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CN102738369B - 发光装置及图像显示装置 - Google Patents

发光装置及图像显示装置 Download PDF

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Publication number
CN102738369B
CN102738369B CN201210223577.XA CN201210223577A CN102738369B CN 102738369 B CN102738369 B CN 102738369B CN 201210223577 A CN201210223577 A CN 201210223577A CN 102738369 B CN102738369 B CN 102738369B
Authority
CN
China
Prior art keywords
light
phosphor
emitting device
powder
fluorophor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210223577.XA
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English (en)
Chinese (zh)
Other versions
CN102738369A (zh
Inventor
高桥向星
原田昌道
广崎尚登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
National Institute for Materials Science
Original Assignee
Kyushu University NUC
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu University NUC, Sharp Corp filed Critical Kyushu University NUC
Publication of CN102738369A publication Critical patent/CN102738369A/zh
Application granted granted Critical
Publication of CN102738369B publication Critical patent/CN102738369B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
CN201210223577.XA 2007-05-30 2008-05-30 发光装置及图像显示装置 Active CN102738369B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007143745 2007-05-30
JP143745/07 2007-05-30
JP318468/07 2007-12-10
JP2007318468A JP2009010315A (ja) 2007-05-30 2007-12-10 蛍光体の製造方法、発光装置および画像表示装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN 200810098708 Division CN101315853A (zh) 2007-05-30 2008-05-30 荧光体的制造方法、发光装置及图像显示装置

Publications (2)

Publication Number Publication Date
CN102738369A CN102738369A (zh) 2012-10-17
CN102738369B true CN102738369B (zh) 2016-06-08

Family

ID=40106803

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201210223577.XA Active CN102738369B (zh) 2007-05-30 2008-05-30 发光装置及图像显示装置
CN 200810098708 Pending CN101315853A (zh) 2007-05-30 2008-05-30 荧光体的制造方法、发光装置及图像显示装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN 200810098708 Pending CN101315853A (zh) 2007-05-30 2008-05-30 荧光体的制造方法、发光装置及图像显示装置

Country Status (2)

Country Link
JP (2) JP2009010315A (ja)
CN (2) CN102738369B (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009010315A (ja) * 2007-05-30 2009-01-15 Sharp Corp 蛍光体の製造方法、発光装置および画像表示装置
WO2010018999A2 (ko) * 2008-08-12 2010-02-18 삼성전기주식회사 β-사이알론 형광체 제조방법
US8158026B2 (en) 2008-08-12 2012-04-17 Samsung Led Co., Ltd. Method for preparing B-Sialon phosphor
CN102216418B (zh) * 2009-06-09 2014-01-15 电气化学工业株式会社 β型塞隆荧光体、其用途及其制造方法
JP2011046780A (ja) * 2009-08-25 2011-03-10 Futaba Corp 蛍光体の製造方法及び蛍光体
US20120162573A1 (en) * 2009-08-31 2012-06-28 Kohsei Takahashi Liquid crystal display
US9163175B2 (en) 2010-09-16 2015-10-20 Denki Kagaku Kogyo Kabushiki Kaisha β-sialon and method of manufacturing thereof, and light-emitting device
WO2012046288A1 (ja) * 2010-10-04 2012-04-12 電気化学工業株式会社 β型サイアロン蛍光体とその製造方法、およびその用途
CN102456294A (zh) * 2010-11-02 2012-05-16 展晶科技(深圳)有限公司 Led显示装置
JP5866870B2 (ja) * 2011-08-26 2016-02-24 三菱化学株式会社 発光装置
CN102516998A (zh) * 2011-09-29 2012-06-27 宁波浩威尔新材料科技有限公司 一种超细荧光粉的制备方法
JP5727955B2 (ja) * 2012-03-08 2015-06-03 株式会社東芝 蛍光体およびその製造方法
US9793444B2 (en) * 2012-04-06 2017-10-17 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
TWI675222B (zh) * 2012-05-09 2019-10-21 日商半導體能源研究所股份有限公司 驅動半導體裝置的方法
TWI570219B (zh) * 2015-02-09 2017-02-11 合皓股份有限公司 製作最強吸收波長介於410奈米(nm)-470奈米(nm)的無稀土螢光材料的方法以及應用其進行光致發白光的方法
CN116293491A (zh) * 2016-04-25 2023-06-23 日本特殊陶业株式会社 波长转换构件、其制造方法及发光装置
JP6985704B2 (ja) * 2016-09-26 2021-12-22 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
JP7227922B2 (ja) * 2017-01-13 2023-02-22 カリクスピュア インコーポレイテッド Ｌｅｄ構造及び連続消毒用照明器具
JPWO2019045106A1 (ja) * 2017-09-04 2020-08-20 三菱ケミカル株式会社 蛍光体、発光装置、画像表示装置及び照明装置
JP6891797B2 (ja) * 2017-12-21 2021-06-18 日亜化学工業株式会社 ディスプレイ装置
TWI728873B (zh) 2020-07-21 2021-05-21 隆達電子股份有限公司 發光二極體裝置
US11294238B1 (en) 2020-10-29 2022-04-05 Lextar Electronics Corporation Low blue light backlight module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195817C (zh) * 1999-11-30 2005-04-06 奥斯兰姆奥普托半导体有限责任公司 日光荧光颜料
CN1613028A (zh) * 2002-03-14 2005-05-04 日东电工株式会社 背光灯及使用它的液晶显示装置
CN1839192A (zh) * 2003-10-03 2006-09-27 独立行政法人物质·材料研究机构 氧氮化物荧光体和发光器具
CN1881629A (zh) * 2005-03-18 2006-12-20 株式会社藤仓 发光器件和照明装置
CN1922741A (zh) * 2004-02-18 2007-02-28 独立行政法人物质·材料研究机构 发光元件和照明器具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI359187B (en) * 2003-11-19 2012-03-01 Panasonic Corp Method for preparing nitridosilicate-based compoun
JP3921545B2 (ja) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
JPWO2006019016A1 (ja) * 2004-08-18 2008-05-08 ソニー株式会社 バックライト装置及びカラー液晶表示装置
WO2006068141A1 (ja) * 2004-12-24 2006-06-29 Kabushiki Kaisha Toshiba 白色ｌｅｄおよびそれを用いたバックライト並びに液晶表示装置
JP4574417B2 (ja) * 2005-03-31 2010-11-04 シャープ株式会社 光源モジュール、バックライトユニット、液晶表示装置
JP2007091960A (ja) * 2005-09-30 2007-04-12 Nitto Denko Corp 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置
US8147715B2 (en) 2005-12-08 2012-04-03 National Institute For Materials Science Phosphor, process for producing the same, and luminescent device
JP3975451B2 (ja) * 2006-12-19 2007-09-12 独立行政法人物質・材料研究機構 蛍光体を用いた照明器具および画像表示装置
JP2009010315A (ja) * 2007-05-30 2009-01-15 Sharp Corp 蛍光体の製造方法、発光装置および画像表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195817C (zh) * 1999-11-30 2005-04-06 奥斯兰姆奥普托半导体有限责任公司 日光荧光颜料
CN1613028A (zh) * 2002-03-14 2005-05-04 日东电工株式会社 背光灯及使用它的液晶显示装置
CN1839192A (zh) * 2003-10-03 2006-09-27 独立行政法人物质·材料研究机构 氧氮化物荧光体和发光器具
CN1922741A (zh) * 2004-02-18 2007-02-28 独立行政法人物质·材料研究机构 发光元件和照明器具
CN1881629A (zh) * 2005-03-18 2006-12-20 株式会社藤仓 发光器件和照明装置

Also Published As

Publication number Publication date
JP2009010315A (ja) 2009-01-15
CN102738369A (zh) 2012-10-17
JP2011140664A (ja) 2011-07-21
CN101315853A (zh) 2008-12-03
JP5485218B2 (ja) 2014-05-07

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
CB02 Change of applicant information

Address after: Osaka Japan

Applicant after: Sharp Corporation

Applicant after: NATIONAL UNIVERSITY CORPORATION KYUSHU UNIVERSITY

Address before: Osaka Japan

Applicant before: Sharp Corporation

Applicant before: Nat Inst For Materials Science (JP)

COR Change of bibliographic data
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20200602

Address after: No.1, 1-1, 2-dingmu, Hashimoto, Central District, Tokyo, Japan

Co-patentee after: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Patentee after: DENKA Co.,Ltd.

Address before: Osaka Japan

Co-patentee before: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Patentee before: SHARP Kabushiki Kaisha

TR01 Transfer of patent right