CN102658522A - Spherical consolidation abrasive grinding and polishing pad for processing optical element - Google Patents
Spherical consolidation abrasive grinding and polishing pad for processing optical element Download PDFInfo
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- CN102658522A CN102658522A CN2012101512830A CN201210151283A CN102658522A CN 102658522 A CN102658522 A CN 102658522A CN 2012101512830 A CN2012101512830 A CN 2012101512830A CN 201210151283 A CN201210151283 A CN 201210151283A CN 102658522 A CN102658522 A CN 102658522A
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Abstract
The invention discloses a spherical consolidation abrasive grinding and polishing pad for processing an optical element, which is characterized in that an abrasive is uniformly mixed with thermosetting resin, and the spherical consolidation abrasive grinding and polishing pad is formed after consolidation, wherein the mass percent of the abrasive to the thermosetting resin is (5-50 percent):(50-95 percent). The abrasive is one or the combination of more of diamond, silica, cerium oxide, aluminum oxide, aluminum oxide, silicon carbide, boron carbide and zirconium oxide, and has the grain of 50nanometers-100micrometers; the thermosetting resin is one or the combination of unsaturated polyester resin, epoxy resin, phenolic resin and polybutadiene; a spherical surface is a convex spherical surface or concave spherical surface and has a diameter of 3.5-1000 micrometers and a radius of curvature of 2.5-infinity. The grinding and polishing of the spherical surface of the consolidation abrasive has the characteristics of stable grinding and polishing properties, simple process, high processing efficiency, low processing cost, no environment pollution and the like.
Description
Technical field
The present invention relates to a kind of finisher, especially a kind of solidified abrasive grinding polishing pad of optical element processing usefulness, the solidified abrasive grinding polishing pad is used in specifically a kind of spherical optics element processing.
Background technology
The spherical optics element is widely used in fields such as optical microscope system, medical endoscope system, and demand increases greatly and day by day.Along with the raising that imaging precision requires, the surface quality of spherical optics element requires also increasingly high, and the spherical optics element mainly adopts the ultraprecision grinding polishing as its manufacturing process.Grinding and polishing process technology level is restricting China's hard disk, optics, semiconductor etc. and Chinese national economy security of operation and the closely-related technical development of national defense safety.Processing spherical optics element need use the sphere grinding and polishing pad, and grinding and polishing pad is that grinding and polishing is processed one of most important instrument, final crudy, working (machining) efficiency and the processing cost of its decision device.
The grinding and polishing pad of using in the processing of spherical optics element grinding polishing at present mainly is cast iron plate, pitch dish and polyurethane, adopts the free abrasive grinding and polishing.Traditional free abrasive grinding and polishing liquid is made up of components such as abrasive particle, pH conditioning agent, oxidants.Yet there is the intrinsic shortcoming of some systems in the free abrasive grinding and polishing: when speed of grinding plate was fast, abrasive material produced and splashes, cause abrasive material waste and working (machining) efficiency lowly; Treatment cost of waste liquor is high; Abrasive material is random distribution on polishing disk, and its distribution density is uneven, causes the inequality of grinding cutting amount, and the workpiece surface figure accuracy is difficult to control.Simultaneously, cast iron plate is harder, and abrasive material is suspended between abrasive disk and the workpiece, and easy damaged workpiece, cast iron plate also easy abrasion need regularly finishing; The pitch dish is softer, and process is yielding, constantly repair to guarantee the face shape of polished workpiece, does not have the self-training ability; The polyurethane grinding and polishing is lined with certain rigidity; But polished workpiece is prone to be absorbed in polishing pad under the effect of pressure, workpiece be prone to collapse the limit, influence the surface figure accuracy of workpiece, simultaneously; Abrasive grain is prone to be absorbed in the hole of polishing pad; Proceeding of influence processing is so polishing pad needs finishing at set intervals.
Free abrasive grinding and polishing spherical optics element, processing mainly depend on manual polishing or the polishing of traditional single shaft machine, and the polishing uncertain factor is many, and free abrasive grinding and polishing pad serious wear needs regularly finishing, and material is removed inhomogeneous, poor repeatability; The finishing of polishing pad relies on processor's years of researches and rich experience, and material is removed inhomogeneous, and working (machining) efficiency is low, poor repeatability.Complex process, each operation to processing auxiliary material and machined parameters require different; The complicated continuous workpiece loading and unloading easy damaged of technology surface of the work, the conversion of technology and anchor clamps simultaneously all needs to clean, and cleans difficulty; The use of a large amount of polishing fluids, processing cost is high.
Summary of the invention
The objective of the invention is to adopt free grinding and polishing liquid to process the seriously polluted of existence mostly to existing spherical optics element grinding polishing; The problem that processing cost is high, working (machining) efficiency is low, the solidified abrasive grinding polishing pad is used in a kind of spherical optics element processing of proposition.
Technical scheme of the present invention is:
The solidified abrasive grinding polishing pad is used in a kind of spherical optics element processing; It is characterized in that abrasive material and thermosetting resin evenly mix; Solidify the back and form sphere solidified abrasive grinding polishing pad, their mass percent is an abrasive material: resin=5%～50%: 50%～95%.
Usually, described abrasive material is the one or more combination in diamond, silica, cerium oxide, aluminium oxide, carborundum, boron carbide, the zirconia.
Described abrasive grain is 50 nanometers～100 micron.
Described thermosetting resin is the one or more combination in unsaturated polyester resin, epoxy resin, phenolic resins, the polybutadiene.
Described sphere is protruding sphere or concave spherical surface.
Described sphere is 3.5～1000 millimeters of diameters, and radius of curvature is 2.5 millimeters～∞.
Beneficial effect of the present invention:
Spherical optics element of the present invention can be widely used in the grinding and polishing processing of sphere elements such as semiconductor, glass, optical crystal, pottery with the solidified abrasive grinding polishing pad, working (machining) efficiency is high, and the surface damage after the processing is little, surface quality is high, and processing cost is low.
Abrasive material of the present invention is cemented on the polishing pad, and the abrasive material utilization rate is high; Simultaneously, also having significantly reduced post processing workload and cost, reduced a large amount of pollutions that are harmful to chemical substances to environment in polishing waste liquid and the cleaning process, is the green processing technology.And in the free abrasive grinding and polishing process, the abrasive material utilization rate utmost point, working (machining) efficiency is not high, the abrasive material random distribution, distribution density is uneven, causes workpiece grinding cutting amount uneven, and workpiece face shape is difficult to control; A large amount of harmful chemical substance contaminated environment in polishing waste liquid and the cleaning process, post processing is complicated high with cost.
The specific embodiment
Below in conjunction with embodiment the present invention is further described.
Embodiment 1: the polishing pad of present embodiment is that abrasive material and thermosetting resin evenly mix, and solidifies the back and forms sphere solidified abrasive grinding polishing pad, and their mass percent is an abrasive material: resin=5%: 95%.
Described abrasive material is a diamond; Granularity is 50 nanometers.
Described thermosetting resin is a unsaturated polyester resin.
Described sphere is protruding sphere; Sphere is 3.5 millimeters of diameters, and radius of curvature is 2.5.
Embodiment 2: the polishing pad of present embodiment is that abrasive material and thermosetting resin evenly mix, and solidifies the back and forms sphere solidified abrasive grinding polishing pad, and their mass percent is an abrasive material: resin=30%: 70%.
Described abrasive material is a carborundum; Abrasive grain is 50 microns.
Described thermosetting resin is a phenolic resins.
Described sphere is a concave spherical surface; Sphere is 500 millimeters of diameters, and radius of curvature is 5 millimeters.
Embodiment 3: the polishing pad of present embodiment is that abrasive material and thermosetting resin evenly mix, and solidifies the back and forms sphere solidified abrasive grinding polishing pad, and their mass percent is an abrasive material: resin=50%: 50%.
Described abrasive material is silica and boron carbide combination; Abrasive grain is 100 microns.
Described thermosetting resin is the combination of epoxy resin and polybutadiene.
Described sphere is protruding sphere; Sphere is 1000 millimeters of diameters, and radius of curvature is 10 millimeters.
The present invention does not relate to all identical with the prior art prior art that maybe can adopt of part and realizes.
Claims (6)
1. the solidified abrasive grinding polishing pad is used in a spherical optics element processing; It is characterized in that abrasive material and thermosetting resin evenly mix; Solidify the back and form sphere solidified abrasive grinding polishing pad, their mass percent is an abrasive material: resin=5%～50%: 50%～95%.
2. the solidified abrasive grinding polishing pad is used in spherical optics element processing according to claim 1, it is characterized in that described abrasive material is the one or more combination in diamond, silica, cerium oxide, aluminium oxide, carborundum, boron carbide, the zirconia.
3. the solidified abrasive grinding polishing pad is used in spherical optics element according to claim 1 and 2 processing, it is characterized in that described abrasive grain is 50 nanometers～100 micron.
4. the solidified abrasive grinding polishing pad is used in spherical optics element processing according to claim 1, it is characterized in that described thermosetting resin is the one or more combination in unsaturated polyester resin, epoxy resin, phenolic resins, the polybutadiene.
5. the solidified abrasive grinding polishing pad is used in spherical optics element processing according to claim 1, it is characterized in that described sphere is protruding sphere or concave spherical surface.
6. use the solidified abrasive grinding polishing pad according to claim 1 or 5 described spherical optics element processing, it is characterized in that described sphere is 3.5～1000 millimeters of diameters, radius of curvature is 2.5 millimeters～∞.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101512830A CN102658522A (en) | 2012-05-16 | 2012-05-16 | Spherical consolidation abrasive grinding and polishing pad for processing optical element |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101512830A CN102658522A (en) | 2012-05-16 | 2012-05-16 | Spherical consolidation abrasive grinding and polishing pad for processing optical element |
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| CN102658522A true CN102658522A (en) | 2012-09-12 |
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| CN2012101512830A Pending CN102658522A (en) | 2012-05-16 | 2012-05-16 | Spherical consolidation abrasive grinding and polishing pad for processing optical element |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103381573A (en) * | 2013-05-27 | 2013-11-06 | 河南科技学院 | Chemical mechanical grinding plate for consolided grinding material used in SiC single crystal wafer grinding process |
| CN104140222A (en) * | 2014-07-31 | 2014-11-12 | 宁国市鑫煌矿冶配件制造有限公司 | Superhard abrasion-resistance grinding body |
| CN110861236A (en) * | 2019-11-21 | 2020-03-06 | 深圳兰品科技有限公司 | Production method of precise elastic abrasive particles |
| CN110922096A (en) * | 2019-12-16 | 2020-03-27 | 韶关大唐研磨材料有限公司 | Diamond gasket and preparation method thereof |
| CN115229671A (en) * | 2022-08-24 | 2022-10-25 | 关勒铭(湖州)晶体材料科技有限公司 | Novel efficient ruby grinding process based on fixed abrasive |
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| JP2002305168A (en) * | 1995-09-13 | 2002-10-18 | Hitachi Ltd | Polishing method, polishing apparatus, and method of manufacturing semiconductor device |
| JP2004345048A (en) * | 2003-05-23 | 2004-12-09 | Jsr Corp | Abrasive pad |
| CN1739915A (en) * | 2005-09-08 | 2006-03-01 | 大连理工大学 | Preparation method of polishing pad for chemical mechanical polishing |
| CN101428404A (en) * | 2008-12-22 | 2009-05-13 | 南京航空航天大学 | Fixed abrasive grinding polishing pad and method of manufacturing the same |
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2012
- 2012-05-16 CN CN2012101512830A patent/CN102658522A/en active Pending
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| JP2002305168A (en) * | 1995-09-13 | 2002-10-18 | Hitachi Ltd | Polishing method, polishing apparatus, and method of manufacturing semiconductor device |
| US20020106980A1 (en) * | 2001-02-07 | 2002-08-08 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
| JP2004345048A (en) * | 2003-05-23 | 2004-12-09 | Jsr Corp | Abrasive pad |
| CN1739915A (en) * | 2005-09-08 | 2006-03-01 | 大连理工大学 | Preparation method of polishing pad for chemical mechanical polishing |
| CN101428404A (en) * | 2008-12-22 | 2009-05-13 | 南京航空航天大学 | Fixed abrasive grinding polishing pad and method of manufacturing the same |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103381573A (en) * | 2013-05-27 | 2013-11-06 | 河南科技学院 | Chemical mechanical grinding plate for consolided grinding material used in SiC single crystal wafer grinding process |
| CN103381573B (en) * | 2013-05-27 | 2016-08-10 | 河南科技学院 | A kind of SiC single crystal slice lapping operation concretion abrasive cmp dish |
| CN104140222A (en) * | 2014-07-31 | 2014-11-12 | 宁国市鑫煌矿冶配件制造有限公司 | Superhard abrasion-resistance grinding body |
| CN110861236A (en) * | 2019-11-21 | 2020-03-06 | 深圳兰品科技有限公司 | Production method of precise elastic abrasive particles |
| CN110922096A (en) * | 2019-12-16 | 2020-03-27 | 韶关大唐研磨材料有限公司 | Diamond gasket and preparation method thereof |
| CN115229671A (en) * | 2022-08-24 | 2022-10-25 | 关勒铭(湖州)晶体材料科技有限公司 | Novel efficient ruby grinding process based on fixed abrasive |
| CN115229671B (en) * | 2022-08-24 | 2024-08-06 | 关勒铭(湖州)晶体材料科技有限公司 | Novel ruby efficient grinding process based on fixed abrasive |
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Application publication date: 20120912 |