CN102962763B - Abrasive particle flush mounting, burnishing device and finishing method - Google Patents

Abstract

The invention provides an abrasive grain embedding device, a polishing device and a polishing method, which not only suppress uneven embedding of abrasive grains but also efficiently embed abrasive grains into a grinding mold base. In the abrasive grain embedding device, while the slurry containing abrasive grains is supplied to the surface of the grinding base, the grinding base is pressed with the pressing member through the slurry, and the pressing member and the grinding base are slid to contain the slurry. The abrasive grains are embedded in the surface of the grinding mold base, and the pressing member has: more than one pressing part; a weight part, which is arranged above the pressing part, and is used to press the pressing part on the grinding mold base; and an ultrasonic vibrator, which Ultrasonic waves are applied to the pressing member, and the pressing member has a pressing surface provided with a plurality of disc-shaped pressing pieces, so that each pressing surface becomes the same length as each other in the relative sliding direction of the pressing member and the grinding mold base, and by suppressing the fluid The unevenness of the stress suppresses the embedding unevenness of the abrasive grains in the grinding die base.

Description

Abrasive embedding device, polishing device and polishing method

technical field

The present invention relates to an abrasive grain embedding device for embedding abrasive grains into the upper surface of a grinding die base, a polishing device provided with the abrasive grain embedding device, and a polishing method for polishing a workpiece using the polishing device. The base is used for grinding various workpieces such as semiconductor wafers, magnetic heads, electronic components, and optical components.

Background technique

In the manufacturing process of semiconductor devices, magnetic heads, electronic components, optical components, etc., the surface of the workpiece is polished by a polishing machine. And, devices such as LSI (Large Scale Integration, large scale integration) are formed on the surface of the polished workpiece, or the surface is used as an optical surface.

A polishing device for polishing the surface of a workpiece is provided with: a grinding die base, which is rotatably supported; a slurry supply member, which supplies a slurry (grinding liquid) containing abrasive grains (free abrasive grains) to the die The surface of the base; the workpiece holding part, which holds the workpiece and makes it contact the surface of the mold base. Then, the mold base is rotated, and while the slurry containing abrasive grains is supplied between the mold base and the workpiece, the workpiece held by the workpiece holding member is pressed against the mold base, so that the workpiece is processed. grinding process. And, in particular, when high quality is required for the surface obtained by grinding, as a finishing process, within a fixed time before the end of the grinding process, grinding is performed while supplying a slurry that does not contain abrasive grains, so that the The defects and damages caused by the free abrasive particles to the workpiece are reduced.

However, for a workpiece having parts with different hardness on the surface to be polished, when the slurry containing abrasive grains is used for polishing, since the part with low hardness is ground faster than the part with high hardness, there is a slurry The problem that the abrasive grains in the center are concentrated in the part with low hardness and the local excessive grinding is performed. Therefore, a method has been proposed in which abrasive grains are embedded in a mold base, and grinding is performed using a grinding mold base in which a part of the embedded abrasive grains is exposed (for example, refer to Patent Document 1). This grinding method is particularly useful when a workpiece is required to have a high surface quality.

In order to form a grinding base embedded with abrasive grains, a lubricant (slurry) containing abrasive grains is applied to a grinding base made of tin, for example, and the grinding base and the lubricant are pressed together with a pressing member at a predetermined While pressing with a strong force, the pressing member and the grinding die base are slid, and the abrasive grains contained in the lubricant are embedded in the grinding die base (refer to Patent Document 1).

In order to carry out the grinding process using only the slurry without free abrasive grains like this, it is necessary to embed the abrasive grains in the mold base before the grinding process, and in order to avoid the gradual wear of the abrasive grains embedded in the mold base and reduce the grinding function, The work of embedding abrasive grains into the mold base needs to be carried out periodically.

However, there is a problem that it takes a very long time to embed a sufficient amount of abrasive grains on the surface of the polishing die base. Therefore, there has been proposed a polishing die base manufacturing apparatus (for example, refer to Patent Document 2) capable of applying ultrasonic vibration to a pressing member in order to shorten the time for embedding abrasive grains in the die base.

Patent Document 1: Japanese Patent Application Laid-Open No. 7-299737

Patent Document 2: Japanese Patent Laid-Open No. 2008-238398

However, in the conventional polishing die set manufacturing apparatus described in Patent Document 2, grooves are formed in the pressing member in order to efficiently supply the slurry between the pressing member and the polishing die set. Therefore, when embedding the abrasive grains while applying ultrasonic vibration to the pressing member, the following problems arise: the abrasive grains are not evenly embedded on the surface of the grinding die base, and there are areas where too many abrasive grains are locally embedded and unembedded areas. into areas with abrasive particles. As a result of earnest research, the applicant of the present application found that the uneven embedding of the abrasive grains is caused by the uneven fluid pressure of the slurry pressed by the pressing member. That is, since the groove is formed in the pressing member, the lengths of the pressing surfaces with respect to the sliding direction are different from each other. Therefore, due to the wedge effect, the fluid pressure generated along the sliding direction becomes uneven, resulting in uneven embedding of the abrasive grains.

In particular, when the intensity of ultrasonic waves is increased, cavitation partially occurs and the surface of the mold base is damaged. In order to avoid this situation, although it is desired to increase the ultrasonic intensity, it is necessary to use an ultrasonic intensity lower than the value at which cavitation occurs. Therefore, it is difficult to increase the embedding efficiency of abrasive grains.

Contents of the invention

The present invention was made in view of such a problem, and an object of the present invention is to efficiently embed abrasive grains in a polishing die base while suppressing embedding unevenness of abrasive grains.

According to a first aspect of the present invention, there is provided an abrasive grain embedding device for embedding abrasive grains contained in a slurry on the surface of a grinding die base, the abrasive grain embedding device The grain embedding device includes: a pressing member for pressing the grinding die base; a slurry supply member for supplying slurry containing abrasive grains to the surface of the grinding die base; and a sliding member for In order to slide the pressing member and the grinding mold base, the pressing member includes: a pressing part; a weight part, which is arranged above the pressing part, and is used to press the pressing part to the grinding a mold base; and an ultrasonic vibrator, which is used to apply ultrasonic waves to the pressing member, the pressing member has a pressing surface, and the pressing surface is provided with a plurality of disc-shaped pressing pieces.

Preferably, the pressing member is arranged at a position that does not protrude from the usage area of the grinding die set.

According to a second aspect of the present invention, there is provided a polishing device having: a grinding die base rotatably supported and having a grinding surface for grinding a workpiece; The grinding die base rotates; a workpiece holding member having a holding surface opposite to the grinding surface of the grinding die base for holding a workpiece, and the workpiece holding member is used to hold the workpiece objects are held in a state of abutting against the grinding die set; a slurry supply member for selectively supplying a slurry containing abrasive grains and a slurry not containing abrasive grains to the surface of the grinding die base; and Abrasive grain embedding device for pressing the grinding die set with a pressing member through a slurry containing abrasive grains, and sliding the pressing member and the grinding die base to remove the abrasive contained in the slurry Grains are embedded in the surface of the grinding die base, and the slurry containing abrasive grains is supplied to the surface of the grinding die base through the slurry supply member, and the pressing member includes: a pressing part; a weight part , which is disposed above the pressing member, and is used to press the pressing member on the grinding mold base; and an ultrasonic vibrator, which applies ultrasonic waves to the pressing member, the pressing member has a pressing surface, the The pressing surface is equipped with a plurality of disc-shaped pressing pieces.

According to a third aspect of the present invention, there is provided a polishing method of polishing a workpiece held by the workpiece holding member using the polishing device described in claim 3, the polishing method The polishing method includes the steps of: a first polishing step of supplying a slurry containing abrasive grains to the surface of the grinding die base, and interposing the abrasive grain-containing slurry with the pressing member. The slurry presses the grinding die base and slides the pressing member and the grinding die base to embed the abrasive grains contained in the slurry into the surface of the grinding die base, and make the processed product The workpiece held by the holding device slides with the grinding mold base to polish the surface of the workpiece; and a second polishing process, after implementing the first polishing process, in the second polishing process , while supplying slurry not containing abrasive grains to the surface of the grinding die base, the workpiece held by the workpiece holding member and the grinding die base are slid to adjust the surface of the workpiece The surface is polished.

In the third aspect of the present invention, between the first polishing step and the second polishing step, a cleaning step for cleaning the grinding base may be performed. The workpiece is selected from the group consisting of sapphire, silicon carbide (SiC), gallium nitride (GaN), and aluminum nitride (AlN).

In the abrasive grain embedding device of the first aspect of the present invention, since the pressing member has a pressing surface and the pressing surface is provided with a plurality of disk-shaped pressing pieces, each pressing surface can be made to be relatively flat against the pressing member and the grinding surface. The relative sliding directions of the mold bases have the same length as each other. Therefore, it is possible to promote embedding of abrasive grains using ultrasonic vibrations, suppress uneven fluid stress, and suppress embedding unevenness of abrasive grains in the polishing die base.

Furthermore, by arranging the pressing member at a position where it does not protrude from the use area of the grinding die base, the pressure generated by the ultrasonic vibration is evenly distributed and cavitation does not occur, so the surface of the grinding die base can be prevented from being damaged.

In the polishing device of the second aspect of the present invention, the slurry containing abrasive grains and the slurry not containing abrasive grains can be used, and the pressing member and the workpiece holding member can be held, so it can also serve as an abrasive embedding device. The function of the device and its function as a polishing device. Moreover, when the workpiece is polished, since the slurry containing abrasive grains and the slurry not containing abrasive grains can be selected and used, the abrasive grains can be embedded in the grinding mold base while polishing, and the Polishing using free abrasive grains and polishing not using free abrasive grains need to be employed separately.

In the polishing method of the third aspect of the present invention, after the first polishing step of polishing the surface of the workpiece using the slurry containing abrasive grains, the surface of the workpiece is polished using the slurry containing no abrasive grains. The second polishing process of polishing is carried out, therefore, the abrasive grains are embedded in the grinding mold base in the first polishing process. Next, in the second polishing step, polishing is performed with the polishing base containing embedded abrasive grains, so that the polishing efficiency can be improved.

Furthermore, if the cleaning step for cleaning the grinding base is performed between the first polishing step and the second polishing step, it is possible to reduce defects and damages on the workpiece caused by free abrasive grains.

Description of drawings

FIG. 1 is a perspective view showing an example of an abrasive embedding device.

Fig. 2 is an exploded perspective view showing a first example of a pressing member.

Fig. 3 is a cross-sectional view showing a first example of a pressing member.

4 is a bottom view showing an example of a pressing piece included in the pressing member.

5 is a perspective view showing an example of a rotation support member constituting the abrasive grain embedding device.

Fig. 6 is an explanatory view showing the relationship between the position and size of the pressing member and the grinding die set.

Fig. 7 is an explanatory view showing the relative sliding direction of the pressing member and the polishing die set when embedding abrasive grains.

Fig. 8 is an explanatory view showing the relationship between the position and size of a conventional pressing member and a polishing die set.

Fig. 9 is a bottom view showing a second example of the pressing piece.

Fig. 10 is a bottom view showing a third example of the pressing piece.

Fig. 11 is a bottom view showing a fourth example of the pressing piece.

Fig. 12 is an exploded perspective view showing a second example of the pressing member.

Fig. 13 is a cross-sectional view showing a second example of the pressing member.

Fig. 14 is a bottom view showing an example of a pressing member constituting the second example of the pressing member.

Fig. 15 is an explanatory view showing the relationship between the position and size of the pressing member and the polishing die set.

Fig. 16 is a perspective view showing an example of a buffing device.

FIG. 17 is a flowchart showing the steps of the polishing method 1 .

FIG. 18 is a flowchart showing the steps of polishing method 2. FIG.

FIG. 19 is a flowchart showing the steps of the polishing method 3 .

FIG. 20 is a graph showing the processing efficiency of polishing method 2 and polishing method 3. FIG.

Label description

1: Abrasive embedding device;

2: device housing;

3: Grinding mold base;

30: surface (upper surface);

31: axis of rotation;

32: motor;

33: central hole;

34: use area;

4: Slurry supply component;

40: slurry;

40a: abrasive particles;

41: the first slurry container;

42: first pump;

43a, 43b: nozzles;

44: second slurry container;

44a: second pump;

45: controller;

5: rotating support member;

51: support rod;

52: drive roller;

53: driven roller;

54: rotating drive member;

541: electric motor;

542: transmission connection member;

6: pressing member;

60, 61a: pressing parts;

61: pressing part;

611, 611a: pressing surface;

600, 600a, 600b, 600c: pressing piece;

62: vibration body;

621: supporting part;

622: lower vibration body;

622b: support shaft;

622c: external thread;

63: heavy hammer parts;

633: storage hole;

634: electrode terminal installation part;

635a, 635b: collector rings;

65: ultrasonic vibrator;

651: piezoelectric body;

652a, 652b: electrodes;

66: upper vibration body;

67: fastening nut;

69: AC power supply component;

691: flexible pipe;

692: rotary connector;

70: supporting part;

71: supporting part;

710: bolt through hole;

72: supporting shaft;

720: The rotating fitting part of the heavy hammer part;

721: vibrator installation department;

722: electrode terminal installation part;

8: rubber ring;

9: Polishing device;

90: workpiece holding member;

91: holding component;

91a: holding surface;

92: support rod;

921: the first roller supporting part;

922: the second roller supporting part;

93: driving roller;

94: rotating drive member;

941: electric motor;

942: transmission connection member.

detailed description

1. The structure of the abrasive grain embedding device

In the abrasive grain embedding device 1 shown in FIG. 1 , a disc-shaped polishing die base 3 is rotatably supported in a device case 2 . The grinding mold base 3 is formed of metal materials such as tin, and a rotating shaft 31 is connected to the bottom of the grinding mold base 3 . A motor 32 as a rotation driving member is connected to the lower end of the rotating shaft 31 , so that the grinding die set 3 is driven to rotate by the motor 32 . A center hole 33 is formed at the center of the grinding die base 3, and the surface (upper surface) 30 of the part formed on the ring around the center hole 33 becomes a use area 34 in which abrasive grains are actually buried and The area to be ground.

A slurry supply member 4 for supplying a slurry 40 to the surface 30 of the polishing die base 3 is arranged at the front portion of the apparatus case 2 . The slurry 40 may contain the abrasive grain 40a, and may not contain the abrasive grain 40a.

The slurry supply member 4 is provided with: a first slurry container 41 for accommodating slurry containing abrasive grains such as diamond abrasive grains with a particle diameter of 0.02 to 1 μm; The slurry containing abrasive grains contained in a slurry container 41 is ejected toward the upper surface 30 of the grinding mold base 3; the first pump 42 is used to deliver the slurry in the first slurry container 41 to the nozzle 43a; Two slurry container 44, it is used to accommodate the slurry that does not contain abrasive grain; Nozzle 43b, it is used for the slurry that does not contain abrasive grain that is accommodated in the second slurry container 44 towards the upper surface of grinding mold base 3 30 ejection; the second pump 44a, which is used to deliver the slurry of the second slurry container 44 to the nozzle 43b; and the controller 45, which controls the operation of the first pump 42 and the second pump 44a. Accordingly, the slurry supply member 4 can selectively supply the slurry containing abrasive grains and the slurry not containing abrasive grains to the surface 30 of the polishing die base 3 .

A pressing member 6 for applying a pressing force for embedding abrasive grains in the grinding die base 3 is disposed above the grinding die base 3 . As shown in Figure 2, this pressing member 6 is equipped with: a plurality of (in the illustrated example is 3) pressing parts 60, and it is used to embed abrasive grain into grinding mold base 3; Above the pressing member 60 , for pressing the pressing member 60 against the grinding mold base; and an ultrasonic vibrator 65 for applying ultrasonic waves to the pressing member 60 to vibrate the pressing member 60 . As shown in FIG. 3 , electrodes 652 a and 652 b are provided on the ultrasonic vibrator 65 .

As shown in FIG. 2 , the pressing member 60 includes a vibrating body 62 , and the vibrating body 62 is vibrated by an ultrasonic vibrator 65 . The vibrating body 62 is equipped with a disk-shaped supporting portion 621 at the bottom, and the vibrating body 62 is equipped with: a large-diameter lower vibrating body 622 extending upward from the upper surface of the supporting portion 621; and a supporting shaft 622b vibrating from the bottom. The upper end of the body 622 extends upward. The lower surface of the support portion 621 is bonded to the pressing portion 61 with an adhesive. In addition, the pressing action part 61 may be attached to the support part 621 with a bolt and a fastening nut.

As shown in FIG. 2 , a ring-shaped rubber ring 8 made of polyurethane is fitted into the lower vibrating body 622 , and the rubber ring 8 is placed on the support portion 621 . On the other hand, an ultrasonic vibrator 65 placed on the lower vibrating body 622 is fitted to the support shaft 622 b. Further, the upper vibrating body 66 is placed on the ultrasonic vibrator 65 , and the upper vibrating body 66 is in a state of being fitted to the support shaft 622 b. An external thread 622c is formed on the upper end of the support shaft 622b, and the ultrasonic vibrator 65 is fixed to the support shaft 622b by screwing and fastening the fastening nut 67 to the external thread 622c. In this way, the pressing unit 61 , the lower vibrating body 622 , the ultrasonic vibrator 65 , and the upper vibrating body 66 are integrated and vibrate.

The rubber ring 8 has the function of isolating, so that the vibration of the vibrating body 62 is not transmitted to the weight member 63 , thereby maintaining good vibration of the vibrating body 62 . And, when the operation of embedding the abrasive grains into the grinding mold base 3 is performed in the abrasive grain embedding device 1 shown in FIG. The gap formed between the surface of the seat 3 and the pressing surface 611 serving as the lower surface of the pressing action portion 61 is uniform over the entire surface of the pressing surface 611 .

As shown in FIG. 2 , the weight member 63 has the same number of storage holes 633 as the number of the pressing members 60 for housing the pressing members 60 . Moreover, an electrode terminal mounting portion 634 is protrudingly provided at the center portion of the upper surface of the weight member 63, and the electrode terminal mounting portion 634 is used to connect a common electrode to all the pressing members 60. Two slip rings 635a, 635b are arranged on the outer peripheral surface. The rotary connector 692 of the AC power supply member 69 shown in FIG. 1 is fitted into the electrode terminal mounting portion 634 configured in this way. In addition, the bus rings 635 a and 635 b arranged on the electrode terminal mounting portion 634 are electrically connected to the electrodes 652 a and 652 b which are arranged on the three vibrating bodies 62 respectively and constitute the vibrator 65 .

As shown in FIG. 3 , the ultrasonic vibrator 65 is composed of a ring-shaped piezoelectric body 651 and ring-shaped electrodes 652 a and 652 b respectively attached to both polarized surfaces of the piezoelectric body 651 . The piezoelectric body 651 is formed of piezoelectric ceramics such as barium titanate (BaTiO ₃ ), lead zirconate titanate (Pb(Zr,Ti)O ₃ ), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), or the like.

As shown in FIG. 4 , in each of the pressing members 60 constituting the pressing member 6 , a plurality of pressing pieces 600 for applying a pressing force to the polishing die set 3 is provided on each pressing action portion 61 . Each of the pressing pieces 600 is made of ceramics in a disk shape, and is fixed in a state protruding downward from the pressing surface 611 . The plurality of pressing pieces 600 are formed to have the same diameter, and are arranged at equal intervals so that their centers are located on the same circular arc.

As shown in FIG. 1 , a rotation support member 5 for supporting the pressing member 6 in a rotatable manner is provided on the rear side of the polishing base 3 . The rotation support member 5 is a support member that supports the pressing member 6 , and the rotation support member 5 includes a support rod 51 that is movable in the horizontal direction and extends horizontally above the grinding die base 3 .

As shown in FIG. 5, which removes the pressing member 6 from the abrasive grain embedding device 1 shown in FIG. The first roller support portion 511 and the second roller support portion 512 are branched from the support rod 51 and are formed at a predetermined distance from each other. The drive roller 52 is rotatably supported on the first roller support portion 511 , and the driven roller 53 is rotatably supported on the second roller support portion 512 . Further, a rotation driving member 54 for rotating the driving roller 52 is disposed on the support rod 51 . The rotation drive member 54 is composed of an electric motor 541 and a transmission connection member 542 including a transmission belt or the like that transmitably connects the drive shaft of the electric motor 541 and the rotation shaft of the drive roller 52 .

Returning to FIG. 1 to continue the description, the abrasive grain embedding device 1 includes an AC power supply member 69 for supplying AC power to the electrodes 652a, 652b of the vibrator 65 shown in FIG. 3 . The AC power supply means 69 outputs, for example, AC power with a frequency of 16 to 100 kHz and a voltage of 20 to 200V. The AC power output from the AC power supply member 69 passes through the wiring (not shown) arranged in the flexible pipe 691 and the rotary connector 692 arranged at the end of the flexible pipe 691, and is collected from the power collector shown in FIG. 3 . The rings 635a, 635b are supplied to the vibrator 65 through the wires 682a, 682b.

As shown in FIG. 6 , each pressing member 60 is located above the use area 34 of the grinding die base 3 . That is, it is a state in which all the pressing surfaces 611 of the pressing action parts 61 are accommodated within the range of the width 34 a of the use area 34 . When the width 34 a of the use area 34 is, for example, 120 mm, the diameter of the pressing member 60 is, for example, about 115 mm. Furthermore, the center of each pressing member 60 is located on an arc concentric with the outer diameter of the weight member 63 .

2. Basic action of abrasive embedding device

In order to embed the abrasive grains in the mold base 3, as shown in FIG. The driving roller 52 is in contact with the driven roller 53 . Next, if necessary, the support rod 51 is moved in the direction of the arrow X, so that the pressing member 60 is located above the use area 34 . In addition, the pressing member 6 may have a fixed position and does not move. In this case, the size of the pressing member 60 is appropriately set so that the pressing member 60 does not protrude from the use area 34 .

Then, the rotary connector 692 of the AC power supply member 69 is fitted into the electrode terminal mounting portion 634 shown in FIG. 3 . Then, the grinding mold base 3 is rotated at a speed of, for example, 30 to 60 rpm in the direction shown by the arrow 3a in FIG. The surface 30 of the die holder 3 is ground.

Next, the drive roller 52 is rotated in the direction indicated by the arrow 52a by driving the electric motor 541 constituting the rotation support member 5 . Thus, since the drive roller 52 contacts the outer peripheral surface of the weight member 63, the pressing member 60 rotates in the direction shown by the arrow 60a at the rotation speed of 15-30 rpm, for example. In this way, by rotating the grinding die base 3 and rotating the pressing member 60, the slurry 40 containing the abrasive grains 40a supplied to the surface 30 of the grinding die base 3 enters between the pressing surface 611 of the pressing action part 61 and the grinding die base 3. Between 30 surfaces.

Furthermore, AC power is applied from the AC power supply member 69 to the electrodes 652 a and 652 b constituting the ultrasonic vibrator 65 . In this way, the piezoelectric body 651 vibrates ultrasonically, and the pressing portion 61 vibrates ultrasonically in the vertical direction.

In this way, when the slurry 40 containing the abrasive grains 40a enters between the pressing surface 611 of the pressing member 60 for ultrasonic vibration and the surface 30 of the grinding die base 3 as described above, when the pressing member 6 and the grinding die base When sliding, the abrasive grains 40a contained in the slurry are pressed against the surface 30 of the grinding die base 3 by the pressing surface 611 of the pressing member 60, thereby embedding the abrasive grains in the surface 30 of the grinding die base 3. Since the pressing member 60 presses the abrasive grains 40 a with the entire circular pressing surface 611 , the abrasive grains 40 a can be efficiently embedded in the surface 30 of the polishing die base 3 .

In Fig. 1, the rotation direction of the grinding mold holder 3 represented by arrow 3a is the same direction as the rotation direction of the pressing member 60 represented by arrow 60a, and the relative sliding direction of the grinding mold holder 3 and the pressing member 60 is shown in Fig. 7 The direction indicated by the arrow X'. Moreover, since the lower surface of the pressing piece 600 as the pressing surface is formed in a circular shape, the relative sliding distance between the lower surface of the pressing piece 600 and the surface 30 of the grinding die holder 3 is fixed regardless of the sliding position. Therefore, the pressure generated by the slurry 40 between the grinding die base 3 and the pressing surface 611 is constant regardless of the position on the grinding die base 3 , so that the unevenness of fluid stress can be suppressed. Accordingly, the abrasive grains 40a can be embedded in the entire surface 30 of the polishing die base 3 with uniform ultrasonic intensity, and uneven embedding of the abrasive grains can be suppressed. Furthermore, abrasive grains can be efficiently embedded in the surface 30 by using ultrasonic waves.

When ultrasonic waves are applied while embedding abrasive grains into the surface 30 of the grinding die base 3, assuming that the pressing surface 611' of the pressing action portion 61' protrudes from the grinding die base 3 as shown in FIG. The pressure distribution does not become uniform over the entire pressing surface 611 ′, but localized pressure becomes extremely high to cause cavitation, and part of the surface 30 of the grinding die base 3 is damaged by the cavitation. However, as shown in FIG. 6 , since the pressing member 60 is arranged at a position that does not protrude from the use area 34 of the grinding die base 3 to the outer peripheral side, the distribution of the pressure generated by the ultrasonic vibration becomes uniform, and cavitation does not occur. , Therefore, damage to the surface 30a of the grinding die base 3 can be avoided.

3. Example of changing the pressing piece

In the pressing member 60, as long as the sliding distances at different positions are fixed, instead of the pressing portion 61 shown in FIGS. 4 and 7, pressing portions 61a to 61c shown in FIGS. Compared with the examples shown in FIGS. 4 and 7 , the pressing portion 61a shown in FIG. 9 has the pressing piece 600 located on the outer peripheral side of the pressing surface 611a, and the outer circumference of the pressing piece 600 is tangent to the outer circumference of the pressing surface 611a. Moreover, the pressing action part 61b shown in FIG. 10 is comprised by arrange|positioning the ring-shaped pressing piece 600b in an arc shape at equal intervals. By forming the circular groove 601 in the center of each pressing piece 600b, the maximum pressure near the center of the pressing piece 600b can be reduced. In addition, the pressing part 61c shown in FIG. 11 is configured such that each pressing piece 600c has a plurality of circular small-diameter pressing surfaces 602, shallow grooves 603 are formed around the pressing surfaces 602, and the pressing pieces 600c Arranged at equal intervals in an arc shape.

4. Structural change example of pressing member

Instead of the pressing member 6 shown in FIGS. 2 and 3 , a pressing member 6 a shown in FIGS. 12 and 13 may be used. The pressing member 6a has a pressing member 61a for pressing abrasive grains contained in the slurry supplied to the surface 30 of the polishing die base 3, and a support member 70 for supporting the pressing member 61a. The pressing member 61a is made of ceramics in a disk shape, has a pressing surface 611a on the lower surface of the pressing member 61a, and has a mounting surface 612a on the upper surface of the pressing member 61a opposite to the pressing surface 611a.

For example, as shown in FIG. 14, on the pressing surface 611a, the disc-shaped pressing pieces 600a are arranged on double circular arcs. The pressing piece 600a protrudes downward with respect to the pressing surface 611a.

As shown in FIG. 12 , the support member 70 has: a support portion 71 to which the mounting surface 612 a of the pressing member 61 a is attached with an adhesive; and a support shaft portion 72 which stands up from the support portion 71 . The support portion 71 is formed in a disc shape with an outer diameter larger than that of the pressing member 61a, and four bolt penetration holes 710 are provided in an arc shape at equal intervals on the outer periphery of the support portion 71 .

The support shaft part 72 is provided with: a large-diameter weight part rotation fitting part 720, which extends upward from the upper surface of the support part 71; a vibrator mounting part 721, which extends upward from the upper end of the weight part rotation fitting part 720. The component rotation fitting portion 720 is small in diameter; and the electrode terminal mounting portion 722 is formed smaller in diameter than the vibrator mounting portion 721 and extends upward from the upper end of the vibrator mounting portion 721 .

The ring-shaped weight member 73 formed of a metal material such as stainless steel is rotatably engaged with the outer peripheral side of the weight member rotational engagement portion 720 . The weight part 73 is formed with a rotation fitting hole 730 in the central part, and the rotation fitting hole 730 is used to rotate and fit with the rotation fitting part 720 of the weight part. Four internally threaded holes 731 are formed at positions corresponding to the four bolt through holes 710 . By rotating the fitting hole 730 and the swivel fitting part 720 of the weight part and placing it on the upper surface of the supporting part 71, and allowing the connecting bolt 64 to pass through the bolt through hole 710 from the lower side of the supporting part 71 and connect with the internal threaded hole 731 are screwed together, and the weight member 73 configured in this way is attached to the support portion 71 .

The ultrasonic vibrator 65 is inserted into the vibrator mounting portion 721 of the support portion 71 . The ultrasonic vibrator 65 is composed of a ring-shaped piezoelectric body 651 and ring-shaped electrodes 652 a and 652 b attached to polarized surfaces on both sides of the piezoelectric body 651 , respectively. The piezoelectric body 651 is formed of piezoelectric ceramics such as barium titanate (BaTiO ₃ ), lead zirconate titanate (Pb(Zr,Ti)O ₃ ), lithium niobate (LiNbO ₃ ), lithium tantalate (LiTaO ₃ ), or the like. The ultrasonic vibrator 65 configured in this way is fitted into the vibrator attachment portion 721 of the support shaft portion 72 , and the ultrasonic vibrator 65 is placed on the upper surface of the weight member rotation engagement portion 720 . In this way, the ring-shaped spacer 66 fitted to the vibrator mounting portion 721 is placed on the ultrasonic vibrator 65 placed on the upper surface of the weight member rotation engaging portion 720 . Then, the ultrasonic vibrator 65 is attached to the vibrator attaching portion 721 by screwing the coupling nut 67 to the external thread portion 723 formed on the upper end portion of the vibrator attaching portion 721 .

As shown in FIG. 13 , two slip rings 681 a and 681 b are disposed on the outer periphery of the electrode terminal mounting portion 722 . The bus rings 681a and 681b are connected to the electrodes 652a and 652b constituting the ultrasonic vibrator 65 through wirings 682a and 682b.

In the pressing member 6a shown in FIGS. 12 and 13, as shown in FIG. 14, since the lower surface of the pressing piece 600a is formed in a circular shape, the sliding distance between the lower surface of the pressing piece 600a and the grinding mold base 3 is fixed and Regardless of the swipe position. Therefore, the pressure generated by the slurry 40 between the grinding die base 3 and the pressing member 61a is constant regardless of the position on the grinding die base 3, and the entire upper surface 30 of the grinding die base 3 can be buried with uniform ultrasonic intensity. Abrasive grains 40a.

And, as shown in Figure 15, because all pressing piece 600a is positioned at the inner side of the use area 34 of grinding mold base 3, therefore, the distribution of the pressure that is produced by ultrasonic vibration reaches uniformity, can not produce cavitation, can avoid grinding mold base The surface 30 of 3 is damaged.

5. Polishing device with abrasive embedding device

The polishing device 9 shown in FIG. 16 is formed by adding a workpiece holding member 90 to the abrasive grain embedding device 1 shown in FIG. Grinding (polishing) of the workpiece. In addition, in the buffing apparatus 9, the same code|symbol as that of FIG. 1 is attached|subjected to the part comprised similarly to the abrasive-grain embedding apparatus 1 shown in FIG. 1, and the detailed description is abbreviate|omitted.

The workpiece holding member 90 includes a cylindrical holding member 91 . On the lower surface of the holding member 91, there is a holding surface 91a for holding a workpiece. The holding surface 91 a faces the surface 30 which is the grinding surface of the grinding die base 3 , and can hold the workpiece held on the holding surface 91 a in contact with the surface 30 of the grinding die base 3 .

The workpiece holding member 90 includes a support rod 92 movable in the horizontal direction. At the end of the support rod 92, there are provided a first roller support portion 921 and a second roller support portion 922 branched from the support rod 92 while maintaining a predetermined interval from each other. form. The drive roller 93 is rotatably supported on the first roller support portion 921 , and a driven roller (not shown) is rotatably supported on the second roller support portion 922 . Furthermore, a rotation drive member 94 for rotating the drive roller 93 is disposed on the support rod 92 . The rotation drive member 94 is constituted by an electric motor 941 and a transmission connection member 942 including a transmission belt or the like that transmitably connects the drive shaft of the electric motor 941 and the rotation shaft of the drive roller 93 .

6. Polishing of workpiece

Next, the operation of the buffing device 9 when the workpiece is polished using the buffing device 9 shown in FIG. 16 will be described. During polishing of a workpiece, a workpiece such as a wafer W is held on the holding surface 91 a of the workpiece holding member 90 . At this time, the surface to be polished of the wafer W is made to face the surface 30 of the polishing die base 3 . Next, the outer peripheral surface of the holding member 91 constituting the workpiece holding member 90 is brought into contact with the driving roller 93 and the driven roller, and the support rod 92 is moved in the direction indicated by the arrow X, thereby positioning the wafer W on the polishing die set 3 above the use area 34 .

In this way, after the wafer W is positioned and the workpiece holding member 90 is supported by the driving roller 93 and the driven roller, the slurry is supplied from the slurry supply member 4 between the surface 30 of the polishing die base 3 and the wafer W, While the electric motor 32 rotates the polishing mold base 3 in the direction indicated by the arrow 3a, the electric motor 941 rotates the driving roller 93, thereby rotating the holding member 91 in the direction indicated by the arrow 91b. In this way, the lower surface of the wafer W mounted on the lower surface of the holding member 91 as the surface to be polished is polished by the abrasive grains 40 a and the slurry embedded in the surface 30 of the polishing die base 3 .

In the polishing apparatus 9 , the slurry containing the abrasive grains 40 a and the slurry not containing the abrasive grains 40 a can be used according to the purpose. For example, whether or not the slurry supplied to the surface 30 of the polishing die base 3 contains abrasive grains 40 a can be controlled by operating either the first pump 42 or the second pump 44 a by the controller 45 of the slurry supply means 4 . Next, an example of the procedure of polishing using the polishing apparatus 9 will be described with reference to the flowcharts of FIGS. 17 to 19 .

(1) Polishing method 1

As shown in FIG. 17 , first, abrasive grains are embedded in the surface 30 of the polishing die base 3 (step S11 ). In step S11 , the pressing member 60 is placed on the surface 30 of the grinding die base 3 , and the pressing member 6 is supported by the rotation support member 5 . On the other hand, in the workpiece holding member 90, the holding member 91 is in a detached state.

Then, the grinding mold base 3 is rotated in the direction shown by the arrow 3a, and the slurry 40 containing the abrasive grains 40a (free abrasive grains) is supplied from the slurry supply member 4 to the surface 30 of the grinding mold base 3, and the The driving roller 52 rotates in the direction indicated by the arrow 52a, and rotates the pressing member 60 in the direction indicated by the arrow 60a. Then, AC power is applied from the AC power supply member 69 to generate ultrasonic vibrations in the pressing member 60 . In this way, the slurry 40 containing the abrasive grains 40 a enters between the pressing surface 611 of the pressing member 60 and the surface 30 of the grinding die base 3 , thereby embedding the abrasive grains 40 a into the surface 30 of the grinding die base 3 . In addition, as the slurry 40, hydrocarbon oil, ethylene glycol, etc. are used, for example.

As mentioned above, by forming the lower surface of the pressing piece 600 as the pressing surface into a circular shape, since the pressure generated by the slurry 40 between the grinding die base 3 and the pressing action part 61 is fixed, it is possible to suppress abrasive grains from forming. uneven embedding.

Next, in order to remove the slurry 40 remaining on the grinding die base 3, the abrasive grains 40a, and the sludge contained in the slurry 40 (processed powder of the grinding die base 3 and the pressing piece 600, etc.), for example, by making the grinding die base 3 While the base 3 is rotating, a high-pressure cleaning solution is sprayed from a nozzle not shown to clean the grinding mold base 3 . Next, after that, a drying process is performed by blowing high-pressure air to the polishing base 3 from a nozzle (not shown) while rotating the grinding base 3 (step S12 ).

In this way, polishing of the workpiece is performed in a state where abrasive grains are embedded in the surface 30 of the grinding die base 3 and the surface 30 is cleaned (step S13 ). During grinding, as shown in FIG. 16 , a workpiece such as a wafer W is held on the holding surface 91 a of the holding member 91 . Next, the holding member 91 is supported in contact with the driving roller 93 and the driven roller, the wafer W is placed on the surface 30 of the polishing die base 3, and the support rod 92 is moved in the X direction as necessary, thereby the wafer W is W is positioned in the use area 34 of the surface 30 of the grinding die holder 3 .

In this way, after the wafer W is placed on the use area 34 of the polishing base 3 , the slurry not containing abrasive grains is supplied from the slurry supply member 4 between the surface 30 of the polishing base 3 and the wafer W to be polished. By the cleaning of step S12, the abrasive grains (free abrasive grains) remaining on the surface 30 of the grinding mold base 3 that have been used in step S11 have been removed. Therefore, when grinding, no scratches caused by free abrasive grains can be obtained. A good processed surface such as grinding marks can improve the surface roughness of the wafer W.

(2) Polishing method 2

As shown in FIG. 18, initially, a wafer is polished using a slurry containing abrasive grains. First, as shown in FIG. 16, the pressing member 6 is held by the rotating support member 5, and the holding member 91 holding the wafer W is held on the workpiece holding member 90, and the pressing member 6 and the wafer W are placed on the polishing mold. The use area 34 of seat 3,

Then, the grinding mold base 3 is rotated in the arrow 3a direction shown in FIG. The pressing surfaces 611 of the member 6 slide against each other, and the surface 30 and the wafer W slide. At this time, AC power is applied from the AC power supply member 69 to generate ultrasonic vibrations in the pressing member 61 . Then, a slurry containing abrasive grains 40 a (free abrasive grains) is supplied from the slurry supply member 4 between the surface 30 of the polishing die base 3 and the wafer W and between the surface 30 and the pressing surface 611 of the pressing member 6 . In this way, the wafer W is polished by the abrasive grains embedded in the surface 30 of the polishing mold base 3 and the abrasive grains (free abrasive grains) supplied from the slurry supply member 4, and the free abrasive grains are pressed by the pressing member 6 to be embedded. into the surface 30 of the grinding mold base 3 (step S21, the first polishing process).

Next, the slurry that does not contain abrasive grains 40a is supplied from the slurry supply member 4 between the surface 30 of the polishing mold base 3 and the wafer W, and the rotating grinding mold base 3 and the rotating wafer W are slid to perform wafer W grinding. grinding. At this time, AC power may be applied from the AC power supply member 69 to cause the pressing member 61 to vibrate ultrasonically, or the pressing member 61 may not be vibrated ultrasonically. In this way, since the free abrasive grains remaining on the surface 30 of the grinding mold base 3 and the abrasive grains (fixed abrasive grains) embedded in the surface 30 of the grinding mold base 3 are used in step S21 to perform grinding, it is different from removing the free abrasive grains by cleaning. Compared with the above-mentioned polishing method 1 of abrasive grains, the polishing efficiency is improved (step S22, second polishing step).

In this method, there will be a further finishing process by CMP (Chemical Mechanical Polishing: Chemical Mechanical Polishing) and the like, and the quality of the wafer will not be high if the method of polishing only by the above-mentioned fixed abrasive grains is adopted. It is an effective method when required, and has the following advantages: It can shorten the processing time of CMP, and even without adding a polishing process with small abrasive grains, it can obtain high-quality polishing compared with free abrasive grains. The processing surface can reduce the process cost.

(3) Polishing method 3

In the above-mentioned polishing method 2, since the polishing by the free abrasive grains is performed in step S22, defects and damages caused by the free abrasive grains may occur on the processed surface of the wafer W. Therefore, in the case where it is desired to reduce the defect or damage, as shown in FIG. Between the polishing (step S33 , second polishing step), a cleaning step (step S32 ) of cleaning the surface 30 of the grinding mold base 3 is performed. The cleaning process has the following methods: a method of spraying a liquid that does not contain abrasive particles onto the surface 30 of the grinding mold base 3; a method of pressing a wafer or a porous polishing pad on the surface 30 of the grinding mold base 3; The method of removing the residue to the grinding mold base 3 by the scraper made by the manufacturer only needs to be selected according to the required quality. If cleaning is performed, since the discharge of free abrasive particles is promoted, the processing quality of the wafer W is improved although the polishing efficiency in step S33 is lower than that in step S22. In addition, step S31 is executed by the same method as step S21, and step S33 is executed by the same method as step S22.

As described above, in the polishing method 2 and the polishing method 3, in the polishing performed while supplying the slurry not containing abrasive grains, since the reduction in processing efficiency can be suppressed, it can be removed by processing that is not affected by free abrasive grains. The volume of the part increases. That is, the area where the grinding marks generated during polishing using free abrasive grains can be removed increases. Accordingly, the diameter of the wafer-shaped workpiece can be increased. In particular, it is effective when polishing hard substrates such as sapphire, SiC (silicon carbide), GaN (gallium nitride), and AlN (aluminum nitride).

【Example 1】

FIG. 20 shows the grinding efficiency of grinding a block of AlTiC (aluminum titanium carbon) used in a magnetic head in the following two cases: using the polishing device 9 of the present invention and polishing by the above-mentioned polishing method 2 and polishing method 3 In the case of processing; and using a common polishing device without an abrasive grain embedding function, as in the above-mentioned polishing method 2 and polishing method 3, after polishing by a slurry containing abrasive grains, it is realized by a slurry that does not contain abrasive grains The polished condition.

It can be seen that regardless of the polishing methods 2 and 3, the polishing efficiency is higher in the case of using the polishing apparatus 9 of the present invention than in the case of using a normal polishing apparatus. This is because, in the polishing device 9 having the function of embedding abrasive grains, the abrasive grains are embedded in the surface 30 of the grinding mold base 3 during the polishing using free abrasive grains, thereby improving the efficiency of polishing without using abrasive grains.

Furthermore, when polishing method 2 and polishing method 3 are compared, it can be seen that polishing method 2 has higher polishing efficiency than polishing method 3 no matter which device is used. This is because, in the polishing method 3, the proportion of free abrasive grains removed by performing cleaning is large, and therefore, the polishing efficiency decreases accordingly.

In addition, it was also found that, among the four methods, when polishing is performed by the polishing method 2 using the polishing apparatus 9 of the present invention, the polishing efficiency is the highest.

Claims (6)

1. an abrasive particle flush mounting, described abrasive particle flush mounting grinds die holder for being imbedded by the abrasive particle contained by slip Surface, described abrasive particle flush mounting is characterised by,

Described abrasive particle flush mounting possesses:

Pressing member, described pressing member is used for pressing described grinding die holder；

Slip supply member, described slip supply member for containing the material of abrasive particle to the supply of the surface of described grinding die holder Slurry；And

Sliding component, described sliding component is used for making described pressing member slide with described grinding die holder,

Described pressing member includes: pressing component；Weight parts, described weight parts are disposed in described pressing component Top, for pressing on described grinding die holder by described pressing component；And ultrasonic oscillator, described ultrasonic oscillator For described pressing component is applied ultrasonic wave,

Described pressing component has press surface, and described press surface is equipped with multiple discoid pressing tablet.

2. abrasive particle flush mounting as claimed in claim 1, it is characterised in that

Described pressing component is arranged in not from the position using region to highlight of described grinding die holder.

3. a burnishing device, it is characterised in that

Described burnishing device possesses:

Grinding die holder, described grinding die holder has the abradant surface for grinding machined object, and described grinding die holder quilt It is supported to rotate；

Rotary-drive member, described Rotary-drive member is used for making described grinding die holder rotate；

Processed article holding component, described processed article holding component has holding face, described holding face and described grinding The described abradant surface of die holder relatively and is used for keeping machined object, and described processed article holding component is for by machined object It is kept into the state abutted with described grinding die holder；

Slip supply member, described slip supply member for selectively supply to the surface of described grinding die holder containing The slip of abrasive particle and the slip not containing abrasive particle；And

Abrasive particle flush mounting, described abrasive particle flush mounting pressing member presses described grinding die holder across slip, described Slip is the slip containing abrasive particle utilizing surface that described slip supply member is supplied to described grinding die holder, and, Make described pressing member slide with described grinding die holder, the abrasive particle contained by described slip is imbedded described grinding die holder Surface,

Described pressing member includes: pressing component；Weight parts, described weight parts are disposed in described pressing component Top, for pressing on described grinding die holder by described pressing component；And ultrasonic oscillator, described ultrasonic oscillator For described pressing component is applied ultrasonic wave,

Described pressing component has press surface, and described press surface is equipped with multiple discoid pressing tablet.

4. a finishing method, described finishing method uses the burnishing device described in claim 3 to be added by described The machined object that work article holding component keeps is polished, and described finishing method is characterised by,

Described finishing method includes following operation:

First polishing process, in this first polishing process, is supplied to described lap by the slip containing abrasive particle The surface of seat, presses described grinding die holder with described pressing member across the described slip containing abrasive particle, and, Make described pressing member and described grinding die holder slide the abrasive particle contained by described slip and imbed described grinding die holder Surface, and, make the machined object and the described grinding die holder that are kept by described processed article holding component slide right The surface of described machined object is polished；

Second polishing process, in this second polishing process, after implementing described first polishing process, will not contain The slip having abrasive particle is supplied to the surface of described grinding die holder, makes the quilt kept by described processed article holding component The surface of described machined object is polished by machining object and the slip of described grinding die holder.

5. finishing method as claimed in claim 4, it is characterised in that

Matting is also included, in this matting between described first polishing process and described second polishing process In, clean described grinding die holder.

6. the finishing method as described in claim 4 or 5, it is characterised in that

Described machined object selects from the group being made up of sapphire, carborundum, gallium nitride and aluminium nitride.