs.
Summary of the invention
The object of the present invention is to provide a kind of water base LED chip clean-out system and preparation method thereof, this clean-out system has clean thorough, high, the non-corrosive advantage of cleaning efficiency.
Technical scheme of the present invention is as follows:
A kind of water base LED chip clean-out system, it is characterized in that being made by the raw material of following weight part: isomery fatty alcohol-polyoxyethylene ether 3-4, single stearic acid glycerine lipoprotein 1-2, sodium salicylate 2-3, propylene glycol 20-25, DOX 10-12, rosin 3-4, ethanol 30-35, tertiary butyl-4-hydroxy methyl-phenoxide 6-8, tripropylene glycol methyl ether 4-5, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, oxidation inhibitor 1035 1-2, phytic acid 1-2, morpholine 3-4, methacrylic acid-2-hydroxy methacrylate 3-4, ethanol 12-15; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
The preparation method of described water base LED chip clean-out system, it is characterized in that comprising the following steps: by deionized water, isomery fatty alcohol-polyoxyethylene ether, single stearic acid glycerine lipoprotein, sodium salicylate, propylene glycol, 1,3-dioxolane, rosin, ethanol, tertiary butyl-4-hydroxy methyl-phenoxide, tripropylene glycol methyl ether mix, under 1000-1200 rev/min of stirring, speed with 6-8 ℃/minute is heated to 60-70 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
Beneficial effect of the present invention
Clean-out system of the present invention is used nonionogenic tenside, and synergistic effect is good, and organism, metal ion, particle etc. are had to the ability of removing fast, does not produce new ionic soil, corrosion-free to chip; Loss still less, reduces costs, thereby save time, has improved greatly the yield rate of chip.Auxiliary agent of the present invention can form protective membrane at chip surface, and isolated air prevents water and other molecules corrosion chip in atmosphere, anti-oxidant, facilitates next step manufacture craft to carry out.
Embodiment
A kind of water base LED chip clean-out system, by following weight part (kilogram) raw material make: isomery fatty alcohol-polyoxyethylene ether 3.5, single stearic acid glycerine lipoprotein 1.5, sodium salicylate 2.5, propylene glycol 23, DOX 11, rosin 3.5, ethanol 32, tertiary butyl-4-hydroxy methyl-phenoxide 7, tripropylene glycol methyl ether 4.5, auxiliary agent 4.5, deionized water 110;
Described auxiliary agent by following weight part (kilogram) raw material make: Silane coupling reagent KH-570 2.5, oxidation inhibitor 1,035 1.5, phytic acid 1.5, morpholine 3.5, methacrylic acid-2-hydroxy methacrylate 3.5, ethanol 14; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 65 ℃, stirs after 25 minutes, then adds other remaining component, is warming up to 84 ℃, stirs 34 minutes, obtains.
The preparation method of described water base LED chip clean-out system, comprise the following steps: by deionized water, isomery fatty alcohol-polyoxyethylene ether, single stearic acid glycerine lipoprotein, sodium salicylate, propylene glycol, 1,3-dioxolane, rosin, ethanol, tertiary butyl-4-hydroxy methyl-phenoxide, tripropylene glycol methyl ether mix, under 1100 revs/min of stirrings, with the speed of 7 ℃/minute, be heated to 65 ℃, add other remaining components, continue to stir 17 minutes, obtain.
This water base LED chip clean-out system is used for cleaning LED lamp chip, and clean rate is 99.5%, can residual insolubles to cleaning silicon chip surface, do not produce new pollution, and do not affect the quality of product, the silicon chip surface after cleaning is clean, and color and luster is consistent, without piebald.
Claims (2)
1. a water base LED chip clean-out system, it is characterized in that being made by the raw material of following weight part: isomery fatty alcohol-polyoxyethylene ether 3-4, single stearic acid glycerine lipoprotein 1-2, sodium salicylate 2-3, propylene glycol 20-25, DOX 10-12, rosin 3-4, ethanol 30-35, tertiary butyl-4-hydroxy methyl-phenoxide 6-8, tripropylene glycol methyl ether 4-5, auxiliary agent 4-5, deionized water 100-120;
Described auxiliary agent is made by the raw material of following weight part: Silane coupling reagent KH-570 2-3, oxidation inhibitor 1035 1-2, phytic acid 1-2, morpholine 3-4, methacrylic acid-2-hydroxy methacrylate 3-4, ethanol 12-15; Preparation method mixes Silane coupling reagent KH-570, phytic acid, ethanol, is heated to 60-70 ℃, stirs after 20-30 minute, then adds other remaining component, is warming up to 80-85 ℃, stirs 30-40 minute, obtains.
2. the preparation method of water base LED chip clean-out system according to claim 1, it is characterized in that comprising the following steps: by deionized water, isomery fatty alcohol-polyoxyethylene ether, single stearic acid glycerine lipoprotein, sodium salicylate, propylene glycol, 1,3-dioxolane, rosin, ethanol, tertiary butyl-4-hydroxy methyl-phenoxide, tripropylene glycol methyl ether mix, under 1000-1200 rev/min of stirring, speed with 6-8 ℃/minute is heated to 60-70 ℃, add other remaining components, continue to stir 15-20 minute, obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310527309.1A CN103571640A (en) | 2013-10-31 | 2013-10-31 | Water-based LED (Light-Emitting Diode) chip cleaning agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310527309.1A CN103571640A (en) | 2013-10-31 | 2013-10-31 | Water-based LED (Light-Emitting Diode) chip cleaning agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103571640A true CN103571640A (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310527309.1A Pending CN103571640A (en) | 2013-10-31 | 2013-10-31 | Water-based LED (Light-Emitting Diode) chip cleaning agent and preparation method thereof |
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| CN (1) | CN103571640A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085578A (en) * | 2016-06-15 | 2016-11-09 | 安徽有通玻璃有限公司 | A kind of cooling liquid for glass finishing |
| CN106085622A (en) * | 2016-05-31 | 2016-11-09 | 安徽福恩光电科技有限公司 | A kind of LED chip cleanout fluid |
| CN106350296A (en) * | 2016-08-25 | 2017-01-25 | 大连奥首科技有限公司 | A kind of efficient environmental protection LED chip cleaning agent and using method |
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Application publication date: 20140212 |