CN102903838A - Packaged LED light source with heat dissipation structure and preparation method thereof - Google Patents

Abstract

The invention discloses a packaged LED light source with radiating structure and a production method thereof. The packaged LED light source comprises a radiator which is provided with a heat conducting device. The top of the radiator is in toothed structure corresponding to the bottom of the heat conducting device. The top of the heat conducting device is in a cell structure and is covered by thermally conductive ceramic, and a wire layer is arranged on the thermally conductive ceramic. An LED chip is disposed in the middle of the cell of the heat conducting device and is connected with the wire layer through gold wires. A phosphor layer is arranged in the cell of the heat conducting device. A glass lens is arranged above the phosphor layer. The packaged LED light source is capable of effectively dissipating heat generated by the LED chip in lighting and is simple in structure. The production method has few processes and is suitable for industrial production and low in cost. Products produced by the production method are fine in physical properties and chemical stability, long in service life, low in production cost and worthy of wide application.

Description

Packaged LED light source with heat dissipation structure and preparation method thereof

technical field

The invention relates to an electronic component and a preparation method thereof, in particular to a packaged LED light source with a heat dissipation structure and a preparation method thereof.

Background technique

The so-called LED (Light Emitting Diode) is a semiconductor light-emitting diode, which is a semiconductor device that can convert electrical energy into light energy. It is widely used as a flashlight, display screen, indicator light, etc. White LED is known as the fourth-generation lighting source to replace fluorescent lamps and incandescent lamps. LED has the characteristics of fast response, high contrast, long life, no radiation, low power consumption and so on. However, the working principle of LED lamps makes the heat dissipation problem very prominent in the high-power LED lighting industry. Many LED lighting solutions do not pay enough attention to heat dissipation, so the current mass-produced high-power LED lamps generally have an actual service life that is far less than the theoretical value. The cost performance is lower than the embarrassing situation of traditional lamps. And the higher the operating temperature of the PN junction in the LED, the lower the luminous efficiency, the shorter the life of the LED, and at the same time, the phenomenon of light decay will occur.

In general, when the forward current flows through the PN junction, the exothermic loss causes the junction area to generate a temperature rise. Near room temperature, for every 1°C increase in temperature, the luminous intensity of the LED will decrease by about 1%. In addition, the luminous wavelength of the LED varies with temperature from 0.2 to 0.3 nm/°C, and the spectral width increases accordingly, which affects the vividness of the color. LEDs can work in an environment of -40°C to 85°C. Generally, the ambient temperature with the best luminous efficiency is -40°C to 40°C. If it exceeds this range, the luminous efficiency will be greatly reduced. Packaging heat dissipation is very important to maintain color purity and luminous intensity. Heat dissipation design is the key technology for the successful application of LEDs. Full attention must be paid to LED packaging to ensure that the temperature of the PN junction does not exceed the allowable temperature. The conventional LED cooling device dissipates heat through an aluminum alloy radiator, and the aluminum alloy material realizes the purpose of collecting and dissipating heat. But the cooling effect is not very ideal. However, the water heat pipe combined with the heat sink to dissipate the heat of the LED has a complex heat dissipation structure, complicated manufacturing process, and poor heat dissipation efficiency.

Contents of the invention

The purpose of the present invention is to provide a packaged LED light source with heat dissipation structure and its preparation method, which has good heat dissipation effect, simple structure, less manufacturing process and low production cost, so as to overcome the shortcomings of the prior art.

The present invention is realized in the following way: the packaged LED light source with heat dissipation structure includes a radiator, and a heat conductor is arranged on the radiator. The top of the radiator and the bottom of the heat conductor are corresponding tooth-shaped structures, and the top of the heat conductor is a concave Groove structure, the top surface of the heat conductor is covered with heat-conducting ceramics, and a wire layer is arranged on the heat-conducting ceramics; an LED chip is arranged in the middle of the groove of the heat conductor, and the LED chip is connected to the wire layer through a gold wire. A fluorescent powder layer is arranged in the groove, and a glass lens is arranged above the fluorescent powder layer.

The radiator and heat conductor are aluminum substrates or copper substrates.

Thermally conductive ceramics are alumina or aluminum nitride.

The phosphor layer is composed of epoxy resin and phosphor powder, and the mixing ratio of epoxy resin and phosphor powder is mixed according to the customary ratio according to the luminous intensity and wavelength of the LED chip.

The material of the wire layer is one or a combination of Mo, Au, Cu, Ag, Ni or Al, or their alloys, or the combination and combination of metals and alloys.

A method for preparing a packaged LED light source with a heat dissipation structure,

Step 1: Process the aluminum substrate or copper substrate into radiators and heat conductors by machining, process the top of the radiator and the bottom of the heat conductor into corresponding tooth structures, and process the top of the heat conductor into grooves structure;

Step 2: growing a layer of heat-conducting ceramics on the top of the heat spreader by magnetron sputtering;

Step 3: Deposit a metal layer on the top surface of the heat-conducting ceramic by magnetron sputtering;

Step 4: On the basis of Step 3, perform mask etching on the metal layer, etch to the surface of the heat-conducting ceramic, and form a wire layer on the surface of the heat-conducting ceramic;

Step 5: Use thermal silicone to stick the LED chip to the groove on the top of the heat spreader, and use gold wire to connect the LED chip and the wire layer, then mix the epoxy resin and fluorescent, and then cover the mixture on the heat spreader In the groove on the top, a phosphor layer is formed;

Step 6: Fix the glass lens sealant on the heat spreader, and use the sealant to seal tightly the contact between the heat spreader and the package shell;

Step 7: Adhere the heat spreader and radiator with thermal silica gel.

The etching method adopts wet etching or normal etching, and a combination of wet etching and normal etching.

Due to the adoption of the above-mentioned technical scheme, compared with the prior art, the present invention provides a groove structure on the top of the heat conductor, so that the LED chip placed in the groove can fully contact the heat conductor, and the heat conductor sends out the LED chip. This structure can effectively dissipate the heat generated by the LED chip when it emits light, and the product has a simple structure, less preparation process, suitable for industrial production, and low production cost. Good physical properties and chemical stability, long service life, low production cost, and wide application value.

Description of drawings

Fig. 1 is the structural representation of radiator;

Fig. 2 is a structural schematic diagram before the top of the heat spreader is not machined;

Fig. 3 is a structural schematic diagram of the top of the heat spreader after machining;

Fig. 4 is A-A sectional view of Fig. 3;

Figure 5 is a plan view after growing thermally conductive ceramics;

Fig. 6 is A-A sectional view of Fig. 5;

Fig. 7 is a plan view after depositing, masking, and etching a wire layer;

Fig. 8 is A-A sectional view of Fig. 7;

Fig. 9 is a plan view after loading the LED chip and covering the phosphor layer;

Fig. 10 is A-A sectional view of Fig. 9;

Fig. 11 is a cross-sectional view after encapsulating the glass lens;

Fig. 12 is the plane view after the heat spreader and radiator are bonded;

Fig. 13 is A-A sectional view of Fig. 12;

14 is a plan view of a multi-chip LED of the present invention;

Reference signs:

1-radiator, 2-heat conductor, 3-thermal ceramic, 4-wire layer, 5-glass lens, 6-phosphor powder layer, 7-gold wire, 8-LED chip.

Detailed ways

Embodiment 1 of the present invention: The structure of the packaged LED light source with a heat dissipation structure is shown in Figure 1, including a heat sink 1 made of an aluminum substrate, and a heat conductor 2 made of an aluminum substrate is arranged on the heat sink 1. The top of the heat conductor 2 and the top of the heat conductor 2 are corresponding tooth-shaped structures, and the top of the heat conductor 2 is a groove structure. There is a wire layer 4 made of Cu; an LED chip 8 is arranged in the middle of the groove of the heat conductor 2, and the LED chip 8 is connected to the wire layer 4 through a gold wire 7, and a phosphor layer is arranged in the groove of the heat conductor 2 6. The phosphor layer 6 is composed of epoxy resin and phosphor powder. The epoxy resin and phosphor powder are mixed according to the ratio provided in the prior art according to the luminous intensity and wavelength of the LED chip, and a glass lens is arranged above the phosphor powder layer 6. 5.

A method for preparing a packaged LED light source with a heat dissipation structure,

Step 1: Machining the aluminum substrate into heat sink 1 and heat spreader 2, processing the top of heat sink 1 and the bottom of heat spreader 2 into corresponding tooth-shaped structures, and processing the top of heat spreader 2 into groove structure;

Step 2: using the magnetron sputtering method to grow a layer of heat-conducting ceramic 3 on the top of the heat conductor 2 with alumina as the material;

Step 3: Deposit a metal layer on the top surface of the heat-conducting ceramic 3 by using the magnetron sputtering method and using metal copper as the material;

Step 4: On the basis of Step 3, perform mask etching on the metal layer, etch to the surface of the heat-conducting ceramic 3, and form a wire layer 4 on the surface of the heat-conducting ceramic 3;

Step 5: Adhere the LED chip 8 to the groove on the top of the heat spreader 2 with thermal silica gel, and connect the LED chip 8 and the wire layer 4 with the gold wire 7, and then use the epoxy resin and phosphor powder according to the luminous intensity of the LED chip Mix with the wavelength according to the ratio provided in the prior art, and cover the groove on the top of the heat conductor 2 to form a phosphor layer;

Step 6: Fix the sealant of the glass lens 5 on the heat spreader 2, and use the sealant to seal tightly the contact between the heat spreader 2 and the packaging shell;

Step 7: Adhere the heat spreader 2 and the heat sink 1 with thermal silica gel.

Embodiment 2 of the present invention: a preparation method of a packaged LED light source with a heat dissipation structure,

Step 1: Machining the copper substrate into heat sink 1 and heat spreader 2, processing the top of heat sink 1 and the bottom of heat spreader 2 into corresponding tooth-shaped structures, and processing the top of heat spreader 2 into groove structure;

Step 2: growing a layer of heat-conducting ceramic 3 on the top of the heat conductor 2 using aluminum nitride as a material by magnetron sputtering;

Step 3: Deposit a metal layer on the top surface of the heat-conducting ceramic 3 by using the magnetron sputtering method and using copper-silver alloy as the material;

Step 4: On the basis of Step 3, perform mask etching on the metal layer, etch to the surface of the heat-conducting ceramic 3, and form a wire layer 4 on the surface of the heat-conducting ceramic 3;

Step 5: Adhere the LED chip 8 to the groove on the top of the heat spreader 2 with thermal silica gel, and connect the LED chip 8 and the wire layer 4 with the gold wire 7, and then use the epoxy resin and phosphor powder according to the luminous intensity of the LED chip Mix with the wavelength according to the ratio provided in the prior art, and cover the groove on the top of the heat conductor 2 to form a phosphor layer;

Step 6: Fix the sealant of the glass lens 5 on the heat spreader 2, and use the sealant to seal tightly the contact between the heat spreader 2 and the packaging shell;

Step 7: Adhere the heat spreader 2 and the heat sink 1 with thermal silica gel.

In addition, a plurality of LED chips 8 can be fabricated as a structure as shown in FIG. 14 .

Claims (8)

1. A packaged LED light source with a heat dissipation structure, including a radiator (1), characterized in that: a heat conductor (2) is arranged on the radiator (1), and the top of the radiator (1) is connected to the heat conductor (2) ) is a corresponding tooth-shaped structure, the top of the heat spreader (2) is a groove structure, the top surface of the heat spreader (2) is covered with heat-conducting ceramics (3), and a wire layer is arranged on the heat-conducting ceramics (3) (4); An LED chip (8) is provided in the middle of the groove of the heat conductor (2), and the LED chip (8) is connected to the wire layer (4) through a gold wire (7). A phosphor layer (6) is arranged in the middle, and a glass lens (5) is arranged above the phosphor layer (6). 2. The packaged LED light source with heat dissipation structure according to claim 1, characterized in that the heat sink (1) and heat conductor (2) are aluminum substrates or copper substrates. 3. The packaged LED light source with heat dissipation structure according to claim 1, characterized in that: the heat-conducting ceramic (3) is aluminum oxide or aluminum nitride. 4. The packaged LED light source with heat dissipation structure according to claim 1, characterized in that: the fluorescent powder layer (6) is composed of epoxy resin and fluorescent powder. 5. The packaged LED light source with heat dissipation structure according to claim 1, characterized in that: the material of the wire layer (4) is one or more of Mo, Au, Cu, Ag, Ni or Al The collocation and combination of metals, or their alloys, or the collocation and combination of metals and alloys. 6. A method for preparing a packaged LED light source with heat dissipation structure, characterized in that: Step 1: Process the aluminum substrate or copper substrate into radiator (1) and heat conductor (2) by machining, and process the top of radiator (1) and the bottom of heat conductor (2) into corresponding tooth shapes structure, and process the top of the heat spreader (2) into a groove structure; Step 2: grow a layer of heat-conducting ceramics (3) on the top of the heat conductor (2) by magnetron sputtering; the thickness of the grown heat-conducting ceramics (3) is 0.1 mm; Step 3: Deposit a metal layer on the top surface of the heat-conducting ceramic (3) by magnetron sputtering; Step 4: On the basis of Step 3, perform mask etching on the metal layer, etch to the surface of the heat-conducting ceramic (3), and form a wire layer (4) on the surface of the heat-conducting ceramic (3); Step 5: Glue the LED chip (8) to the groove on the top of the heat spreader (2) with thermal silica gel, and use gold wire (7) to connect the LED chip (8) and the wire layer (4), and then epoxy and Phosphor powder is mixed, and then the mixture is covered in the groove at the top of the heat spreader (2) to form a phosphor powder layer (6); Step 6: Fix the sealant of the glass lens (5) on the heat spreader (2), and use the sealant to seal tightly the contact between the heat spreader (2) and the packaging shell; Step 7: Adhere the heat spreader (2) and the radiator (1) with thermal silica gel. 7. The preparation method of the packaged LED light source with heat dissipation structure according to claim 6, characterized in that: the etching method adopts wet etching or normal etching, and the combination of wet etching and normal etching method. 8. The packaged LED light source with heat dissipation structure according to claim 6 further comprises a structure in which a plurality of LED chips are made into an array.

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