CN103039130B - Surface mounting method for electronic components and printed circuit boards manufactured using said method - Google Patents
Surface mounting method for electronic components and printed circuit boards manufactured using said method Download PDFInfo
- Publication number
- CN103039130B CN103039130B CN201180022028.XA CN201180022028A CN103039130B CN 103039130 B CN103039130 B CN 103039130B CN 201180022028 A CN201180022028 A CN 201180022028A CN 103039130 B CN103039130 B CN 103039130B
- Authority
- CN
- China
- Prior art keywords
- wiring board
- electronic unit
- lid
- printed wiring
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 50
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000011229 interlayer Substances 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 19
- 239000011889 copper foil Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 11
- 238000009434 installation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 7
- 238000003672 processing method Methods 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 208000019901 Anxiety disease Diseases 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 230000036506 anxiety Effects 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000000280 densification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 230000002730 additional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention can solve the following problem, namely an electronic component is surface mounted on a mounting pad section provided directly above a through via without sacrifice of productivity and reliability. As a solution means, the invention provides a method for surface-mounting the electronic component (60) to the mounting pad section (14) provided directly above the through via (11) in a printed wiring board (16) and a printed circuit board used by the method. Specifically, first, a lid body (30) that covers through holes of the through via (11) is mounted in the mounting pad section (14). Then, soldered platforms that bury the lid body (30) are formed on the mounting pad section (14) by solder printing. The electronic component (60) is then mounted on top of the printed wiring board (16) and the printed wiring board to which the electronic component (60) has been mounted is heat processed. The method of the invention can suit any printed wiring board provided with the mounting pad section structure directly above the through via.
Description
Technical field
The present invention relates to the method for surface mounting of electronic unit, more specifically, relate to the method for the mounting mat directly over the thru passages being arranged at printed wiring board (Consistent leads to PVC ア) carrying out surface installation to electronic unit, and the printed circuit board (PCB) using the method to manufacture.
Background technology
In recent years, be that the miniaturization of electronic equipment of representative and multifunction are growing with portable phone.Accompany therewith, also seek more small-sized and H.D electronic unit is installed on printed wiring board.CSP(Chip Size Package: chip size packages) be one in this type of electrical component.CSP is that surface is installed on printed wiring board usually at the packaging part parts with the narrow-pitch of about 0.3 ~ 1.0mm with joint soldered ball.
For coordinating the densification of electronic unit connecting portion, the mounting mat portion of printed wiring board also needs densification.Therefore, can consider to arrange mounting mat portion directly over thru passages.
But be difficult to improve packing density by arranging mounting mat directly over the thru passages of printed wiring board in the past.
Before this problem of detailed description, to the structure of the printed wiring board manufactured according to prior art, and the method for surface mounting that this printed wiring board carries out electronic unit is described.
As a printed wiring board example with thru passages, Fig. 5 shows the structure of multilayer printed-wiring board 120.Fig. 5 (a) is the plane graph of the multilayer printed-wiring board 120 with thru passages, and Fig. 5 (b) is the end-view of the A-A ' line along Fig. 5 (a).
First the planar configuration of multilayer printed-wiring board 120 is described.
As shown in Fig. 5 (a), the surface of multilayer printed-wiring board 120 is all covered by photoresistance solder flux (Off ォ ト ソ ル ダ ー レ ジ ス ト) layer 115 except peristome 119A ~ 119E.
The mounting mat portion 116A ~ 116D for mounting electronic parts is provided with in the bottom surface of peristome 119A ~ 119D, and thru passages 118A ~ 118D.From Fig. 5 (a) and (b), mounting mat portion 116A ~ 116D utilizes plated film 114 to be electrically connected respectively with thru passages 118A ~ 118D.In addition, be provided with mounting mat portion 116E in the bottom surface of peristome 119E, but thru passages is not set.This mounting mat portion 116E is sometimes for engaging with the empty pin of electronic unit.Empty pin is also not used in actual signal conduction, but for remaining on the depth of parallelism of the electronic unit that printed wiring board upper surface is installed.
In addition, at the plated film 114 that peristome 119A ~ 119E bottom surface is exposed, in order to improve solder wettability, gold-plated etc. surface treatment is implemented.
Next the cross-sectional configuration of multilayer printed-wiring board 120 is described.
As shown in Fig. 5 (b), multilayer printed-wiring board 120 with the multilayer circuit base material two circuit substrate (namely with circuit substrate 108 and the circuit substrate 113 of coverlay) bonded via adhesive layer 109 for essential structure.
Here, the circuit substrate 108 with coverlay pastes by polyimide film 106(such as at the back side of circuit substrate 104, and 12 μm are thick) and adhesive layer 105(formed thereon is such as, 15 μm are thick) coverlay 107 that forms.Adhesive layer 105 is formed by such as propylene class or epoxies binding agent.
Circuit substrate 104 processes as follows: at the thick polyimide film of flexible insulating substrate material 101(such as 25 μm) two-sidedly there is Copper Foil 102 and 103(respectively for such as 12 μm thick) double-side copper-applying foil laminate plate, make, by light processing method, Copper Foil is processed into predetermined pattern.In addition, in light processing method, form photoresist oxidant layer, form Resist patterns by exposing and being developed on Copper Foil, thereafter, with this Resist patterns for mask carries out the etching of Copper Foil, thus form the Copper Foil (circuit pattern) with predetermined pattern.
Circuit substrate 113 processes as follows: to the two-sided double-side copper-applying foil laminate plate with Copper Foil 111 and 112 at flexible insulating substrate material 110, make, by light processing method, Copper Foil is processed into predetermined pattern.
Thru passages 118A ~ the 118D of multilayer printed-wiring board 120, the through through hole of through-thickness is formed at the commitment positions of above-mentioned multilayer circuit base material, and thick by the plated film 114(such as 8 μm formed this through hole enforcement conductive treatment and electrolytic copper plating process) form.Thru passages 118A ~ 118D works as the interlayer conductive path being electrically connected the wiring of each layer.In addition, through hole utilizes NC Drilling operation etc. to be formed as the size of such as Φ 150 μm.
Use Fig. 6 A and Fig. 6 B below, on above-mentioned multilayer printed-wiring board 120, the method that electronic unit carries out installing on surface is described according to prior art.Fig. 6 A and Fig. 6 B is the operation end-view of the method for surface mounting for illustration of electronic unit.
(1) metallograph (metal mask) 130 of solder printing first, is prepared.Metallograph 130 have the multiple peristomes 131 corresponding respectively with the mounting mat portion 116A ~ 116E of multilayer printed-wiring board 120,131 ...
Then, as Fig. 6 A(1) shown in, with the peristome 131 of metallograph 130,131 ... the mode overlapping respectively with the mounting mat portion 116A ~ 116E of multilayer printed-wiring board 120, multilayer printed-wiring board 120 is settled metallograph 130.
(2) then, as Fig. 6 A(2) shown in, metallograph 130 is piled up the rear slip scraper 150 of welding paste 140, carries out solder printing.Thus, welding paste 140 is imbedded in the inside of the peristome 131 of metallograph 130.
(3) then, as Fig. 6 B(3) shown in, metallograph 130 is unloaded from multilayer printed-wiring board 120.Thus, the solder platform (preparation solder layer) 141 be made up of welding paste, 141 ... be formed on each mounting mat portion 116A ~ 116E.
(4) then, the electronic unit 160(such as CSP being provided with soldered ball on terminal 161 is prepared).Then, after the mode be placed on solder platform 141 with the soldered ball of electronic unit 160 carries out contraposition to electronic unit 160 and multilayer printed-wiring board 120, electronic unit 160 is mounted on multilayer printed-wiring board 120.
(5) thereafter, heat treated (reflow process) is carried out to the multilayer printed-wiring board 120 having carried electronic unit 160.Thus, as Fig. 6 B(4) shown in, utilize the solder-joint parts 142 that the welding paste of solder platform 141 and the melt solder balls of electronic unit 160 are formed, electronic unit 160 is bonded on mounting mat portion 116A ~ 116E.
Then, describe the problem of above-mentioned prior art in detail, that is, this problem of mounting mat portion can not be set the thru passages 118A ~ 118D of the multilayer printed-wiring board 120 with thru passages is upper.
From above-mentioned surperficial installation procedure, when arranging mounting mat portion directly over thru passages, the solder melted in reflow process, will flow in the through hole of thru passages.Consequently, the amount of solder of solder-joint parts is not enough, thus produces the anxiety of bad connection.Further, because the amount of solder flowed into is different to each through hole, tilt relative to multilayer printed-wiring board so produce electronic unit and the anxiety of the depth of parallelism can not be maintained.Such problem is not limited only to the structure of multilayer printed-wiring board 120, and any printed wiring board with thru passages all may occur.
For the foregoing reasons, also can avoid arranging directly over thru passages even if the mounting mat portion of printed wiring board generally sacrificed packing density in the past.
In addition, proposed the method (patent documentation 1) of electronic unit being carried out to surface installation directly over thru passages in the past.In the method, first, the mounting mat portion (solder pads 12) directly over thru passages (plated through hole 17) prints soldering paste.Next, carry out heat treated, the soldering paste of fusing is introduced in the through hole of thru passages, and make it solidify in through hole.Repeatedly carry out this preparation solder operation, make in through hole completely by fill solder.Next, after making the planarization of mounting mat portion, mounting electronic parts.
The problem of the method is, needs repeatedly to carry out preparation solder operation before mounting electronic parts, and operation is miscellaneous, and productivity ratio is low.Further, owing to causing fire damage in multiple times to printed wiring board, so the anxiety producing various bad (crack of thru passages, the expansion of insulating resin, stripping etc.) will be had.
In addition, in recent years, although consider environmental problem and use the situation of lead-free solder in increase, lead-free solder wetability compared with eutectic solder is poor.Therefore, when using lead-free solder, solder is filled in all through holes in fact very difficult equably.
Method of surface mounting as other also has to consider to use end path.Such as, in patent documentation 2, disclose the assembly type multilayer printed-wiring board having end path (blind via hole 30), high-density installation can be carried out.When there being end path, because solder does not flow out, thus directly over blind via hole 30 mounting electronic parts, can than being easier to.
But, in the manufacture of assembly type multilayer printed-wiring board, generally speaking, need a lot of man-hours and material.Further, need, by requiring that the laser processing of detailed condition setting is formed with end path, to be difficult to by formation such as NC Drilling operations.
As mentioned above, all the time, need a kind ofly take into account productivity ratio and reliability and can the method for the mounting mat portion directly over thru passages carrying out electronic unit installation be arranged at.
Prior art document
Patent documentation
Patent documentation 1: JP 7-112109 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2004-200260 publication.
Summary of the invention
The present invention makes based on to the understanding of above-mentioned technology, its object is to, there is provided a kind of when not damaging productivity ratio and reliability, be arranged at the method for the mounting mat portion directly over thru passages carrying out surface installation to electronic unit, and the printed circuit board (PCB) using the method to manufacture.
According to a kind of mode of the present invention, a kind of method of surface mounting of electronic unit is provided, be arranged in the mounting mat portion directly over the thru passages of printed wiring board to electronic unit carry out surface install, it is characterized in that, prepare the lid that thermal coefficient of expansion is the value between the thermal coefficient of expansion of described electronic unit and the thermal coefficient of expansion of described printed wiring board, in the mode covering the through hole of described thru passages, described lid is placed in described mounting mat portion, in described mounting mat portion, the solder platform burying described lid underground is formed by carrying out solder printing, mode on described solder platform is placed in by described electro part carrying on described printed wiring board with the connecting portion of described electronic unit, and heat treated is carried out to the described printed wiring board carrying described electronic unit.
According to another kind of mode of the present invention, a kind of printed circuit board (PCB) is provided, it is characterized in that, have: the printed wiring board carrying out the thru passages of interlayer connection; Solder-joint parts, directly over the through hole being arranged at described thru passages; Lid, covers the through hole of described thru passages and is embedded in described solder-joint parts; And electronic unit, be installed on described printed wiring board via described solder-joint parts, the thermal coefficient of expansion of described lid is the value between the thermal coefficient of expansion of described electronic unit and the thermal coefficient of expansion of described printed wiring board.
According to these features, the present invention has following effect.
The through hole of thru passages is settled the lid covering the through hole of thru passages, forms the solder platform (preparation solder layer) burying described lid underground.Thus, when reflow process, because lid has clogged through hole, the solder melted is not flowed in through hole.Therefore, because the amount of solder forming junction surface can not reduce, so not only increase the reliability of solder-joint parts, the depth of parallelism of electronic unit relative to printed wiring board can also be maintained.
Accompanying drawing explanation
Fig. 1 is the operation end-view of the manufacture method for illustration of the multilayer printed-wiring board directly over thru passages with mounting mat portion;
Fig. 2 (a) is the plane graph of the printed wiring board being provided with mounting mat portion directly over thru passages, and (b) is the end-view of the A-A ' line along (a);
Fig. 3 A is the end face key diagram of the operation of the method for surface mounting of the electronic unit that embodiments of the present invention are shown;
Then Fig. 3 A, Fig. 3 B is the end face key diagram of the operation of the method for surface mounting of the electronic unit that embodiments of the present invention are shown;
Then Fig. 3 B, Fig. 3 C is the end face key diagram of the operation of the method for surface mounting of the electronic unit that embodiments of the present invention are shown;
Fig. 4 is the end face key diagram of the printed wiring board of the lid settling variation on through hole;
Fig. 5 (a) is the plane graph with the printed wiring board leaving the mounting mat portion that thru passages is arranged, and (b) is the end-view of the A-A ' line along (a);
Fig. 6 A is the operation end-view of the method for surface mounting that the electronic unit adopting prior art is shown;
Then Fig. 6 A, Fig. 6 B is the operation end-view of the method for surface mounting that the electronic unit adopting prior art is shown.
Drawing reference numeral explanation
1A, 1B, 101,110 flexible insulating substrate materials; 2A, 2B, 3A, 3B, 102,103,111,112 Copper Foils; 4A, 4B, 104,113 circuit substrate; 5,107 coverlays; 5a dielectric film; 5b, 109 adhesive layers; 6,108 with the circuit substrate of coverlay; 7,105 adhesive layers; 8 laminate circuits base materials; 9 through holes; 10,114 plated films; 11 thru passages; 12A, 12B outer circuit pattern; 13,115 photoresistance welding flux layers; 14 mounting mat portions; 15 peristomes; 16,120 multilayer printed-wiring boards; 20,130 metallographs (metal mask); 21,131 peristomes; 30,30A, 30B, 30C lid; 30C1 disc; 30C2 column; 40,150 scrapers; 50,140 welding pastes; 51,141 solder platforms (preparation solder layer); 52,142 solder-joint parts; 60,160 electronic units; 61,161 terminals; 70 multilayer boards; 106 polyimide films; 116A, 116B, 116C, 116D, 116E mounting mat portion; 118A, 118B, 118C, 118D thru passages; 119A, 119B, 119C, 119D, 119E peristome.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.In addition, the structural element in each figure with same function uses identical label, and the structural element for identical label can not describe in detail repeatedly.
First, composition graphs 1 is described the manufacture method being provided with mounting mat portion multilayer flexible printed wiring plate directly over thru passages.
(1) prepare at the thick polyimide film of flexible insulating substrate material 1A(such as 25 μm) two-sided have Copper Foil 2A and Copper Foil 3A(be such as separately 12 μm thick) flexibility double face copper clad panel.And, as shown in Fig. 1 (1), make to use light processing method, Copper Foil 2A is processed into given circuit pattern, manufacture the circuit substrate 4A of assembling.
(2) then, prepare at the thick polyimide film of flexible insulating substrate material 1B(such as 25 μm) two-sided have Copper Foil 2B and Copper Foil 3B(be such as separately 12 μm thick) flexibility double face copper clad panel.And, use the light processing method identical with the situation of circuit substrate 4A, Copper Foil 3B be processed into set circuit pattern, shop drawings 1(2) shown in assembling circuit substrate 4B.
(3) then, from Fig. 1 (3), at the back side (in figure downside) the bonding coverlay 5 of circuit substrate 4B, the circuit substrate 6 with coverlay is manufactured.This coverlay 5 is at the thick polyimide film of dielectric film 5a(such as 12 μm) it is upper that to form the adhesive layer 5b(such as 15 μm be made up of the binding material of propylene class or epoxies thick).
(4) then, as shown in Fig. 1 (3), after circuit substrate 4A is carried out contraposition with the circuit substrate 6 with coverlay, stacked via the bonding material layer 7 be made up of the binding material of propylene class or epoxies, manufacture stacked circuit substrate 8.
(5) then, as shown in Fig. 1 (4), NC Drilling operation is utilized to form through hole 9(Φ 150 μm at the commitment positions of laminate circuits base material 8).In addition, the diameter in through hole 9 needs the balance of the shape of the connecting portion of the electronic unit considering through hole 9 and lift-launch and determines.Generally speaking, when aperture is little, processing cost can easily uprise, and on the other hand, when aperture is large, can affect the setting height(from bottom) of the electronic unit after this carried.Therefore, the diameter in through hole 9 is set as in the scope of such as 100 ~ 300 μm.
In addition, through hole 9 is not limited to NC Drilling operation, also can be formed by adopting the laser processing of various laser (UV-YAG laser, carbonic acid laser, excimer laser etc.).
(6) then, from Fig. 1 (5), after implementing conductive treatment to through hole 9, by implementing the skin of electrolytic copper plating process at multilayer circuit base material 8, and the inwall formation plated film 10(such as 8 μm in through hole 9 is thick).Thus, the thru passages 11 carrying out interlayer connection is obtained.
(7) then, make to use light processing method, outer field for multilayer circuit base material 8 conducting film (Copper Foil+plated film) is processed into predetermined pattern, at two-sided formation outer circuit pattern 12A and 12B of multilayer circuit base material 8.
In addition, the photoresist used in the light processing method of this operation, preferably uses the dry film photoresist with the thickness (such as 20 μm thick) covering through hole 9.In addition, even if use aqueous resist or electricity attachment resist, also thru passages 11 can be protected.
(8) then, as shown in Fig. 1 (5), photoresistance welding flux layer 13 is formed needing the region of insulation protection.Be formed in bottom surface at photoresistance welding flux layer 13 to expose mounting mat portion 14(and comprise thru passages 11) peristome 15.
Thereafter, gold-plated surface treatment of Denging is implemented to the plated film 10 exposed at peristome 15, and carries out sharp processing, obtain the multilayer printed-wiring board 16 with thru passages.
Fig. 2 (a) shows the plane graph of the multilayer printed-wiring board 16 manufactured by said method.Fig. 2 (b) is the end-view of the A-A ' line along Fig. 2 (a).
From Fig. 2 (a) and Fig. 2 (b), the mounting mat portion 14 of multilayer printed-wiring board 16 is arranged on directly over thru passages 11.Thus, compared with above-mentioned multilayer printed-wiring board 120, the configuration density in the mounting mat portion of multilayer printed-wiring board 16 improves, and can tackle the situation of high-density installation.
Then, composition graphs 3A to Fig. 3 C is described the method that electronic unit carries out installing on surface on this multilayer printed-wiring board 16.
(1) metallograph (metal mask) 20 of solder printing first, is prepared.Metallograph 20 have with the mounting mat portion 14 of multilayer printed-wiring board 16,14 ... respectively corresponding peristome 21,21 ...
And, as Fig. 3 A(1) shown in, with the peristome 21 of metallograph 20,21 ... with the mounting mat portion 14 of multilayer printed-wiring board 16,14 ... mode overlapping respectively settles metallograph 20 on multilayer printed-wiring board 16.
In addition, the peristome 21 of metallograph 20 forms the size by a lid about 30 described later.That is, the diameter of peristome 21 is larger than the diameter of spherical lid 30.Meanwhile, in order to prevent putting into two lids 30 in 1 peristome 21,2 times of the diameter of preferred peristome 21 is not enough lid 30 diameter.
(2) then, as Fig. 3 A(2) shown in, the mode covering the through hole of thru passages 11 with the spherical lid 30 be made up of metal settles lid 30 in each mounting mat portion 14.
More specifically, metallograph 20 is piled up multiple lid 30,30 ... after, in the mode of the upper surface of inswept mask 20, scraper 40 is slided, one by one fall into make lid 30 that the peristome 21 of mask 20 is inner and mode that is that clog the through hole of thru passages 11 is settled.Then, lid 30 is fixed by carrying out air adsorption from thru passages 11 lower side.
In addition, the diameter of lid 30 is set to the value of large 10 ~ 20 μm of the diameter (about 130 μm) than thru passages 11.In order to ensure the depth of parallelism of electronic unit, the size (diameter) of lid 30 is preferably made to be unanimously fixed value.
(3) then, as Fig. 3 B(3) shown in, after metallograph 20 is piled up welding paste 50, scraper 40 is slided and carries out solder printing.Thus, welding paste 50 imbeds the inside of the peristome 21 of metallograph 20, and the lid 30 in peristome 21 is embedded in welding paste 50 and is fixed.
(4) then, as Fig. 3 B(4) shown in, metallograph 20 is unloaded from multilayer printed-wiring board 16.Thus, be embedded with the solder platform (preparation solder layer) 51 of lid 30,51 ... in each mounting mat portion 14,14 ... upper formation.
(5) then, the electronic unit 60(such as CSP that preparation surface is installed), the connecting portion (terminal 61 of electronic unit 60, or the soldered ball that terminal 61 is arranged) of this electronic unit 60 is placed on solder platform 51, contraposition is carried out to electronic unit 60 and multilayer printed-wiring board 16.Thereafter, electronic unit 60 is equipped on multilayer printed-wiring board 16.
(6) then, heat treated (reflow process) is carried out to the multilayer printed-wiring board 16 having carried electronic unit 60.Thus, as Fig. 3 C(5) shown in, the welding paste of solder platform 51 melts and forms solder-joint parts 52.Utilize this solder-joint parts 52, electronic unit 60 is engaged in the mounting mat portion 14 of multilayer printed-wiring board 16.
In this operation, because lid 30 works as the lid of the through hole of thru passages 11, so the solder of fusing can not flow into through hole.Thus, because the amount of solder forming solder-joint parts 52 can not reduce, so the reliability of solder-joint parts 52 improves, and the depth of parallelism of electronic unit 60 relative to printed wiring board 16 can be maintained.
Further, lid 30 is spheroids, because fixing height is formed on its top, so the setting height(from bottom) of electronic unit 60 (balance) is stablized, more can guarantee the depth of parallelism.
Through above-mentioned operation, can obtain being arranged at the multilayer board 70 mounting mat portion 14 directly over thru passages 11 having installed electronic unit 60.
As Fig. 3 C(5) shown in, multilayer board 70 has across the solder-joint parts 52 directly over the through hole being arranged at thru passages 11 electronic unit 60 being installed on multilayer printed-wiring board 16.In addition, lid 30 is embedded in solder-joint parts 52, clogs the through hole of thru passages 11.
As described above, according to present embodiment, when not damaging productivity ratio and reliability, surface installation can be carried out to electronic unit being arranged in the mounting mat portion directly over thru passages 11.In addition, according to present embodiment, electronic unit, solder-joint parts reliability that narrow-pitch is installed can be provided high and the printed circuit board (PCB) that the electronic unit depth of parallelism is good.
In addition, in the above description, although the material of lid 30 uses metal, the present invention is not limited to this.That is, as long as the material of lid 30 can not melt and lose the material as the function of lid in reflow process.Therefore, also can be the insulator of resin etc.But from the viewpoint of solder wettability, the surface of preferred lid is metal.Therefore, as lid, also can use and electroplating processes is implemented to the nucleome that is made up of resin and defines the resin core of conductive film (such as Ni/Au coating) on surface.
In addition, in order to cushion effect of stress on the printed wiring board (printed circuit board (PCB)) being provided with electronic unit, the thermal coefficient of expansion of the material of lid also can be set as the numerical value between the thermal coefficient of expansion of electronic unit and the thermal coefficient of expansion of printed wiring board.By using the resin with such thermal coefficient of expansion as the material of lid 30, the elasticity of resin can be utilized cushion the stress that the thermal expansion difference between the electronic unit 60 owing to installing and multilayer printed-wiring board 16 produces.
In addition, if lid 30 be arranged at become mounting mat portion directly over it thru passages on, do not need to be arranged at do not become mounting mat portion directly over it thru passages on arrange.Like this, by only at needs position configuration lid, manufacturing process can be made more economical.
In addition, in above-mentioned explanation, although the shape of lid 30 is spheroid, the present invention is not limited to this.That is, the shape of lid 30 as long as can cover the through hole of thru passages, such as, also can be that oval spherical lid 30A(is with reference to Fig. 4 (a)), or the lid 30B(of disc-shape is with reference to Fig. 4 (b)).
In addition, identical with spheroid situation, as the shape of the depth of parallelism more can guaranteeing electronic unit, (with reference to Fig. 4 (c)) the lid 30C be made up of the disc 30C1 and the column 30C2 orthogonal with this disc 30C1 that cover through hole also can be used.In this case, the length of column 30C2, is preferably greater than the diameter of peristome 15.
In addition, the installation method of electronic unit of the present invention is not limited to above-mentioned multilayer printed-wiring board 16, can be applicable to have any printed wiring board being provided with mounting mat portion structure directly over thru passages.
Based on above-mentioned record, those skilled in the art may can both expect additional effect of the present invention and various distortion, but mode of the present invention is not limited to above-mentioned execution mode.Do not depart from derive from the content of the scope defined of Patent request and equivalent thereof the conceptual thought of the present invention, aim scope in, various additional, to change and part is deleted all likely.
Claims (14)
1. a method of surface mounting for electronic unit, be arranged in the mounting mat portion directly over the thru passages of printed wiring board to electronic unit carry out surface install, it is characterized in that,
Prepare the lid that thermal coefficient of expansion is the value between the thermal coefficient of expansion of described electronic unit and the thermal coefficient of expansion of described printed wiring board,
In the mode covering the through hole of described thru passages, described lid is placed in described mounting mat portion,
The solder platform burying described lid underground is formed in described mounting mat portion by carrying out solder printing,
Mode on described solder platform is placed in by described electro part carrying on described printed wiring board with the connecting portion of described electronic unit, and
Heat treated is carried out to the described printed wiring board being equipped with described electronic unit.
2. the method for surface mounting of electronic unit as claimed in claim 1, is characterized in that, the shape of described lid is spherical, oval shape that is spherical, discoid or that be made up of disc and the column orthogonal with described disc.
3. the method for surface mounting of electronic unit as claimed in claim 2, it is characterized in that, described lid is made up of the material do not melted because of described heat treated.
4. the method for surface mounting of electronic unit as claimed in claim 3, it is characterized in that, the resin that described lid has conductive film by metal, resin or surface is formed.
5. the method for surface mounting of electronic unit as claimed in claim 1, is characterized in that,
Carry out the operation described lid being placed in described mounting mat portion as follows:
Prepare to have the peristome of the size that described lid is passed through, the metallograph of solder printing,
In the mode making the described peristome of described metallograph overlapping with described mounting mat portion, described metallograph is placed on described printed wiring board,
After described metallograph is piled up multiple described lid, in the mode of inswept described metallograph upper surface, scraper is slided, makes described lid fall into the inside of described peristome one by one,
Carry out the operation forming described solder platform in described mounting mat portion as follows:
After described metallograph piles up welding paste, scraper is slided and carries out solder printing,
Described metallograph is unloaded from described printed wiring board.
6. the method for surface mounting of electronic unit as claimed in claim 2, is characterized in that, after described lid is placed in described mounting mat portion, fixing described lid by carrying out air adsorption from the lower side of described thru passages.
7. the method for surface mounting of electronic unit as claimed in claim 1, it is characterized in that, described lid is made up of the material do not melted because of described heat treated.
8. the method for surface mounting of electronic unit as claimed in claim 1, is characterized in that, after described lid is placed in described mounting mat portion, fixing described lid by carrying out air adsorption from the lower side of described thru passages.
9. the method for surface mounting of electronic unit as claimed in claim 1, is characterized in that,
Described solder printing,
To there is the metallograph of the peristome corresponding with described mounting mat portion, be placed on described printed wiring board in the mode that described peristome is overlapping with described mounting mat portion,
In the mode of the upper surface of inswept described metallograph, scraper is slided, the welding paste that described metallograph is piled up is imbedded the described peristome of described metallograph, and
Described metallograph is unloaded from described printed wiring board.
10. a printed circuit board (PCB), is characterized in that, has:
There is the printed wiring board of the thru passages carrying out interlayer connection,
Solder-joint parts, directly over the through hole being arranged at described thru passages,
Lid, covers the through hole of described thru passages and buries underground in described solder-joint parts, and
Electronic unit, is installed on described printed wiring board across described solder-joint parts,
The thermal coefficient of expansion of described lid is the value between the thermal coefficient of expansion of described electronic unit and the thermal coefficient of expansion of described printed wiring board.
11. printed circuit board (PCB)s as claimed in claim 10, is characterized in that, the shape of described lid is spherical, oval shape that is spherical, discoid or that be made up of disc and the column orthogonal with described disc.
12. printed circuit board (PCB)s as claimed in claim 11, it is characterized in that, the resin that described lid has conductive film by metal, resin or surface is formed.
13. printed circuit board (PCB)s as claimed in claim 10, it is characterized in that, the resin that described lid has conductive film by metal, resin or surface is formed.
14. printed circuit board (PCB)s as claimed in claim 10, is characterized in that, described printed wiring board take flexible insulation film as the flexible printing wiring board of base material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010139271A JP5389748B2 (en) | 2010-06-18 | 2010-06-18 | Electronic component surface mounting method and printed circuit board manufactured using the method |
| JP2010-139271 | 2010-06-18 | ||
| PCT/JP2011/051456 WO2011158524A1 (en) | 2010-06-18 | 2011-01-26 | Surface mounting method for electronic components and printed circuit boards manufactured using said method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103039130A CN103039130A (en) | 2013-04-10 |
| CN103039130B true CN103039130B (en) | 2015-06-24 |
Family
ID=45347938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180022028.XA Active CN103039130B (en) | 2010-06-18 | 2011-01-26 | Surface mounting method for electronic components and printed circuit boards manufactured using said method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5389748B2 (en) |
| CN (1) | CN103039130B (en) |
| TW (1) | TWI498068B (en) |
| WO (1) | WO2011158524A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5275330A (en) * | 1993-04-12 | 1994-01-04 | International Business Machines Corp. | Solder ball connect pad-on-via assembly process |
| CN1245007A (en) * | 1997-01-16 | 2000-02-16 | 福特环球技术公司 | Optimized solder joints for surface mount chips |
| US6199273B1 (en) * | 1995-12-19 | 2001-03-13 | Sumitomo Metal Industries, Ltd. | Method of forming connector structure for a ball-grid array |
| CN1759642A (en) * | 2003-03-10 | 2006-04-12 | 日立金属株式会社 | Method and device for mounting conductive ball |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4799997B2 (en) * | 2005-10-25 | 2011-10-26 | 富士通株式会社 | Method for manufacturing printed circuit board for electronic device and electronic device using the same |
| TWI413471B (en) * | 2006-01-27 | 2013-10-21 | Ibiden Co Ltd | Method and device for mounting solder ball |
| JP5024009B2 (en) * | 2007-12-10 | 2012-09-12 | 日本電気株式会社 | Electronic circuit mounting method and mounting structure |
-
2010
- 2010-06-18 JP JP2010139271A patent/JP5389748B2/en active Active
-
2011
- 2011-01-26 WO PCT/JP2011/051456 patent/WO2011158524A1/en active Application Filing
- 2011-01-26 CN CN201180022028.XA patent/CN103039130B/en active Active
- 2011-06-17 TW TW100121240A patent/TWI498068B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5275330A (en) * | 1993-04-12 | 1994-01-04 | International Business Machines Corp. | Solder ball connect pad-on-via assembly process |
| US6199273B1 (en) * | 1995-12-19 | 2001-03-13 | Sumitomo Metal Industries, Ltd. | Method of forming connector structure for a ball-grid array |
| CN1245007A (en) * | 1997-01-16 | 2000-02-16 | 福特环球技术公司 | Optimized solder joints for surface mount chips |
| CN1759642A (en) * | 2003-03-10 | 2006-04-12 | 日立金属株式会社 | Method and device for mounting conductive ball |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103039130A (en) | 2013-04-10 |
| JP2012004418A (en) | 2012-01-05 |
| TW201221003A (en) | 2012-05-16 |
| WO2011158524A1 (en) | 2011-12-22 |
| JP5389748B2 (en) | 2014-01-15 |
| TWI498068B (en) | 2015-08-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8238109B2 (en) | Flex-rigid wiring board and electronic device | |
| KR101194713B1 (en) | Module, wiring board and module manufacturing method | |
| JP5001731B2 (en) | Connection structure between printed circuit board and electronic components | |
| US20090242262A1 (en) | Multi-layer wiring board and method of manufacturing the same | |
| US10506722B2 (en) | Fusion bonded liquid crystal polymer electrical circuit structure | |
| TWI461118B (en) | Electronic-component-mounted wiring substrate and method of manufacturing the same | |
| KR20160059125A (en) | Element embedded printed circuit board and method of manufacturing the same | |
| KR20130063984A (en) | Wiring board and method of manufacturing the same | |
| US11075092B2 (en) | Multi-layer substrate | |
| KR20150065029A (en) | Printed circuit board, manufacturing method thereof and semiconductor package | |
| JP4788754B2 (en) | Component built-in wiring board and method for manufacturing component built-in wiring board | |
| TWI489919B (en) | Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic component | |
| CN103039130B (en) | Surface mounting method for electronic components and printed circuit boards manufactured using said method | |
| CN1326432C (en) | High-density circuit board without pad design and manufacturing method thereof | |
| JP2013211497A (en) | Component joint structure | |
| JP2004327743A (en) | Wiring board with solder bumps and method of manufacturing the same | |
| KR102023729B1 (en) | printed circuit board and method of manufacturing the same | |
| JP2007059588A (en) | Method of manufacturing wiring board, and wiring board | |
| JP2009147066A (en) | Part built-in wiring board, and manufacturing method for part built-in wiring board | |
| CN108305864A (en) | Novel terminal | |
| JP4514459B2 (en) | Wiring board and manufacturing method thereof | |
| JP2006186149A (en) | Printed circuit boards and electronic devices | |
| CN100521121C (en) | Method for manufacturing substrate with emergent points | |
| JP2007324232A (en) | BGA type multilayer wiring board and BGA type semiconductor package | |
| JP4395356B2 (en) | Wiring board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |