CN102707771A - Embedded memory module and host board inserted therein - Google Patents

Abstract

The invention provides an embedded memory module and a host board inserted therein, the memory module comprises a circuit board, at least one flash memory and a controller, the flash memory and the controller are arranged on the circuit board, the circuit board comprises a signal transmission connector, the host board comprises a microprocessor and at least one signal transmission connecting seat, the embedded memory module is inserted in the connecting seat of the host board through the signal transmission connector so as to transmit at least one data meeting eMMC transmission protocol specification, wherein the controller and the flash memory are arranged on the circuit board instead of being packaged into an existing or existing BGA form, and the signal transmission connector on the circuit board is inserted into the host board, so that the production yield and the heat dissipation effect of the embedded memory module can be improved, and the memory capacity of the host board can be easily expanded.

Description

Embedded memory module and the motherboard it plugs into

technical field

The invention relates to an embedded memory module and a main board inserted therein, in particular to a memory module capable of transmitting a signal transmission connector of eMMC transmission protocol specification data and a main board inserted therein.

Background technique

eMMC (embedded Multi Media Card; Embedded Multi Media Card) is an embedded memory standard specification developed by the MMC Association, which is widely used in portable electronic devices (such as: mobile phones, tablet computers).

Please refer to FIG. 1 and FIG. 2 , which are respectively a bottom view structural schematic diagram of an existing embedded memory chip and a cross-sectional structural schematic diagram of an embedded memory chip disposed on a motherboard. As shown in the figure, the existing embedded memory chip 100 is a memory chip conforming to the eMMC standard specification, and it adopts a ball grid array (BallGrid Array; BGA) packaging method by stacking a controller 11 and at least one flash memory 13 It is disposed on a substrate 17 , and includes a plurality of spherical structures 10 (for example: 169 spherical structures) under the substrate 17 , and the controller 11 and the flash memory 13 are electrically connected to the lead frame 171 of the substrate 17 through wires 15 .

Furthermore, the embedded memory chip 100 utilizes the spherical structure 10 to be bonded to the layout circuit of the motherboard 200 in an electronic device, so that the microprocessor 21 of the motherboard 200 can communicate with the embedded memory chip through the spherical structure 10 100 accessing at least one piece of data conforming to the specification of the eMMC transmission protocol.

The existing embedded memory chip 100 is packaged in BGA by stacking the controller 11 and the flash memory 13 to form a chip structure, which can effectively reduce the size of the embedded memory chip 100 and can be quickly soldered to the electronic device. on the motherboard 200, thereby shortening the manufacturing time of the electronic device. However, making the embedded memory chip 100 through BGA packaging will produce some problems, which are as follows:

1. Considering the package size of the embedded memory chip 100 , it is impossible to build a large number of flash memory 13 , so the memory capacity of the embedded memory chip 100 will be limited accordingly.

2. The controller 11, the flash memory 13 and their power lines are packaged in a tiny chip in a stacked manner, which easily causes heat dissipation problems.

3. Manufacturing the embedded memory chip 100 by BGA packaging is not easy to improve the production yield. Furthermore, during the process of the embedded memory chip 100, as long as one of the components (such as the controller 11 or the flash memory 13) fails or malfunctions, the entire embedded memory chip 100 can only be classified as defective. repair.

4. Since the embedded memory chip 100 is soldered to the motherboard 200 through the spherical structure 101 , the user cannot replace the embedded memory chip 100 on the motherboard 200 by himself and must send it to the factory for inspection and replacement.

In view of this, the present invention proposes an embedded memory module with an innovative structure to improve the problems caused by existing embedded memory chips, thereby providing an embedded memory with high yield, good heat dissipation, and large memory capacity Modules will be the object of the invention.

Contents of the invention

An object of the present invention is to provide a kind of embedded memory module, its controller and flash memory are arranged on a circuit board, then controller and flash memory are not packaged into the conventional BGA form but change and be arranged on the circuit board to make, cause It is easy to detect and repair components, and effectively improve the production yield of embedded memory modules. An object of the present invention is to provide a kind of embedded memory module, its controller, flash memory and its power line are respectively arranged on a circuit board, so not only can construct more flash memory to improve memory capacity, and can obtain thus Better cooling effect.

An object of the present invention is to provide an embedded memory module, its controller, flash memory and its power circuit are independently arranged on the circuit board, and when one of the components fails or is damaged, the action of component replacement can also be easily performed.

An object of the present invention is to provide a kind of embedded memory module and its plugged motherboard, the embedded memory module utilizes a signal transmission connector to be plugged in a signal transmission connection socket of the motherboard, then use Or you can replace an embedded memory module with a normal function or a larger memory capacity from the motherboard.

An object of the present invention is to provide a kind of embedded memory module and its plugged motherboard, the embedded memory module utilizes a signal transmission connector to be plugged in a signal transmission connection seat of the motherboard, then the motherboard At least one piece of data conforming to the specification of the eMMC transmission protocol can be accessed for the embedded memory module through the plugging of the signal transmission connector and the signal transmission connection socket.

In order to achieve the above object, the present invention provides an embedded memory module, comprising: a circuit board, including a signal transmission connector; at least one flash memory, used to store data; and a controller, the controller and the flash memory are arranged on the circuit On the board, the controller is electrically connected to the flash memory and the signal transmission connector, and the embedded memory module uses the signal transmission connector to transmit at least one data conforming to the specification of the eMMC (embedded Multi MediaCard) transmission protocol.

In an embodiment of the present invention, wherein the signal transmission connector is a connector conforming to an SD interface standard specification, a CF interface standard specification connector, a Cfast interface standard specification connector, a MS interface standard specification connector, A connector of MMC interface standard specification, a connector of SATA interface standard specification, a connector of IDE interface standard specification, a connector of USB interface standard specification, a connector of PCI-E interface standard specification, etc. Specifications for data transmission A connector of the interface standard specification, a self-defined golden finger signal transmission connector or a self-defined pin type signal transmission connector. In an embodiment of the present invention, the signal transmission connector is made as a golden finger interface connector or a pin type interface connector.

In an embodiment of the present invention, the controller and the flash memory are independently arranged on the circuit board.

In an embodiment of the present invention, the controller and the flash memory are packaged into a ball grid array chip to be bonded to the circuit board through a ball structure. .

The present invention also provides a mainboard on which an embedded memory module is inserted, including: a microprocessor; In the transmission connection socket, the microprocessor of the motherboard can access at least one data conforming to the specification of the eMMC transmission protocol for the embedded memory.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 is a bottom view structural schematic diagram of an existing embedded memory chip;

Fig. 2 is a schematic cross-sectional structure diagram of an existing embedded memory chip arranged on a motherboard;

Fig. 3 is the schematic diagram of the circuit structure of a preferred embodiment of the embedded memory module of the present invention and the motherboard inserted therein;

Fig. 4 is a three-dimensional structural schematic diagram of a preferred embodiment of the embedded memory module of the present invention and its inserted motherboard:

Fig. 5 is a schematic cross-sectional structure diagram of an embodiment of the embedded memory module of the present invention;

Fig. 6 is a schematic diagram of the circuit structure of an embodiment of the embedded memory module of the present invention and its inserted motherboard;

FIG. 7 is a three-dimensional structural schematic diagram of an embodiment of the embedded memory module and the motherboard inserted therein according to the present invention.

Among them, reference signs

100 embedded memory chips 10 spherical structures

11 Controller 13 Flash memory

15 Conductors 17 Substrate

171 lead frame 200 motherboard

21 microprocessors 300 embedded memory modules

301 embedded memory module 31 controller

33 flash memory 35 circuit board

37 signal transmission connectors 500 motherboard

51 Microprocessor 53 Signal transmission connector

600 embedded memory chips 60 spherical structure

61 conductors 63 substrates

631 lead frame

Detailed ways

Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

Please refer to FIG. 3 and FIG. 4 , which are a schematic diagram of a circuit structure and a schematic diagram of a three-dimensional structure of a preferred embodiment of the embedded memory module and the motherboard on which it is inserted, respectively, according to the present invention. As shown in the figure, the embedded memory module 300 of this embodiment includes a controller 31 , at least one flash memory 33 and a circuit board 35 . And the motherboard 500 that the embedded memory module 300 is plugged into is the motherboard of an electronic device (for example: computer, mobile phone, portable electronic product), and it includes a microprocessor 51 and a signal transmission connection socket 53 , the microprocessor 51 is electrically connected to the signal transmission connection socket 53 .

Wherein, the controller 31 , the flash memory 33 and their power lines are independently arranged on the circuit board 35 . One side of the circuit board 35 is provided with a signal transmission connector 37 , and the controller 31 is electrically connected to the flash memory 33 and the signal transmission connector 37 respectively.

Furthermore, the signal transmission connector 37 of the present invention is a connector conforming to an SD (Secure Digital Memory Card) interface standard specification, a CF (Compact Flash Card) interface standard connector, a Cfast (Compact Flash FAST Card ) interface standard specification connector, a MS (Memory Stick) interface standard specification connector, a MMC (Multi Media Card) interface standard specification connector, a SATA (Serial Advanced Technology Attachment) interface standard specification connector, An IDE (Integrated Development Environment) interface standard connector, a USB (Universal Serial Bus) interface standard connector, a PCI-E (Personal Computer Interface Express) interface standard connector or other devices that can be used to transmit data Specification interface standard specification connector.

Or, in yet another embodiment of the present invention, the signal transmission connector 37 can also be a signal transmission connector with a custom specification, and can also be selected as a connector in the form of a PCB gold finger interface or a connection in the form of a pin interface. head.

The embedded memory module 300 is plugged into the signal transmission connection seat 53 of the motherboard 500 through the signal transmission connector 37, so that the microprocessor 51 of the motherboard 500 can pass through the signal transmission connector 37 and the connection seat 53. Inserting the embedded memory module 300 to access at least one data conforming to the specification of the eMMC (embedded Multi Media Card; embedded multimedia card) transmission protocol.

Here, the embedded memory module 300 of the present embodiment does not package the controller 31 and the flash memory 33 into the conventional ball grid array (Ball Grid Array; BGA) form but instead arranges them on the circuit board 35 for production, and the following advantages can be obtained :

(1). The controller 31, the flash memory 33 and their power lines are independently arranged on the circuit board 35, which is easy to detect and repair the components of the controller 31 and the flash memory 33, thereby greatly improving the production yield of the embedded memory module 300 .

(2). The controller 31, the flash memory 33 and their power lines are independently arranged on the circuit board 35, so that a better heat dissipation effect can be obtained, and one of the components fails or is damaged, and the action of component replacement can be easily performed.

(3). The embedded memory module 300 of this embodiment is not produced by chip packaging, and its size does not need to be specially regulated. A large number of flash memory 33 can be constructed to increase the memory capacity of the embedded memory module 300 .

(4). The embedded memory module 300 is plugged into the signal transmission connection socket 53 of the motherboard 500 by using the signal transmission connector 37, and the user can plug and unplug the motherboard 500 to replace a normal function or a larger memory capacity. The embedded memory module 300 increases the convenience of memory maintenance or expansion.

Please refer to FIG. 5, FIG. 6 and FIG. 7, which are respectively a schematic cross-sectional structure diagram of an embodiment of the embedded memory module of the present invention, a schematic diagram of the circuit structure and a three-dimensional structure of an embodiment of the embedded memory module and its inserted motherboard. schematic diagram. As shown in the figure, the embedded memory module 301 of this embodiment adopts the BGA packaging method to package the controller 31 and the flash memory 33 in a chip 600 structure.

The controller 31 and the flash memory 33 packaged inside the embedded memory chip 600 will be stacked on a substrate 63, and the substrate 63 includes a plurality of spherical structures 60 (for example: 169 spherical structures), the controller 31 and the flash memory 33 The lead frames 631 are respectively electrically connected to the substrate 63 through the wires 61 . Moreover, the embedded memory chip 600 is bonded to the circuit board 35 through the spherical structure 60 , so that the embedded memory module 301 of this embodiment can be produced.

Similarly, the embedded memory module 301 of this embodiment is plugged into the signal transmission connection socket 53 of the motherboard 500 via a signal transmission connector 37, so that the microprocessor 51 of the motherboard 500 can communicate with the embedded memory. The module 301 accesses at least one piece of data conforming to the specification of the eMMC transmission protocol.

According to this implementation, even if the embedded memory module 301 is made by BGA packaging, the user can replace the embedded memory module 301 inserted in the signal transmission connection socket 53 of the motherboard 500 by himself, so as to increase memory maintenance. Or the convenience of expansion.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (6)

1. An embedded memory module, characterized in that, comprising: A circuit board, including a signal transmission connector; at least one flash memory for storing data; and A controller, the controller and the flash memory are arranged on the circuit board, the controller is electrically connected to the flash memory and the signal transmission connector, and the embedded memory module uses the signal transmission connector to transmit at least one data conforming to the specification of the eMMC transmission protocol. 2. The embedded memory module according to claim 1, wherein the signal transmission connector is a connector meeting a SD interface standard specification, a CF interface standard specification connector, a Cfast interface standard specification Connector, a connector of MS interface standard specification, a connector of MMC interface standard specification, a connector of SATA interface standard specification, a connector of IDE interface standard specification, a USB interface standard specification connector, a PCI -E interface standard specification connector, signal transmission connector of other standard interfaces that can be used to transmit data, a self-defined gold finger gold finger signal transmission connector or a self-defined pin type signal transmission connector. 3. The embedded memory module according to claim 1, wherein the signal transmission connector is made as a golden finger interface connector or a pin type interface connector. 4. The embedded memory module according to claim 1, wherein the controller and the flash memory are independently disposed on the circuit board. 5. The embedded memory module according to claim 1, wherein the controller and the flash memory are packaged into a ball grid array chip and bonded to the circuit board through a ball structure. 6. A motherboard inserted into the embedded memory module according to claim 1, characterized in that it comprises: a microprocessor; and At least one signal transmission connection socket, the embedded memory module is inserted into the signal transmission connection socket of the motherboard through the signal transmission connector, so that the microprocessor of the motherboard can access at least one of the embedded memory Data that conforms to the eMMC transfer protocol specification.

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