CN103247228A - Half-metalized holographic copper-plated film and preparing method thereof - Google Patents
Half-metalized holographic copper-plated film and preparing method thereof Download PDFInfo
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- CN103247228A CN103247228A CN2013101497318A CN201310149731A CN103247228A CN 103247228 A CN103247228 A CN 103247228A CN 2013101497318 A CN2013101497318 A CN 2013101497318A CN 201310149731 A CN201310149731 A CN 201310149731A CN 103247228 A CN103247228 A CN 103247228A
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- layer
- copper
- holographic
- hologram
- plating film
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- 238000000034 method Methods 0.000 title abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 109
- 229910052802 copper Inorganic materials 0.000 claims abstract description 108
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 105
- 238000007747 plating Methods 0.000 claims abstract description 35
- 238000003486 chemical etching Methods 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 121
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 230000001681 protective effect Effects 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 229920002521 macromolecule Polymers 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000005406 washing Methods 0.000 claims description 12
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 claims description 9
- 239000004831 Hot glue Substances 0.000 claims description 7
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 3
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 abstract 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 4
- 150000001879 copper Chemical class 0.000 description 3
- 238000001093 holography Methods 0.000 description 3
- 239000002952 polymeric resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000006263 metalation reaction Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 241000208125 Nicotiana Species 0.000 description 1
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005269 aluminizing Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The invention discloses a half-metalized holographic copper-plated film and a preparing method thereof. The copper plated film comprises a transparent base layer, a transparent release layer, a transparent holographic layer and a hot melting glue layer which are sequentially glued together from top to bottom, a copper-plated layer corresponding to the holographic layer is arranged under the holographic layer, and a protecting layer consistent with the copper-plated layer is arranged under the copper-plated layer and glued with the hot melting glue layer. The preparing method thereof includes the steps of: coating the release layer on the base layer, coating the holographic layer on the release layer, plating copper on the holographic layer in a vacuum manner, pressing, printing the protecting layer on the copper-plated layer, and cleaning copper by chemical etching with 25%-35% mass of ferric chloride complex solution at the temperature of 55-60 DEG C. The position of the copper-plated layer corresponds to holographic patterns, and the purpose for mutual reflection is achieved.
Description
Technical field
The invention belongs to the anti-counterfeiting mark field, relate to a kind of local copper facing of location particularly, local transparent holographic film, or local transparent pressed antifakery label also relate to the preparation method of this copper plating film.
Background technology
Laser holography is through nearly 30 years development, be widely used in industry-by-industry, particularly holographic aluminized film and holographic plating deielectric-coating are dazzled characteristics such as beautiful color, high reflectance because of it, promoted the class of product effectively, obtained favorable comment widely, but along with development of times, traditional packaging film is because of the dilatation in market, anti-counterfeiting performance is existing to be reduced, need combine with other technologies, the needs that could adapt to market, simultaneously, the holographic film of the medium of aluminizing can not reach requirement of client on class.
Laser holographic mark is through for many years technological accumulation, tobacco, daily use chemicals, industry-by-industries such as securities have been obtained widely and have been used, particularly the locating thermoprint sign is with high content of technology because of it, characteristics such as manufacture difficulty is big, promoted the class of product effectively, obtained favorable comment widely, but along with development of times, traditional holographic anti-counterfeiting label is because of the dilatation in market, anti-counterfeiting performance is existing to be reduced, and need combine with other technologies, could adapt to the needs in market, simultaneously, traditional laser holographic anti counterfeiting label mainly adopts golden electrochemical aluminum to do, in texture, the equal defectiveness in brightness aspect can't reach the requirement of high-end product.
On the other hand; the technology of aluminizer may further comprise the steps successively at present: be coated with release layer, be coated with hologram layer at release layer, aluminize at hologram layer, impress, print protective seam at aluminium coated, wash aluminium at substrate layer; wash aluminium and generally adopt alkali cleaning; alkali cleaning is the cost height not only; and the solution of washing behind the aluminium is alkalescence; be not easy to handle, very easily cause secondary pollution.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency holographic copper plating film of a kind of semi-metal and preparation method thereof is provided, it has holographic effect, and be provided with copper plate in certain location, other position then is transparent, and the position of copper plate can be corresponding with hologram pattern, reaches the purpose of setting off mutually, improved the class of product from face, increase the difficulty of making, promoted the antifalse effect of product effectively.
For achieving the above object, the present invention is by the following technical solutions:
The holographic copper plating film of a kind of semi-metal; comprise the transparent substrate layer that is bonded together successively, transparent release layer, transparent hologram layer and hot melt adhesive layer from top to bottom; below hologram layer, be provided with the copper plate corresponding with hologram layer; lower floor at copper plate is provided with the protective seam consistent with copper plate, and protective seam and hot melt adhesive layer are bonded together.
The holographic copper plating film of above-mentioned semi-metal, described hologram layer are by the transparent macromolecule resin layer and be stamped in that hologram pattern on the transparent macromolecule resin layer constitutes, and copper plate is located at below the hologram pattern of hologram layer, and its shape is consistent with hologram pattern.
The holographic copper plating film of above-mentioned semi-metal, described hologram layer are by the transparent macromolecule resin layer and be stamped in that hologram pattern on the transparent macromolecule resin layer constitutes, copper plate be located at hologram layer except in the zone below the transparent macromolecule resin layer of hologram pattern.
Be that hologram layer is that thereby the hologram case constitutes hologram layer on polymer resin layer, copper plate is local the existence, can be provided in a side of below the hologram pattern of hologram layer, and its shape is consistent with hologram pattern; Also can be provided in a side of below the hologram pattern of hologram layer, not have copper plate below the hologram pattern, the zone except hologram pattern all is copper facing copper layer.Copper plate and hologram pattern combine and set off mutually like this, constitute visual impact.
The holographic copper plating film of above-mentioned semi-metal, described protective seam is dope layer.
The holographic copper plating film of above-mentioned semi-metal, protective seam is ink lay.
The holographic copper plating film of above-mentioned semi-metal, substrate layer is any of PE, PET, PVC, BOPP.
The holographic copper plating film of above-mentioned semi-metal, the thickness of described substrate layer is 0.012-0.003mm, establishes a cut channel on the described release layer at least, the shape of cut channel is any in literal, pattern or literal and the combination of patterns.
The holographic copper plating film of above-mentioned semi-metal, it is characterized in that: the thickness of described substrate layer is 0.006 ~ 0.2mm, establishes a cut channel on the described release layer at least, the shape of cut channel is any in literal, pattern or literal and the combination of patterns.
The manufacture craft of the holographic copper plating film of above-mentioned semi-metal; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; the described copper step of washing is to be that 25%-35% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 55-60 °.
The manufacture craft of above-mentioned metalized holographic copper plating film, the described copper step of washing is to be that 30% iron chloride complex solution carries out chemical etching with mass content, temperature remains on 58 °.
Adopt technique scheme, the present invention has following advantage: because its holographic effect, and be provided with copper plate in certain location, other position then is transparent, and the position of copper plate can be corresponding with hologram pattern, reaches the purpose of setting off mutually, improved the class of product from face, increase the difficulty of making, promoted the antifalse effect of product effectively.The semi-metal effect has promoted the manufacture difficulty of product effectively, has strengthened false proof effect.Copper plate has promoted the class of product effectively, has obtained good visual effect.The all right locating thermoprint of this copper plating film identifies thereby make the holographic copper facing locating thermoprint of semi-metal in various external packings simultaneously, has same effect.The copper of washing in the manufacturing process of the present invention adopts the metal exchange method, and it is effective to wash copper, and cost is low, and stable performance.
Description of drawings
Fig. 1 is structural representation of the present invention.
Embodiment
The holographic copper plating film of a kind of semi-metal as shown in Figure 1, comprise the transparent substrate layer 1 that is bonded together successively, transparent release layer 2, transparent hologram layer 3 and hot melt adhesive layer 6 from top to bottom, release layer 2 is macromolecule resins, has with substrate layer one and very peels off effect.Below hologram layer 3, be provided with the copper plate corresponding with hologram layer 4; lower floor at copper plate 4 is provided with the protective seam consistent with copper plate 5, and described protective seam is dope layer, is printed on the copper plate; can protect copper plate effectively, not have the place of protective seam all not have copper plate.Protective seam 5 is bonded together with hot melt adhesive layer 6.Hot melt adhesive layer 6 plays a part bonding, the hologram pattern thermoprint can held on the subsides thing.
When the present invention made semi-metal holography copper plating film, its substrate layer thickness was 0.006 ~ 0.2mm.
When the present invention makes semi-metal holography copper facing locating thermoprint sign, its substrate layer thickness is 0.012-0.003mm, namely make holographic copper plating film as stated above earlier, again with this copper plating film locating thermoprint in various external packings, thereby make the holographic copper facing locating thermoprint sign of semi-metal.
Protective seam of the present invention can also be ink lay.
Copper plate of the present invention can have dual mode:
One is as follows: described hologram layer is by the transparent macromolecule resin layer and be stamped in that hologram pattern on the transparent macromolecule resin layer constitutes, polymer resin layer, be mainly used to the hologram case, copper plate is located at below the hologram pattern of hologram layer, and its shape is consistent with hologram pattern.
It is two as follows: described hologram layer is by the transparent macromolecule resin layer and be stamped in that hologram pattern on the transparent macromolecule resin layer constitutes, copper plate be located at hologram layer except in the zone below the transparent macromolecule resin layer of hologram pattern.
Be that hologram layer 1 is that thereby the hologram case constitutes hologram layer on polymer resin layer, copper plate is local the existence, can be provided in a side of below the hologram pattern of hologram layer, and its shape is consistent with hologram pattern; Also can be provided in a side of below the hologram pattern of hologram layer, not have copper plate below the hologram pattern, the zone except hologram pattern all is copper facing copper layer.Copper plate and hologram pattern combine and set off mutually like this, constitute visual impact.
The present invention's substrate layer of the present invention is any of PE, PET, PVC, BOPP, establishes a cut channel on the described release layer at least, and the shape of cut channel is any in literal, pattern or literal and the combination of patterns.
Manufacture craft practical way of the present invention is as follows:
Embodiment 1: the manufacture craft of the holographic copper plating film of a kind of semi-metal; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; the described copper step of washing is to be that 25% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 55 °.
Embodiment 2: the manufacture craft of the holographic copper plating film of a kind of semi-metal; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; the described copper step of washing is to be that 26% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 56 °.
Embodiment 3: the manufacture craft of the holographic copper plating film of a kind of semi-metal; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; the described copper step of washing is to be that 30% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 58 °.
Embodiment 4: the manufacture craft of the holographic copper plating film of a kind of semi-metal; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; the described copper step of washing is to be that 33% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 57 °.
Embodiment 5: the manufacture craft of the holographic copper plating film of a kind of semi-metal; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; the described copper step of washing is to be that 35% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 60 °.
Principle of washing process for copper of the present invention is as follows: 2FeCl
3+ Cu
2FeCl
2+ CuCl
2, because FeCl
3The complex compound cost is low, and washes the FeCl behind the copper
2+ CuCl
2Solution can also be made other purposes, can not cause environmental pollution.
Claims (10)
1. the holographic copper plating film of a semi-metal; comprise the transparent substrate layer (1) that is bonded together successively, transparent release layer (2), transparent hologram layer (3) and hot melt adhesive layer (6) from top to bottom; it is characterized in that: below hologram layer (3), be provided with the copper plate corresponding with hologram layer (4); lower floor at copper plate (4) is provided with the protective seam consistent with copper plate (5), and protective seam (5) is bonded together with hot melt adhesive layer (6).
2. the holographic copper plating film of semi-metal according to claim 1, it is characterized in that: described hologram layer is by the transparent macromolecule resin layer and be stamped in that hologram pattern on the transparent macromolecule resin layer constitutes, copper plate is located at below the hologram pattern of hologram layer, and its shape is consistent with hologram pattern.
3. the holographic copper plating film of semi-metal according to claim 1, it is characterized in that: described hologram layer is by the transparent macromolecule resin layer and be stamped in that hologram pattern on the transparent macromolecule resin layer constitutes, copper plate be located at hologram layer except in the zone below the transparent macromolecule resin layer of hologram pattern.
4. according to the holographic copper plating film of each described semi-metal among the claim 1-3, it is characterized in that: described protective seam is dope layer.
5. according to the holographic copper plating film of each described semi-metal among the claim 1-3, it is characterized in that: protective seam is ink lay.
6. according to the holographic copper plating film of each described semi-metal among the claim 1-3, it is characterized in that: substrate layer is any of PE, PET, PVC, BOPP.
7. the holographic copper plating film of semi-metal according to claim 6, it is characterized in that: the thickness of described substrate layer is 0.012-0.003mm, at least establish a cut channel on the described release layer, the shape of cut channel is any in literal, pattern or literal and the combination of patterns.
8. according to the holographic copper plating film of each described semi-metal in the claim 6, it is characterized in that: the thickness of described substrate layer is 0.006 ~ 0.2mm, at least establish a cut channel on the described release layer, the shape of cut channel is any in literal, pattern or literal and the combination of patterns.
9. the manufacture craft of the holographic copper plating film of semi-metal according to claim 1; may further comprise the steps successively: be coated with release layer at substrate layer, be coated with hologram layer at release layer, vacuum copper facing on hologram layer, impression, print protective seam at copper plate, wash copper; it is characterized in that: the described copper step of washing is to be that 25%-35% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 55-60 °.
10. the manufacture craft of metalized holographic copper plating film according to claim 9 is characterized in that: the described copper step of washing is to be that 30% iron chloride complex solution carries out chemical etching with mass content, and temperature remains on 58 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101497318A CN103247228A (en) | 2013-04-26 | 2013-04-26 | Half-metalized holographic copper-plated film and preparing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101497318A CN103247228A (en) | 2013-04-26 | 2013-04-26 | Half-metalized holographic copper-plated film and preparing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103247228A true CN103247228A (en) | 2013-08-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101497318A Pending CN103247228A (en) | 2013-04-26 | 2013-04-26 | Half-metalized holographic copper-plated film and preparing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103963505A (en) * | 2014-04-24 | 2014-08-06 | 绍兴京华激光制品有限公司 | Production technology of holographic anti-counterfeiting film |
| CN111251737A (en) * | 2018-11-30 | 2020-06-09 | 国网河南省电力公司南阳供电公司 | Manufacturing method of label for electric power |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1045732A (en) * | 1990-04-14 | 1990-10-03 | 三虹电器有限公司石家庄分公司 | Improved copper-clad plate painting and manufacturing method thereof |
| CN1130572A (en) * | 1995-12-28 | 1996-09-11 | 惠守斌 | Method for making metal calling cards |
| US6045713A (en) * | 1997-01-09 | 2000-04-04 | Sumitomo Metal Mining Co., Ltd. | Method of manufacturing a 2-layered flexible substrate |
| CN2410250Y (en) * | 2000-01-17 | 2000-12-13 | 深圳大学反光材料厂 | Film with non-continuous metallization |
| CN101875268A (en) * | 2009-04-28 | 2010-11-03 | 李华容 | Positioning heat printing packaging material and making method thereof |
| CN201698647U (en) * | 2009-11-18 | 2011-01-05 | 河南省卫群科技发展有限公司 | Double-faced holographic anti-removing film belt with anti-fake mark |
-
2013
- 2013-04-26 CN CN2013101497318A patent/CN103247228A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1045732A (en) * | 1990-04-14 | 1990-10-03 | 三虹电器有限公司石家庄分公司 | Improved copper-clad plate painting and manufacturing method thereof |
| CN1130572A (en) * | 1995-12-28 | 1996-09-11 | 惠守斌 | Method for making metal calling cards |
| US6045713A (en) * | 1997-01-09 | 2000-04-04 | Sumitomo Metal Mining Co., Ltd. | Method of manufacturing a 2-layered flexible substrate |
| CN2410250Y (en) * | 2000-01-17 | 2000-12-13 | 深圳大学反光材料厂 | Film with non-continuous metallization |
| CN101875268A (en) * | 2009-04-28 | 2010-11-03 | 李华容 | Positioning heat printing packaging material and making method thereof |
| CN201698647U (en) * | 2009-11-18 | 2011-01-05 | 河南省卫群科技发展有限公司 | Double-faced holographic anti-removing film belt with anti-fake mark |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103963505A (en) * | 2014-04-24 | 2014-08-06 | 绍兴京华激光制品有限公司 | Production technology of holographic anti-counterfeiting film |
| CN103963505B (en) * | 2014-04-24 | 2016-03-30 | 绍兴京华激光制品有限公司 | A kind of holographic false proof film production process |
| CN111251737A (en) * | 2018-11-30 | 2020-06-09 | 国网河南省电力公司南阳供电公司 | Manufacturing method of label for electric power |
| CN111251737B (en) * | 2018-11-30 | 2022-02-22 | 国网河南省电力公司南阳供电公司 | Manufacturing method of label for electric power |
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Application publication date: 20130814 |